Defining Requirements and Specifications for 400G & all

Modulations – 200G, 300G, 500G+

NGON 2016

July 30, 2016

Karl Gass

OIF Physical and Link Layer

Committee Vice-Chair for Optics

About the OIF

The Optical Internetworking Forum:

• Represents an end-to-end ecosystem

membership base of 100+ members

• Accelerating market adoption and

ROI for new technologies • OIF 100G DWDM work united the industry

around a 100G framework and IAs for

photonics, FEC and module MSA

• Electrical work defines critical backplane,

chip and module interfaces for 100-400G

• Open and agile workplan • Find gaps obstructing deployment and fill

them internally or working with other SDOs

• Distributed Control, Centralized Control –

whatever best fits operator needs!

www.oiforum.com

Network Operators

System Suppliers

Transceiver Suppliers

Component Suppliers

PLL Electrical, Protocol and Optical working groups

Looking for opportunities to serve the industry by development of

interoperable solutions that are not being addressed by other

industry bodies

• Electrical interfaces (Common Electrical Interface)

• Protocol interfaces (MLG, Flex E)

• Optical interfaces

Publically available, freely shared, Implementation Agreements

Broadly defined so applicable to multiple market segments

Addressing current industry needs of speed (data rate), density,

power efficiency, flexibility (re-use)

Electrical Implementation Agreements

CEI IA is a clause-based format supporting publication of new clauses over time: • CEI-1.0: included CEI-6G-SR, CEI-6G-LR, and CEI-11G-SR clauses.

• CEI-2.0: added CEI-11G-LR clause

• CEI-3.0: added work from CEI-25G-LR, CEI-28G-SR

• CEI-3.1: added work from CEI-28G-MR and CEI-28G-VSR

CEI-11G and -28G specifications have been used as a basis for specifications developed in IEEE 802.3, ANSI/INCITS T11, and IBTA.

CEI 56G projects are in progress: • LR: backplane

• MR: chip to chip

• VSR: chip to module

• XSR: chip to optics engine (separate chips)

• USR: chip to optics engine (2.5D or 3D package)

CEI 112G – under discussion!

2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 SxI-5 CEI-1.0 CEI-2.0 CEI-3.0 CEI-3.1

3G 6G

11G 25G & 28G 56G

112G

CEI 56G Applications

Host IC

Module

Connector

AC

Coupling

Cap Module

Retimer IC

USR

LR

MR

VSR

XSR

Different reaches, number of connectors,

channel materials mean we can optimize the

application specifications for best efficiency

Different modulations provide advantage in

certain cases

CEI-56G Application Space

6

USR: 2.5D/3D applications

1 cm, no connectors, no packages

XSR: Chip to nearby optics engine

5 cm, no connectors

5-10 dB loss @28 GHz

VSR: Chip-to-module

10 cm, 1 connector

10-20 dB loss @28 GHz

MR: Interfaces for chip to chip and midrange backplane

50 cm, 1 connector

15-25 dB loss @14 GHz

20-50 dB loss @28 GHz

LR: Interface for chip to chip over a backplane

100cm, 2 connectors

35dB at 14Ghz

Chip-to-Chip & Midplane Applications

Chip-to-Module

Chip Pluggable Optics

CEI-56G-USR

Chip Chip

Backplane or Passive Copper Cable

Chip Chip

3D Stack

CEI-56G-XSR

CEI-56G-VSR

2.5D Chip-to-OE

Optics Chip

Chip to Nearby OE

CEI-56G-MR

CEI-56G-LR

NRZ IA

NRZ & PAM4 IAs

NRZ & PAM4 IAs

NRZ & PAM4 IAs

PAM4 & ENRZ IAs

CEI-56G is leading the drive to higher bandwidths for both networking and data center applications.

Projects underway in five link reaches with multiple modulations

PLL – How OIF Accelerated 100G

Router Router OTN

Switch

100GbE OTH, OTU4 100GbE

IEEE 802.3ba

ITU-T

OIF 40G development highly fragmented

Collaboration much improved on 100G

• Clear business case

• Stronger ecosystem

• Consistent standards and IAs

Fra

me

r

Photonic TX

Photonic RX

100G ULH MSA

FEC

OTN

Switch

OIF work on 100G DWDM transport united the industry around

• An overall framework including a modulation format

• Detailed IAs including photonics Tx/Rx modules, FEC, MSA

400G ?

How do we build on our successful deployment of coherent

100G systems?

400G Technology Options White Paper

http://www.oiforum.com/documents/download-technology-

options-for-400g-implementation/

Carrier/User requirements

Survey of modulation formats/options from White Paper

400G Systems

Theoretical system parameters in terms of OSNR@BER=10-2 (SD-FEC) /OSNR@BER=10-3 (HD-FEC) for all reported modulation formats

9

Coherent Transport

Optical components still dominate coherent modem system costs and this cost is very volume sensitive.

Complexity and system level flexibility at the coherent DSP engine level actually enables a substantial cost savings for the industry since it enables the consolidation of the industry EO component volumes into only three functions.

• This is the strength of the coherent solution for transport.

• It has enabled coherent to move into markets not originally

expected [dominates Metro now]

10

Flexible transceiver

11

What can be flexible？ • Baud rate

• Modulation format

• FEC algorithms and overhead

• Sampling rate

• Grid

Different combinations suitable for different scenarios

Interfaces to support SDN which brings end to end reconfiguration and performance optimization

Steven Gringeri, Nabil Bitar, and Tiejun J. Xia. "Extending Software Defined Network Principles to Include Optical Transport." IEEE Communications Magazine March 2013: 32-40.

Flexible Coherent DWDM Transmission Framework

Description:

• There are different technical approaches for beyond 100G, but

lack of consensus on implementation.

• Different from 100G, new features like flex data rate (single chip)

have been incorporated into beyond 100G technology.

• Business perspective to improve the investment on the beyond

100G technology elements for both system vendors and

component suppliers.

Goal/Scope: This project will develop a Framework:

• Technical solution(s) for Flex Coherent Transmission

implementation for different application scenarios: long haul,

metro, and data center inter-connection.

• To provide guidance on the hardware implementation, which is

given fundamentally by two parameters: the modulated

spectrum width and the number of optical carriers.

CFP8-ACO

Description:

• A new analog coherent optics (ACO) project that supports

higher baud rate and higher wavelength/carrier-count

applications at higher density per wavelength/carrier than the

existing CFP2-ACO.

• Up to 4 wavelengths/carriers.

• Up to 64 Gbaud per wavelength/carrier.

Utilizes existing CFP8 definition from the CFP-MSA group:

• 20W power profile.

• The 9.5 mm module height allows for a double stack line card

design or belly to belly.

• The 40 mm module width enables a 2 x 8 configuration for a 16

module line card.

Validation of PLL Work: Interop Demos!

Interoperability demos have taken place at OFC and ECOC over the past 4 years demonstrating CEI-25G, CEI-56G and CFP2-ACO These are interops of OIF member hardware

Summary

OIF has an established history of meeting industry needs for interoperable electrical channels, protocols and optical hardware.

Applications for Backplanes, chip to chip for various reaches, VSR for chip to module, are evolving to meet new requirements and data rates.

Optical solutions are being developed that enable flexibility of deployment in terms of reach and bandwidth

The complete industry benefits when we work together to build an ecosystem.

Thank You!