DS90UB933-Q1 FPD-Link III Serializer for 1-MP/60-fps Cameras 10/12 Bits,100 MHz
1 Features• AEC-Q100 qualified for automotive applications
with the following results:– Device temperature grade 2: –40°C to +105°C
ambient operating temperature• 37.5-MHz to 100-MHz input pixel clock support• Robust Power-Over-Coaxial (PoC) operation• Programmable data payload:
– 10-Bit payload up to 100-MHz– 12-Bit payload up to 100-MHz
• Continuous low latency bidirectional controlinterface channel with I2C support at 400-kHz
• Embedded clock with DC-balanced coding tosupport AC-coupled interconnects
• Capable of driving up to 15-m coaxial or ShieldedTwisted-Pair (STP) cables
• 4 Dedicated General-Purpose Input/Output (GPIO)• 1.8-V, 2.8-V or 3.3-V compatible parallel inputs on
serializer• Single power supply at 1.8-V• ISO 10605 and IEC 61000-4-2 ESD compliant
2 Applications• Automotive
– Surround View Systems (SVS)– Front Cameras (FC)– Rear View Cameras (RVC)– Sensor fusion– Driver Monitor Cameras (DMS)– Remote satellite RADAR, ToF, and LIDAR
sensors• Security and surveillance• Machine vision applications
3 DescriptionThe DS90UB933-Q1 device offers an FPD-Link IIIinterface with a high-speed forward channel and abidirectional control channel for data transmissionover a single coaxial cable or differential pair. TheDS90UB933-Q1 device incorporates differentialsignaling on both the high-speed forward channel andbidirectional control channel data paths. Theserializer/deserializer pair is targeted for connectionsbetween imagers and video processors in anelectronic control unit (ECU). This device is ideallysuited for driving video data requiring up to 12-bit pixeldepth plus two synchronization signals along withbidirectional control channel bus.
Using TI’s embedded clock technology allowstransparent full-duplex communication over a singledifferential pair, carrying asymmetrical-bidirectionalcontrol channel information. This single serial streamsimplifies transferring a wide data bus over PCBtraces and cable by eliminating the skew problemsbetween parallel data and clock paths. Thissignificantly saves system cost by narrowing datapaths that in turn reduce PCB layers, cable width, andconnector size and pins. Internal DC-balancedencoding/decoding is used to support AC-coupledinterconnects.
Device InformationPART NUMBER(1) PACKAGE BODY SIZE (NOM)
DS90UB933-Q1 WQFN (32) 5.00 mm × 5.00 mm
(1) For all available packages, see the orderable addendum atthe end of the data sheet.
DS90UB933-Q1SNLS546E – AUGUST 2016 – REVISED NOVEMBER 2020
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.
11 Device and Documentation Support..........................4611.1 Documentation Support.......................................... 4611.2 Receiving Notification of Documentation Updates.. 4611.3 Support Resources................................................. 4611.4 Trademarks............................................................. 4611.5 Electrostatic Discharge Caution.............................. 4611.6 Glossary.................................................................. 46
4 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (January 2020) to Revision E (November 2020) Page• Added register 0x27[3] to register map.............................................................................................................30• Clarified PDB voltage level for t3 and t4 in Power-Up Sequencing from 90% VPDB to PDB VIH ...................... 37• Changed Power-Up Sequencing alternative programming steps (t3*) to add NCLK reset...............................37• Clarified Power-Up Sequencing alternative programming steps (t3*) to remove delay between I2C commands
Changes from Revision C (November 2019) to Revision D (January 2020) Page• Clarified GPO2 description by removing statement about leaving pin open if unused ...................................... 4• Added maximum power up timing constraint between VDD_n and PDB ........................................................ 37• Added recommended software programming steps if VDD_n to PDB maximum power up timing constraint
can not be met ................................................................................................................................................. 37
Changes from Revision B (September 2018) to Revision C (November 2019) Page• Added register 0x27[5] to register map ............................................................................................................30
Changes from Revision A (December 2016) to Revision B (September 2018) Page• Added recommendation to ensure GPO2 is low when PDB goes high.............................................................. 4• Added external clock input frequency range ......................................................................................................6• Added strap pin input current specification for MODE and IDX pins ................................................................. 7• Updated TJIT1 PCLK input jitter in the external oscillator mode........................................................................10• Added that 0.45UI TJIT2 maximum is when used with DS90UB934-Q1 and added new foot note ..................10• Added clarification on MODE pin description in PCLK from imager mode ...................................................... 22• Updated the MODE setting values to ratio from voltage...................................................................................22• Updated IDX setting values to ratio from voltage............................................................................................. 27• Added register "TYPE" column per legend ......................................................................................................30
DS90UB933-Q1SNLS546E – AUGUST 2016 – REVISED NOVEMBER 2020 www.ti.com
• Added type and default value to the reserved register bits that were missing this information........................ 30• Added that register 0x00[7:1] does not auto update IDX strapped address .................................................... 30• Added description for 0x05 bits 1 and 0 (TX_MODE_12b and TX_MODE_10b)............................................. 30• Added reference to Power over Coax Application report..................................................................................37• Clarified description on PDB pin usage during power up ................................................................................ 37• Added paragraph to explain setting registers if GPO2 state is not determined when PDB goes high ............ 37• Added GPO2 to suggested power-up sequencing diagram ............................................................................ 37• timing constraint for PDB to GPO2 delay ........................................................................................................ 37• Revised coax connection diagram to include pulldown resistor for GPO2 ...................................................... 39• Revised STP connection diagram to include pulldown resistor for GPO2 .......................................................41
Changes from Revision * (August 2016) to Revision A (December 2016) Page• Changed Product Preview to Production Data release...................................................................................... 1
Parallel data Inputs. For 10-bit MODE, parallel inputs DIN[0:9] are active. DIN[10:11] areinactive and should not be used. Any unused inputs (including DIN[10:11]) must be NoConnect. For 12-bit MODE, parallel inputs DIN[0:11] are active. Any unused inputs must beNo Connect.
HSYNC 1Input,
LVCMOSw/ pulldown
Horizontal SYNC input. Note: HS transition restrictions: 1. 12-bit mode: No HS restrictions(raw) 2. 10-bit mode: HS restricted to no more than one transition per 10 PCLK cycles.Leave open if unused.
VSYNC 2Input,
LVCMOSw/ pulldown
Vertical SYNC input. Note: VS transition restrictions: 1. 12-bit mode: No VS restrictions (raw)2. 10-bit mode: VS restricted to no more than one transition per 10 PCLK cycles. Leaveopen if unused.
PCLK 3Input,
LVCMOSw/ pulldown
Pixel clock input pin. Strobe edge set by TRFB control register 0x03[0].
GENERAL PURPOSE OUTPUT (GPO)
GPO[1:0] 16,15 Output,LVCMOS
General-purpose output pins can be configured as outputs, used to control and respond tovarious commands. GPO[1:0] can be configured to be the outputs for input signals comingfrom GPIO[1:0] pins on the deserializer or can be configured to be outputs of the localregister on the serializer. Leave open if unused.
GPO[2]/CLKOUT 17 Output,
LVCMOS
GPO[2] pin can be configured to be the output for input signal coming from the GPIO[2] pinon the deserializer or can be configured to be the output of the local register on theSerializer. It can also be configured to be the output clock pin when the DS90UB933-Q1device is used in the external oscillator mode. See Section 7.4 for a detailed description ofExternal Oscillator mode. It is recommended to pull GPO2 to GND with a minimum 40-kΩresistor to ensure GPO2=LOW when PDB transitions from LOW to HIGH.
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GPO[3] can be configured to be the output for input signals coming from the GPIO[3] pin onthe deserializer or can be configured to be the output of the local register setting on theserializer. It can also be configured to be the input clock pin when the DS90UB933-Q1serializer is working with an external oscillator. See Section 7.4 for a detailed description ofexternal oscillator mode. Leave open if unused.
BIDIRECTIONAL CONTROL BUS - I2C-COMPATIBLE
SCL 4 Input/Output,Open Drain
Clock line for the bidirectional control bus communicationSCL requires an external pullup resistor to V(VDDIO).
