Diamond-Coated Electrode and M e t h o d for Producing

Same WO 2004104272 (Sumitomo Electric Ind.) Seki, Y.; Izumi, K.; et al. Diamond electrode having a sufficiently low resistance made by increasing the amount of boron added there- to. A method for producing a high-performance, high- durability electrode is also disclosed by which adhe- siveness between a diamond coating and a substrate and separation resistance during electrolysis are increased. An electrode composed of a substrate and a diamond layer coating the substrate are characterized in that the electrode is composed of a base coated with diamond and the diamond contains boron in such an amount that the boron concentration is not less than 10,000 ppm but not more than 100,000 ppm. The base is preferably made of an insulating material.

Coat ing• for Me ta l Ca• t ing Parts

U.S. 2004104261 (Russian American Technology AL) Buclaragin, L.V.; Deininger, M. Method for coating or impregnat ing a metal tool with a metal oxide to render the metal part more resistant to liquid metal at tack or micro-welds. The method includes the steps of applying a liquid metal carboxylate composition, or a solution thereof, to a substrate material, and exposing the substrate to an environment tha t will cause vaporization or dissipa- tion of any excess carboxylic acids in the liquid metal carboxylate composition while the metal car- boxylates are being converted to metal oxides.

higher, and subjecting the article to a surface treat- ment with a solution containing a noble metal com- pound, to thereby carry out an electroless plating; and a method for metal plating, characterized in that it comprises subjecting an article to be plated to a surface t rea tment with a fluid obtained by mixing or reacting a silane coupling agent having, in a reel- ecule thereof, a functional group exhibit ing the capability of capturing a metal with a noble metal compound, and t reat ing the resul tant article at a high tempera ture of 150°C or higher, to thereby carry out an electroless plating. The above methods allow the metal plating with good adhesion to an article being difficult to carry out a metal plating.

Reader queries relating to patents published in Metal ~nishing or to

advise on patent searches of the approximately 30 million patents in

the public domain, can be e-mailed to Anselm Kuhn, Metal Finishing

Information Services Ltd., at finpubs~compuserve.com. The patents

summarized are a sampling of some 500 surface-finishing-related

patents published every month. Almost all patents can be viewed on

the Internet and downloaded or printed, in many cases free of charge,

at www.uspto.gov and www.delphion.com. mF

airborne emissions R E D U C E * metal consumption

brightener consumption

A SER-DUCTOR ® pump / eductor agitation system on your plating tank can:

Coating M e t h o d for Inhibit ing React ion

WO 2004106579 (Ishikawajima Harima Heavy Ind.) Aoki, Y.; Sate, A. A coating method for inhibiting a reaction which com- prises coating the surface of a nickel base superalloy with a reaction inhibiting agent comprising cobalt, chromium, or ruthenium or alloy containing one of these elements as a primary component, prior to alu- minum diffi~sion coating. The coating method allows the enhancement of the resistance to oxidation of a Ni-based superalloy and also allows the inhibition of generation of a secondary reaction zone.

M e t h o d for Electroless Plat ing and Meta l -P la ted Art ic le

WO 2004108986 (Nikko Materials Co. Ltd.) Imori, T.; Sekiguchi, J.; et al. Method for metal plating, characterized in tha t it comprises subjecting an article to be plated to a sur- face t rea tment with a silane coupling agent having, in a molecule thereof, a functional group exhibiting the capabili ty of captur ing a metal , t rea t ing the resul tant article at a high temperature of 150°C or

a Reduce airborne fume emissions of chrome, nickel, acid copper and volatile additives by 90%.

• Save metal as a result of more uniform brightness and thickness distribution

• Reduce brightener consumption 20%

• Double your current density for a faster plating rate

• Improve throw and deposit thicknesss in blind holes and recesses

• Reduce heating costs up to 25%

• Reduce or eliminate gas pitting

• Reduce carbonates in cyanide processes

• Reduce ventilation requirements

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October 2005 59