DEVELOPMENT OF A THERMAL ENERGY
STORAGE SYSTEM FOR COLD CHAIN
APPLICATION
Author
Md. Monir Hossain
DEPARTMENT OF MECHANICAL ENGINEERING
DHAKA UNIVERSITY OF ENGINEERING & TECHNOLOGY, GAZIPUR
DECEMBER 2019
DEVELOPMENT OF A THERMAL ENERGY
STORAGE SYSTEM FOR COLD CHAIN
APPLICATION
A Thesis
by
Md. Monir Hossain
DEPARTMENT OF MECHANICAL ENGINEERING
DHAKA UNIVERSITY OF ENGINEERING & TECHNOLOGY, GAZIPUR
DECEMBER 2019
DEVELOPMENT OF A THERMAL ENERGY
STORAGE SYSTEM FOR COLD CHAIN
APPLICATION
A Thesis
by
Md. Monir Hossain
Student No.: 142301 (P), Session: 2014-2015
Supervisor
Dr. Hasan Mohammad Mostofa Afroz
Professor, Department of Mechanical Engineering
Director, Institute of Energy Engineering
Dhaka University of Engineering & Technology, Gazipur
Submitted to the
DEPARTMENT OF MECHANICAL ENGINEERING
DHAKA UNIVERSITY OF ENGINEERING & TECHNOLOGY, GAZIPUR
In partial fulfillment of the requirements for the award of the degree
MASTER OF SCIENCE IN MECHANICAL ENGINEERING
DECEMBER 2019
The Thesis entitled “Development of a Thermal Energy Storage System for Cold Chain
Application” submitted by Md. Monir Hossain, Student No.: 142301-P has been accepted as
satisfactory in partial fulfillment of the requirement for the Degree of Master of Science in
Mechanical Engineering on 17th December, 2019.
BOARD OF EXAMINERS
1. (Dr. Hasan Mohammad Mostofa Afroz)
Professor
Department of Mechanical Engineering
Dhaka University of Engineering & Technology, Gazipur
Gazipur-1707, Bangladesh.
Chairman
(Supervisor)
2.
(Dr. Mohammad Zoynal Abedin)
Professor and Head
Department of Mechanical Engineering
Dhaka University of Engineering & Technology, Gazipur
Gazipur-1707, Bangladesh.
Member
(Ex-officio)
3.
(Dr. Md. Anowar Hossain)
Professor
Department of Mechanical Engineering
Dhaka University of Engineering & Technology, Gazipur
Gazipur-1707, Bangladesh.
Member
4.
(Dr. Md. Mostaqur Rahman)
Associate Professor
Department of Mechanical Engineering
Dhaka University of Engineering & Technology, Gazipur
Gazipur-1707, Bangladesh.
Member
5.
(Dr. Mohammad Ariful Islam)
Professor
Department of Mechanical Engineering
Khulna University of Engineering & Technology
Khulna, Bangladesh.
Member
(External)
DECLERATION
I confirm that the work showed in this thesis or any portion of thesis has not been submitted
previously, to qualify for the award of any other academic degree. The data and information
are derived from the published and unpublished work of others has been acknowledged in the
text and a list of references is given.
Signature
.......................................
(Md. Monir Hossain)
Signature of Thesis Supervisor
...................................................................
(Dr. Hasan Mohammad Mostofa Afroz)
Professor, Department of Mechanical Engineering
Director, Institute of Energy Engineering
Dhaka University of Engineering & Technology, Gazipur
Gazipur-1707, Bangladesh.
Nomenclature
Abbreviation Full Meaning
COP : Coefficient of Performance
LMTD : Log Mean Temperature Difference
PCM : Phase Change Material
PV : Photovoltaics
SHS : Sensible Heat Storage
STC : Standard Test Condition
TES : Thermal Energy Storage
VCR : Vapour Compression System
LHS : Latent Heat Storage
i
Content Page No.
Acknowledgement _________________________________________________________ vi
Abstract __________________________________________________________________vii
Chapter 1: Introduction _______________________________________________________ 1
1.1 Background ___________________________________________________________ 1
1.2 Literature Review ______________________________________________________ 2
1.3 Scope of Work ________________________________________________________ 5
1.4 Objectives of the Current Research Work ___________________________________ 5
Chapter 2: Phase Change Material (PCM) as Thermal Energy Storage __________________ 6
2.1 Introduction to Phase Change Material (PCM) _______________________________ 6
2.2 Categorization of PCMs _________________________________________________ 6
2.2.1 Organic Type PCM _________________________________________________ 7
2.2.2 Inorganic Type PCM ________________________________________________ 7
2.2.3 Eutectic Type PCM _________________________________________________ 8
2.3 Implementation of PCMs as Thermal Energy Storage __________________________ 8
2.3.1 Solar Photovoltaic (PV) System _______________________________________ 8
2.3.2 Air Conditioning applications _________________________________________ 9
2.3.3 Solar Water Heating Application _______________________________________ 9
2.3.4 Biomedical applications ______________________________________________ 9
2.3.5 Thermal Energy Storage in Buildings __________________________________ 10
2.3.6 Nuclear Thermal Energy Storage Systems ______________________________ 11
2.3.7 Storage and Transport of Thermal Sensitive Products _____________________ 11
2.3.8 Other Applications _________________________________________________ 12
Chapter 3: Experimental Setup & Methodology __________________________________ 13
3.1 Experimental Facility __________________________________________________ 13
3.2 PCM Heat Exchanger __________________________________________________ 14
3.2.1 Casing or Shell ____________________________________________________ 15
Table of Contents
ii
3.2.2 PCM Plate _______________________________________________________ 16
3.2.3 Heat Exchanger Coil _______________________________________________ 17
3.2.4 Fin _____________________________________________________________ 18
3.2.5 Refrigerant Distributor ______________________________________________ 18
3.2.6 Condensing Unit __________________________________________________ 19
3.3 Fabrication of the Experimental Setup _____________________________________ 20
3.4 Design of the PCM Heat Exchanger _______________________________________ 21
3.5 Equipment used in the Experiment ________________________________________ 22
3.6 Experimental Procedure ________________________________________________ 26
Chapter-4: Results & Discussions _____________________________________________ 28
4.1 Solidification and Melting Characteristics of PCM ___________________________ 28
4.1.1 Temperature Distribution during Solidification (Basic Model)_______________ 29
4.1.2 Temperature Distribution during Melting (Basic Model) ___________________ 32
4.1.3 Temperature Distribution during Solidification (Fins Incorporated Model) _____ 34
4.1.4 Temperature Distribution during Melting (Fins Incorporated Model) _________ 36
4.1.5 Temperature Distribution during Solidification (Refrigerant Distributor Model) _ 38
4.1.6 Temperature Distribution during Melting (Refrigerant Distributor Model) _____ 40
4.1.7 Comparisons of Solidification Phenomena for all Models __________________ 41
4.1.8 Melting Phenomena Comparison for all Models __________________________ 43
4.2 Performance Analysis of VCR System _____________________________________ 45
4.3 Performance Analysis of Air Side of PCM Heat Exchanger ____________________ 46
Chapter-5: Conclusion and Further Research _____________________________________ 49
5.1 Conclusion __________________________________________________________ 49
5.2 Future Research Work _________________________________________________ 50
References ________________________________________________________________ 51
iii
Caption Page No.
Figure 2.1: Classification of PCM (Solid-Liquid) __________________________________ 6
Figure 3.1: Schematic Diagram of the Experimental Setup __________________________ 13
Figure 3.2: Photographic View of the Experimental Setup __________________________ 14
Figure 3.3: PCM Heat Exchanger at different Manufacturing Level ___________________ 15
Figure 3.4: PCM Plates with PCM and Heat Exchanger Coil ________________________ 16
Figure 3.5: PCM Plates with Heat Exchanger Coil ________________________________ 16
Figure 3.6: PCM Heat Exchanger Coils outside and within PCM Plates ________________ 17
Figure 3.7: Helical Coil Tube with its Dimensions ________________________________ 17
Figure 3.8: Heat Exchanger Coils with Incorporated Fins ___________________________ 18
Figure 3.9: Positions and locations of fins within PCM plates ________________________ 18
Figure 3.10: Refrigerant Distributor Attached to the Experimental Setup _______________ 19
Figure 3.11: Photographic view of Condensing Unit with its Components ______________ 19
Figure 3.12: Positions of Thermocouples within PCM Plates ________________________ 20
Figure 4.1: PCM Heat Exchanger Models (a) Basic Model (b) Fins Incorporated Model (c)
Refrigerant Distributor Model ________________________________________________ 28
Figure 4.2: Plate and Coil Numbering of the PCM Heat Exchanger ___________________ 29
Figure 4.3: Temperature Distribution during Solidification (all plates) without Fin and
Distributor ________________________________________________________________ 29
Figure 4.4: Temperature Distribution during Solidification (a) Plate-1 (b) Plate-2 (c) Plate-3
without Fin and Distributor ___________________________________________________ 30
Figure 4.5: PCM Heat Exchanger during Solidification (Basic Design) without Fin and
Distributor ________________________________________________________________ 31
Figure 4.6: Temperature Distribution during Melting (all plates) without Fin and Distributor
_________________________________________________________________________ 32
Figure 4.7: Temperature Distribution during Melting (a) Plate-1 (b) Plate-2 without Fin and
Distributor ________________________________________________________________ 32
Figure 4.8: Temperature Distribution during Melting (a) Plate-3 without Fin and Distributor
_________________________________________________________________________ 33
Figure 4.9: Temperature Distribution during Solidification (all plates) with fin __________ 34
List of Figures
iv
Figure 4.10: Temperature Distribution during Solidification (with fin) (a) Plate-1 (b) Plate-2
(c) Plate-3 with fin _________________________________________________________ 35
Figure 4.11: Temperature Distribution during Melting (all plates) with fin ______________ 36
Figure 4.12: Temperature Distribution during Solidification (with fin) (a) Plate-1 (b) Plate-2
(c) Plate-3 with fin _________________________________________________________ 37
Figure 4.13: Temperature Distribution during Solidification (all plates) with Fin and
Distributor ________________________________________________________________ 38
Figure 4.14: Temperature Distribution during Solidification with Distributor and Fin (a) Plate-
1 (b) Plate-2 (c) Plate-3 with Fin and Distributor __________________________________ 39
Figure 4.15: Image Taken during Solidification with Fin and Distributor _______________ 39
Figure 4.16: Temperature Distribution during Melting (all plates) with Fin and Distributor _
_________________________________________________________________________ 40
Figure 4.17: Temperature Distribution during Melting with Distributor and Fin (a) Plate-1 (b)
Plate-2 with Fin and Distributor _______________________________________________ 40
Figure 4.18: Temperature Distribution during Melting with Distributor and Fin at Plate-3 with
Fin and Distributor _________________________________________________________ 41
Figure 4.19: Temperature Distribution during Solidification at plate-1 for different Design
Conditions ________________________________________________________________ 41
Figure 4.20: Temperature Distribution during Solidification at plate-2 for different Design
Conditions ________________________________________________________________ 42
Figure 4.21: Temperature Distribution during Solidification at plate-3 for different Design
Conditions ________________________________________________________________ 42
Figure 4.22: Temperature Distribution during Melting at plate-1 for different Design
Conditions ________________________________________________________________ 43
Figure 4.23: Temperature Distribution during Melting at plate-2 for different Design
Conditions ________________________________________________________________ 44
Figure 4.24: Temperature Distribution during Melting at plate-3 for different Design
Conditions ________________________________________________________________ 44
Figure 4.25: R-22 P-h Chart for Existing Refrigeration System ______________________ 45
Figure 4.26: Bypass Factor of PCM Heat Exchanger at Different Velocities ____________ 47
Figure 4.27: Average Inlet Air Temperature, Average Outlet Air Temperature and Average
Plate Surface Temperature ___________________________________________________ 47
Figure 4.28: Sensible Heat Transfer Rate by Air at Different Time ____________________ 48
v
Caption Page No.
