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Detector module development for the CBM Silicon Tracking System
Anton Lymanetsfor the CBM collaboration
Universität Tübingen, Kiev Institute for Nuclear Research
KINR
2
STS terminology
05.03.2013
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013
station 1
station 2
station 4
station 6
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 3
Module concept05.03.2013
sensor1024 strips58 μm pitch
microcablemultilayer
Module design is driven by the material budget and noise requirements.
front-end board8 chips with 128 channels each
To be mounted support structurescarbon fibre
05.03.2013
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 4
Sensor + cable
05.03.2013
• 1024 strips• ± 7.5 stereo angle• 58 μm strip pitch• (6262) mm2 size
Multi-layer cable mock-up
Cable structure
Wide cable is to be connected to a sensor
Kapton mesh
Kapton
Al
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 5
Sensor + cable interconnection
05.03.2013
Daisy-chained sensors
Sensor-to-cable connection
Mechanical and handling studyExperience: alignment of a cable with 1024 strips is difficult!
Connection technology: TAB bonding
L-shaped legs for sensor mounting
Manufactured in Kharkiv(SE SRTIIE)Talk: M. Singla HK 35.7
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 6
Sensor + cable prototypes
05.03.2013
See: T. Balog HK 35.8 Performance evaluation of a module prototype
Compatible with current n-XYTER front-end boards with ERNI connectors
30 cm
Goal: demonstrate the cable concept, TAB bonding, long cables
•2128 channels(double-sided
readout)•Different lengths
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 7
New module assembly concept
• Many narrow cables (128 channels each)• Same multi-layer structure• Mitigate alignment, yield and testability risks
05.03.2013
8
Sensor quality assurance
•Visual inspection•Electrical characterization▫Current-voltage▫Capacitance-voltage behavior▫Interstrip parameters: resistance and capacitance▫Channel yield (coupling capacitors, PN-junctions)▫Double-metallization▫Shorts and breaks
05.03.2013
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013
1300+ double-sided sensors have to be tested: probe station, long term stability, etc…
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 9
Front-end electronics
05.03.2013
FEE prototype base on n-XYTER chip STS front-end board concept• STS-XYTER chip• 8 chips (128 channels each)• Chips are wire-bonded to the PCB
Readout chips have to be tested individually before FEB assembly.
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 10
Module assembly steps
05.03.2013
Tested chip + tested cable
Readout test only after full assembly every component has to be testedNeed quality assurance, logistics and tooling for module production
TAB bond both sensorsides using fixtures(non-reworkable)
Nest chips in a FEB,Wire bond to the PCB
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 11
Low-mass support structures
05.03.2013
Mechanical study: carbon fibre support
• ultra-light: mass 14 g/m• mechanical precision within 100 μm• maximal rigidity
A. Lymanets - Detector module development for the CBM STS - DPG Dresden 2013 12
Summary
•Module hierarchy developed•Quality assurance tasks▫Sensors▫Cables▫Front-end-electronics▫Tooling and procedures are under development
•Fixtures for quality assurance and module assembly
•Quality assurance for >1000 modules will be required
•QA sites in Germany (GSI, Tuebingen) and Russia (Dubna)
05.03.2013