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DEFECT CONTROL AIT XP+ Advanced Wafer Inspection THE AIT XP+™, A HIGH-THROUGHPUT LINE MONITOR INSPECTION SYSTEM WITH INCREASED SENSITIVITY AND THROUGHPUT, captures extremely small defects and new defect types found in 130-nm and 100-nm design rule processes, even for challenging process technologies like Cu and low-k damascene. The AIT XP+ delivers reduced cost of ownership (CoO) and enhanced sensitivity in all die regions with a single scan using production-proven Adaptive Mode™ technology. The AIT family adds further inspection improvements through the CORE architecture, with new defect detection algorithms and inline automatic defect classification (iADC). Field upgrades to the AIT XP+ are available for AIT II, AIT III, and AIT XP, extending customer benefits from AIT technology and enabling transition to future AIT enhancements for patterned wafer inspection. PRODUCT DESCRIPTION CORE Architecture The AIT XP+ family features the revolutionary CORE architecture, with the flexibility to provide the fastest path to deployment of new sensitivity and analysis algorithms. CORE is a key part of KLA-Tencor’s answer to the ever-increasing demand for higher performance. • Advanced detection algorithms—Improve noise suppression for increased capture of existing defects, as well as detection of new defect types. The algorithms also allow fabs to migrate toward larger spot sizes while maintaining equivalent levels of sensitivity, or to increase defect capture at the same spot size and throughput. • iADC (Inline Automatic Defect Classification)—Using the same production-proven technology as the 23xx and eS30 systems and sharing a common iADC manager, iADC extracts information in real time during inspection to classify all defects on a wafer. This allows better nuisance filtering for improved defect capture; trending by killer-defect type for faster, more reliable recognition of excursions; and defect review sample shaping, allowing for more efficient use of SEM review resources. Together, these capabilities improve CoO by focusing on defects of interest, resulting in faster identification and correction of yield problems. • Triggered on-tool review sampling and image capture—Speeds time to results through the improved understanding of defect sources and impact of these sources on the process. Production Proven AIT Technology The AIT XP+ builds on the experience of the industry’s leading laser scanning, patterned wafer line-monitoring tool. • Adaptive Mode—The AIT XP+ builds on the AIT XP’s adaptive mode technology to adjust dynamically to the pattern scatter of varying die regions, capturing defects in both "bright" logic and "dark" array regions in a single inspection pass. Adaptive Mode automatically adjusts in real time, providing full-die sensitivity without extra inspection scans. • Proprietary Optics and Collection Geometry—Patented double- darkfield technology provides color and grain suppression to optimize the defect signal and filter out noise. Three independent collectors offer selectable polarizers and programmable spatial filters for complete capture of all critical defect types, especially in memory applications. • AIT MultiSpot TM Technology—Offers optimized speed and sensi- tivity combinations for a large range of current and future production applications. • Easy-To-Use Interface and Recipe Setup—The same streamlined user interface as the AIT XP, coupled with Adaptive Mode, enables powerful, flexible recipe setup, while reducing the number of necessary recipe-creation parameters and minimizing setup time. Templates simplify the recipe setup process, allowing easy transfer of parameters across recipes, process levels, and devices. By contributing to reduction of engineer/operator effort and time, these features enhance overall tool CoO. OPTIMIZED DEFECT SOLUTIONS With a full range of AIT systems now available, fabs can achieve faster time to results and reduce CoO by deploying the right throughput and sensitivity during any phase of patterned-wafer inspection and for monitoring in all process modules. Together with the AIT UV, featuring unsurpassed throughput and sensitivity for 300-mm patterned wafer inspection; 23XX, providing maximum sensitivity for critical line monitoring applications; and eS30 for benchmark sensitivity in process development, ramp and engineering analysis; the AIT XP+ is part of KLA-Tencor’s commitment to provide customers with optimized inspection solutions for throughput, sensitivity, and CoO.