Table 3.1: Specification of PCM Heat Exchanger _________________________________ 15
Table 3.2: Specification of PCM Heat Exchanger Casing ___________________________ 15
Table 3.3: PCM Plates Specification ___________________________________________ 17
Table 4.1: Pressure and Temperatures at different Positions of the Refrigeration System __ 46
Table 4.2: Bypass Factor of PCM Heat Exchanger at Different Air Velocities ___________ 46
List of Tables
vi
Acknowledgement
Foremost, I would like to offer this endeavor to our almighty Allah who showered his utmost
blessings upon me during the challenging moments of this journey. He always provided me the
strength, good health and peace of mind for doing the research.
It is a pleasure to express my heartiest gratitude to my thesis supervisor, Prof. Dr. Hasan
Mohammad Mostofa Afroz, Director, Institute of Energy Engineering. His motivation
stimulated me in all the time of study and writing of the thesis. I could not have imagined
having a better mentor than him.
My sincere thanks also goes to Prof. Dr. Mohammad Zoynal Abedin, Head, Department of
Mechanical engineering for his encouragement and insightful comments.
Also, I convey my humble gratefulness to Prof. Dr. Md. Ariful Islam, Prof. Dr. Md. Anowar
Hossain and Dr. Md. Mostaqur Rahman, the committee members of my defense, for their
willingness to manage time even at hardship and also for advices with constructive suggestions.
Also, I would like to thank Md. Abdul Aziz, Lecturer, Institute of Energy Engineering for his
valuable support during the experiment. Finally, I must express my very profound gratitude to
my family members for providing unfailing support and continuous encouragement throughout
the years of study and through the process of researching and writing this thesis. This
accomplishment would not have been possible without them. Thanks all.
vii
Abstract
Post-harvest losses having a great impact in the economy of developing countries like
Bangladesh. To obstruct post-harvest losses and ensure better quality of foods, suitable cold
chain is necessary from harvesting to market selling. Storing thermal energy within phase
change material (PCM) in cold chain application is more advantageous than conventional
refrigeration system. In this aspect proper design of PCM energy storage devices and their
better performance should be assured to preserve cold chain.
In this thesis, three PCM heat exchanger models are developed to investigate the performance
analysis of the heat exchanger models and to compare their research output. In the first basic
model the refrigerant is distributed through a header mechanism to the evaporator coil and in
the second model fins are incorporated at the evaporator coil side and the header mechanism
at the inlet side of the evaporator is replaced by an efficient refrigerant distributor in the third
model. In the first model during charging period it is found that the nearest coil region solidified
within 2 hours and furthermost regions remain in liquid state for very longer time.
Incorporating fins in the evaporator coil side give improvement in solidification characteristics
in the second model but all the PCM regions are not completely solidified although it takes
more than 6 hours for partial solidification. In the third model where, refrigerant distributor is
used the solidification is completed in all the regions within 3.0 hours. During discharging
(melting) period the last model ensures almost 4.0 hours melting period.
In the refrigerant distributor model experiment shows that the heat exchange rate between air
and PCM is higher at the initiation of melting period and reduced with increasing time of
melting. The temperature difference between inlet and outlet air is higher at the initial
discharging period and becomes lower with increasing time. The sensible heat transfer rate
decreases with increasing time period and it varies from 2200 to 1300 W within 4 hours time
period. The PCM plate temperature is also increased with increasing duration of melting.
Temperature difference varies from 16 to 9C within 4 hours time period. The air bypass factor
of the PCM heat exchanger is increased by increasing air velocity. Bypass factor increases 6%
from the air velocity 1.2 m/s to 2m/s.
The performance of refrigerant distributor model is quite satisfactory and some other
modification can improve its heat transfer rate further. This type of heat exchanger is best suited
for cold chain application like refrigerated vehicle or cold storage.
1
Chapter 1: Introduction
1.1 Background
Thermal energy storage (TES) is now-a-days a major concern due to higher cost of energy and
inadequacy of energy resources. TES can be utilized either latent heat (changing phase of
storage material) or sensible heat (changing the storage material temperature). In sensible heat
storage (SHS) system the physical state of the storage material remains unchanged such as
solid to solid, liquid to liquid or gas to gas. But in latent heat storage (LHS) system the physical
state of the storage material is changed to another state like solid to liquid, liquid to gas or gas
to solid. The most suitable phase transition is solid-liquid transition due to greater heat of
fusion. These solid-liquid latent heat storage materials are also known as phase change material
(PCM). The latent heat storage system is more convenient to store thermal energy (hot or cold)
due to its compactness, higher heat storing capacity, changing phase at a constant temperature.
The PCM latent storage method suitable for food cold chain application, air-conditioning,
electrical load shifting and so on. Food cold chain is most sensitive part for human health
security. Different foods like fish, vegetables, meat have to store at every stage (from harvest
to consumption) at different standard temperature to minimize the metabolic and microbial
deterioration. In developing countries like Bangladesh, the use of refrigeration system to store
foods increasing rapidly during last decade to reduce the post-harvest losses. The additional
load for the refrigeration system drives to load variation in electricity demand and supply. In
this circumstances PCM storage system can give better solution by shifting load from peak to
off-peak hour. During night period when the electricity demand is less, the energy can be stored
to PCM and at the day-time this stored energy from PCM can be used by simple solidification-
melting process.
Transportation of foods from one place to another by using vapour compression driven
refrigerated vehicle is another problem due to use of large amount of fuel, increasing CO2
emission. This problem can be resolved by using PCM based refrigerated vehicle where PCM
plate is placed on the wall of vehicle refrigerated space and heat is exchanged within foods and
PCM. In all the stages of food cold chain PCM can be a better alternative than existing systems.
A very important issue is to select suitable PCM, since different products have to store different
standard temperature and humidity. Different PCMs change their phases at different
temperature. So, it is very inefficient to use different PCM in a single cold storage or many
cold storages from which each cold storage is based on a single PCM. A major drawback of
PCM is the lower thermal conductivity at solid phase that reduces heat transfer from PCM to
foods.
2
Developing a PCM based heat exchanger could be a better alternative which will be placed
outside the cold storage or refrigerated vehicle and supply cold to the chamber. The
experimental analysis of energy storage using PCM heat exchangers is a burning topic,
primarily due to the high latent heat of PCMs upon freezing and melting nearly at constant and
workable desired temperatures. However, the technology of the PCM based heat exchanger, its
heat transfer characteristics, performance, sizes should be analyzed before its
commercialization. That’s why the performance, air side heat transfer characteristics,
solidification and melting is analyzed throughout the research work.
1.2 Literature Review
Refrigeration makes reduction of the rate at which food changes is occurred. These changes
mainly microbiological (microorganisms’ growth), physiological (e.g. respiration, ripening),
biochemical (e.g. pigment degradation, browning reactions and lipid oxidation) and moisture
loss. An effective cold-chain can prevent or slowing these changes efficiently.
Temperature effect in storage conditions already analyzed for varieties foods such as
vegetables [1], frozen dough [2], ice cream [3-5], and meat [6-7]. Duun et al. [6] investigated
the drip loss from pork roast under various storing conditions. Greater drip loss was occurred
from meat subjected to temperature abuse than storing meat at a fixed temperature. Yanniotis
et al. [7] investigated the bovine muscle drip loss (Musculus semimembranosus) stored in a
freezing chamber running with defrosting cycles. The drip loss with defrosting was higher
comparing without defrosting cycle in the meat samples. Ice cream is also under investigations
to check the impact of storage conditions. Flores and Goff [5] analyzed that ice crystals size
was larger under shifting conditions comparing constant storage temperature. Donhowe and
Hartel [3, 4] investigated the same result as size increasing of crystal.
In reality a small amount of foods (almost 10%) are usually refrigerated and post-harvest losses
tends to 30% of total production [8]. So, providing safe, high quality food products the cold-
chain from the initial freezing, storage, transport, to retail display in every aspect must be paid
attention. But due to cost increasing and lack of energy resources many researchers focused on
thermal energy storage. It is currently using in household water heating; its use is essential for
solar heating; off-peak air conditioning and load factor of electric utilities can be improved [9].
In off-peak air conditioning [9] 'coolness' is produced during off-peak time when the generation
of electricity exceeds demand, stored in a TES material and used during peak hour of electricity
demand. TES can be achieved either through sensible heat or through latent heat (phase
change). The significance of PCM for energy storage is well established, primarily due to their
higher thermal energy storage density.
The performance of a latent heat storage module consists of cylindrical shaped capsules packed
with PCM and heat transfer fluid passing along the capsules, this heat exchange is already
3
investigated for different PCMs [10-12]. Green and Vliet [13] developed a shell and tube type
heat exchanger having baffles where water is using on the shell side as the heat transfer fluid.
The PCM was encapsulated in the horizontal tubes bundle. The rectangular encapsulation was
also analyzed where the PCM was accommodated alike to plate-type heat exchanger
arrangement. Abhat [14] and Humpries et al. [15] have abridged about the materials that can
be used as latent heat storage material. Commercially available paraffin waxes are less costly,
having intermediate thermal storage densities, and a broad span of melting temperatures. But
most of these having lower thermal conductivities that bound their used. To ensure fair heat
transfer rate at solidification or melting periods of the PCM, a notable temperature difference
must be maintained between the temperature of heat transfer fluid and the temperature of
melting of PCM. So that the PCM should be chosen based on their melting temperatures and
higher latent heats of fusion. Admitting this situation, Farid [16] suggested to use PCM's having
different melting temperatures to enhance heat transfer rate in a rectangular encapsulation
storage unit. The concept was enlarged further by Farid et al. [17] for PCM's encapsulation in
multirows of upright cylinders with heat exchange medium as air flowing covering them. The
simulation result of that unit represents notable development in heat charging and discharging
in which three PCM's of dissimilar melting temperatures were utilized. The waxes were
presumed to be melted at certain temperatures in this simulation that can be valid only for pure
compounds.