SDA 5 Input/Output,Open Drain
Data line for the bidirectional control bus communicationSDA requires an external pullup resistor to V(VDDIO).
MODE 8 Input, analog
Device mode selectResistor (Rmode) to ground and 10-kΩ pullup to 1.8 V rail. MODE pin on the serializer canbe used to select whether the system is running off the PCLK from the imager or an externaloscillator. See details in Table 7-2.
IDX 6 Input, analogDevice ID Address SelectThe IDX pin on the serializer is used to assign the I2C device address. Resistor (RID) toGround and 10-kΩ pullup to 1.8 V rail. See Table 7-6.
CONTROL AND CONFIGURATION
PDB 9Input,
LVCMOSw/ pulldown
Power-down mode input pinPDB = H, Serializer is enabled and is ON.PDB = L, Serializer is in power down mode. When the serializer is in power down, the PLL isshut down, and IDD is minimized. Programmed control register data is NOT retained andreset to default values.
RES 7Input,
LVCMOSw/ pulldown
ReservedThis pin MUST be tied LOW.
FPD–Link III INTERFACE
DOUT+ 13 Input/Output,CML
Non-inverting differential output, bidirectional control channel input. The interconnect mustbe AC coupled with a 0.1-µF capacitor.
DOUT- 12 Input/Output,CML
Inverting differential output, bidirectional control channel input. The interconnect must be ACcoupled with a 0.1-µF capacitor. For applications using single-ended coaxial interconnect,place a 0.047-µF AC-coupling capacitor in series with a 50-Ω resistor before terminating toGND.
POWER AND GROUND(1)
VDDPLL 10 Power,Analog PLL power, 1.8 V ±5%.
VDDT 11 Power,Analog Tx analog power, 1.8 V ±5%.
VDDCML 14 Power,Analog CML and bidirectional channel driver power, 1.8 V ±5%.
VDDD 28 Power, Digital Digital Power, 1.8 V ±5%.
VDDIO 25 Power, Digital Power for I/O stage. The single-ended inputs and SDA, SCL are powered from V(VDDIO).VDDIO can be connected to a 1.8 V ±5% or 2.8 V ±10% or 3.3 V ±10%.
VSS DAP Ground, DAP DAP must be grounded. DAP is the large metal contact at the bottom side, located at thecenter of the WQFN package. Connected to the ground plane (GND) with at least 9 vias.
6 Specifications6.1 Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNITSupply voltage – V(VDD_n) (V(VDDPLL), V(VDDT), V(VDDCML), V(VDDD)) –0.3 2.5 V
Supply voltage – V(VDDIO) −0.3 4 V
LVCMOS input voltage −0.3 V(VDDIO) + 0.3 V
FPD-Link III I/O voltage – V(VDD_n) –0.3 V(VDD_n) + 0.3 V
Junction temperature 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 6.3.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD RatingsVALUE UNIT
V(ESD)Electrostaticdischarge
Human body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 3B ±8000
V
Charged device model (CDM), per AECQ100-011CDM ESD Classification Level C6
over operating free-air temperature range (unless otherwise noted)MIN NOM MAX UNIT
External clock input frequency to GPO3 - 10-bit mode 25 50 MHz
External clock input frequency to GPO3 - 12-bit mode 25 66.67 MHz
(1) Supply noise testing was done with minimum capacitors (as shown on Figure 8-9, Figure 8-5 on the PCB. A sinusoidal signal is ACcoupled to the V(VDD_n) (1.8 V) supply with amplitude = 25 mVp-p measured at the device V(VDD_n) pins. Bit error rate testing of input tothe serializer and output of the deserializer with 10-meter cable shows no error when the noise frequency on the serializer is less than1 MHz. The deserializer, on the other hand, shows no error when the noise frequency is less than 750 kHz.
Over recommended operating supply and temperature ranges unless otherwise specified.(1) (2) (3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITVIH High level input voltage VIN = 2.52 V to 3.08 V 0.7 VIN VIN VVIL Low level input voltage VIN = 2.52 V to 3.08 V GND 0.3 VIN
IIN Input current VIN = 0 V or 3.08 V, VIN = 2.52 V to 3.08 V –20 ±1 20 µA
VOH High level output voltage V(VDDIO) = 2.52 V to 3.08 V, IOH = −4 mA V(VDDIO) - 0.4 V(VDDIO) V
VOL Low level output voltage V(VDDIO) =2.52 V to 3.08V IOL = 4 mA GND 0.4 V
IOSOutput short-circuitcurrent VOUT = 0 V Serializer
GPO outputs –11 mA
IOZ Tri-state output current PDB = 0 V,VOUT = 0 V or V(VDDIO)
(1) The Electrical Characteristics tables list verified specifications under the listed Section 6.3 except as otherwise modified or specified bythe Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not verified.
(2) Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to groundexcept VOD and ΔVOD which are differential voltages.
(3) Typical values represent most likely parametric norms at 1.8 V or 3.3 V, TA = 25°C, and at the Section 6.3 at the time of productcharacterization and are not verified.
(4) The back channel frequency (MHz) listed is the frequency of the internal clock used to generate the encoded back channel datastream. The data rate (Mbps) of the encoded back channel stream is the back channel frequency divided by 2.
(1) Recommended input timing requirements are input specifications and not tested in production.(2) T is the period of the PCLK.(3) Typical values represent most likely parametric norms at 1.8 V or 3.3 V, TA = 25°C, and at Section 6.3 at the time of product
characterization and are not verified.(4) 0.45UI maximum when used with DS90UB934-Q1 deserializer. When used with DS90UB914A-Q1 deserializer, the maximum is 0.3UI.(5) ƒPCLK denotes input PCLK frequency to the device.(6) ƒOSC denotes input external oscillator frequency to the device (GPO3/CLKIN).
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6.7 AC Timing Specifications (SCL, SDA) - I2C-CompatibleOver recommended supply and temperature ranges unless otherwise specified. (Figure 6-1)
PARAMETER TEST CONDITIONS MIN NOM MAX UNITRECOMMENDED INPUT TIMING REQUIREMENTS
ƒSCL SCL Clock FrequencyStandard mode 100 kHz
Fast mode 400 kHz
tLOW SCL Low PeriodStandard mode 4.7 µs
Fast mode 1.3 µs
tHIGH SCL high periodStandard mode 4.0 µs
Fast mode 0.6 µs
tHD:STAHold time for a start or a repeated startcondition
Standard mode 4.0 µs
Fast mode 0.6 µs
tSU:STASetup time for a start or a repeated startcondition
Standard mode 4.7 µs
Fast mode 0.6 µs
tHD:DAT Data hold timeStandard mode 0 3.45 µs
Fast mode 0 900 ns
tSU:DAT Data setup timeStandard mode 250 ns
Fast mode 100 ns
tSU:STO Setup time for stop conditionStandard mode 4.0 µs
Fast mode 0.6 µs
tBUF Bus free time between stop and startStandard mode 4.7 µs
Fast mode 1.3 µs
tr SCL and SDA rise timeStandard mode 1000 ns
Fast mode 300 ns
tf SCL and SDA fall timeStandard mode 300 ns
Fast mode 300 ns
6.8 Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C-CompatibleOver recommended supply and temperature ranges unless otherwise specified(1)
PARAMETER TEST CONDITIONS MIN NOM MAX UNITRECOMMENDED INPUT TIMING REQUIREMENTS
VIH Input high level SDA and SCL 0.7 × V(VDDIO) V(VDDIO) V
VIL Input low level SDA and SCL GND 0.3 × V(VDDIO) V
(1) Specification is verified by design.(2) FPD-Link device was designed primarily for point-to-point operation and a small number of attached slave devices. As such the
minimum IOL pullup current is targeted to lower value than the minimum IOL in the I2C specification.
