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David Smart

UK Sales Manager

David Smart

UK Sales Manager

WHY PHOTOCHEMICAL MILLING ?

(Chemical Milling)WHY PHOTOCHEMICAL MILLING ?

(Chemical Milling)

Only method of producing a component without changing the structure of the substrate

Cheap method of manufacture

Flexible tooling

What is Photochemical Machining/

Chemical Milling?

What is Photochemical Machining/

Chemical Milling?

The selective etching of metal substrates to produce a required component

TYPES OF ETCHANTTYPES OF ETCHANT

Ferric Chloride

Ferric Nitrate

Used to etch Ferrous metals, Brass, Copper, Nickel, Aluminium

Used to etch Silver and silver alloys

and Molybdenum

The Photo-Chemical

Milling Industry

has never had a dedicated

chemical supplier

The Photo-Chemical

Milling Industry

forced to use processes designed

for the lesser requirements of the

PCB Industry

Requirements for the

Chemical Milling Industry

more difficult to meet

than those of the

PCB Industry

MacDermid

has the technology

to pass the

Chemical Milling Industries

most stringent requirements

Differences in Copper Substrates

1.PCB Industry

Formed by electroplating pure

copper/100µm thick.

2.Chemical Milling

Hot rolled from ingots

impure copper/200-400µ thick

very severe soiling problems.

Types of metals that areChemically-milled

•Copper•Alloy 42 Kovar•Mild Steel•Stainless Steel•Brass•Aluminium

The use of a properly

formulated alkaline cleaner

is the most cost effective way

to prepare metals for

photo-resist application

Pre-Cleaning Philosophy

Production processes involved in Manufacture

Production Process - Stage 1Production Process - Stage 1Material Storage and Cutting

Production Process - Stage 2Production Process - Stage 2

Panel Cleaning and Drying

Can be either vertical or horizontal

Production Process - Stage 3Production Process - Stage 3

Laminating, Exposure and Developing

Production Process - Stage 4Production Process - Stage 4

Typical photo-tool Spray Developing of image

Laminating, Exposure and Developing

Etching of Image with Ferric Chloride

Production Process - Stage 5Production Process - Stage 5

Production Process - Stage 6Production Process - Stage 6

Strip Dry-film Etch Resist

Cut panel Cleaned Laminated Imaged

Developed Etched Stripped

Panel Appearance After Each StagePanel Appearance After Each Stage

Processes for Chemical MillingProcesses for Chemical Milling

Alkaline Clean

Circamac 104

Rinse Acid Clean/Nano-etch

Circamac 115 NE Copper Cleaner orCircamac 117 KE Cleaner

Rinse Rinse Photo-resistApplicationand Imaging

Dry

Develop

Circamac 280 HWTDeveloperAquamer Anti-foam 2

Rinse Etch

Circamac 290Etchant CMCircamac 295Oxidant

Rinse Resist Strip Rinse Rinse Dry

Aquamer MI 200

Aquamer PR 200

Aquamer MP 500

Circamac 202Circamac 256

Final Finishing Stage Final Finishing Stage Copper and brass can be required to be finished with

either electro plated

nickel or

nickel and tin or

nickel and gold

Sterling Silver

Etched parts are often formed e.g. to make boxes or

screens for printed circuit boards - RF screening cans

Etching FactorsEtching Factors

Solder Paste Stencil ProductionSolder Paste Stencil Production

A stencil is ………..

A sheet of metal with holes in it - used to deposit solder paste

An Essential tool, the design and optimisation of which is critical to achieving consistent printed results and product quality

OR

Stencil Manufacturing TechnologyStencil Manufacturing Technology

�Electroforming

�Accurate,Cost effective stencil solutions

�Used for component pitches down to 0.635mm

�Improved dimensional accuracy for finer pitch requirements

�Used for component pitches down to 0.4mm

�Laser-formed Stencil material is electroformed and the apertures are lasered

�Precision Etching(Photo Chemical Machining)

�Laser Cutting

�Provides the best paste release of all the technologies

�Can be used for all components and packages

Processes for Chemical Milling of Stainless Steel Solder Paste Screens

Alkaline Clean

Circamac 104

Rinse Acid Clean/Nanoetch

Circamac 117 KE

Rinse Rinse PhotoresistApplicationand Imaging

Dry

Develop

Circamac 280 HWTDeveloperAquamer Anti-foam 2

Rinse Etch

Circamac 290Etchant CMCircamac 295Oxidant

Rinse Resist Strip

Circamac 202Circamac 256

Rinse Rinse Dry

Aquamer

Stencil Blank

Etchant

Photo resist

Exposed aperture

Final etched/required size

1ST Subtractive process..Precision etching (PCM)

1ST Subtractive process..Precision etching (PCM)

Latest Manufacturing Technology

Conductive MandrelPhoto-Resist Anode Basket Nickel pellets

Electroforming ProcessElectroforming Process

A

Metal deposit

Typical Electroformed aperture profile Typical Electroformed aperture profile

Trapezoidal Aperture formation

Flexible metal blade

Trapezoidal Apertures

Consistent height Uniform Deposits

Optimised Paste Release for Finer Pitch PrintingOptimised Paste Release for Finer Pitch Printing

Would you choose the bucket or the drainpipe?

Multi-level stencils

Multi- level stencils Multi- level stencils

Able to achieve the paste volumes required by all components

Standard thickness

Extra height for SM connectors, power devices and PLCC’s

Reduced deposits for fine pitch applications

New Technology - MicrostructuresNew Technology - Microstructures

Manufacturing of high density circuits -

Manufactured by electroforming

Typical track and gap of 15 - 25 microns

PRODUCTS FOR CHEMICAL MILLING• 26104 Circamac 104 Copper Cleaner - Alkali spray cleaner to remove tenacious soils used with Circamac 115 before Photo-mech

• 26016 Circamac 115 Copper Cleaner NE - Low foaming cleaner / nanoetch also promotes resist adhesion

• 26017 Circamac 117 Chemcleaner KE - Low foaming cleaner formulated for steel and iron alloys prior to photo resist lamination

• 19257 MacuPrep G4 - Stabilised micro-etch for copper and brass, provides ultra fine surface

• 24712 Canclean SPA 2 Aluminium Cleaner - Spray cleaner for aluminium prior to photo resist lamination

• 26502 Circamac 202 Resist Stripper - Effectively removes full aqueous dry film resist leaving a residue free surface

• 26015 Circamac 256 Resist Stripper - Removes dry film resist effectively and efficiently from fine line/spacing, for spray applications

• 26280 Circamac 280 HWT Developer - A concentrated liquid alkaline solution to develop dry film resist with water softening agents

• 19798 Aquamer Anti-foam 2 - A solvent free, easily dispersed, non silicone defoamer for use in acid and alkaline aqueous solutions

• 26290 Circamac 290 Etchant CM - Ferric Chloride etch for the rapid etching of all grades of copper, brass, steel, and aluminium

• 46346 Circamac 295 Re-Gen Sodium Chlorate Solution (40%) - Used to regenerate ferric chloride solutions.

• Aquamer MP 500 Series Superior dry-film for acid etching resist available in a variety of thicknesses

• Aquamer PR 200 Series Superior dry-film for acid etching resist available in a variety of thicknesses