Due to availability PCMs at different temperatures allow wide range of application for storing
thermal energy and load shifting purposes. In spite of the great advantages of PCM that can
dispense, many systems are quiet using alternative methods and giving the idea of PCM heat
exchangers for storing thermal energy. Heat extraction from pool-type nuclear reactor is an
example. Pool water temperature is increased by 2 °F per 1 h when in operation, so the cooling
rate is less than 2 °F per 48 h after shutdown. To retrieve this, Castano et al. [18] theoretically
designed a sensible heat storage system using chilled water/glycol tank to exchange heat in
looping with the main cooling system of reactor and cool pool water of 30,000 gallon from 88
°F to 68 °F in 1.5 h. For the extended period of reactor at full power operation and power
upgrade in future, a higher cooling mechanism is required than the finite sensible heat of water.
Using PCM in TES systems can solve these restrictions. PCM has higher storage density in a
compact size and having the ability to discharge at constant temperatures compared to water
with sensible heating systems.
Thermal energy storage using PCM can also be used in data centers like Apple, Google,
Facebook and so on where the temperature rises due to heat generated by electronic circuits. In
2008, ASHRAE’s standards and thermal guidelines 2008 [19, 20] amplified the maximum
permissible operating temperature range of A1 class servers and data centers to 32 °C and
recommended 27 °C for all classes. So, the thermal load of data center can be encountered by
the chilled water supply of 22–24 °C temperature. It is feasible to produce 16–17 °C or lower
4
water temperature for data centers and store “cold” energy in PCM at off-peak periods at night
from cooling tower in absence of mechanical chiller systems.
PCM thermal energy storage system gives a simpler and workable solution. PCMs are specified
by their less thermal conductance that can reduce the heat transfer rate. In order to recompose
for the less thermal conductivities, very efficient design must be employed. Coil-in-PCM
arrangement heat exchanger analyzed by researchers [21–23], their major problem is the less
heat transfer area to volume [24]. Many researchers investigated disseminate particles of high
thermal conductivity and micro encapsulation. The investigation performed by Martin et al.
[25] in a porous graphite matrix utilizing encapsulated PCM of paraffin and 50% performance
was enhanced for storing energy in response time. However, 20% less energy storage density
was detected. Zhao et al. [26] analyzed implantation of metal foam as a metallic matrix
structure and result showed 3 to 10 times improvement of the overall heat transfer (U) rate.
Medrano et al. [24] investigated experimentally five distinct categories PCM heat exchangers,
counting plate type heat exchanger design and shell-and-tube design also. During testing under
the similar environment, the highest average thermal power found at compact plate type design
and shell and tube design having better heat transfer area to heat transfer volume. Lin et al. [27]
analyzed plastic slabs matrix which is packed by PCM. The result shows that the compactness
and slabs thickness play crucial role to achieve highest heat transfer.
The use of well conductive fins provides a feasible solution to enhance the performance of
thermal energy storage unit heat transfer [28]. In addition, no difficulties during fabrication,
lower cost, and fins gain maintenance is a prospective way comparing with other heat transfer
enhancement approaches [29, 30]. Using fin to raise heat transfer, corrosion potential and
thermal conductivity are two main criteria for selecting fin materials. In addition, the cost of
fin materials different thermophysical properties, and machinability also important parameters
[31]. Shaon et al. [32] investigated solidification and melting characteristics of PCM
numerically and validated with experimental data to examine the performance of an innovative
latent heat based thermal energy storage system. In melting period higher heat flux, energy
storage and faster solidification is obtained for PCM pack of 6.5 cm thickness with maximum
number of fins. For the design of PCM based thermal energy storage the review by the
researcher is available in [33, 34].
In brief analyzing many researches work it is found that the performance of thermal energy
storage devices solely depends on the surface area between PCM and heat transfer fluid. PCM
thermal conductivity can be increased by macro encapsulations but this application is limited
for weight, costings and energy storage density draining due to the presence of additives. The
incorporating fins also give some improvement. The uniform distribution of heat throughout
the PCM is very crucial.
5
1.3 Scope of Work
This research work represents the suitable design of a PCM latent thermal energy storage
system by analyzing different characteristics like solidification-melting phenomena, heat
transfer rate, air side temperature variations, bypass factor and system COP. In this aspect
initially a PCM heat exchanger is designed, fabricated and analyzed. Based on the result the
design is modified and again analyzed to reach the optimum design approach. Water is used as
a PCM that having phase transition temperature at 0C. Using water as a PCM positive
temperature can be maintained within cold storage or refrigerated vehicle and wide range of
fresh fruits and vegetables can be stored by controlling the cold flow to the cold storage.
1.4 Objectives of the Current Research Work
The following objectives will be considered in the present study:
a. To develop a PCM based energy storage unit with heat exchanger.
b. To check the performance of the heat exchanger such as solidification, melting
characteristics of PCM, air side bypass factor, air temperature variations at inlet and
outlet of the heat exchanger.
c. To select suitable design of PCM heat exchanger from different modifications.
d. To calculate system capacity needed for the designed PCM heat exchanger.
6
Chapter 2: Phase Change Material (PCM) as Thermal Energy Storage
The storing system of thermal energy can be sensible or latent. Latent heat storage system has
some advantages over sensible heat storage system like higher heat of fusion/vaporization,
energy density etc. Within latent heat storage system liquid to solid phase change has greater
flexibility than liquid-gas phase change. Liquid to solid phase change latent storage material is
also known as phase change material (PCM).
2.1 Introduction to Phase Change Material (PCM)
Phase change materials (PCM) are the substances which have high latent heat of fusion,
solidification and melting is occurred at a fixed temperature, stores and releases large amount
latent heat energy.
2.2 Categorization of PCMs
An extensive range of PCMs with varying working temperature and thermal properties are
available. The classification of PCM (solid-liquid families) shown in figure 2.1. These PCMs
broadly categorized as eutectic, inorganic and organic [34].
Figure 2.1: Classification of PCM (Solid-Liquid)
7
2.2.1 Organic Type PCM
Paraffin and Non-Paraffin are the major category of organic PCMs. Paraffin is composed of
saturated hydrocarbon chain (CnH2n+2). The length of chain dependent to the latent heat of
fusion and it maintains a proportional relationship. Paraffin have the special properties such as
non-toxic, having better stability upon cycling, non-corrosive, ability to crystallize with little
amount of subcooling or no subcooling [35]. They are quite flammable, lower thermal
conductivity and changing the volume is high during phase transition. The modern class of
PCMs for TES is non-paraffin materials [34]. Although there are different types of non-paraffin
but, fatty acids having preferable properties like thermophysical and kinetic. It has the high
research of interest now-a-day. The general construction chain of fatty acids is
CH3(CH2)2nCOOH [36]. Fatty acids having the properties such as greater latent heat, changes
of volume are small during phase change, fixed temperature of melting and show reproducible
behavior during melting and solidification compared with paraffin. Since they are composed
of single component that ensures ideal stability on cycling [37]. Fatty acids have some similar
properties as like paraffin. These are less thermal conductivity, flammable at higher
temperature and small or no supercooling [33]. The latest organics PCMs, sugar alcohols
having distinguish formula HOCH2 [CH(OH)]nCH2OH [37]. Since these are in the initial stage
of research phase so slight information is found. The have the properties such as higher heat of
fusion and higher density compared with other different organic PCMs. However, they have
some amount of subcooling compared with other organic PCMs. Fatty acid combining with
alcohol can produce esters which is also known as fatty acid esters. They have the properties
of non-toxicity and exhibit no supercooling. They are commercially available for various
application [38].
2.2.2 Inorganic Type PCM
Metallic alloys and salt hydrates are main two categories of inorganic PCMs. Normally
inorganic PCMs having greater heat of fusion than organic PCMs except sugar alcohols [37].
Salt hydrates comprised of salt and water and after solidification these make crystal matrix
[39]. Their melting temperature vary from 15 to 117C with high latent heat [40]. Molten salts
melting temperature vary from 250 to 1680C [41]. Salt hydrates PCM groups have the great
significance in research and chosen by many researchers due to their wide range of applications
in the TES system. Due to their lower cost and availability of salt hydrates, they are using many
commercial applications for TES. The example of extensively available salt hydrates for
commercial application at low cost are CaCl2.6H2O and Na2SO4.10H2O. These two salt
hydrates PCMs have comparatively high thermal conductivity with others and show small
volume change during solidification/melting. The thermal conductivity varies from 0.4 to 1
W/m-K [39, 40, 42]. One of the major problems of salt hydrates PCMs is the instability on
8
cycling and salt-water separation which leads to reduction in latent heat of energy. Adding
thickened compound could be a solution of this problem. Supercooling and causing corrosion
to metals are another problem of salt hydrate. Metallic alloys are another inorganic PCM having
high weight. Their thermal conductivity is comparatively high and greater latent heat of fusion.
But they are not selected as commercial PCMs for their bulkiness.
2.2.3 Eutectic Type PCM
Eutectic mixtures of inorganic or organic compound makes new PCMs with better properties
and various melting temperatures. Two or more inorganic or organic PCM components consist
mixture which melt and solidify concurrently [39]. Mixing of PCMs is used get new eutectic
PCMs which change their phase at the same temperature but new eutectic PCM have better
melting performance [34]. Eutectic mixtures are usually analyzed by diverse experiments to
find the distinct behavior like fixed melting temperature and greater enthalpy. If some
components give good results then again several experiments are conducted for optimization
such as optimized composition. This requires a lot of research work and time.
2.3 Implementation of PCMs as Thermal Energy Storage
There is vast commercial application of PCMs in TES system. In this part this application will
be discussed. The cost, capacity of thermal energy storage can be reduced by using PCMs in
various applications. It is systematic and environment friendly way of usage of energy. By
using PCM for TES the greenhouse gas emission can be reduced by 40% [43]. PCMs play a
major role for TES application. However, in special cases using PCMs can save 50% energy
can be saved TES systems [35].
2.3.1 Solar Photovoltaic (PV) System
Generation of energy from PV panels solely rely on the solar radiation intensity, panels quality
and panels temperature [44]. PV panel generation efficiency reduces with increasing panels
temperature. From the solar radiation only 10 to 20% is found as electrical energy and rest
amount is used to increase temperature of the PV panels and reflected [43]. The power
efficiency of PV panels is decreased by 0.5% per kelvin with the rising of temperature. The PV
module temperature increase to 80C or higher that leads to 28% loss in electrical energy
conversion from solar energy with reference to the standard test condition (STC). Different
research works have been performed such as use of fans to supply air, pumps to circulate water
or other energy consumable devices to improve PV panels cooling and efficiency. However, to
avoid overheating of PV panels, PCMs integration in the panels is an efficient solution. This
type of PV-PCMs integration system ensure longer life and desired temperature with better
efficiency. Surprisingly PV-PCMs integration system have higher potentiality comparing with
9
other natural ventilation or cooling since PV-PCMs integration is free from the effect of wind
direction. To increase conversion coefficient and reduce power loss due to temperature Hasan
et al. [45] established a PV-PCM system. The PV panel peak temperature is maintained less
than 45C at 950 W/m2 solar irradiation. In another research Atkin and Farid [46] established
a new PV-PCM system. In this system external fins are used in PCM infused graphite to
upgrade the heat transfer at the back side of the panel. By this thermal system 13% efficiency
can be raised. PV-PCM system is viable economically if the excess heat is used to supply
building heating system by introducing solar thermal system with PV-PCM system [47].