Over recommended operating supply and temperature ranges unless otherwise specified.PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
12–bit modePCLK = 100 MHz, Default registers 500
(1) tPLD is the time required by the serializer to obtain lock when exiting power-down state with an active PCLK.(2) Specification is verified by design.(3) Typical values represent most likely parametric norms at 1.8 V or 3.3 V, TA = 25°C, and at Section 6.3 at the time of product
characterization and are not verified.(4) Specification is verified by characterization and is not tested in production.(5) UI – Unit Interval is equivalent to one ideal serialized data bit width. The UI scales with PCLK frequency.
7 Detailed Description7.1 OverviewThe DS90UB933-Q1 is optimized to interface with the DS90UB934-Q1 or DS90UB964-Q1 using a 50-Ω coaxinterface. The DS90UB933-Q1 also works with the DS90UB934-Q1 or DS90UB964-Q1 using an STP interface.
The DS90UB933/934 FPD-Link III chipsets are intended to link mega-pixel camera imagers and videoprocessors in ECUs. The Serializer/Deserializer chipset can operate from 37.5 MHz to 100 MHz pixel clockfrequency. The DS90UB933-Q1 device transforms a 10/12-bit wide parallel LVCMOS data bus along with abidirectional control channel control bus into a single high-speed differential pair. The high-speed serial bitstream contains an embedded clock and DC-balanced information which enhances signal quality to support ACcoupling. The DS90UB934-Q1 device receives the single serial data stream and converts it back into a 10/12-bitwide parallel data bus together with the control channel data bus. The DS90UB933/934 chipsets can accept upto:• 12-bits of DATA + 2 SYNC bits for an input PCLK range of 37.5 MHz to 100 MHz in the 12-bit mode. Note: No
HS/VS restrictions (raw).• 10-bits of DATA + 2 SYNC bits for an input PCLK range of 50 MHz to 100 MHz in the 10-bit mode. Note:
HS/VS restricted to no more than one transition per 10 PCLK cycles.
The DS90UB933/934 chipset offer customers the choice to work with different clocking schemes. TheDS90UB933/934 chipsets can use an external oscillator as the reference clock source for the PLL (see Section7.4.1) or PCLK from the imager as primary reference clock to the PLL (see Section 7.4.2).
The high-speed forward channel is composed of 28 bits of data containing video data, sync signals, I2C, andparity bits. This data payload is optimized for signal transmission over an AC-coupled link. Data is randomized,balanced and scrambled. The 28-bit frame structure changes in the 12-bit mode and 10-bit mode internally andis seamless to the customer. The bidirectional control channel data is transferred over the single serial link alongwith the high-speed forward data. This architecture provides a full-duplex low-speed forward and backward path
across the serial link together with a high-speed forward channel without the dependence on the video blankingphase.
7.3.2 Line Rate Calculations for the DS90UB933/934
The DS90UB933-Q1 device divides the clock internally by divide-by-2 in the 10-bit mode and by divide-by-1.5 inthe 12-bit mode. Conversely, the DS90UB934-Q1 multiplies the recovered serial clock to generate the properpixel clock output frequency. The following are the formulae used to calculate the maximum line rate in thedifferent modes:
• For the 12-bit mode, Line rate = ƒPCLK × (2/3) × 28; for example, ƒPCLK = 100 MHz, line rate = (100 MHz) ×(2/3) × 28 = 1.87 Gbps
• For the 10-bit mode, Line rate = ƒPCLK/2 × 28; for example, ƒPCLK = 100 MHz, line rate = (100 MHz/2) × 28 =1.40 Gbps
7.3.3 Error Detection
The chipset provides error detection operations for validating data integrity in long distance transmission andreception. The data error detection function offers users flexibility and usability of performing bit-by-bit datatransmission error checking. The error detection operating modes support data validation of the followingsignals:
• Bidirectional control channel data across the serial link• Parallel video/sync data across the serial link
The chipset provides 1 parity bit on the forward channel and 4 cyclic redundancy check (CRC) bits on the backchannel for error detection purposes. The DS90UB933/934 chipset checks the forward and back channel seriallinks for errors and stores the number of detected errors in two 8-bit registers in the serializer and thedeserializer, respectively.
To check parity errors on the forward channel, monitor registers 0x55 and 0x56 on the DS90UB934. The parityerror counter registers return the number of data parity errors that have been detected on the FPD3 receiverdata since the last detection of valid lock or last read of these registers (0x55 and 0x56). These registers arecleared on read.
To check CRC errors on the back channel, monitor registers 0x0A and 0x0B on the serializer.
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For applications requiring multiple cameras for frame-synchronization, TI recommends using the generalpurpose input/output (GPIO) pins to transmit control signals to synchronize multiple cameras together. Tosynchronize the cameras properly, the system controller must provide a field sync output (such as a vertical orframe sync signal), and the cameras must be set to accept an auxiliary sync input. The vertical synchronizesignal corresponds to the start and end of a frame and the start and end of a field. Note this form ofsynchronization timing relationship has a non-deterministic latency. After the control data is reconstructed fromthe bidirectional control channel, there is a time variation of the GPIO signals arriving at the different targetdevices (between the parallel links). The maximum latency (t1) of the GPIO data transmitted across the link is 32µs.
Note
The user must verify that the timing variations between the different links are within their system andtiming specifications.
See Figure 7-1 for an example of this function.
The maximum time (t2) between the time the GPIO signal arrives at Camera A and Camera B is 23 µs.
There are 4 GPOs on the serializer and 4 GPIOs on the deserializer when the DS90UB933/934 chipsets are runoff the pixel clock from the imager as the reference clock source. The GPOs on the serializer can be configuredas outputs for the input signals that are fed into the deserializer GPIOs. In addition, the GPOs on the serializercan behave as outputs of the local register on the serializer. The GPIOs on the deserializer can be configured tobe the input signals feeding the GPOs (configured as outputs) on the serializer. In addition the GPIOs on thedeserializer can be configured to behave as outputs of the local register on the deserializer. The DS90UB933-Q1serializer GPOs cannot be configured as inputs for remote communication with deserializer. If theDS90UB933/934 chipsets are run off the external oscillator source as the reference clock, then GPO3 on theserializer is automatically configured to be the input for the external clock and GPO2 is configured to be theoutput of the divide-by-2 clock which is fed into the imager as its reference clock. In this case, the GPIO2 andGPIO3 on the deserializer can only behave as outputs of the local register on the deserializer. The GPIOmaximum switching rate is up to 66 kHz when configured for communication between deserializer GPIO toserializer GPO.
7.3.6 LVCMOS V(VDDIO) Option
1.8 V/2.8 V/3.3 V Serializer inputs are user configurable to provide compatibility with 1.8 V, 2.8 V, and 3.3 Vsystem interfaces.
7.3.7 Pixel Clock Edge Select (TRFB / RRFB)
The TRFB/RRFB selects which edge of the pixel clock is used. For the SER, this register determines the edgethat the data is latched on. If TRFB register is 1, data is latched on the rising edge of the PCLK. If TRFB registeris 0, data is latched on the falling edge of the PCLK. For the DES, this register determines the edge that the datais strobed on. If RRFB register is 1, data is strobed on the rising edge of the PCLK. If RRFB register is 0, data isstrobed on the falling edge of the PCLK.
DIN/
ROUT
PCLK
TRFB/RRFB: 0 TRFB/RRFB: 1
Figure 7-3. Programmable PCLK Strobe Select
7.3.8 Power Down
The SER has a PDB input pin to ENABLE or power down the device. Enabling PDB on the SER disables the linkto save power. If PDB = HIGH, the SER operates at its internal default oscillator frequency when the input PCLKstops. When the PCLK starts again, the SER locks to the valid input PCLK and transmit the data to the DES.When PDB = LOW, the high-speed driver outputs are static HIGH. See Section 8.1.2 for power-up requirements.
