DS90UB96X-Q1EVM User's Guide
User's Guide
Literature Number: SNLU177July 2016
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Contents
Contents
1 DS90UB96X-Q1EVM User's Guide .......................................................................................... 51.1 General Description ......................................................................................................... 51.2 Features....................................................................................................................... 61.3 System Requirements....................................................................................................... 71.4 Contents of the Demo Evaluation Kit ..................................................................................... 71.5 Applications Diagram........................................................................................................ 71.6 Typical Configuration ........................................................................................................ 81.7 Quick Start Guide ............................................................................................................ 91.8 Demo Board Connections .................................................................................................. 9
1.8.1 Power Supply........................................................................................................ 91.8.2 Power Over Coax Interface ...................................................................................... 101.8.3 MIPI CSI-2 Output Signals ....................................................................................... 111.8.4 FPD-Link III Signals ............................................................................................... 131.8.5 I2C Interface ........................................................................................................ 131.8.6 Control Interface................................................................................................... 14
1.9 Enable and Reset .......................................................................................................... 151.10 ALP Software Setup ....................................................................................................... 16
1.10.1 System Requirements ........................................................................................... 161.10.2 Download Contents .............................................................................................. 161.10.3 Installation of the ALP Software ................................................................................ 161.10.4 Startup - Software Description.................................................................................. 171.10.5 Information Tab................................................................................................... 181.10.6 Registers Tab ..................................................................................................... 191.10.7 Registers Tab - Address 0x00 Selected ...................................................................... 201.10.8 Registers Tab - Address 0x00 Expanded ..................................................................... 211.10.9 Scripting Tab...................................................................................................... 221.10.10 Sample ALP Python Script .................................................................................... 22
1.10.10.1 Initialization ................................................................................................. 221.11 Troubleshooting ALP Software ........................................................................................... 27
1.11.1 ALP Loads the Incorrect Profile ................................................................................ 271.11.2 ALP does not detect the EVM .................................................................................. 30
1.12 Typical Connection and Test Equipment................................................................................ 321.13 Termination Device ........................................................................................................ 321.14 Typical Test Setup ......................................................................................................... 321.15 Equipment References .................................................................................................... 341.16 Cable References .......................................................................................................... 341.17 Bill of Materials ............................................................................................................. 35
2 PCB Schematics................................................................................................................. 463 Board Layout ..................................................................................................................... 53
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List of Figures
List of Figures1-1. Applications Diagram........................................................................................................ 71-2. Typical Configuration ........................................................................................................ 81-3. Interfacing to the EVM ...................................................................................................... 91-4. Power Over Coax Network................................................................................................ 101-5. Launching ALP ............................................................................................................. 171-6. Initial ALP Screen .......................................................................................................... 171-7. Follow-up Screen........................................................................................................... 181-8. ALP Information Tab ....................................................................................................... 181-9. ALP Registers Tab ......................................................................................................... 191-10. ALP Device ID Selected................................................................................................... 201-11. ALP Device ID Expanded ................................................................................................. 211-12. ALP Scripting Tab .......................................................................................................... 221-13. USB2ANY Setup ........................................................................................................... 271-14. Remove Incorrect Profile .................................................................................................. 281-15. Add Correct Profile ......................................................................................................... 281-16. Finish Setup................................................................................................................. 