PACS FPU

PACS IHDR 12/13 Nov 2003

Distribution Boards and FPU Harness Concept

R. Graue, D. KampfKayser-Threde

PACS FPU

PACS IHDR 12/13 Nov 2003

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Blue Detector Interface

Material

CAD Drawing No manual Changes

FPFPU

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SheetDINWeightScaleSurfaceGen. tolerances

NameDateChangeState

File

Checked

Prep.

NameDate

1:2 -- A3 1

2

Assembly01 First Issue 22.03.01KC

--

02 9 connectors ->724.08.01KC

03 10mm <->15mm09.10.01KC

PACS-KT-ICD-0800W1.04

0800w104.CatDrawing

KC23.01.0204 Routing & Struts

60

92

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Bending begins at z(detector)= -105

First support after 90° with R=20mm

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4K level

2Klevel

Distribution Board – Blue Detector

PACS FPU

PACS IHDR 12/13 Nov 2003

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Red Detector Interface

Material

CAD Drawing No manual Changes

FPFPU

of

SheetDINWeightScaleSurfaceGen. tolerances

NameDateChangeState

File

Checked

Prep.

NameDate

1:2 -- A3 1

2

Assembly01 First Issue 10.04.00KC

--

02 09->08/09 12.03.00KC

22.03.002K Srap03 KC04 COG / Handling P.0705.01KC

KC23.07.01chamfer 10x1005

06 9 connectors->724.08.01KC07 routing & susp.23.01.02KC0900w107.CatDrawing

PACS-KT-ICD-0900W1.07

2K Level

60 (4k level)

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First support after 90° with R=20mm

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Bending begins atz(detector)=-105

4K Level

Distribution Board

Harness layout due to equal length of all detector modules

Distribution Board – Red Detector

PACS FPU

PACS IHDR 12/13 Nov 2003

EM Breadboard

PACS FPU

PACS IHDR 12/13 Nov 2003

• Rigid-flex boards• Material

– PCB: FR4– Flexible Harness: Polyimide

• Layout shall be designed according to CNES QFT/SP.0019

• Connectors: Cannon MDM 3401029 01B .... FR139• Capacitors: WIMA MKS 6,8 micro Farad, 50 VDC,

30 VAC• Resistors: RNC 55 according to ESA SCC 40001

001

Distribution Board – Approved Design

PACS FPU

PACS IHDR 12/13 Nov 2003

Distribution board test matrix

PC BDesign

MPE C ircu it D esign

KTLayout/M echanica l

D esign

Clearanceby M PE: Layout design,N et lis tby KT: M echanica l design

CQM / PFMSD "blue, red"ESA qualifiedInd. standard

Test bordsfor ESA pcbevaluation

PCB m anufacturing

-Circuit test-Optical inspection

PCBsCQM/PFM

componentsmounting

PCBIncoming inspection

Componentsprocurement and

qualificationby M PE/ESA

10x LN2Cryo cycles

-Circuit test-Optical inspection

Integration in FPFPU

PACS FPU

PACS IHDR 12/13 Nov 2003

Incoming inspection according to inhouse procedures

Visual inspection (components, bonding points) Measuring machine

Pin to pin continuity Insulation Cross talk ohmic resistance test

PCB layout test against Gerber data (automated inspection protocol)

Distribution Boards – Functional Verification Plan

PACS FPU

PACS IHDR 12/13 Nov 2003

Distribution Boards Functional Check Out Test Plan on FPU

level

• Functional tests (prior and after cold vibration tests and during He temperature tests)– Complete detector chain operation required– Detection of Photoconductor signals (tbd by MPE)– Test operations controlled by COE (MPE-tbc)– Validation of signals by MPE (determination of

nominal Photoconductor operation)

PACS FPU

PACS IHDR 12/13 Nov 2003

• PCB design completed• Manufacturing data package completed• ICD updated• CQM components tested /screened/released by

ESA (Resistors, capacitors, connectors)

CQM Distribution Board –Status - Completed Tasks I

Design, Documentation and Components

PACS FPU

PACS IHDR 12/13 Nov 2003

• EM Test board – Manufactured – Functional testing– Cryogenic cycling test (LN2)– Cryogenic vibration test (LHe) – Cryo STM test

• CQM Boards– PCBs Manufactured and under inspection (NCR wrt

anomalies)

• PFM Boards– PCBs Manufactured and under inspection (see CQM)

CQM Distribution Board –Status - Completed Tasks I

Assembly

PACS FPU

PACS IHDR 12/13 Nov 2003

• CQM Boards– Assembly– Functional testing– Cryogenic cycling test (LN2)– Qualification testing of bookbinder fabrication technology– Documentation (Inputs for DP)– Distribution board delivery until 11.2003

• PFM Boards– Asssembly and testing– Capacitor screening and distribution board delivery until

7.2004

Distribution Board –Status – Open Work and Schedule

PACS FPU

PACS IHDR 12/13 Nov 2003Distribution Boards Cryo Qualification Test

Matrix

Tests Planned Qualification

Tests

Performed BB Test

Performed Cryo STM

Test

Comments

Ambient simplified Functional Test prior / after Cold Vibration Test

X X - KT provided stand alone test

Cold Vibration Test (LN2 or He) – (3

axes)

X - X (He) MPE tests; mounted in Cryo STM (FPU)

Thermal Cycling LN2 X X - KT shock tests with 10 cycles

Ambient functional tests after thermal cycling test (LN2)

X X - KT tests

Thermal Vacuum Test (He) X X X MPE provided functional BB and CQM FPU tests

Functional Test at cryogenic temperatures (He)

X X - BB test provided by MPE with performance characterization

Distribution Boards are Cryo Vibration Qualified

PACS FPU

PACS IHDR 12/13 Nov 2003

• PFM Capacitor screening (Updated procedure) • Verification test plan of PCB bookbinder

technology manufacturing procedure in progress– Microscopic tests (e.g. cracks)– Thermal tests– Functional tests

Distribution Board - Open Points

PACS FPU

PACS IHDR 12/13 Nov 2003

Filter Wheel 1SpectometerJ302P302JO2

J301P3O1JO1

Filter Wheel 2Bolometer

J303

J304

P303

P304

J03

J04

Calibration Source 2

J306P306J06

C01

C02

C03

C04

Calibration Source 1

J305P305J05C05

C06

Chopper J07

J308T-Sensor 4K connection (TBC)

T-Sensorone axis mount

P308

J318 P318

J08C08

Cable not manufactured at KAYSER-THREDE

PACS Inner FPU Harness

PhotoconductorDetector (red)

DistributionBoard 1 (red)

J100-J124

J10 -J18

P100-P124

MPE Distribution Board 2(blue)

J200-J225

P200-P225

PhotoconductorDetector (blue)

J20 -J28

MPE

GratingAssembly

J40

CSL

Bolometer Array

JXX PXX JXXCEA

(50-99)

J41

CSL

J42

J43

CSL

CSL

(power)

(power red.)

(signal)

(signal red.)

Outer FPU Harness

J309T-Sensortwo axis mount

T-Sensor three axis mount

P309

J319 P319

J09

31s

31s

31s

31s

31s

31s

31s

31s

31p

31p

31p

31p

9p

9p

9p

9p

9s

9s

9s

9s

9s

9s

15p

15p15s

15s

15s

15s

FPU Harness Architecture

PACS FPU

PACS IHDR 12/13 Nov 2003

• Harness designed and approved• Manufacturing data package released• CQM/PFM Manufacturing completed• CQM/PFM Hardware delivered and inspected• ICD approved• CQM harness under integration into FPU (CQM)

Harness – CQM/PFM Procurement Status