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7.4 Device Functional Modes7.4.1 DS90UB933/934 Operation With External Oscillator as Reference Clock
In some applications, the pixel clock that comes from the imager can have jitter which exceeds the tolerance ofthe DS90UB933/934/964 chipsets. In this case, operate the DS90UB933-Q1 device by using an external clocksource as the reference clock for the DS90UB933/934/964 chipsets. This is the recommended operating mode.The external oscillator clock output goes through a divide-by-2 circuit in the DS90UB933-Q1 serializer, and thisdivided clock output is used as the reference clock for the imager. The output data and pixel clock from theimager are then fed into the DS90UB933-Q1 device. Figure 7-4 shows the operation of the DS90UB33/934chipsets while using an external automotive grade oscillator.
Figure 7-4. DS90UB933-Q1/934-Q1 Operation in the External Oscillator Mode
When the DS90UB933-Q1 device is operated using an external oscillator, the GPO3 pin on the DS90UB933-Q1is the input pin for the external oscillator. In applications where the DS90UB933-Q1 device is operated from anexternal oscillator, the divide-by-2 circuit in the DS90UB933-Q1 device feeds back the divided clock output to theimager device through GPO2 pin. The pixel clock to external oscillator ratios must be fixed for the 12–bit modeand the 10–bit mode. In the 10-bit mode, the pixel clock frequency divided by the external oscillator frequencymust be 2. In the 12-bit mode, the pixel clock frequency divided by the external oscillator frequency must be 1.5.For example, if the external oscillator frequency is 48 MHz in the 10-bit mode, the pixel clock frequency of theimager must be twice of the external oscillator frequency, that is, 96 MHz. If the external oscillator frequency is48 MHz in the 12-bit mode, the pixel clock frequency of the imager must be 1.5 times of the external oscillatorfrequency, that is, 72 MHz. For the range of PCLK frequency and the external clock input frequency to GPO3 in10-bit and 12-bit modes, see Section 6.3.
When PCLK signal edge is detected, and 0x03[1] = 0, the DS90UB933-Q1 switches from internal oscillatormode to an external PCLK. Upon removal of PCLK input, the device switches back into internal oscillator mode.In external oscillator mode, GPO2 and GPO3 on the serializer cannot act as the output of the input signalcoming from GPIO2 or GPIO3 on the deserializer.
Table 7-1. Device Functional Mode With Example XCLKIN = 48 MHzMODE GPIO3 XCLKIN GPIO2 XCLKOUT =
XCLKIN / 2 RATIO INPUT PCLK FREQUENCY =XLCKIN * RATIO
Table 7-1. Device Functional Mode With Example XCLKIN = 48 MHz (continued)MODE GPIO3 XCLKIN GPIO2 XCLKOUT =
XCLKIN / 2 RATIO INPUT PCLK FREQUENCY =XLCKIN * RATIO
12-bit 48 MHz 24 MHz 1.5 72 MHz
7.4.2 DS90UB933/934 Operation With Pixel Clock From Imager as Reference Clock
The DS90UB933/934/964 chipsets can be operated by using the pixel clock from the imager as the referenceclock. Figure 7-5 shows the operation of the DS90UB933/934/964 chipsets using the pixel clock from the imager.If the DS90UB933-Q1 device is operated using the pixel clock from the imager as the reference clock, then theimager uses an external oscillator as its reference clock. There are 4 GPIOs available in this mode (PCLK fromimager mode).
Figure 7-5. DS90UB933-Q1/934-Q1 Operation in PCLK mode
7.4.3 MODE Pin on Serializer
The MODE pin on the serializer can be configured to select if the DS90UB933-Q1 device is to be operated fromthe external oscillator or the PCLK from the imager. The pin must be pulled to VDD_n(1.8 V, not VDDIO) with aresistor R1 and a pulldown resistor R2 for external oscillator mode to create the ratio shown in Figure 7-6. If thedevice is to be operated from PCLK from imager mode, MODE pin can be pulled up to VDD_n (1.8V) with a 10-kΩresistor directly or use the ratio shown in Figure 7-6 and Table 7-2. Suggested resistor values are given in Table7-2. The recommended maximum resistor tolerance is 1%. Other resistor values can be used as long as theratio is met under all conditions.
Serializer
R1
R2
MODE
1.8 V
VMODE
Figure 7-6. MODE Pin Configuration on DS90UB933-Q1
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When a PCLK is not applied to the DS90UB933-Q1, the serializer establishes the FPD-III link using an internaloscillator. During normal operation (not BIST) the frequency of the internal oscillator can be adjusted fromDS90UB933-Q1 register 0x14[2:1] according to Table 7-3. In BIST mode, the internal oscillator frequency shouldonly be adjusted from the DS90UB934-Q1. The BIST frequency can be set by either pin strapping (Table 7-4) orregister (Table 7-5). In BIST DS90UB933-Q1 register 0x14[2:1] is automatically loaded from the DS90UB934-Q1through the bi-directional control channel.
Table 7-3. Clock Sources for Forward Channel Frame on the Serializer During Normal OperationDS90UB933-Q1Reg 0x14 [2:1]
10-BITMODE
12-BITMODE
00 50 MHz 37.5 MHz
01 100 MHz 75 MHz
10 50 MHz 37.5 MHz
11 Reserved Reserved
7.4.5 Built-In Self Test
An optional at-speed built-in self test (BIST) feature supports the testing of the high-speed serial link and low-speed back channel. This is useful in the prototype stage, equipment production, and in-system test and also forsystem diagnostics.
The chipset can be programmed into BIST mode using either pins or registers on the DES only. By default, BISTconfiguration is controlled through pins. BIST can be configured via registers using BIST Control register (0xB3).Pin-based configuration is defined as follows:
• BISTEN = HIGH: Enable the BIST mode, BISTEN = LOW: Disable the BIST mode.• Deserializer GPIO0 and GPIO1: Defines the BIST clock source (PCLK vs various frequencies of internal
OSC)
Table 7-4. BIST Pin ConfigurationDESERIALIZER GPIO[0:1] OSCILLATOR SOURCE BIST FREQUENCY
BIST mode provides various options for the PCLK source. Either external pins (GPIO0 and GPIO1) or registerscan be used to program the BIST to use external PCLK or various OSC frequencies. Refer to Table 7-4 for pinsettings. The BIST status can be monitored real-time on the PASS pin. For every frame with error(s), the PASSpin toggles low for one-half PCLK period. If two consecutive frames have errors, PASS toggles twice to allowcounting of frames with errors. Once the BIST is done, the PASS pin reflects the pass/fail status of the last BISTrun only for one PCLK cycle. The status can also be read through I2C for the number of frames in errors. BISTstatus register retains results until it is reset by a new BIST session or a device reset. To evaluate BIST inexternal oscillator mode, both the external oscillator and PCLK must be present. For all practical purposes, theBIST status can be monitored from the BIST Error Count register 0x57 on the DS90UB934 deserializer.
7.4.7 Sample BIST Sequence
• Step 1: For the DS90UB933/934 FPD-Link III chipset, BIST mode is enabled via the BISTEN pin ofDS90UB934-Q1 FPD-Link III deserializer. The desired clock source is selected through the deserializerGPIO0 and GPIO1 pins as shown in Table 7-4.
• Step 2: The DS90UB933-Q1 serializer BIST pattern is enabled through the back channel. The BIST patternis sent through the FPD-Link III to the deserializer. Once the serializer and deserializer are in the BIST modeand the deserializer acquires lock, the PASS pin of the deserializer goes high, and BIST starts checking theFPD-Link III serial stream. If an error in the payload is detected, the PASS pin switches low for one half of theclock period. During the BIST test, the PASS output can be monitored and counted to determine the payloaderror rate.
• Step 3: To stop the BIST mode, the deserializer BISTEN pin is set LOW. The deserializer stops checking thedata. The final test result is not maintained on the PASS pin. To monitor the BIST status, check the BISTError Count register, 0x57 on the deserializer.
• Step 4: The link returns to normal operation after the deserializer BISTEN pin is low. Figure 7-8 shows thewaveform diagram of a typical BIST test for two cases. Case 1 is error free, and Case 2 shows one withmultiple errors. In most cases, it is difficult to generate errors due to the robustness of the link (differentialdata transmission, etc.); thus, they may be introduced by greatly extending the cable length, faulting theinterconnect, or by reducing signal condition enhancements (Rx equalization).