291-17. ALP No Devices Error ..................................................................................................... 301-18. Windows 7, ALP USB2ANY Driver ...................................................................................... 301-19. ALP in Demo Mode ........................................................................................................ 311-20. ALP Preferences Menu.................................................................................................... 311-21. Typical Test Setup for Application ....................................................................................... 321-22. Typical Test Setup for Evaluation ........................................................................................ 333-1. Top Overlay ................................................................................................................. 533-2. Top Solder................................................................................................................... 543-3. Top Layer 1 ................................................................................................................. 543-4. Layer 2....................................................................................................................... 553-5. Layer 3....................................................................................................................... 553-6. Layer 4....................................................................................................................... 563-7. Layer 5....................................................................................................................... 563-8. Bottom Layer 6 ............................................................................................................. 573-9. Bottom solder ............................................................................................................... 573-10. Bottom Overlay ............................................................................................................. 58
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List of Tables
List of Tables1-1. Orderable EVM Variants .................................................................................................... 51-2. Power Supply................................................................................................................. 91-3. Power Over Coax Power Supply Feed Configuration ................................................................. 111-4. MIPI CSI-2 (TX Port 0) Output Signals - J6 Pinout ................................................................... 111-5. MIPI CSI-2 (TX Port 1) Output Signals - J7 Pinout .................................................................... 121-6. MIPI CSI-2 (Assembly Variant SV601176-002) Output Signals - J31 Pinout ...................................... 131-7. FPD-Link III Signals ........................................................................................................ 131-8. IDx I2C Device Address Select - J34 .................................................................................... 141-9. Primary I2C Interface Header - J4........................................................................................ 141-10. Secondary I2C Interface Header - J5 .................................................................................... 141-11. I2C VDDIO Interface Header - J30 ....................................................................................... 141-12. VDDIO Interface Header - J1 ............................................................................................. 141-13. GPIO Interface Header - J2............................................................................................... 141-14. CMLOUTP Output Signals ................................................................................................ 151-15. Mode SW-DIP4 - S1 ....................................................................................................... 151-16. Control SW-DIP2 - SW1................................................................................................... 151-17. LEDs ......................................................................................................................... 151-18. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-001 .................................................. 351-19. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-002 .................................................. 41
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DS90UB96X-Q1EVM User's Guide
Chapter 1SNLU177–July 2016
DS90UB96X-Q1EVM User's Guide
1.1 General DescriptionThe Texas Instruments DS90UB96X-Q1EVM evaluation module (EVM) is a functional board design forevaluating the FPD-Link III Deserializer to MIPI CSI-2 ADAS (Advanced Driver Assistance Systems) Hub.This kit will demonstrate the functionality and operation of the DS90UB96X-Q1 family of chipsets. Theinformation provided in this document can be applied to devices such as DS90UB964-Q1. This EVM canalso be used as a hardware reference design for any implementation of the DS90UB96X-Q1 series. Someportions and components in the EVM or in this document may include the references to DS90UB964-Q1instead of addressing all part numbers. For the purposes of this document, the DS90UB964-Q1 isinterchangeable with the DS90UB96X-Q1.
The DS90UB96X-Q1 is a versatile camera hub capable of connecting serialized camera data receivedfrom up to 4 independent video datastreams via an FPD-Link III interface using standard coaxial cables.When coupled with DS90UB913A/913Q serializers, the DS90UB964-Q1 receives data from 1-Megapixelimagers supporting HD 720p/800p/960p resolution at 30/60Hz frame rates. The DS90UB96X-Q1 mergesand manages multiple data streams into a MIPI CSI-2 compliant output for interconnect to a downstreamprocessor.
The EVM is a development add-on module to add surround view capability to any of a variety of videoprocessor systems such as the TI TDA3x ADAS Processor, or an Applications Processor, Image SignalProcessor (ISP), and SOC. The system consists of four cameras each of which receives controlinformation and power through FAKRA coaxial cables, and uses the same cable to return the videoinformation to an EVM board. Each of the FPD-Link III interfaces also includes a separate low latency bi-directional control channel that conveys control information from an I2C port. General purpose I/O signalssuch as those required for camera synchronization and functional safety features also make use of this bi-directional control channel.
NOTE: The demo board is not intended for EMI testing. The demo board was designed for easyaccessibility to device pins with tap points for monitoring or applying signals, additional padsfor termination, and multiple connector options.
The Texas Instruments DS90UB96X-Q1EVM helps to evaluate the operation and performance of theDS90UB964-Q1 and is available for order in two variants. See Table 1-1 of orderable EVM variants andconfiguration.