2.3.2 Air Conditioning applications
Many researchers investigated PCMs based air conditioning systems. The energy consumption
in air conditioning system based on PCM is lower than existing traditional air conditioning
systems. PCMs extract heat during phase change that reduces the entering temperature of air
to the evaporator coil. This system can increase thermal performance of the air conditioner. A
PCM based air conditioner is analyzed by Chaiyat et al. [48] that ensures the improvement of
thermal efficiency and reducing electricity consumption efficiently. Another researcher
Vakilaltojjar [49] developed a PCM based air conditioner where cold air is passed into several
thin flat PCM containers. The investigation determines the PCM slab thickness and air gaps
effects. Spherical shaped packed capsule PCM bed used in air conditioning system was
analyzed that gives better performance [50].
2.3.3 Solar Water Heating Application
Integration of PCMs into solar heating system can improve efficiency of the solar heating
system. Prakash et al. [51] investigated a PCM based solar heating system (water) which have
PCM layer filled at the bottom. Water is heated first by the sun during day time and then the
heat is transferred into PCM in the latent heat form at the bottom layer. When sun is not
available the heat is transferred from PCM into water to increase its temperature. This system
shows a low efficiency due to imperfect heat transfer between PCM and water. The improved
design of this storage system was analyzed by Ghoneim [52]. A cylindrical shaped tank that is
used as storage of PCM and multiple tubes attached with solar plate is a system of such type.
This system enhances the heat transfer between PCM and water and ensure longer time heat
reservation.
2.3.4 Biomedical applications
In biomedical applications PCMs give important solutions for various biomedical system
which needs thermal protection. Comfort skin temperatures can be maintained by using PCM
based textiles and special bandages that is used for heating or cooling therapy such as burning
10
therapies [53]. At a recent time, hot and cold PCM pads is used to treat several pains and is
available at the doorstep. A special thermal protection device is proposed by Mondieig et al.
[54], which is made of PCM with double walled packaging and very useful for blood storage
and transportation. An innovative concept was developed by Lv et al. [55] in the thermal
protection during cryosurgery by using PCMs. From thermal injury healthy tissues located near
the cancerous tumor can be protected located near the cancerous tumor. A different
investigation performed by Wang et al. [56] for highly effective and sensitive thrombin
detection by using RNA thermal probes with PCM nanoparticles. The thermal probes with
PCM extract heat and exhibit thermal signal at the time of temperature scan. The area and
position of the peak determines the thrombin amount and existence.
2.3.5 Thermal Energy Storage in Buildings
PCMs are used to make comfort range temperature and reduce power consumption in buildings
by storing and releasing heat. In the daytime when sunshine available the energy is stored in
PCMs and at night this energy can be released. The energy is possible to store in different ways
such as using solar cells, PCM within concrete walls, tiles, wallboards [41, 42]. Due to
availability, simplicity and easy installing ceiling tiles and wallboard are commercially very
popular. PCM within the building structure is an efficient management system. It is used as an
alternative of conventional mechanical heating or cooling system since it maintains comfort
temperature in the room. It also helps to reduce the electrical energy consumption by
temperature shifting to the off-peak hour. It also reduces the peak power demand notably. The
ventilated PCM ceiling tiles or wallboards also act as a discharge system at night and can
improve the efficiency of PCM thermal system of the building.
When outside temperature is raised at daytime and it closes to the PCM melting temperature,
all the PCM melts and store thermal energy in the form of latent heat energy. At night the
temperature is low and PCM again solidified by discharging its heat to the environment. The
ventilation system ensures full discharge of PCM and after that new day cycle begins. PCM is
selected based on its phase change temperature to adjust the environment. Pure PCM is not
found for all melting temperatures. In these case eutectic mixtures give the best solution to find
new PCM mixture at desired melting temperatures. Many researchers studied about the PCMs
for building TES system. It is found that the PCM technique in building application can save
14% to 87% thermal energy based on specified environment and parameters [56]. PCM used
as a building TES system can be compared with other building sensible equipment and due to
latent heat storage PCM ensures greater benefit. One of building PCM is Lauryl Alcohol which
melting point is at 23.83C and heat of fusion is 216.5 kJ/kg. On the other hand, the water and
concrete rock heat capacity expect to be 0.750 kJ/(Kg-K) and 4.182 kJ/(kg-K), respectively
[41].
11
2.3.6 Nuclear Thermal Energy Storage Systems
Many researchers already proposed different methods to store excess heat generated at lower
electricity demand by nuclear reactor [57-60]. Nuclear power plants should operate at the
constant base load power for its operational reliability and economic purpose. Due to variable
demand of electricity nuclear reactor must operate at uneven load. Economic penalties can be
occurred due to uneven power demand and capacity factor can be affected badly [60]. In this
type of odd situation, the integrated thermal energy storage system helps the reactors to meet
the demand variations. When demand is low the excess heat can be stored PCM based heat
storage tank by changing PCM phase at an appropriate temperature. Lee et al. [58] suggested
to use underground rocks in the replacement of storage tank with PCM. This excess heat can
be used to produce electricity by conventional thermal power plant when peak demand is
available. Although the availability of various TES system for nuclear power plant, but PCM
is most popular due to its unique advantages such as suitable phase change temperature and
greater storage capacity. Saeed et el. [60] proposed an advanced model where Lithium chloride
is used as a PCM in the storage tank. Nuclear reactor thermal power was retained at fixed level
since the demand is gathered from PCM based TES tank. The research work also considered
the natural safety at unplanned shutdown. Natural circulation is used to transfer decay heat to
the TES tank. The reactor attained a state of shutdown less than half an hour and normal
temperatures is maintained within the safety range during the transient. High melting
temperature PCMs like molten salts or their mixture is selected to design this type of heat
storage tank. The melting temperatures of these PCMs range between 250 and 1680 °C, the
heat of melting range between 68 and 1041 J/g [38].
2.3.7 Storage and Transport of Thermal Sensitive Products
Storage and transport of temperature sensitive products are regular commercial application of
PCMs. In this fields the common products are fresh vegetables, fish, medical commodities,
beverages etc. The performance of a modified refrigerator with PCM was analyzed by Azzouz
et al. [61, 62]. The PCM based refrigerator operates within 5 to 9 hours backup without power
supply based on load condition. The test was performed for various PCM thickness, outside
temperature and thermal loads. The final result showed that the performance is 10 to 30%
higher compared with conventional systems. Gin et al. [63] analyzed PCMs effectiveness
against heat load in a freezer. The common heat loads are electrical power failure, defrosting,
openings of freezer door. The analysis concluded that if PCM is used then the temperature does
not rise remarkably that leads to less energy consumption. It is also demonstrated by
Subramanian et al. [64] that domestic refrigerators with PCM incorporated can enhance the
food quality by reducing hysteresis cycle rate. The transportation of thermal sensitive products
within PCM based containers is cost effective and maintain great quality. PCM containers are
comparatively cheap and it can control the temperature and heat throughout the transportation
12
period. The heat transfer across the wall of transportation trucks can be reduced by using PCMs
[65]. The investigation showed that 29.1% heat loss can be pull back from the refrigerated
trucks. This massive energy savings leads to lower size refrigeration system capacity. This
also increase the operational life for refrigerated trucks and diesel emission is reduced
significantly if it is diesel driven. Using special container for transportation of thermal sensitive
product is an important concern. This can be achieved by using special PCM equipped rigid or
soft containers and having PCM with lower melting temperature [35]. Due to high latent heat
of fusion the PCM is able to maintain the food or commodities at desired temperature level for
a long time period without external source.
2.3.8 Other Applications
The PCMs application in various sector is under development. The possible technique to use
PCMs as TES system are boundless. The use of PCM for special body cooling is proposed for
athletes which ensures comfort by regulating body temperature, reduce fatigue, dehydration
[66]. Another important application is PCM integrated walls. The PCM integrated wall is very
efficient to capture and release heat and very effective in peak load shifting [67]. A thin was
integrated with PCM can act as a high thermal energy reservoir. PCM is also can be used in
the transparent part of the buildings such as special glass window filled with PCM [68]. The
window filled with PCM is more efficient than air filled window and having the capacity to
filter thermal radiation. PCMs can be used in Lithium-ion batteries for cooling purpose to
increase better lifespan by avoiding overheating [69]. PCM can also be used for cooling the
engines either electric or combustion engine [70]. PCMs can also be used for thermal control
in spacecraft, greenhouses and solar cooking system [71, 72, 73].
13
Chapter 3: Experimental Setup & Methodology
3.1 Experimental Facility
In the experimental setup it has three major components such as condensing unit, PCM heat
exchanger and data logging-acquisition system. The schematic diagram of the experimental
setup is shown in figure 3.1. A condensing unit supplies cool refrigerant to the PCM heat
exchanger’s evaporator coil and receives hot refrigerant after exchanging heat to the PCM. In
this case PCM heat exchanger acts as an evaporator. The PCM heat exchanger assembly
consists of a stainless-steel vessel to contain the three PCM plates, baffles and twelve helical
tubes set. PCM plates hold PCM within the plates and copper tubes set (evaporator coils)
submerged within the water. The refrigerant flows through the helical submerged copper tubes
that act as wall between water and refrigerant. Heat is transferred between refrigerant and water
through copper tubes. Water was chosen as PCM for its availability and wide range of
application. During charging cycle the condensing unit is turned on and cool refrigerant passes
through the evaporator coil and PCM becomes solidified. During discharging cycle, the
1. Compressor 6. Mass flow filter 10. Helical coil tube 15. Data to computer
2. Condenser 7. Mass flow meter 11. Thermocouple 16. Computer
3. Receiver 8. Expansion valve 12. PCM plate
4. Filter-Dryer 9. Pressure & temperature 13. Thermocouple line
5. Sight glass sensor (to data logger) 14. Data logger
1
2 3
4 5 6 7 8
9
10
11
12
13
14 16 15
Figure 3.1: Schematic Diagram of the Experimental Setup.
14
condensing unit is turned off and air is sucked from the lower portion of the PCM heat
exchanger and after exchanging heat between PCM and air separated by steel plate, the cold
air then moves away through the upper portion of the PCM heat exchanger and melting of PCM
is occurred. The experimental data is logged with the help of a data logger with data acquisition
system (laptop). In the figure 3.1 the yellow lines indicate refrigeration cycle between
condensing unit and PCM heat exchanger coil and the green lines indicate data receiving and
acquisition from different sensors and thermocouples. The image of the experimental setup
with different components is shown in figure 3.2. The details of each of components of the
experimental setup will be described in the following sections.