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An integrated I2C slave controller is embedded in the DS90UB933-Q1 serializer. It must be used to configure theextra features embedded within the programmable registers or it can be used to control the set of programmableGPIOs.
7.5.2 Description of Bidirectional Control Bus and I2C Modes
The I2C-compatible interface allows programming of the DS90UB933-Q1, DS90UB934-Q1, DS90UB964-Q1, oran external remote device (such as image sensor) through the bidirectional control channel. Registerprogramming transactions to/from the DS90UB933/934/964 chipset are employed through the clock (SCL) anddata (SDA) lines. These two signals have open drain I/Os, and both lines must be pulled up to V (VDDIO) by anexternal resistor. Pullup resistors or current sources are required on the SCL and SDA busses to pull them highwhen they are not being driven low. A logic LOW is transmitted by driving the output low. Logic HIGH istransmitted by releasing the output and allowing it to be pulled up externally. The appropriate pullup resistorvalues depend upon the total bus capacitance and operating speed. The DS90UB933-Q1 I2C bus data ratesupports up to 400 kbps according to I2C fast mode specifications.
For further description of general I2C communication, refer to the Understanding the I2C Bus application note .For more information on choosing appropriate pullup resistor values, see the I2C Bus Pullup Resistor Calculationapplication note .
A
C
K
A
C
K
A
C
K
S P
Sto
p
Bus Activity:
Slave
SDA Line
Bus Activity:
MasterSlave
Address Address Data
Sta
rt
0
Register
7-bit Address
Figure 7-9. Write Byte
Bus Activity:
Master
SDA Line
Bus Activity:
Slave
Sta
rt
Slave
Address
A
C
K
S
Address
A
C
K
S
Sta
rt
Slave
Address
A
C
K
N
A
C
K
P
Sto
p
Data
0 1
Register
7-bit Address 7-bit Address
Figure 7-10. Read Byte
SCL
SDA
START STOP
1 2 6 7 8 9 1 2 8 9
MSB
7-bit Slave Address
R/W
Direction
BitAcknowledge
from the Device
MSB
Data Byte
*Acknowledge
or Not-ACK
ACK N/ACK
Repeated for the Lower Data Byte
and Additional Data Transfers
LSB LSB
Figure 7-11. Basic Operation
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I2C pass-through provides a way to access remote devices at the other end of the FPD-Link III interface. Thisoption is used to determine if an I2C instruction is transferred over to the remote I2C bus. For example, when theI2C master is connected to the deserializer and I2C pass-through is enabled on the deserializer, any I2C traffictargeted for the remote serializer or remote slave is allowed to pass through the deserializer to reach thoserespective devices.
If the master controller transmits an I2C transaction for address 0xA0, the DES A with I2C pass-through enabledtransfers I2C commands to remote Camera A. The DES B (with I2C pass-through disabled) will NOT pass I2Ccommands on the I2C bus to Camera B.
ECU
Module
DS90UB934-Q1DS90UB933-Q1
DIN[11:0]
,HS,VS
PCLK
CMOS
Image
Sensor
I2C
ROUT[11:0],
HS,VS,
PCLK
I2C
SDASCL
SDASCL
PC
DES B: I2C_SLAVE
Local
I2C_PASS_THRU Disabled
DS90UB934-Q1DS90UB933-Q1
DIN[11:0]
,HS,VS
PCLK
CMOS
Image
Sensor
I2C
ROUT[11:0],
HS,VS,
PCLK
I2C
SDASCL
SDASCL
Camera B
Slave ID: (0xA0)
SER A:
Remote I2C _MASTER Proxy
DES A: I2C_SLAVE
Local
I2C_PASS_THRU Enabled
Camera A
Slave ID: (0xA0)
MasterSER B:
Remote I2C_MASTER Proxy
Figure 7-13. I2C Pass-Through
7.5.4 Slave Clock Stretching
The I2C-compatible interface allows programming of the DS90UB933-Q1, DS90UB934-Q1, DS90UB964-Q1, oran external remote device (such as image sensor) through the bidirectional control. To communicate andsynchronize with remote devices on the I2C bus through the bidirectional control channel/MCU, the chipsetutilizes bus clock stretching (holding the SCL line low) during data transmission; where the I2C slave pulls theSCL line low on the 9th clock of every I2C transfer (before the ACK signal). The slave device does not controlthe clock and only stretches it until the remote peripheral has responded. The I2C master must support clockstretching to operate with the DS90UB933/934/964 chipset.
7.5.5 IDX Address Decoder on the Serializer
The IDX pin on the serializer is used to decode and set the physical slave address of the serializer (I2C only) toallow up to five devices on the bus connected to the serializer using only a single pin. The pin sets one of the 4
possible addresses for each serializer device. The pin must be pulled to V (VDD_n) (1.8 V, not V (VDDIO)) with aresistor, R3, and a pulldown resistor R4. Suggested resistor values are given in Table 7-6. The recommendedmaximum resistor tolerance is 1%. Other resistor values can be used as long as the ratio is met under allconditions.
Some applications require multiple camera devices with the same fixed address to be accessed on the same I2Cbus. The DS90UB933-Q1 provides slave ID matching/aliasing to generate different target slave addresses whenconnecting more than two identical devices together on the same bus. This allows the slave devices to beindependently addressed. Each device connected to the bus is addressable through a unique ID byprogramming of the slave alias register on deserializer. This remaps the slave alias address to the targetSLAVE_ID address; up to 8 ID aliases are supported in sensor mode when slaves are attached to theDS90UB933-Q1 serializer. In display mode, when the external slaves are at the deserializer the DS90UB933-Q1supports one ID alias. The ECU controller must keep track of the list of I2C peripherals in order to properlyaddress the target device.
See Figure 7-15 for an example of this function.
• ECU is the I2C master and has an I2C master interface.• The I2C interfaces in DES A and DES B are both slave interfaces.• The I2C protocol is bridged from DES A to SER A and from DES B to SER B.• The I2C interfaces in SER A and SER B are both master interfaces.
If master controller transmits I2C slave 0xA0, DES A (address 0xC0), with pass-through enabled, forwards thetransaction to remote Camera A. If the controller transmits slave address 0xA4, the DES B 0xC2 recognizes that0xA4 is mapped to 0xA0 and is transmitted to the remote Camera B. If controller sends command to address0xA6, the DES B (address 0xC2), with pass-through enabled, forwards the transaction to slave device 0xA2.
In the register definitions under the TYPE and DEFAULT heading, the following definitions apply:
• R = Read only access• R/W = Read / Write access• R/RC = Read only access, Read to Clear• (R/W)/SC = Read / Write access, Self-Clearing bit• (R/W)/S = Read / Write access, Set based on strap pin configuration at startup• LL = Latched Low and held until read• LH = Latched High and held until read• S = Set based on strap pin configuration at startup
Table 7-7. DS90UB933-Q1 Control RegistersAddr(Hex) Name Bits Field TYPE Default Description
0x00 I2C Device ID7:1 DEVICE ID
R/W 0xB0
7-bit address of serializer (0x58'h default). This fielddoes not auto update IDX strapped address.
0 Serializer ID SEL 0: Device ID is from IDX1: Register I2C Device ID overrides IDX
Clear CRC error countersThis bit is NOT self-clearing.1: Clear counters0: Normal operation
4 I2C Remote WriteAuto Acknowledge R/W 0
Automatically acknowledge I2C remote writeThe mode works when the system is LOCKed.1: Enable: When enabled, I2C writes to thedeserializer (or any remote I2C Slave, if I2C PASSALL is enabled) are immediately acknowledgedwithout waiting for the deserializer to acknowledge thewrite. The accesses are then remapped to addressspecified in 0x06.0: Disable
3 I2C Pass-ThroughAll R/W 0
1: Enable Forward Control Channel pass-through of allI2C accesses to I2C IDs that do not match theserializer I2C ID. The I2C accesses are thenremapped to address specified in register 0x06.0: Enable Forward Control Channel pass-through onlyof I2C accesses to I2C IDs matching either the remotedeserializer ID or the remote I2C IDs.