Table 1-1. Orderable EVM Variants
EVM Orderable Name EVM Variant POC Network DescriptionDS90UB964-Q1EVM SV601176-001 DS90UB913A Compatible Samtec QSH connectorDS90UB964-Q1EVMTDA SV601176-002 DS90UB913A Compatible Samtec QTH connector to TDA3X EVM
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1.2 Features• Aggregates data from up to 4 cameras over FPD-Link III interface• Supports 1-Megapixel sensors with HD 720P/800P/960P resolution at 30/60Hz frame rate (paired w/
DS90UB913A)• Multi-camera synchronization• Supports MIPI DPHY 1.2 / CSI-2 Version 1.3 compliant
– 2x CSI-2 output ports– Supports 1, 2, 3, 4 data lanes per CSI-2 port– CSI-2 data rate scalable for 400 Mbps / 800 Mbps / 1.6 Gbps per data lane– Programmable data types– Four Virtual Channels– ECC and CRC generation
• Supports Single-ended Coax cable and Power Over Coax• Adaptive receive equalization• I2C with Fast-mode Plus up to 1 Mbps• Flexible GPIOs for camera sync and functional safety• Single +12V power supply for EVM
MIPI CSI-2
Processor SoC
DS90UB96X-Q1 FPD-Link III HUB
D3+/-
D2+/-
D1+/-
D0+/-
CLK+/-
FPD-Link III Serializer
I2C
GPIO
FPD-Link IIICoax or STP
FPD-Link III Serializer
FPD-Link III Serializer
FPD-Link III Serializer
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1.3 System Requirements
The major components of the DS90UB96X-Q1EVM are:• DS90UB964-Q1• On-board Power-over-Coax (POC) interface• Four Fakra coax connectors for digital video, power, control and diagnostics• Samtec QSH type connectors on CSI-2 interfaces• On-board I2C programming interface
In order to demonstrate, the following is required (not included):1. Four Omnivision sensor boards with DS90UB913A Serializer boards
(a) TI DS90UB913A-CXEVM OR TI SAT0088 ‘MiniSer’AND
(b) OV10635 P/N: OV10635-EAAE-AA0A OR OV10640 P/N: OV10640-EAAA-AA0A (DVP)2. Four TIDA-00262 Aptina AR0140 sensor modules and DS90UB913A Serializer3. Four DACAR/FAKRA coax cables4. I2C host controller that support clock stretching5. Applications Processor Card6. Power supply for 12V @ 2A
1.4 Contents of the Demo Evaluation Kit• One EVM board with the DS90UB96X-Q1
1.5 Applications Diagram
Figure 1-1. Applications Diagram
DS90UB96XADAS HUB
Head Unit, ECU
Power Over Coax Cable
(I2C)
(MIPI CSI-2)Application Processor Display
(Video Data)
(I2C)
Camera Sensor
FPD-Link III Serializer
Camera Sensor
FPD-Link III Serializer
Camera Sensor
FPD-Link III Serializer
Camera Sensor
FPD-Link III Serializer
FPD-Link III
(I2C)
(I2C)
(I2C)
(Video Data)
(Video Data)
(Video Data)
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1.6 Typical Configuration
Figure 1-2. Typical Configuration
J24
CN1,CN2
CN3,CN4
FPD-LINK III I/O
GPI/O
FUNCTION CONTROLS
POWER SUPPLY
MIPI CSI-2 OUTPUTS
I2C BUS
POC CONFIG
USB2ANY CONNECTOR
J2
S1
+12VDC
J6,J7
J4,J5
1.1V
+5%
1.8V +5%
3.3V
+10%
SW1
J32J36
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1.7 Quick Start Guide1. Connect mini USB J36 to USB port for register programming2. Optional : Connect an external I2C host adapter I2C signals on J4 port for register programming3. Configure switches S1 and SW1 to set device’s operating modes4. Configure VFEED power supply for each channel of CN1, CN2, CN3, CN4 on J32 header5. Plug the four sensors into the four DS90UB913A serializer boards to create four camera modules6. Connect the four camera modules to channels 1, 2, 3, and 4 using coax cables on CN1, CN2, CN3,
CN47. Interface MIPI CSI-2 output signals (J6 or J7) to application processor8. Provide power to board on J24 (+12VDC)
(a) Optional +1.1VDC power supply on J22(b) Optional +1.8VDC power supply on J28(c) Optional +3.3VDC power supply on J29
