New Developments in the Metal Finishing Field Compiled by Anselm Kuhn, Metal Finishing Information Services Ltd.

Recently published patents

M e t h o d of E tch ing w i t h A m m o n i a and F luor ine

C h e m i s t r i e s

US. 2004211517 Annapragada, R.; Sadjadi, R. Gas-phase plasma etching.

Delivery of Dissolved Ozone US. 2004211514 Torek, K.J.; Morgan, J.C., et al. Constant or pulsed supply of ozone in fluid medium.

F o r m a t i o n of F u n c t i o n a l

C o a t i n g and F u n c t i o n a l C o a t e d A r t i c l e

US. 2004214015 Asai, M.; Uehara, H., et al. Organo-silicon species reacts with alipatic hydrocarbon on surface of plastics, glass, metal, and ceramic to create a hydrophobic surface, stain-repel- lent, or electroconductive layer.

Substrate Binder US. 2004208993 Fongalland, D.C.; Gascoyne, J.M., et al. Porous substrate is formed from slurry, then impregnated with polymeric material or dispersion of silica and fluorinated polymer.

C o a t i n g P r e c u r s o r and M e t h o d for C o a t i n g a S u b s t r a t e w i t h a R e f r a c t o r y Layer US. 2004197482 Lamaze, A.P.; Barthelemy, C. Silicone resin, metal compounds, and organic solvent are applied to the surface and the solvent evapo- rated, leaving a hard refractory silicon containing layer after calci- nation, which is resistant to oxi- dizing environments, molten metal or molten salt attack.

M e t h o d s and A p p a r a t u s for M a k i n g I n t e g r a t e d - C i r c u i t W i r i n g f r o m Copper , S i lver , (Sold, and O t h e r M e t a l s

Grant Manufacturing & Alloying, Inc,

US. 2004206308 (Micron Tech Inc.) Ahn, K.Y.; Forbes, L. Copper requires presence of dif- fusion barrier, which is formed by PVD and/or CVD.

Delivery of Dissolved Ozone U.S. 2004194883 Torek, K.J.; Morgan, J.C., et al. Fluid can be sprayed in an ozone- rich environment, or prior mixing of fluid and ozone may be used.

Diamond Bectmde for Beclbrolysis US. 2004206624 Hosonuma, M.; Nara, M., et al. (Permelec Electrode Ltd.) A diamond electrode has a pro- longed ]ife by combining a conven- tional diamond electrode having a relatively short life with other components. A diamond electrode for electrolysis includes an elec- trode substrate, at least the sur- face of which comprises Magneli- phase t i tanium oxide, and conductive diamond supported as

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Tin 4, Tin/Lead • Copper Zinc • Nickel

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• D Shaped- 2"x4" & l"x3" 4° Ovals, 1.5" x 3 4- Mossy tin

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Clean, sharp, d ist inct stop of f lines. K i t w i th I quart pot and 5 ]bs. of Thermo-Cote N-4 strippable coating. Cools fast to give you perfect mask. Non Contaminat ~ng. Peel o f f and remelt for reuse. Wrlte for details arid

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66 www.metalfinishing.com

an electrode catalyst on a surface of the electrode. The electrode cata- lyst may contain a ti tanium oxide powder. Magneli-phase t i tanium oxide improves conductivity with- out forming a stable oxide layer on the substrate surface.

P r o c e s s f o r P r o d u c i n g A l u m i n u m O x i d e F i l m s a t L o w T e m p e r a t u r e U.S. 2004197476 Skarp, J.; Linnermo, M., et al. ALD formation of a lumina sur- face layer at <190°C.

O x i d a t i o n I n h i b i t i o n o f C a r b o n - C a r b o n C o m p o s i t e s US. 2004213906 Mazany, A.M.; Bianco, R., et al. (Goodrich Corp.) Phosphoric acid or salt and alu- minum salt are applied to surface and infiltrated, then heated.

Electrochemical Machining Method and Apparatus U.S. 2004195109 Mori, Y.; Shirakashi, M., et al. Uses ultrapure Water and has cata- lyst with ion exchange function.

P l a t i n g M e t h o d a n d P l a t i n g A p p a r a t u s US. 2004195106 Mishima, K.; Inoue, H., et al. Electrodeposition of copper into fine interconnects and trenches on a wafer or similar object.

Electrolytic Solution for Electrochemical Deposit Gold and its Alloys U.S. 2004195107 Chalumeau, L.; Leclere, C. An aqueous electrolytic solution for electrodeposition of gold or its alloys includes at least a soluble gold com- pound designed for electrodeposition

and, optionally at least, a secondary metal compound designed for code- position in the form of a gold alloy. The solution includes 0.3 to 3 moles per mole of gold contained in the electrolytic solution of an organic compound having one or two alde- hyde functions, this organic com- pound being ,or an organic com- pound having three to 20 carbon atoms and one or two aldehyde func- tions in the form of a saturated or unsaturated, linear or branched aliphatic group, or a group containing at least a saturated, unsaturated, or aromatic cycle. The organic compound may further include at least a het- eroelement selected among oxygen, nitrogen, sulfur and phosphorus, or be in the form of a salt, in particular, a sulphonate. The presence of the organic compound enables increasing the speed of electrodeposition and/or decreasing contact resistance.

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April 2005 67