2 I2C Pass-Through R/W 1
I2C Pass-through mode1: Pass-through enabled. DES alias 0x07 and slavealias 0x090: Pass-through disabled
1 OV_CLK2PLL R/W 0
1:Enabled : When enabled this register overrides theclock to PLL mode (External Oscillator mode or DirectPCLK mode) defined through MODE pin and allowsselection through register 0x35 in the serializer.0: Disabled : When disabled, Clock to PLL mode(External Oscillator mode or Direct PCLK mode) isdefined through MODE pin on the Serializer.
0 TRFB R/W 1
Pixel clock edge select1: Parallel interface data is strobed on the rising clockedge0: Parallel interface data is strobed on the falling clockedge
Table 7-7. DS90UB933-Q1 Control Registers (continued)Addr(Hex) Name Bits Field TYPE Default Description
0x05 Mode Select
7 RSVD R/W 0 Reserved
6 RSVD R/W 0 Reserved
5 MODE_OVERRIDE R/W 0
Allows overriding mode select bits coming from back-channel.1: Overrides MODE select bits0: Does not override MODE select bits
4 MODE_UP_TO_DATE R 0
1: Status of mode select from deserializer is up-to-date.0: Status is NOT up-to-date.
3 Pin_MODE_12–bit mode R 0 1: 12-bit mode is selected.
0: 12-bit mode is not selected.
2 Pin_MODE_10–bit mode R 0 1: 10-bit mode is selected.
0: 10-bit mode is not selected.
1 TX_MODE_12b R/W 0
Selects 12 bit data-bus. This bit changes the Tx modesettings if MODE_OVERRIDE is SET 0x05[5] = 1.1: Enables 12 bit HF mode0: Disables 12 bit HF modeNote: This bit changes mode settings on TX. WhenTX_MODE_12b is set TX_MODE_10b must becleared; 0x05[1:0] = 10.
0 TX_MODE_10b R/W 0
Selects 10 bit data-bus. This bit changes the Tx modesettings if MODE_OVERRIDE is SET 0x05[5] = 1.1: Enables 10b mode0: Disables 10b modeNote: This bit changes mode settings on TX. WhenTX_MODE_10b is set TX_MODE_12b must becleared; 0x05[1:0] = 01.
0x06 DES ID
7:1 DeserializerDevice ID R/W 0x00
7-bit deserializer Device ID Configures the I2C SlaveID of the remote deserializer. A value of 0 in this fielddisables I2C access to the remote deserializer. Thisfield is automatically configured by the bidirectionalcontrol channel once RX Lock has been detected.Software may overwrite this value, but should alsoassert the FREEZE DEVICE ID bit to preventoverwriting by the bidirectional control channel.
0 Freeze Device ID R/W 0
1: Prevents auto-loading of the deserializer Device IDby the bidirectional control channel. The ID is frozen atthe value written.0: Update
0x07 DES Alias7:1 Deserializer ALIAS
ID R/W 0x00
7-bit remote deserializer device alias ID Configures thedecoder for detecting transactions designated for anI2C deserializer device. The transaction is remappedto the address specified in the DES ID register.A value of 0 in this field disables access to the remotedeserializer.
0 RSVD R/W 0 Reserved
0x08 SlaveID7:1 SLAVE ID R/W 0x00
7-bit remote slave device ID Configures the physicalI2C address of the remote I2C slave device attachedto the remote deserializer. If an I2C transaction isaddressed to the slave alias ID, the transaction isremapped to this address before passing thetransaction across the bidirectional control channel tothe deserializer and then to remote slave. A value of 0in this field disables access to the remote I2C slave.
0 RSVD R/W 0 Reserved
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Table 7-7. DS90UB933-Q1 Control Registers (continued)Addr(Hex) Name Bits Field TYPE Default Description
0x09 Slave Alias7:1 SLAVE ALIAS ID R/W 0x00
7-bit remote slave device alias ID Configures thedecoder for detecting transactions designated for anI2C slave device attached to the remote deserializer.The transaction is remapped to the address specifiedin the slave ID register. A value of 0 in this fielddisables access to the remote I2C slave.
0 RSVD R/W 0 Reserved
0x0A CRC Errors 7:0 CRC Error Byte 0 R 0x00 Number of back-channel CRC errors during normaloperation. Least significant byte.
0x0B CRC Errors 7:0 CRC Error Byte 1 R 0x00 Number of back-channel CRC errors during normaloperation. Most significant byte
0x0C General Status
7:5 Rev-ID R 0x0 Revision ID0x0: Production Revision ID
4 RX Lock Detect R 0 1: RX LOCKED0: RX not LOCKED
3 BIST CRCError Status R 0 1: CRC errors in BIST mode
0: No CRC errors in BIST mode
2 PCLK Detect R 0 1: Valid PCLK detected0: Valid PCLK not detected
1 DES Error R 0
1: CRC error is detected during communication withdeserializer.This bit is cleared upon loss of link or assertion of CRCERROR RESET in register 0x03[5].0: No effect
0 LINK Detect R 0
1: Cable link detected0: Cable link not detectedThis includes any of the following faults:— Cable open— '+' and '-' shorted— Short to GND— Short to battery
0x0DGPO[0]
and GPO[1]Configuration
7 GPO1 OutputValue R/W 0
Local GPIO output value. This value is output on theGPIO pin when the GPIO function is enabled. Thelocal GPIO direction is output, and remote GPIOcontrol is disabled.
6 GPO1 RemoteEnable R/W 1
Remote GPIO Control1: Enable GPIO control from remote deserializer. TheGPIO pin must be an output, and the value is receivedfrom the remote Deserializer.0: Disable GPIO control from remote deserializer
5 RSVD R/W 0 Reserved
4 GPO1 Enable R/W 1 1: GPIO enable0: Tri-state
3 GPO0 OutputValue R/W 0
Local GPIO output value. This value is output on theGPIO pin when the GPIO function is enabled. Thelocal GPIO direction is output, and remote GPIOcontrol is disabled.
2 GPO0 RemoteEnable R/W 1
Remote GPIO Control1: Enable GPIO control from remote deserializer. TheGPIO pin must be an output, and the value is receivedfrom the remote Deserializer.0: Disable GPIO control from remote deserializer.
Table 7-7. DS90UB933-Q1 Control Registers (continued)Addr(Hex) Name Bits Field TYPE Default Description
0x0EGPO[2]
and GPO[3]Configuration
7 GPO3 OutputValue R/W 0
Local GPIO output value. This value is output on theGPIO pin when the GPIO function is enabled. Thelocal GPIO direction is output, and remote GPIOcontrol is disabled.
6 GPO3 RemoteEnable R/W 0
Remote GPIO vontrol1: Enable GPIO control from remote Deserializer. TheGPIO pin must be an output, and the value is receivedfrom the remote deserializer.0: Disable GPIO control from remote Deserializer.
5 GPO3 Direction R/W 1 1: Input0: Output
4 GPO3 Enable R/W 1 1: GPIO enable0: Tri-state
3 GPO2 OutputValue R/W 0
Local GPIO output value. This value is output on theGPIO pin when the GPIO function is enabled. Thelocal GPIO direction is output, and remote GPIOcontrol is disabled.
2 GPO2 RemoteEnable R/W 1
Remote GPIO Control1: Enable GPIO control from remote deserializer. TheGPIO pin must be an output, and the value is receivedfrom the remote deserializer.0: Disable GPIO control from remote deserializer.
1 RSVD R/W 0 Reserved
0 GPO2 Enable R/W 1 1: GPIO enable0: Tri-state
0x0F I2C MasterConfig
7:5 RSVD R 0x0 Reserved
4:3 SDA Output Delay R/W 00
SDA output delay This field configures output delay onthe SDA output. Setting this value increases outputdelay in units of 50 ns. Nominal output delay values forSCL to SDA are:00: ~350 ns01: ~400 ns10: ~450 ns11: ~500 ns
2 Local WriteDisable R/W 0
Disable remote writes to local registers setting this bitto a 1 prevents remote writes to local device registersfrom across the control channel. This prevents writesto the serializer registers from an I2C master attachedto the deserializer. setting this bit does not affectremote access to I2C slaves at the serializer.