9. For details of pin-names and pin-functions, please refer to the DS90UB96X-Q1 datasheet.
Figure 1-3. Interfacing to the EVM
1.8 Demo Board Connections
1.8.1 Power Supply
Table 1-2. Power Supply
Reference Signal Description
J20.1 +12VMain PowerSingle +12VDC (nominal) power connector that supplies power to theentire board.
J22.1 (Optional) +1.1V 1.1V ±5%Alternative to Main Power
FB
4.7 PH
1.��
FAKRAconnector
FPD3 signal
VFEED_POC
100 PH
1.��
0.1 PF
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Table 1-2. Power Supply (continued)Reference Signal Description
J28.2 (Optional) +1.8V 1.8V ±5%Alternative to Main Power
J29.2 (Optional) +3.3V 3.3V ±5%Alternative to Main Power
1.8.2 Power Over Coax InterfaceThe DS90UB96X-Q1EVM offers four power over coax interfaces (POC) to connect cameras through acoaxial cable with FAKRA connectors. Power is delivered on the same conductor that is used to transmitvideo and control channel between the host and the camera. By default, 5V power supply is applied overthe coax cable. Refer Table 1-3 to for other POC configurations.
For power over coax (POC) on the EVM, the circuit uses a filter network as shown in Figure 1-4. The POCnetwork frequency response corresponds to the bandwidth compatible with DS90UB913A chipsets.
Figure 1-4. Power Over Coax Network
WARNINGVerify that the power voltage is properly set before plugging intoCN1, CN2, CN3, CN4. Power supply is not fused. Overvoltage willcause damage to boards directly connected due to incorrect inputpower supplies.
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Table 1-3. Power Over Coax Power Supply Feed Configuration
Reference Signal Description
J14 VFEED_POC1Power Over Coax Power Feed Selection 1Short pins 1-2: +9V power supply from VFEED_LDO1Short pins 2-3: +5V power supply from 5V_SW (Default)
J16 VFEED_POC2Power Over Coax Power Feed Selection 2Short pins 1-2: +9V power supply from VFEED_LDO2Short pins 2-3: +5V power supply from 5V_SW (Default)
J35 VDD_EXT
Power Over Coax Power Feed using +12V Main Power (J21)Note: J16 and J14 must to left OPEN if using this configurationShort pins 1-2: +12V power supply to VFEED_POC1Short pins 2-3: +12V power supply to VFEED_POC2
J32.1 VFEED1Remote power supply connection to CN1Short J32.1-2: VFEED_POC1 (Default)Short J32.1 & J33.1: VFEED_POC2
J32.3 VFEED2Remote power supply connection to CN2Short J32.3-4: VFEED_POC1 (Default)Short J32.3 & J33.2: VFEED_POC2
J32.5 VFEED3Remote power supply connection to CN3Short J32.5-6: VFEED_POC1 (Default)Short J32.5 & J33.3: VFEED_POC2
J32.7 VFEED4Remote power supply connection to CN4Short J32.7-8: VFEED_POC1 (Default)Short J32.7 & J33.4: VFEED_POC2
1.8.3 MIPI CSI-2 Output SignalsProvided on the DS90UB96X-Q1EVM, J6 and J7 are Samtec QSH-type connectors that can be matedwith a matching QTH type connector on the top. This Samtec connector provides a means to route CSI-2signals out of the DS90UB96X-Q1. The J6 and J7 corresponds to CSI0 Port and CSI1 Port outputconnection signals respectively, and includes access to I2C and other miscellaneous GPIO signals. Zeroohm resistor pads are available if a connection to other signals is required. The mating connector partnumber is QTH-020-01-H-D-DP-A.
