DPNC

Daniel La Marra

Activities in theElectronics Group

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218/12/2012 2012 Electronic Highlights

GrElec in 2012

3+1 Electronics Engineers Daniel La Marra Stéphane Débieux Yannick Favre

Alessandro La Rosa• IBL

2 Technical Assistants Gabriel Pelleriti Javier Mesa

2012 Electronic Highlights 318/12/2012

Projects Highlight

ATLAS (LHC) IBL (upgrade phase0 2013-

2014) ABCn130 (upgrade phase2

2022) Neutrinos

MICE (production) Astrophysique

LOFT POLAR

2012 Electronic Highlights 418/12/2012

IBL : Local support - stave

2012 Electronic Highlights 518/12/2012

IBL : Dressed module with flex

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IBL - Loading procedure

2012 Electronic Highlights 7

IBL : Test bench for PCB/Flex Saver production

Purpose : Full production test : ~80 PCB savers, 500 Flex savers Details :

• 320 signals / PCB saver : automatic test for short & open circuit on each signal

• FPGA firmware development for signals stimulus & PC communication (Yannick)

• PC software development for checking & reporting (Yannick) • Test execution (Gaby)

Saver under test

Checked OK for ID=1

PC interface

Flex saversPCB saver

Xilinx Stimulus Board

HW interface18/12/2012

2012 Electronic Highlights 8

IBL : IST & beam pipe EMI qualification

Purpose : Screening qualification against ElectroMagnetic Interference Measurement : Transfer impedance + Screening attenuation vs frequency :

• Tube under test inserted into a copper tube for environment insensitivity• IBL Support Tube (IST) qualification (carbon fiber + Ag glue + end rings)• Beam pipe shielding methods investigation & qualification

Hardware : Vector Network Analyzer [100KHz-4GHz]

IST

Beam PipeVNA

Copper tube enclosure

Good shielding

Bad shielding

Tubes undertest

18/12/2012

918/12/2012 2012 Electronic Highlights

ABCn-130 : Main improvements

ABCn-250 New ABCn-130

Technology: 250nm 130nm

# channels: 128 256

Data rate: 40 Mbit/s 80 Mbit/s

Data flow : Variable Fixed (data rate increase)

TX Chain (chip to chip)

Hardware token signal Software Xon/Xoff (more flexibility)

Single Event Upset Protection

none Configuration choice :- Watchdog or - 3X Flip Flop + vote or- Hamming code

# buffer levels: 1 2 (L0 & L1 triggers)

2012

10

ABCn-130 : Layout (not final) Submission Scenarios

18/12/2012 2012 Electronic Highlights

Chip size 7900 um x 6700 um

Independent of HCC Regular MOSIS MPW on 4th February 2013

(reachable for ABC130, not for HCC) Shared Engineering run with the

NA62/TDCpix submission (forecast 1Q 2013, may be very close to the MOSIS MPW date, but with some flex.)

With HCC : Engineering Run, attached to HCC

schedule

Preferred scenario

DBB : Digitizer & Buffer Board

Context :• MICE experiment (RAL/UK)• Electron Muon Ranger detector (EMR)• Part of a collaborative team with the Front End Board • Board & FPGA design + test : Stéphane Débieux

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Mice experiment

EMR

DBB : Overview

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2 Gigabit transceivers

Altera Stratix II FPGA

Power Supply : 3 DC/DC

LVDS Connections to FEB

Connectors for DBBs daisy-chain

DAQ SMA Connectors

DIP switch for Board ID

Connector for FPGA programming

DBB : Current status

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Further tests in the lab qualified the DBB for production

54 boards to be produced identically to the first 6 prototypes

2 to 3 months delay expected for the production, delivery in March/April 2013

2012 Electronic Highlights 14

LOFT : Large Observatory For x-ray Timing

Context :• Matter in neutrons Stars & close to black

hole event horizon• ESA program, launch 2020-22• Wide Field Monitor : high resolution• Large Area Detector : 10m² of detector 2-

30keV : 6 panels 7x3 modules/panel 4x4 Front End Electonics/modules => 2016 FEE

overall : DPNC/ISDC design responsibility

FEE :• ~130x70mm• Very low noise• Silicon Drift Detector technology (used in ALICE)• 14 ASICs per FEE, 16 channels/ASIC• Chip On Board technology, very small pads (39µ)• Bonding: ASIC to SDD (17µ), Through PCB Bonds, ASIC to PCB• PCB: Flex-Rigid technology

FEE

Module Back End Electronics

Panel

SDD (bottom)18/12/2012

2012 Electronic Highlights 15

LOFT : Large Observatory For x-ray Timing

FEE Prototype 2012 :• Large PCB for measurements access, Small SDDetector Proto, EMC & HV

constraints• Components: 4 ASICs, linear regulators, digital interfaces, HV/MV filters• Labview interface

• Board Design Schematics + Layout: Yannick• Components & ASIC mounting/bonding: Gaby, Maarten• Tests : in progress at BOLOGNA

SDD location

ASIC

Trough PCB hole for bonding

75um PCB trace width

39um square pads

18/12/2012

2012 Electronic Highlights 16

POLAR : An instrument to measureGamma Ray Bursts polarization

2 layers flex with stiffener:• Design made by PSI• Schematics and Layout was imported into our Cadence tools• Modification with close relationship with the mechanics group• Added a rigid part (stiffener) • Length changed

18/12/2012

2012 Electronic Highlights 17

POLAR : An instrument to measureGamma Ray Bursts polarization

18/12/2012

News in this design:• Very small via between 2 layers• Hole: 0.09mm• Pad: 0.15mm

2012 Electronic Highlights 1818/12/2012

Conclusion

This year was going on with some works initiated last year or even before: IBL ABCn130 MICE

There was also new works for several different projects like: LOFT POLAR

But we also started some studies for new projects like: NA61 (neutrinos) DAMPE (astrophysics) JEM-EUSO (astrophysics)