1 I2C Bus TimerSpeed up R/W 0
Speed up I2C bus watchdog timer1: Watchdog timer expires after approximately 50microseconds.0: Watchdog timer expires after approximately 1second.
0 I2C Bus TimerDisable R/W 0
1. Disable I2C bus watchdog timer when the I2Cwatchdog timer may be used to detect when the I2Cbus is free or hung up following an invalid terminationof a transaction. If SDA is high and no signaling occursfor approximately 1 second, the I2C bus is assumed tobe free. If SDA is low and no signaling occurs, thedevice attempts to clear the bus by driving 9 clocks onSCL.0: No effect
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Table 7-7. DS90UB933-Q1 Control Registers (continued)Addr(Hex) Name Bits Field TYPE Default Description
0x10 I2C Control
7 RSVD R/W 0 Reserved
6:4 SDA Hold Time R/W 0x1Internal SDA hold time. This field configures theamount of internal hold time provided for the SDAinput relative to the SCL input. Units are 50 ns.
3:0 I2C Filter Depth R/W 0x7I2C glitch filter depth. This field configures themaximum width of glitch pulses on the SCL and SDAinputs that will be rejected. Units are 10 ns.
0x11 SCL High Time 7:0 SCL High Time R/W 0x82
I2C master SCL high time This field configures thehigh pulse width of the SCL output when the serializeris the master on the local I2C bus. Units are 50 ns forthe nominal oscillator clock frequency. The defaultvalue is set to provide a minimum (4 µs + 1 µs of risetime for cases where rise time is very fast) SCL hightime with the internal oscillator clock running at 26MHz rather than the nominal 20 MHz.
0x12 SCL LOW Time 7:0 SCL Low Time R/W 0x82
I2C SCL low time This field configures the low pulsewidth of the SCL output when the serializer is themaster on the local I2C bus. This value is also used asthe SDA setup time by the I2C slave for providing dataprior to releasing SCL during accesses over thebidirectional control channel. Units are 50 ns for thenominal oscillator clock frequency. The default value isset to provide a minimum (4.7 µs + 0.3 µs of fall timefor cases where fall time is very fast) SCL low timewith the internal oscillator clock running at 26 MHzrather than the nominal 20 MHz.
0x13 General PurposeControl 7:0 GPCR[7:0] R/W 0x00 1: High
0: Low
0x14 BIST Control
7:5 RSVD R 0x0 Reserved
4:3 RSVD R/W 0x0 Reserved
2:1 Clock Source R/W 0x0
Allows choosing different OSC clock frequencies forforward channel frame.OSC clock frequency in functional mode when OSCmode is selected or when the selected clock source isnot present, for example, missing PCLK/ externaloscillator. See Table 7-3 for oscillator clock frequencieswhen PCLK/ external clock is missing.
0 RSVD R/W 0 Reserved
0x15 -0x1D Reserved
0x1E BCC WatchdogControl
7:1 BCC WatchdogTimer R/W 0x7F
The watchdog timer allows termination of a controlchannel transaction if it fails to complete within aprogrammed amount of time. This field sets thebidirectional control channel watchdog timeout value inunits of 2 ms. This field should not be set to 0.
Selects the OSC frequency to drive out on GPO2 inexternal oscillator mode.0: Divide by 2 (default)1: Divide by 4
4:0 RSVD R/W 0x06 Reserved
0x2A CRC Errors 7:0 BIST Mode CRCErrors Count R 0x00 Number of CRC errors in the back channel when in
BIST mode
0x2B -0x2C Reserved
0x2D Inject ForwardChannel Error
7 Force ForwardChannel Error R/W 0
1: Forces 1 (one) error over forward channel frame innormal operating mode. Self-clearing bit.0: No error
6:0 Force BIST Error R/W 0x00
N: Forces N number of errors in BIST mode. Thisregister MUST be set BEFORE BIST mode is enabled.BIST error count register on the deserializer must beread AFTER BIST mode is disabled for the correctnumber of errors incurred while in BIST mode.0: No error
0x2E -0x34 Reserved
0x35 PLL ClockOverwrite
7:4 RSVD R/W 0x0 Reserved
3 PIN_LOCK toExternal Oscillator R 0
Status of mode select pin1: Indicates external oscillator mode is selected bymode-resistor0: External oscillator mode is not selected by mode-resistor
2 RSVD R 0 Reserved
1 LOCK to ExternalOscillator
R/W 0 Affects only when 0x03[1] =1 (OV_CLK2PLL) and0x35[0] = 01: Routes GPO3 directly to PLL0: Allows PLL to lock to PCLK
0 LOCK2OSC
R/W 1 Affects only when 0x03[1] = 1 (OV_CLK2PLL)1: Allows internal OSC clock to feed into PLL0: Allows PLL to lock to either PCLK or external clockfrom GPO3
(1) To ensure optimum device functionality, TI recommends to NOT write to any RESERVED registers.
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Information in the following applications sections is not part of the TI component specification, and TIdoes not warrant its accuracy or completeness. TI’s customers are responsible for determiningsuitability of components for their purposes. Customers should validate and test their designimplementation to confirm system functionality.
8.1 Application InformationThe DS90UB933-Q1 was designed as a serializer to support automotive camera designs. Automotive camerasare often located in remote positions such as bumpers or trunk lids, and a major component of the system cost isthe wiring. For this reason it is desirable to minimize the wiring to the camera. This chipset allows the video data,along with a bidirectional control channel, and power to all be sent over a single coaxial cable. The chipset isalso able to transmit over STP and is pin-to-pin/backwards compatible with the DS90UB913A-Q1 andDS90UB913Q-Q1.
8.1.1 Power Over Coax
See application report Sending Power Over Coax in DS90UB933 Designs for more details.
8.1.2 Power-Up Requirements and PDB Pin
Transition of the PDB pin from LOW to HIGH must occur after the VVDDIO and VVDD_n supplies have reachedtheir required operating voltage levels. Direct control of the PDB timing by processor GPIO is recommended ifpossible. When direct control of PDB is not available, the PDB pin can be tied to the power supply rail with anRC filter network to help ensure proper power up timing. GPO2 should be low when PDB goes high. Timingconstraints are noted in Suggested Power-Up Sequencing and Power-Up Sequencing Constraints. Please referto Power Down section for device operation when powered down.
If GPO2 state is not determined when PDB goes high, DS90UB933-Q1 registers must be programmed toconfigure the transmission mode. Mode Select register 0x05[5] must be set to 1 and register 0x05 bit 1 and 0 areto be selected based on desired 12-bit or 10-bit transmit data format.
Common applications tie the V(VDDIO) and V(VDD_n) supplies to the same power source of 1.8 V typically. This isan acceptable method for ramping the V (VDDIO) and V (VDD_n) supplies. The main constraint here is that theV(VDD_n) supply does not lead in ramping before the V(VDDIO) system supply. This is noted in Suggested Power-Up Sequencing with the requirement of t1 ≥ 0. V(VDDIO) must reach the expected operating voltage earlier thanV(VDD_n) or at the same time.
Table 8-1. Power-Up Sequencing ConstraintsSYMBOL DESCRIPTION TEST CONDITIONS MIN TYP MAX Units
t0 V(VDDIO) rise time 10% to 90% of nominal voltage on risingedge. Monotonic signal ramp is required 0.05 5 ms
t1 V(VDDIO) to V(VDD_n) delay 10% of rising edge (V(VDDIO)) to 10% ofrising edge (V(VDD_n))
0 ms
t2 V(VDD_n) rise time10% to 90% of nominal voltage on risingedge. Monotonic signal ramp is required.