3.2 PCM Heat Exchanger
The PCM heat exchanger shown in figure 3.3 is a stainless-steel cased box having three PCM
plates. These plates are small boxes also made from stainless steel and placed within the PCM
box that contain PCM (water). The PCM heat exchanger box is insulated by 1.5-inch (38.1mm)
cork sheet to prevent the heat loss between outside air and PCM heat exchanger. The PCM
plates are separated by three stainless steel baffles which is placed inside the PCM box and
around the plates. The lower and the upper portion of the PCM heat exchanger have opening
to suck and deliver air. The flowing air is directed through PCM plates’ gaps with the help of
baffles like shell and tube heat exchanger. The flow of air through the PCM heat exchanger is
maintained by a runner.
PCM Heat Exchanger
Data Acquisition Laptop
Pressure Sensor
Filter and Drier
Flow Meter
Data Logger
High & Low Pressure Lines
Condensing Unit
Liquid Receiver
Wire Thermocouples
Experiment Table
Figure 3.2: Photographic View of the Experimental Setup
15
The specifications of the PCM heat exchanger are also given in Table 3.1.
Table 3.1: Specification of PCM Heat Exchanger
Parameter Description
Box Size (L × B × H) 0.45 m × 0.40 m × 0.46 m
Box Sheet Thickness 1.5 mm
Plate Size (L × B × H) 0.41 m × 0.10 m × 0.31 m
Amount of PCM (Water) 32.33 kg
Melting or Solidification Point of PCM (Water/Ice) 0 C
Latent of heat of PCM (Water/Ice) 334 kJ/kg
Total Stored Energy 10800 kJ
Thermal Conductivity of PCM (Water) 0.59 W/m.K
Thermal Conductivity of PCM (Ice) 2.20 W/m.K
3.2.1 Casing or Shell
The steel vessel act as a shell which encompasses all the components of the PCM heat
exchanger and ensures the reduction of heat loss since the outer surface of the casing is properly
insulated. Full heat exchanger covered with white PVC sheet of 3 mm thick. The casing holds
the runner which sucks air from the lower portion opening of the heat exchanger and deliveries
it to the upper portion opening (shown in figure 3.3). The specification of the casing given in
the table 3.2 as following.
Table 3.2: Specification of PCM Heat Exchanger Casing.
Parameter Description
Casing Material Stainless Steel
Casing Material Thermal Conductivity 45.3 W/m.K at 20C
Insulation Material Cork Board
Insulation Thickness 38.1 mm
PVC Sheet Thickness 3 mm
Insulation Thermal Conductivity 0.04 W/m.K
Figure 3.3: PCM Heat Exchanger at different Manufacturing Level
16
Parameter Description
Size (L × B × H) without insulation 0.45 m × 0.40 m × 0.46 m
Size (L × B × H) with insulation 0.53 m × 0.48 m × 0.54 m
3.2.2 PCM Plate
The PCM plates are small boxes that contain PCM (water) and evaporator coils submerged into
water. Three PCM plates placed within the PCM box and baffles around these to maintain
uniform gap between plates. The size of the PCM plates were designed by considering the
amount of water, volume expansion of water, volume required for evaporator coil. The
designed size of each of PCM plate is 0.41 m × 0.10 m × 0.31 m (L × B × H). The external
surfaces of the plate come into contact with air to transfer heat from solid ice during discharge
cycle. The photographic view of the PCM plates shown in figure 3.4 and 3.5. The specification
of the PCM plates given in table 3.3.
PCM Plates
Casing
Runner
Figure 3.4: PCM Plates with PCM and Heat Exchanger Coil
Plate-3
Plate-2
Plate-1
Coil no. 1
Coil no. 2
Coil no. 3
Coil no. 4
Figure 3.5: PCM Plates with Heat Exchanger Coil
17
Table 3.3: PCM Plates Specification
Parameter Description
Plate Size (L × B × H) 0.41 m × 0.10 m × 0.31 m
Plate Material Stainless Steel
Thermal Conductivity 45.3 W/m.K at 20C
Plate Material Thickness 1.5 mm
3.2.3 Heat Exchanger Coil
The helical shape of copper tubes (coil) incorporated in the heat exchanger plate and this shape
of the tubes ensure high density of tubes i.e. compact structure. The helical coil shaped tubes
ensure high heat transfer area compared with straight tube. The PCM heat exchanger has 12
sets of helical coils where each of the plate contains 4 sets of tube. At each plate four coil sets
are connected by supply and return distribution header (shown in figure 3.6). The distribution
headers are connected by inlet and outlet header. The specification of each helical coil is shown
in figure 3.7.
Parameter Description
Tube Material Copper
Tube outer diameter 9.525 mm
Tube inner diameter 8.001 mm
Tube Wall thickness 0.762 mm
Helix diameter 76.2 mm
Pitch 25.4 mm
Height 330.2 mm
Coil revolution 13
Figure 3.7: Helical Coil Tube with its Dimensions
Heat Exchanger Coil
Coil Distribution Header
Figure 3.6: PCM Heat Exchanger Coils outside and within PCM Plates
Inlet Header
Outlet Header
18
3.2.4 Fin
In the second modification of the PCM heat exchanger copper fins are attached within the heat
exchanger helical tubes to expand the heat transfer surface area during charging period of PCM.
Two different fin sizes are used to transfer heat flow in both longitudinal and traverse direction
of PCM plates. The incorporated fins within the coils shown in figure 3.8 with fin specification
and the locations of fins within PCM plates shown in figure 3.9.
3.2.5 Refrigerant Distributor
In the third modification of PCM heat exchanger a refrigerant distributor is included in the
supply refrigerant line to distribute refrigerant uniformly through all the helical evaporator
coils. The refrigerant distributor is attached to the inlet side of the PCM heat exchanger and
twelve coils are connected individually with the outlet side of the refrigerant distributor. The
Parameter Description
Fin Material Copper
Fin thickness 0.89 mm
Long fin size (L × B) 375 mm × 35 mm
Short fin size (L × B) 100 mm × 35 mm
No. of long fin per plate 5
No. of short fin per plate 20
Figure 3.8: Heat Exchanger Coils with Incorporated Fins
Figure 3.9: Positions and locations of fins within PCM plates
19
refrigerant distributor is properly insulated to avoid the heat loss through it. The image of
refrigerant distributor connected to the PCM heat exchanger is shown in figure 3.10.
3.2.6 Condensing Unit
The condensing unit is used to supply cool refrigerant to the PCM heat exchanger and solidify
the PCM. The capacity of the condensing unit was 2.0 tons of refrigeration (7.03 kW) that is
capable to continuous supply of refrigerant through the cycle. The refrigerant used in this
condensing unit was R-22.
Refrigerant
Distributor
Figure 3.10: Refrigerant Distributor Attached to the Experimental Setup
Dryer
Liquid Receiver
Condenser
Condenser Fan
Compressor
Accumulator
Expansion Valve
Figure 3.11: Photographic view of Condensing Unit with its Components.
20
The main parts of the condensing unit are as following and also shown in figure 3.11:
a. Compressor
b. Condenser
c. Evaporator
d. Expansion Valve
e. Receiver
f. Filter-Dryer
g. Accumulator
3.3 Fabrication of the Experimental Setup
After manufacturing the PCM heat exchanger the experimental setup was equipped with
several sensors at different positions. Pressure sensors and thermocouples at four positions to
check the system coefficient of performance (COP), two anemometers at the inlet and outlet
air flow positions to check the air velocities variations. Pressure and temperature of the
refrigerant at four different positions such as before and after condenser, before and after the
PCM heat exchanger (evaporator) were obtained by using digital pressure-temperature
combined sensors to examine the system performance. A refrigerant mass flow meter also
attached in the refrigeration line after the condenser to inspect the mass flow rate of the
refrigerant. Twelve thermocouples were submerged into the PCM to check solidification and
melting temperatures variations. Four thermocouples were placed within each PCM plate. The
positions of thermocouples within the plates are shown in figure 3.12. The schematic diagram
full fabricated experimental setup is shown in the figure 3.1.
Figure 3.12: Positions of Thermocouples within PCM Plates
21
3.4 Design of the PCM Heat Exchanger
The heat transfer coefficient at refrigerant side of the evaporator is calculated according to
shah’s [74] method for two phase flow and the heat transfer coefficient at PCM (water) side is
calculated by considering natural convection over horizontal tube or cylinder. Material
properties and different data after calculation is given as following.
PCM Properties Refrigerant (R-22) Properties
Phase Transition Temperature : 0C Saturation Temperature : -6C
Initial/Ambient Temperature : 25C Mass Flow Rate : 145 kg/h
Average/Film Temperature : 12.5C Saturation Pressure : 407.69 kPa
Latent Heat of Solidification : 334 kJ/kg Latent Heat of Vaporization : 209.76 kJ/kg
Density of PCM : 998.9
kg/m3
Density (Liquid Phase) : 1301.6 kg/m3
Viscosity : 1.215 Pa-s Density (Vapor Phase) : 17.504 kg/m3
Thermal Conductivity (Liquid
Phase)
: 0.59
W/mK
Specific Heat (Liquid
Phase)
: 1.154 kJ/kgK
Thermal Conductivity (Solid
Phase)
: 2.2 W/mK Thermal Conductivity
(Liquid Phase)
: 0.0975 W/mK
Prandtl Number : 8.64 Surface Tension : 0.0126 N/m
Viscosity (Liquid Phase) : 0.000233 Pa-s
Viscosity (Vapor Phase) : 0.00001124 Pa-s
• Size of each PCM plate = 0.4046 m × 0.1016 m × 0.3048 m (16 in × 4 in × 12 in)
• No. of PCM plate = 03
• Total Volume of PCM plates = 0.0376 m3
• Total amount of PCM (water) = 32.34 kg (10.78 kg in each plate)
• Approximate time required for solidification = 2.75 hours
• Volume/space required for PCM (water) in PCM plate = 0.0324 m3
• Volume/space required for tube = 0.0017 m3
• Volume/space required for PCM solidification = 0.0030 m3
• Total volume/space required for PCM = 0.0371 m3
• Space available (0.0376 m3 - 0.0371 m3) = 0.0005 m3
• Energy stored in PCM during solidification = 10800 kJ
The calculated heat transfer rate and the size of tube is as following.