There are third party solutions like the HDR-128291-XX breakout board from Samtec which can be used.The HDR- 128291-XX is a breakout board with a mating connector to J6 & J7 and standard SMA maleconnectors. More info on this breakout board can be obtained from Samtec website. Another third partyoption is the ZX100 by Zebax Technologies. More information on this board can be obtained from Zebaxwebsite.
Table 1-4. MIPI CSI-2 (TX Port 0) Output Signals - J6 Pinout
Pin # Signal Name Pin # Signal Name
1 NC 2 EXP_SCL0(I2C_SCL or I2C_SCL2)
3 NC 4 EXP_SDA0(I2C_SDA or I2C_SDA2)
5 CSI0_CLK_P 6 NC7 CSI0_CLK_N 8 NC
9 CSI0_D0_P 10 EXP_REF_CLK0(REFCLK)
11 CSI0_D0_N 12 GND
13 CSI0_D1_P 14 RESETn_0(PDB)
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Table 1-4. MIPI CSI-2 (TX Port 0) Output Signals - J6 Pinout (continued)Pin # Signal Name Pin # Signal Name
15 CSI0_D1_N 16 GND
17 CSI0_D2_P 18 SPI_MOSI_0(GPIO0 or GPIO3)
19 CSI0_D2_N 20 SPI_SCLK_0(GPIO1 or GPIO4)
21 CSI0_D3_P 22 SPI_CSn_0(GPIO2 or GPIO5)
23 CSI0_D3_N 24 GND25 NC 26 NC27 NC 28 NC29 NC 30 VDD_3V331 NC 32 VDD_3V333 NC 34 VDD_3V335 NC 36 VDD_3V337 NC 38 VDD_1V839 NC 40 VDD_1V8
Table 1-5. MIPI CSI-2 (TX Port 1) Output Signals - J7 Pinout
Pin # Signal Name Pin # Signal Name
1 NC 2 EXP_SCL1(I2C_SCL or I2C_SCL2)
3 NC 4 EXP_SDA1(I2C_SDA or I2C_SDA2)
5 CSI1_CLK_P 6 NC7 CSI1_CLK_N 8 NC
9 CSI1_D0_P 10 EXP_REF_CLK1(REFCLK)
11 CSI1_D0_N 12 GND
13 CSI1_D1_P 14 RESETn_1(PDB)
15 CSI1_D1_N 16 GND
17 CSI1_D2_P 18 SPI_MOSI_1(GPIO0 or GPIO3)
19 CSI1_D2_N 20 SPI_SCLK_1(GPIO1 or GPIO4)
21 CSI1_D3_P 22 SPI_CSn_1(GPIO2 or GPIO5)
23 CSI1_D3_N 24 GND25 NC 26 NC27 NC 28 NC29 NC 30 VDD_3V331 NC 32 VDD_3V333 NC 34 VDD_3V335 NC 36 VDD_3V337 NC 38 VDD_1V839 NC 40 VDD_1V8
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Table 1-6. MIPI CSI-2 (Assembly Variant SV601176-002) Output Signals - J31Pinout
Pin # Signal Name Pin # Signal Name
1 NC 2 EXP_SCL0(I2C_SCL or I2C_SCL2)
3 NC 4 EXP_SDA0(I2C_SDA or I2C_SDA2)
5 CSI0_CLK_P 6 NC7 CSI0_CLK_N 8 NC
9 CSI0_D0_P 10 EXP_REF_CLK0(REFCLK)
11 CSI0_D0_N 12 GND
13 CSI0_D1_P 14 RESETn_0(PDB)
15 CSI0_D1_N 16 GND
17 CSI0_D2_P 18 SPI_MOSI_0(GPIO0 or GPIO3)
19 CSI0_D2_N 20 SPI_SCLK_0(GPIO1 or GPIO4)
21 CSI0_D3_P 22 SPI_CSn_0(GPIO2 or GPIO5)
23 CSI0_D3_N 24 GND25 CSI1_CLK_P 26 NC27 CSI1_CLK_N 28 NC29 CSI1_D0_P 30 VDD_3V331 CSI1_D0_N 32 VDD_3V333 CSI1_D1_P 34 VDD_3V335 CSI1_D1_N 36 VDD_3V337 NC 38 VDD_1V839 NC 40 VDD_1V8
NOTE: * Remove R130-R145 for CSI-2 source connected to J6/J7 *