VPDB < 10% of V(VDDIO)
0.05 5 ms
t3* V(VDD_n) to PDB VIH delay 90% rising edge (V(VDD_n)) to PDB VIH 0 16 ms
t4 PDB to GPO2 delay PDB VIH to 10% of rising edge (GPO2) 1.3 ms
* If timing constraint t3 cannot be assured, the following programming steps should be issued to the via local I2Ccontrol (not via remote back channel). These programming steps should be completed > 10ms after the powersequence is complete (VPDB > PDB V IH) with no delay between write commands. This step will cause a briefrestart of the forward channel output:
The SER/DES supports only AC-coupled interconnects through an integrated DC-balanced decoding scheme.External AC-coupling capacitors must be placed in series in the FPD-Link III signal path as shown in Figure 8-2.For applications utilizing single-ended 50-Ω coaxial cable, the unused data pin (DOUT–, RIN–) must utilize a0.047-µF capacitor and must be terminated with a 50-Ω resistor. For high-speed FPD–Link III transmissions, thesmallest available package should be used for the AC-coupling capacitor. This helps minimize degradation ofsignal quality due to package parasitics.
The DS90UB933/934/964 chipset is intended to be used in a point-to-point configuration through a shieldedcoaxial cable. The serializer and deserializer provide internal termination to minimize impedance discontinuities.The interconnect (cable and connectors) must have a differential impedance of 100 Ω, or a single-endedimpedance of 50 Ω. The maximum length of cable that can be used is dependent on the quality of the cable(gauge, impedance), connector, board(discontinuities, power plane), the electrical environment (for example,power stability, ground noise, input clock jitter, PCLK frequency, etc.). The resulting signal quality at the receivingend of the transmission media may be assessed by monitoring the differential eye opening of the serial datastream. A differential probe should be used to measure across the termination resistor at the CMLOUTP/N pins.
DS90UB933-Q1SNLS546E – AUGUST 2016 – REVISED NOVEMBER 2020 www.ti.com
Eye diagrams in STP applications have roughly double the swing as with coax (Figure 8-6 and Figure 8-7).
9 Power Supply RecommendationsThis device is designed to operate from an input core voltage supply of 1.8 V. Some devices provide separatepower and ground terminals for different portions of the circuit. This is done to isolate switching noise effectsbetween different sections of the circuit. Separate planes on the PCB are typically not required. Pin descriptiontables typically provide guidance on which circuit blocks are connected to which power terminal pairs. In somecases, an external filter may be used to provide clean power to sensitive circuits such as PLLs. The voltageapplied on V(VDDIO) (1.8 V, 2.8 V, 3.3 V) or other power supplies making up V(VDD_n) (1.8 V) must be at the inputpin - any board level DC drop must be compensated (that is, ferrite beads in the path of the power supply rails).
DS90UB933-Q1SNLS546E – AUGUST 2016 – REVISED NOVEMBER 2020 www.ti.com
10 Layout10.1 Layout GuidelinesDesign circuit board layout and stack-up for the serializer/deserializer devices to provide low-noise power feed tothe device. Good layout practice also separates high frequency or high-level inputs and outputs to minimizeunwanted stray noise pickup, feedback and interference. Power system performance may be greatly improvedby using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides planecapacitance for the PCB power system with low-inductance parasitics, which has proven especially effective athigh frequencies, making the value and placement of external bypass capacitors less critical. External bypasscapacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in therange of 0.01 µF to 0.1 µF. Tantalum capacitors may be in the 2.2-µF to 10-µF range. Voltage rating of thetantalum capacitors should be at least 5× the power supply voltage being used.
TI recommends surface mount capacitors due to their smaller parasitics. When using multiple capacitors persupply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of powerentry. This is typically in the 50-µF to 100-µF range and smooths low frequency switching noise. TI recommendsconnecting power and ground pins directly to the power and ground planes with bypass capacitors connected tothe plane with via on both ends of the capacitor. Connecting power or ground pins to an external bypasscapacitor increases the inductance of the path.
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body sizereduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency ofthese external bypass capacitors, usually in the range of 20 to 30 MHz. To provide effective bypassing, multiplecapacitors are often used to achieve low impedance between the supply rails over the frequency of interest. Athigh frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducingthe impedance at high frequency.
Some devices provide separate power for different portions of the circuit. This is done to isolate switching noiseeffects between different sections of the circuit. Separate planes on the PCB are typically not required. PinDescription tables typically provide guidance on which circuit blocks are connected to which power pin pairs. Insome cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs.
Use at least a four-layer board with a power and ground plane. Locate LVCMOS signals away from thedifferential lines to prevent coupling from the LVCMOS lines to the differential lines. Closely-coupled differentiallines of 100 Ω are typically recommended for differential interconnect. The closely coupled lines help to ensurethat coupled noise appears as common-mode and thus is rejected by the receivers. The tightly coupled linesalso radiate less.
Information on the WQFN package is provided in AN-1187 Leadless Leadframe Package (LLP) (SNOA401).
10.1.1 Interconnect Guidelines
See Application Note 1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008) for full details.
• Use 100-Ω coupled differential pairs• Use the S/2S/3S rule in spacings
– – S = space between the pair– – 2S = space between pairs– – 3S = space to LVCMOS signal
• Minimize the number of Vias• Use differential connectors when operating above 500-Mbps line speed• Maintain balance of the traces• Minimize skew within the pair
Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the TexasInstrument web site at: www.ti.com/lvds.
10.2 Layout ExampleStencil parameters such as aperture area ratio and the fabrication process have a significant impact on pastedeposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improveboard assembly yields. If the via and aperture openings are not carefully monitored, the solder may flowunevenly through the DAP. Stencil parameters for aperture opening and via locations are shown in the following:
Figure 10-1. No Pullback WQFN, Single Row Reference Diagram
Table 10-1. No Pullback WQFN Stencil Aperture Summary for DS90UB933-Q1
Figure 10-2 and Figure 10-3 are derived from the layout design of the DS90UB933-Q1 evaluation module(EVM). The EVM is designed for coax operation. The trace carrying high-speed serial signal DOUT+ is criticaland must be kept as short as possible. Burying this trace in an internal PCB layer may help reduce emissions. IfPower-over-Coax is used, the stub must be minimized by placing the filter network as close as possible to thecoax connector. These graphics and additional layout description are used to demonstrate both proper routingand proper solder techniques when designing in this serializer.
11 Device and Documentation Support11.1 Documentation Support11.1.1 Related Documentation
For related documentation see the following:
• I2C over DS90UB913/4 FPD-Link III with Bidirectional Control Channel (SNLA222)• Sending Power Over Coax in DS90UB913A Designs (SNOA549)• FPD-Link Learning Center• Understanding the I2C Bus• I2C Bus Pullup Resistor Calculation• Soldering Specifications Application Report,• IC Package Thermal Metrics Application Report,• AN-1187 Leadless Leadframe Package (LLP) Application Report• LVDS Owner's Manual• An EMC/EMI System-Design and Testing Methodology for FPD-Link III SerDes• Ten Tips for Successfully Designing with Automotive EMC/EMI Requirements
11.2 Receiving Notification of Documentation UpdatesTo receive notification of documentation updates, navigate to the device product folder on ti.com. In the upperright corner, click on Alert me to register and receive a weekly digest of any product information that haschanged. For change details, review the revision history included in any revised document.
11.3 Support ResourcesTI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straightfrom the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and donot necessarily reflect TI's views; see TI's Terms of Use.
11.4 TrademarksTI E2E™ is a trademark of Texas Instruments.All trademarks are the property of their respective owners.11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handledwith appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits maybe more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.
11.6 GlossaryTI Glossary This glossary lists and explains terms, acronyms, and definitions.
DS90UB933-Q1SNLS546E – AUGUST 2016 – REVISED NOVEMBER 2020 www.ti.com
DS90UB933TRTVRQ1 ACTIVE WQFN RTV 32 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 105 UB933Q
DS90UB933TRTVTQ1 ACTIVE WQFN RTV 32 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 UB933Q
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to twolines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
DS90UB933TRTVRQ1 WQFN RTV 32 2500 367.0 367.0 35.0
DS90UB933TRTVTQ1 WQFN RTV 32 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Nov-2020
Pack Materials-Page 2
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