Parameter Value
Heat transfer coefficient at refrigerant side, htp : 2677.64 W/m2K
Heat transfer coefficient at PCM side, hT : 70.46 W/m2K
Overall heat transfer coefficient, U : 68.65 W/m2K
22
Parameter Value
Log mean temperature difference, LMTD : 15.22 K
Heat flux, q : 1045.12 W/m2
PCM charging rate, q : 1090.91 W
Tube diameter, d : 0.009525 m
Total length of tube required, L : 34.88 m
Length of tube required per plate : 11.63 m
No. of coil per plate : 04
Length of tube required per coil per plate : 2.91 m
The tubes turned into helix form in the PCM heat exchanger and each plate contains four helix
tubes. So length of per helix is 2.91 m. So helix size will be calculated as following:
Helix size Calculation:
Helix Length, L (m)
𝐿 = 𝑛√(𝐶2 + 𝑃2)
Pitch, P (m) Helix
Diameter, D
(m)
Helix
Circumference, C
(m)
No. of Turns,
n
2.91 m 0.0254 0.0762 0.2394 12.07 13
3.5 Equipment used in the Experiment
The equipment used in this research are listed as following with their specifications.
Equipment Name with Photo Specifications
Refrigerant Mass Flow Meter
Brand: Max Machinery, Inc.
Model: P214 Piston Flow Meter (Frequency)
Flow Range: 5 cc/min to 10,000 cc/min
Accuracy (at 3 cP): ± 0.2% of reading over a 200:1
range
Maximum Operating Pressure: 210 bar (3000 psi)
Recommended Filtration: 10 micron
Fluids: Most non-aqueous, organic liquids
23
Equipment Name with Photo Specifications
Fine Wire Duplex Insulated
Thermocouple Wire
Brand: OMEGA
Model: GG-K-36
Type: K
Maximum Temperature: 482C
Nominal Size: 0.8 mm × 1.1 mm
Pressure Transducer
Brand: Firstrate
Model: FST800-217
Pressure range: up to 600 bar
Operating temperature range: (-40°C to 125°C)
Supply Voltage: 9~30 VDC/ 15~30 VDC
Signal Output: 4~20 mA/ 0~5VDC
Accuracy: ±0.5%FS
Refrigerant Recovery System
Brand: Yellow Jacket
Model: RecoverXLT2-AP™
Capabilities: Vapor, liquid, push/pull
Refrigerants: R-32, R-1234yf, R-1234ze as well as the
most common CFC, HFC and HFO
refrigerants, including R-22, R-404A,
R-407, R-410A, R-448A and R-449A
Compressor: ½ hp, twin cylinder, reciprocating, oil-less
Power Source: 230V - 50/60 Hz
Amps: 4.0
Operating Temperature: 40° to 122° F (4° to 50° C)
Refrigerant Leak Detector
Brand: D-Tek Select
Model: 712-202-G1
Minimum sensitivity: 0.10 oz. / yr. (3 g/a)
Power source: NiMH batteries (rechargeable)
Probe: Rubber-coated flexible metal,
approx. 15 in. (38 cm) long
24
Equipment Name with Photo Specifications
Digital Psychrometer
Brand: Yellow Jacket
Model: 69008
Temperature range: -4° to 122°F (-20° to 50°C)
Resolution: 0.1°F/ºC, 0.1% RH
Operating temperature range: 4° to 122°F
(-20° to 50°C) 0-100% RH
Accuracy: Relative humidity functions
(± 3% RH at 25°C)
Temperature ± 1°F (0.6°C)
Sensors: Temperature: thermistor bead
Humidity: polymer film (capacitance)
Update rate: 2-6 seconds depending on function
Recovery Burnout Filter for Dirty
Systems
Brand: Yellow Jacket
Model: 95014
High capacity inline filter
Removes Moisture and Burnt Oil as well as Acid
Refrigerant Charging Scale
Brand: Inficon
Model: Wey-TEK HD Wireless
Accuracy: ±0.06% of reading, ±0.25 oz. (10 g)
Resolution: 0.25 oz. (10 g)
Wireless range 30 ft. (10 m) v
Vacuum Pump Systems
Brand: Yellow Jacket
Model: 93560
Free air displacement: 6.0 cfm
Motor: 1/2 hp - 1725 rpm
Weighing capacity: 250 lb. (115 kg)
Display: Full-color graphical display
Wireless range: 30 ft. (10 m)
25
Equipment Name with Photo Specifications
Wireless Vacuum Gauge and
vacuume pressure & Temperature
gauge
Brand: Yellow Jacket
Model: ManTooth-PTV (67023)
Pressure Sensing Resolution: 0.1 psi, 0.1 bar, 1 kPa,
0.001 MPa, 0.01 kg/cm^2
Pressure Sensing Accuracy: 0.5% of full scale at 25°C;
1% of full scale 55°F to
130°F; 2% of full scale -40°F to 248°F
Working Pressure: 0 – 700 psia (48.3 bar)
Temperature Sensor Range (Instrument) Sensing
element: -40°F to 266°F (-40°C
to 130°C)
Sight glass
Brand: Yellow Jacket
Model: 41145
Connection: 1/4" Flare x 1/4" Female Flare
Item Weight: 5.4 ounces
Humidity and temperature display
and data logger
Brand: Tektronix
Model: KEITHLY 3706A
Measuring: Temperature, pressure
Up to 576 two-wire or 720 one-wire multiplexers
channels in one mainframe
Expansion Valves
Brand: Danfoss
Model: 068Z3209
Type: Thermostatic
Maximum working pressure: 34 bar
Minimum Temperature: –60°C
Refrigerant: R-22, R-134a, R-407C, R-404A
26
Equipment Name with Photo Specifications
Annemometer
Brand: HTC Instrument
Model: AVM – 07
Air Velocity Range: 0.40 ~ 45.0 m/s
Resolution: 0.1 m/s
Accuracy: ± (2% +0.1m/s)
3.6 Experimental Procedure
During charging cycle the water converted into ice by rejecting heat into the refrigerant which
flows through the heat exchanger coil. After solidification, the ice is used to supply cold to the
room or cold storage chamber. The air comes into the heat exchanger from the lower portion
of the heat exchanger and it touches the PCM plates and becomes cold by exchanging heat
from air to PCM plate that contained ice. This cold air is supplied to the required medium. The
air side heat transfer rate can be enlarged by incorporating fin at the PCM plates.
The PCM heat exchanger was initially designed by considering two phase flow at refrigerant
side and PCM side. After that, manufacturing of the heat exchanger was completed by using
welding, joining, bending, flaring, insulating etc. process. Then the experiment was begun as
following.
I. The full setup was fabricated with twelve thermocouples within PCM plates, four
thermocouples and two anemometers at air inlet and outlet side of PCM heat exchanger,
pressure and temperature sensors at four positions of the refrigeration circuit to take the
readings.
II. Then the condensing unit was in operational mode for a certain amount of time to
examine the solidification characteristics like temperature distribution, solidification
time.
III. After solidification of water, the melting characteristics like temperature distribution,
melting time also observed by using several thermocouples with the help of data
acquisition system. This solidification and melting phenomena were observed 5 times.
IV. Based on the experimental results the design of the PCM heat exchanger was slightly
modified i.e. fins were incorporated with heat exchanger coils. Then again solidification
and melting characteristics were observed 5 times.
27
V. Although solidification and melting characteristics were improved but refrigerant
distribution was not uniform. For that reason, the design of PCM heat exchanger is
again modified by installing refrigerant distributor in replacement of inlet header
mechanism.
VI. During melting period, the inlet and outlet air temperatures and velocities variations
also observed with the help of data logger.
VII. Then these 5 sets of experimental data were analyzed to make a conclusion about the
design of PCM heat exchanger.
28
Chapter-4: Results & Discussions
4.1 Solidification and Melting Characteristics of PCM
Solidification and melting characteristics were observed for three different models. In the first
model which is termed as basic model, header mechanism is used to distribute refrigerant
through evaporator coils. In the second model fins were attached to enhance heat transfer at the
PCM side of the PCM heat exchanger. The header mechanism is still present in this model and
termed as fins incorporated model. In the last model header mechanism was replaced by
refrigerant distributor to distribute refrigerant through evaporator coils. In this model the fins
are also present and name of this model is refrigerant distributor model. These three PCM heat
exchanger models is shown in figure 4.1.
To check the temperature distribution within the plates four thermocouples were placed at each
of the plate. So total twelve thermocouples positioned within three plates. The positions of
twelve thermocouples within plates is shown in figure 3.12. Each of plates having four
evaporator helical coils, one thermocouple is positioned at each of the coils. So, every plate
contains four thermocouples. The numbering of the thermocouple is as following.
𝑇𝑚𝑛 = 𝑇ℎ𝑒𝑟𝑚𝑜𝑐𝑜𝑢𝑝𝑙𝑒 𝑎𝑡 𝑝𝑙𝑎𝑡𝑒 𝑛𝑜. ′𝑚′ 𝑎𝑛𝑑 𝑐𝑜𝑖𝑙 𝑛𝑜. ′𝑛′
Plate number starts from the right side, viewing from the front side of the PCM heat exchanger
and coil number starts from far most region to the closest region of the inlet header. The plate
and coil numbering are shown in figure 4.2.
(a) (b) (c)
Figure 4.1: PCM Heat Exchanger Models (a) Basic Model (b) Fins Incorporated Model (c) Refrigerant Distributor Model
29
During solidification and melting the temperatures were recorded at 30 seconds interval. After
incorporating fins, the temperatures were also recorded and finally installing a refrigerant
distributor (replacement of header) at the inlet side of the PCM heat exchanger the temperature
readings were also observed. The temperature distributions during solidification and melting
are described at the following sections.
4.1.1 Temperature Distribution during Solidification (Basic Model)
The temperature readings at twelve different positions were obtained during solidification at
30 seconds interval in the basic PCM heat exchanger model where header mechanism was used
to distribute refrigerant. Temperature readings of all thermocouples is plotted against duration
(time needed to solidify) shown in figure 4.3 and temperature distribution for each of plates
Figure 4.3: Temperature Distribution during Solidification (all plates) without Fin and Distributor
Figure 4.2: Plate and Coil Numbering of the PCM Heat Exchanger
30
shown in figure 4.4. It is observed that, at plate-1 thermocouple T1-4 & T1-3 show negative
temperature but T1-2 & T1-1 are positive and close to zero. So, the regions at thermocouples T1-
4 & T1-3 are solidified first and other two regions were not completely solidified. So, at plate-1
coil-3 & 4 regions solidified less than one hour, coil-2 region solidified within 2.5 hours and
coil-1 region solidified more than 3.5 hours. At plate-2 & plate-3 thermocouple T2-4 & T3-4 are
negative respectively and all the other thermocouples show positive temperature close to zero.
