1
DDR-3 DIMM Vertical Mount SocketFCN-07 Series
FEATURES
• DDR-3: 240pin DIMM socket connector (press-fit or through hole type)• Fujitsu original unique structure for twin contact points structure.
Item SpecificationOperating temperature range
-55°C to +85°C
Current rating DC 0.5AVoltage rating AC 25VContact resistance 40mΩ maximum
(DC 20mv, 10mA)Dielectric withstanding voltage
AC 500V for 1 minute
Insulation resistance 1,000MΩ minimum (DC500V)
Insertion force 155.7N (about 15.9kgf) less than
Compliant pin insertion force
4,800N (about 489.5kgf) less than
Item SpecificationInsulating material LCP, UL94 V-0Conductor Copper Alloy Plating Contact Gold plating
Compliant Tin platingHook LCP, UL94V-0
Plastic tray quantity: 40 pieces/trayContainer quantity: 200 pieces
RoHS compliant
Fujitsu’s FCN-07 DDR-3 DIMM socket is a vertical mount press-fit socket. The unique contact structure provides for twin points of contact that insure that dust is wiped clean when module is installed.In addition, the twin points guarantee constant contact between the module and contact even in a high vibration environment.
Double contact
MATERIALS
Not for New Designs
2
DDR-3DIMM Vertical Mount Socket
SPECIFICATIONS
FCN-074J240-G/2P
A ANo.121
No.1
No.240
No.120
φ2.1±0.08
(4.3
)
47±0.157±0.1
5±0.171±0.1
144.8±0.5Max.142
Min.128.6(*a)
Center line of polarizing keyCenter line of (*a)(*b)
(12)
133.75(*b) (card slot length)
Date Code
22.7
±0.2
5
2.25
±0.1
5
7.5±0.2
Max.165
Max
.26
Min
.14.
5
Min
.5
Min.10
Ejector moving area
0.73±0.1(第二接点口径寸法)
(第一接点口径寸法)0.69±0.1
(カード挿入部)1.42±0.05
断面 A-A X-section A-A
1.3±0.053.
3±0.
2
No.121 A A
No.1
No.240
No.120133.75(*b) (カードスロット長)
Ejector open Max.165
Unit: mm
Press-fit version
3
DDR-3DIMM Vertical Mount Socket
SPECIFICATIONS
FCN-074J240-G/2P
No.240
No.120
Keep out area 165.0
PCB foot print Max.142
φ2.45±0.05
Detail A
57±0.055±0.05
1×(48-1)= 47±0.1 1×(72-1)= 71±0.1
No.1
No.121
11.5
(12) Center line of foot print
-0
-0
Keep out area
7.7
1±0.051.
9±0
.05
1.9
±0.0
51.
9±0
.05
φ0.56±0.05 PTH 240 (φ0.66Drill hole)φ1±0.05 Pad 240
2×17
.3±0
.12×
9.5±
0.1
4×3±
0.1
(4)
Pad1
1±0.05(pitch)
1×(48-1)= 47±0.12×(5.175)
2.5±0.05
Detail A
5±0.051×(72-1)= 71±0.1
4× 2.1±0.15Pad 120
133.35±0.15(12) 2×(2.8)
Center line of module board (0.5
)30+
0.50
-0.
15
Component area
1.27±0.1C0.1+0.10-0.05
1.5±0.1
Detail A
3.8±
0.15
240X 0.8±0.05
0.2±
0.15
2.5±
0.2
Unit: mm
Press-fit version
Applicable substrate thickness (mm): 1.6 min.
4
DDR-3DIMM Vertical Mount Socket
SPECIFICATIONS
FCN-074J240-G/1D
133.75
No.121
No.120
No.240
No.1
B B
142 Max.128.6 Min.
5±0.1
81±0.171±0.1
57±0.147±0.1
0.2
4.3
2 -Ø2.1±0.08
26 M
ax.
2.35
±0.2
5
0.4
7.55 Max.
165 MAX. Hook open
144.8
Mechanical key center line
Unit: mm
Through-hole solder version
5
DDR-3DIMM Vertical Mount Socket
165 Max.
10 Min.
26 Max.
14.5
Min.
5 M
in.
1.3±0.05
2.1±
0.08
1.3±0.05
1X(48-1)=47 1X(72-1)=71
No.121
No.1
No.240
No.120
57±0.05 81±0.05
Detail C 2Ø2.25±0.05
7.75
-0 M
ax.
511.5
165 MAX. Hook open142 MAX. PCB footprint
Mechanical key center line
2.45
±0.0
8
1.8±0.05
1±0.05
1.9
±0.0
51.
9±0
.05
1.9
±0.0
5
Ø0.7 PTH 240+0.08-0.05
SPECIFICATIONS
FCN-074J240-G/1D
Unit: mm
Through-hole solder version
Detail "C"Scale 5/1
Applicable substrate thickness (mm): 1.6
6
DDR-3DIMM Vertical Mount Socket
PACKAGING TRAY
Contact
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