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AMD~ DELIVERING THE FUTURE OF HIGH-PERFORMANCE COMPUTING MARK PAPERMASTER Aug 5, 2019
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DELIVERING THE FUTURE OF HIGH-PERFORMANCE COMPUTING MARK PAPERMASTER Aug 5, 2019
AMD HISTORY OF INNOVATION
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First to break the First to break teraflops World 's First 4K game First 16-core World's first 7nm
historic 1GHz barrier performance barrier first APU consoles HEDT processor datacenter GPU
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World 's first x86-64 First to break Inside every major First 32-Core First 32-core First 7nm bit architecture 1GHz GPU barrier gaming console x86 single socket HEDT processor chiplet design
server CPU
GPU AND CPU PERFORMANCE TRENDS
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PROCESS TECHNOLOGY DELIVERED SIGNIFICANT GAINS
Technology Energy Efficiency and Density Across Process Nodes
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- - --·--- TO CONTINUED PERFORMANCE IMPROVEMENT
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MOORE'S LAW KEEPS SLOWING
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WHILE COSTS CONTINUE TO INCREASE Cost Per Yielded mm2 for a 250mm2 Die
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ADVANCES WILL CONTINUE
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AMD "Zen 2" CPU-based system scored an estimated 15% higher than previous generation AMD “Zen” based system using estimated SPECint®_base2006 results. SPEC and SPECintare registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org. RZ3-34
CORE DESIGN AND IP
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MAINSTREAM 2P SERVER PERFORMANCE
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EXTREME MODULARITY
Chiplets andMCMs
Passive lnterposers and 30 Memory
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Today
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Silicon Modularity from Advanced
30Stacking
System and Component Modularity
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COMPUTING PLATFORMS
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HETEROGENEOUS PLATFORMS FPGAs/ Accelerators High Speed Interconnects
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OPTIMIZING SYSTEM PERFORMANCE WITH HETEROGENEOUS COMPUTING
- Semi-Custom Socs & FPGAs
- GPGPU
- General Purpose Cores
APPLICATIONS
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MACHINE LEARNING EXPANDS ITS REACH
Today
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Future
Future Al algorithms will require unique configurations
Inference for Low-Power Environments
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FUTURE PROLIFERATION OF HETEROGENEITY
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Today
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RESEARCH APPLICATIONS
SPACE EXPLORATION
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CLIMATE CHANGE
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CHEMICAL SCIENCES
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ENERGY SOLUTIONS
MACHINE LEARNING REAL TIME SIMULATION
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THE DOE, AMD & CRAY ANNOUNCE FRONTIER
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SOFTWARE CHALLENGES IN EMERGING SYSTEMS
SOFTWARE OPPORTUNITIES IN EMERGING SYSTEMS
FUTURE HIGH-PERFORMANCE COMPUTING REQUIRES INNOVATION IN ALL DIMENSIONS
SILICON
Efficient, power optimized designs
with innovative architecture
24 I FUTURE OF COMPUTING COi
SYSTEM
Interconnects, memory and topologies balanced
to address the key performance bottlenecks
SOFTWARE
Self-optimizing software to
accelerate system capabilities
SECURITY
Secure Virtual Machines
Components that are Robust to Side Channel and
Denial of Service Attacks
Scalable Security from loT to Cloud
Trusted Supply Chain
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expressed in this material are those of the author(s) and do not
necessarily reflect the views of the Networking and Information
Technology Research and Development Program."
The Networking and Information Technology Research and Development
(NITRD) Program
Mailing Address: NCO/NITRD, 2415 Eisenhower Avenue, Alexandria, VA 22314
Physical Address: 490 L'Enfant Plaza SW, Suite 8001, Washington, DC 20024, USA Tel: 202-459-9674,
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