At plate-2 coil-4 region (T2-4) takes almost 1 hour for solidification, coil-2 and 3 regions (T2-2,
T2-3) solidified within 3.5 hours and coil-1 region (T2-1) takes more than 3.5 hours for complete
solidification. At plate-3 coil-4 region (T3-4) takes less than 1 hour for solidification and coil-
1, 2 and 3 (T3-1, T3-2 and T3-3) regions were not completely solidified. It is observed that the
amount of solidification is higher at plate-1 than other two plates and each coil-4 region PCM
at all plates solidified first. Amount of solidification at plate-1 is higher because huge amount
of refrigerant passes through plate-1 evaporator coils compared with other plates coils. So, the
(a) (b)
(c)
Figure 4.4: Temperature Distribution during Solidification (a) Plate-1 (b) Plate-2 (c) Plate-3 without Fin and Distributor
31
refrigerant distribution among plates are not uniform. The position of each coil no. 4 of all
plates close to the inlet header (shown in figure 4.1) so vast number of refrigerant passes
through all coil no. 4 and these become solidified first and after solidification these go to
negative temperature. It takes only a few hours to solidify completely at coil no. 4 region. After
solidification of all coil no.4 regions the heat is transferred from nearest coil (coil no. 4) to far
most coil (coil no. 1) in a slow manner since the thermal conductivity of ice very low. Through
other coils except coil no. 4 pass a small amount of refrigerant so it takes much amount of time
to solidify and show a positive temperature close to zero. So, it is clear that in the basic design
of PCM heat exchanger the refrigerant distribution is not uniform and most of the refrigerant
passes through all nearby coils. The image taken after solidification is shown in figure 4.5.
Intel Header
Outlet Header
Plate-1
Plate-2
Plate-3
Figure 4.5: PCM Heat Exchanger during Solidification (Basic Design) without Fin and Distributor
32
4.1.2 Temperature Distribution during Melting (Basic Model)
At melting (discharging) stage the ambient air comes into contact with heat exchanger plate
and goes out to the atmosphere. In the basic design, during solidification the PCM near the
header region is solidified first and maximum solidification is occurred at plate-1. The melting
temperature distribution at all plates shown in figure 4.6 and individual plates separately in
figure 4.7 and 4.8.
Figure 4.6: Temperature Distribution during Melting (all plates) without Fin and Distributor
(a) (b)
Figure 4.7: Temperature Distribution during Melting (a) Plate-1 (b) Plate-2 without Fin and Distributor
33
During melting all the thermocouples of plate-1 (T1-1, T1-2, T1-3 and T1-4) start with a negative
temperature and become positive after a certain time changing their phase. At plate-1 all the
PCM regions take 6 to 8 hours for complete melting since plate-1 was completely solidified.
At plate-2 coil-4 region (T2-4) takes almost 6 hours for melting, coil-2 and 3 regions (T2-2 and
T2-3) melt within 2.5 hours and coil-1 region (T2-1) shows sensible temperature variations. In
plate-3 only thermocouple coil no. 4 (T3-4) shows both sensible and latent heat transfer and this
region PCM takes almost 5 hours for complete melting and other thermocouples (T3-1, T3-2, and
T3-4) indicate only sensible heat transfer. The melting duration is fully depending on amount of
solidification. In this case only plate-1 was completely solidified so it shows longer melting
time but other plates were not completely solidified and show uneven melting duration.
So, in the basic header mechanism design plate-1 is more efficient than all other plates. Overall
the temperature distribution is not uniform in both solidification and melting and heat is
concentrated to the nearest header region.
So that in the second model fins were incorporated to distribute heat from the nearest header
region PCM to far region PCM.
Figure 4.8: Temperature Distribution during Melting (a) Plate-3 without Fin and Distributor
34
4.1.3 Temperature Distribution during Solidification (Fins Incorporated Model)
Attaching fin to the evaporator coils ensures better heat transfer during solidification. The heat
is transferred from the nearest header coil region (coil no. 4 region) to far most coil region (coil
no. 1 region). In this case the heat transfer from nearest region to furthermost region is little bit
higher since fins are incorporated. The solidification with fins incorporated for all plates shown
in figure 4.9 & 4.10.
At plate-1 all the regions are solidified completely and take less amount of time than other
plates. In this plate coil-3 and 4 regions (T1-3 and T1-4) PCM solidified within 4 to 5 hours and
coil-1 & 2 regions (T1-1 and T1-2) take almost 7 to 8 hours for complete solidification. At plate-
2 coil-3 & 4 regions (T2-3 and T2-4) PCM solidified within 4 hours, coil-2 region (T2-2) solidified
within 8 hours and coil-1 region (T2-1) was not completely solidified. The solidification
behavior is fairly improved at plate-2 than without fins design (basic design). At plate-3 two
thermocouples (T3-4 & T3-3) indicate better solidification takes almost 6 hours for solidification
but other two thermocouples show positive constant temperature which clarify that those
regions are not completely solidified.
By incorporating fin, the solidification characteristics is improved than without fin and
solidification phenomenon is quite satisfactory at plate-1 and plate-2. Although heat is
transferred from header nearest region to far most region but still far most regions are not fully
solidified as like nearest regions. In generally heat was more or less distributed through all the
PCM regions but it takes longer time for solidification and some of the regions are still not
solidified.
Figure 4.9: Temperature Distribution during Solidification (all plates) with fin
35
(a) (b)
(c)
Figure 4.10: Temperature Distribution during Solidification (with fin) (a) Plate-1 (b) Plate-2 (c) Plate-3 with fin
36
4.1.4 Temperature Distribution during Melting (Fins Incorporated Model)
Attaching fins to the existing PCM heat exchanger design show some improvement during
solidification in some of the region but some of the PCM regions still not solidified. So the
melting of the PCM did not show significant improvement in all regions during melting.
In figure 4.12 at plate-1, it is observed that three thermocouples (T1-4, T1-3 & T1-2) show normal
melting and takes almost 4 to 6 hours for discharging but another thermocouple (T1-1) indicates
less than 1 hour discharging time. At plate-1 coil-2, 3 & 4 regions take 4 to 6 hours for complete
melting and coil-1 region takes less than 1 hour for melting. At plate-2 all the PCM regions
take 2.5 to 6 hours for complete melting. At plate-3 coil-4 region takes 3 hours, coil-3 region
takes 1.5 hours and coil-1 & 2 take less than 1 hour for melting. The melting temperature
distribution is solely depending on amount of solidification and these melting characteristics
indicates non uniform temperature distribution. So, in the third model (refrigerant distributor
model) a refrigerant distributor was installed to distribute refrigerant uniformly for uniform
solidification.
Figure 4.11: Temperature Distribution during Melting (all plates) with fin
37
(a) (b)
(c)
Figure 4.12: Temperature Distribution during Solidification (with fin) (a) Plate-1 (b) Plate-2 (c) Plate-3 with fin
38
4.1.5 Temperature Distribution during Solidification (Refrigerant Distributor
Model)
Installing a refrigerant distributor at the inlet line by replacing header ensures uniform
distribution of the refrigerant through all the evaporator coil. The temperature distribution
during solidification for all plates shown in figure 4.13 and individual plates in figure 4.14.
From the figure it is shown that all the plates are solidified uniformly and within a shorter
period of time than with or without fin. Each and every thermocouple starts with positive
temperatures and changing its phase at 0℃ and then going to negative temperatures. These
thermocouples show normal phase change behavior. The variation of temperature from one
thermocouple to another within a plate is not significant. The image during solidification is
shown in figure 4.15. It takes almost 3 hours for complete solidification of all PCM plates. So,
the optimized solidification phenomenon is found in distributor based PCM heat exchanger
with fin.
Figure 4.13: Temperature Distribution during Solidification (all plates) with Fin and Distributor
39
Wire Thermocouples
Figure 4.15: Image Taken during Solidification with Fin and Distributor
(a) (b)
(c)
Figure 4.14: Temperature Distribution during Solidification with Distributor and Fin (a) Plate-1 (b) Plate-2 (c) Plate-3 with
Fin and Distributor
40
4.1.6 Temperature Distribution during Melting (Refrigerant Distributor Model)
All the plates were fully solidified during charging period. In discharging period all of the
thermocouple starts with a negative temperature then change their phase at 0℃, after go to
positive temperature. All the plates grant more than 4 hours during discharging period. The
melting temperature distribution is shown in figure 4.16, 4.17 and 4.18. All the plates show
almost same characteristics and melting period.
Figure 4.16: Temperature Distribution during Melting (all plates) with Fin and Distributor
(a) (b)
Figure 4.17: Temperature Distribution during Melting with Distributor and Fin (a) Plate-1 (b) Plate-2 with Fin and Distributor
41
4.1.7 Comparisons of Solidification Phenomena for all Models
The temperature distributions during solidification at different plates for different models are
shown in figure 4.19, 4.20 & 4.21. The comparisons considered for 3.5 hours solidification
period.
In the basic model (without fin and distributor) at plate-1 two evaporator coils regions solidified
within half an hour and other two thermocouples take more than 3.5 hours for solidification. It
indicates that the refrigerant passes through those two coils. At the same plate after
incorporating fins, all the evaporator coils regions solidified uniformly but takes more than 3.5
Figure 4.18: Temperature Distribution during Melting with Distributor and Fin at Plate-3 with Fin and Distributor
Figure 4.19: Temperature Distribution during Solidification at plate-1 for different Design Conditions
42
hours for complete solidification. A significant improvement is occurred when refrigerant
distributor is used. In this case all the evaporator coils regions completely solidified within 2.5
hours.
At plate-2 without fin and distributor design only one evaporator coil solidified within one hour
and other evaporator coils regions need more than 3.5 hours for solidification. But in case of
fins incorporated design it exhibits same characteristics as like plate-1. For with fin and
Figure 4.20: Temperature Distribution during Solidification at plate-2 for different Design Conditions
Figure 4.21: Temperature Distribution during Solidification at plate-3 for different Design Conditions
43
distributor design one evaporator coil region takes almost 1.3 hours for solidification and other
evaporator coils regions need 2.7 hours for complete solidification.
At plate-3 in basic design one evaporator coil region takes less than half an hour to solidify and
other thermocouple regions maintain a positive constant temperature and need more than 3.5
hours for solidification. At the same plate the incorporated fins design all the evaporator coils
regions exhibit constant phase change temperature and need more than 3.5 hours for
solidification. But with fin and distributor design shows better solidification than other designs.
In this case only 2 hours is needed for complete solidification.
Overall the basic model shows uneven solidification through all the regions, fins incorporated
model shows some improvement in temperature distribution but it takes longer time for
solidification. The refrigerant distributor model shows uniform temperature distribution for all
the regions of the PCM plates. So, it is concluded that refrigerant distribution through header
does not ensure uniform distribution
4.1.8 Melting Phenomena Comparison for all Models
The melting temperature distributions for different plates at different design conditions are
shown in figure 4.22, 4.23 and 4.24. The melting comparison considered for 6 hours time
period. In the basic model plate-1 PCM takes more than 6 hours during melting. But after
incorporating fin, melting time maintains more than 5 hours but one thermocouple indicates
Figure 4.22: Temperature Distribution during Melting at plate-1 for different Design Conditions
44
less than one hour. But at the same plate the backup time reduces to 4 hours but all the region
show simultaneous melting in the refrigerant distributor model.
Figure 4.23: Temperature Distribution during Melting at plate-2 for different Design Conditions
Figure 4.24: Temperature Distribution during Melting at plate-3 for different Design Conditions
45
At plate-2 the basic design condition ensures more than 5 hours melting time for one region of
PCM but other PCM regions shows less than 2.5 hours which is unusual. But at incorporated
fins design two PCM regions show better melting than other two regions. At the fin and
distributor design the melting behavior is uniform with more than 3.5 hours backup. At plate-
3 only refrigerant distributor model has uniform melting and significant melting time but other
two models show non-uniform melting distribution with uneven melting time from region to
region.
Finally, it is clear that the melting phenomena is better in the refrigerant distributor model than
other two models. Although plate-1 shows better performance in all models.
4.2 Performance Analysis of VCR System
To analyze the performance the Vapor Compression Refrigeration (VCR) system the pressure
and temperature readings at four different position were observed at different periods. The
average pressure and temperature are shown at table 4.1. Using these data and with the help of
P-h chart the Coefficient of Performance (COP) of the system is calculated using the following
formulas.
𝐶𝑂𝑃 (𝐶𝑜𝑒𝑓𝑓𝑖𝑐𝑖𝑒𝑛𝑡 𝑜𝑓 𝑃𝑒𝑟𝑓𝑜𝑟𝑚𝑎𝑛𝑐𝑒) =𝑅𝑒𝑓𝑟𝑖𝑔𝑒𝑟𝑎𝑡𝑖𝑛𝑔 𝐸𝑓𝑓𝑒𝑐𝑡
𝐶𝑜𝑚𝑝𝑟𝑒𝑠𝑠𝑜𝑟 𝑊𝑜𝑟𝑘
𝑜𝑟, 𝐶𝑂𝑃 =𝐸𝑛𝑡ℎ𝑎𝑙𝑦 𝑎𝑡 𝐸𝑣𝑎𝑝𝑜𝑟𝑎𝑡𝑜𝑟 𝑂𝑢𝑡𝑙𝑒𝑡 − 𝐸𝑛𝑡ℎ𝑎𝑙𝑦 𝑎𝑡 𝐸𝑣𝑎𝑝𝑜𝑟𝑎𝑡𝑜𝑟 𝐼𝑛𝑙𝑒𝑡
𝐸𝑛𝑡ℎ𝑎𝑙𝑝𝑦 𝑎𝑡 𝐶𝑜𝑚𝑝𝑟𝑒𝑠𝑠𝑜𝑟 𝑂𝑢𝑡𝑙𝑒𝑡 − 𝐸𝑛𝑡ℎ𝑎𝑙𝑝𝑦 𝑎𝑡 𝐶𝑜𝑚𝑝𝑟𝑒𝑠𝑠𝑜𝑟 𝐼𝑛𝑙𝑒𝑡=
ℎ1 − ℎ4
ℎ2 − ℎ3
𝐶𝑜𝑜𝑙𝑖𝑛𝑔 𝐶𝑎𝑝𝑎𝑐𝑖𝑡𝑦 = 𝑀𝑎𝑠𝑠 𝐹𝑙𝑜𝑤 𝑅𝑎𝑡𝑒 × 𝑅𝑒𝑓𝑟𝑖𝑔𝑒𝑟𝑎𝑡𝑖𝑛𝑔 𝐸𝑓𝑓𝑒𝑐𝑡 = �̇� × (ℎ1 − ℎ4)
Figure 4.25: R-22 P-h Chart for Existing Refrigeration System
46
Table 4.1: Pressure and Temperatures at different Positions of the Refrigeration System
Measuring Point Pressure, psi [MPa] Temperature [℃] Enthalpy (kJ/kg)
After Evaporator (PCM Heat Exchanger), h1 37.56 [0.259] -10.2 402.6
After Compressor, h2 293.85 [2.026] 91.8 459.1
After Condenser, h3 291.96 [2.013] 49.5 261.2
Before Evaporator (PCM Heat Exchanger), h4 42.79 [0.295] -15.9 261.2
Mass flow rate of refrigerant = 40.22×10-3 kg/s (1808.80 cc/min)
So, 𝐶𝑂𝑃 = 402.6−261.2
459.1−402.6≈ 2.503
𝐶𝑜𝑜𝑙𝑖𝑛𝑔 𝐶𝑎𝑝𝑎𝑐𝑖𝑡𝑦 = 40.22 × 10−3 (402.6 − 261.2) = 5.6871 𝑘𝑊 = 1.6249 𝑇𝑅
The capacity of the system falls to 1.63 TR from 2.0 TR. It is because the system was modified
to maintain low evaporator temperature.
4.3 Performance Analysis of Air Side of PCM Heat Exchanger
Two thermocouples were placed at the air inlet, two thermocouples were placed at the air outlet
and three thermocouples were placed on the plates of the PCM heat exchanger. The temperature
readings at inlet and outlet at different velocities shown in table 4.2. Using the values, the
bypass factor of the PCM heat exchanger is calculated with the help of following formula.
𝐵𝑦𝑝𝑎𝑠𝑠 𝐹𝑎𝑐𝑡𝑜𝑟 = 𝑈𝑛𝑡𝑜𝑢𝑐ℎ𝑒𝑑 𝐴𝑖𝑟
𝑇𝑜𝑡𝑎𝑙 𝐴𝑖𝑟=
𝑂𝑢𝑡𝑙𝑒𝑡 𝐴𝑖𝑟 𝑇𝑒𝑚𝑝𝑒𝑟𝑎𝑡𝑢𝑟𝑒 − 𝑃𝑙𝑎𝑡𝑒 𝑇𝑒𝑚𝑝𝑒𝑟𝑎𝑡𝑢𝑟𝑒
𝐼𝑛𝑙𝑒𝑡 𝐴𝑖𝑟 𝑇𝑒𝑚𝑝𝑒𝑟𝑎𝑡𝑢𝑟𝑒 − 𝑃𝑙𝑎𝑡𝑒 𝑇𝑒𝑚𝑝𝑒𝑟𝑎𝑡𝑢𝑟𝑒
The variation of bypass factor with average velocity is shown in figure 4.26. The bypass factor
is increased with increasing air velocity. From the air velocity 1.2 m/s to 2 m/s the bypass factor
is increased almost 6%. The variation of average inlet air, outlet air and plate surface
temperatures at different times are shown in figure 4.27.
Table 4.2: Bypass Factor of PCM Heat Exchanger at Different Air Velocities
Air Velocity (m/s) Inlet Air Temp. (℃) Outlet Air Temp. (℃) PCM Plate Temp. (℃) Bypass Factor
1.2 28.16 12.22 0.2894 0.4281
1.3 28.81 12.90 0.3599 0.4408
1.5 28.91 12.98 0.3549 0.4421
1.6 28.68 13.25 0.4163 0.4540
1.9 28.65 13.88 0.3966 0.4772
2.0 28.49 13.94 0.4096 0.4818
The average inlet and outlet air temperature difference is high at the initial stage of melting and
becomes low after certain period of backup. The inlet air temperature is nearly average
throughout the melting period and average plate surface temperature increases with increasing
duration of melting. The average plate surface temperature varies from 0C to 5C within the
47
melting period. Temperature difference between inlet and outlet varies from 16 to 9C within
4 hours time period.
The sensible heat transfer rate from the heat exchanger PCM by the air throughout the melting
period is shown in figure 4.28. The sensible heat transfer rate is high at the initial stage of
melting since the temperature difference was high. The sensible heat transfer rate decreases
with increasing time period and it varies from 2200 to 1300 W within 4 hours time period.
Figure 4.26: Bypass Factor of PCM Heat Exchanger at Different Velocities
Figure 4.27: Average Inlet Air Temperature, Average Outlet Air Temperature and Average Plate Surface Temperature
49
Chapter-5: Conclusion and Further Research
5.1 Conclusion
In the present work a PCM heat exchanger is developed to investigate the performance analysis
of the heat exchanger such as solidification-melting behavior, bypass factor phenomenon, heat
transfer rate variation and average temperature variation for cold chain application like
refrigerated vehicle or cold storage. Three models of the PCM heat exchanger were developed
to compare the performance variations and to select the best one. In the first basic model the
evaporator (PCM heat exchanger coil) refrigerant is distributed through a header mechanism
and in the second model fins are incorporated at the evaporator coil side to enhance the heat
transfer rate during solidification & melting. The header mechanism at the inlet side of the
evaporator is replaced by an efficient refrigerant distributor in the third model.
The solidification and melting behavior are analyzed for all the models of the PCM heat
exchanger and compared. The nearest header region PCM is solidified first and other regions
take a huge amount of time to solidify in the basic PCM heat exchanger model. It is occurred
due to non-uniform distribution of refrigerant and lower heat conductivity of PCM after
solidification. In order to minimize the heat transfer problem from solidified PCM to liquid
PCM fins are incorporated in the second model. After attaching fins, the heat transfer rate is
improved than first model but it takes longer time to completely solidify all the PCM. So that
in the third model a refrigerant distributor is introduced by replacing inlet header of the
evaporator. Due to refrigerant distributor and incorporated fins (third model) the solidification
characteristics is improved than other two models. In the refrigerant distributor model, it takes
3.0 hours to completely solidify all the PCM.
During melting period in the first two models show that different PCM regions have different
melting time since complete solidification was not ensured. But in the refrigerant distributor-
based model all the PCM regions indicate almost same amount of melting time during
discharging process. So, the third model is most efficient during solidification and melting.
The air side performance of PCM heat exchanger is analyzed for the third model due to its
appropriateness. Experiment shows that at the initial stage of melting period the sensible heat
transfer rate is higher and becomes lower within the duration. The sensible heat transfer rate
degradation shows polynomial behavior during discharging period. The sensible heat transfer
rate decreases with increasing time period and it varies from 2200 to 1300 W within 4 hours
time period. The temperature difference between inlet and outlet air higher at the initial melting
period and becomes lower with increasing time. Temperature difference varies from 16 to 9C
within 4 hours time period. The PCM plate temperature is also increased with increasing
50
duration of melting. The air bypass factor of the PCM heat exchanger is increased by increasing
air velocity. Bypass factor increases 6% from the air velocity 1.2 m/s to 2m/s.
5.2 Future Research Work
The PCM heat exchanger models developed in this research work is a good initiative to design
air to PCM heat exchanger. But some other important challenges can also be investigated in
future. The important analysis should be considered in the future are:
Water is considered as only PCM in the research work. Some other PCM such as
ethylene glycol, water-salt solution can be considered for further investigation.
Using nanoparticle within the PCM can increase heat transfer rate within PCM. This
research can also be investigated further.
To improve the air side heat transfer fins can be attached in the air side and the effect
of air side fins can be explored.
The temperature distribution in the air side of the PCM heat exchanger can be observed
in the future to investigate air side performance.
The copper was used as fin material in this research works. The effect of other fin
materials can be analyzed.
The number of PCM plates and their orientation is an important factor for heat transfer.
Changing the number of PCM plates with its orientation can be analyzed in future.
The condensing unit capacity in this research work is minimal. Higher capacity
condensing unit can reduce solidification time and can change the scenario of the
temperature distribution.
51
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