** Populate R130-R145 when source connected through J31 **
1.8.4 FPD-Link III Signals
Table 1-7. FPD-Link III Signals
Reference Signal DescriptionCN1 RIN0+ FAKRA connectorCN2 RIN1+ FAKRA connectorCN3 RIN2+ FAKRA connectorCN4 RIN3+ FAKRA connector
1.8.5 I2C InterfaceA standalone external I2C host can connect via J4, J5 for programming purposes. Examples of externalI2C host controllers are Texas Instruments USB2ANY and Total Phase Aardvark I2C/SPI host adapter(Total Phase Part#: TP240141).
Optional access to I2C signals are also available via CSI-2 connectors J6, J7, or J31. I2C signal levels canbe configured through J30 to be at 1.8V or 3.3V when the I2C interface is accessed through connectorsJ4, J5.
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Table 1-8. IDx I2C Device Address Select - J34
Reference Signal Description
J34 IDXSelects I2C Device AddressOpen: 0x30 (7'b) or 0x60 (8'b)Short: 0x3D (7'b) or 0x7A (8'b) (Default)
Table 1-9. Primary I2C Interface Header - J4
Reference Signal DescriptionJ4.1 VDD_I2C External I2C bus voltageJ4.2 I2C_SCL I2C Clock Interface for primary I2C busJ4.3 I2C_SDA I2C Data Interface for primary I2C busJ4.4 GND Ground
Table 1-10. Secondary I2C Interface Header - J5
Reference Signal DescriptionJ5.1 VDD_I2C External I2C bus voltageJ5.2 I2C_SCL2 I2C Clock Interface for secondary I2C busJ5.3 I2C_SDA2 I2C Data Interface for secondary I2C busJ5.4 GND Ground
Table 1-11. I2C VDDIO Interface Header - J30
Reference Signal Description
J30 VDD_I2CSelects I2C IO bus voltageShort pins 1-2: 3.3V IO (Default)Short pins 2-3: 1.8V IO
1.8.6 Control Interface
Table 1-12. VDDIO Interface Header - J1
Reference Signal Description
J1 VDDIOSelects VDDIO bus voltageShort pins 1-2: 3.3V IO (Default)Short pins 2-3: 1.8V IO
Table 1-13. GPIO Interface Header - J2
Reference Signal DescriptionJ2.2 GPIO0 General Purpose Input/Output 0J2.4 GPIO1 General Purpose Input/Output 1J2.6 GPIO2 General Purpose Input/Output 2J2.8 GPIO3 General Purpose Input/Output 3J2.10 GPIO4 General Purpose Input/Output 4J2.12 GPIO5 General Purpose Input/Output 5J2.14 GPIO6 General Purpose Input/Output 6J2.16 GPIO7 General Purpose Input/Output 7
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Table 1-14. CMLOUTP Output Signals
Reference Signal DescriptionTP1 CMLOUTP Test Pad for Channel Monitor Loop-through DriverTP2 CMLOUTN Test Pad for Channel Monitor Loop-through Driver
(1) Only set one ON.(2) This function is only available with 2-MP ADAS chipsets.
Table 1-15. Mode SW-DIP4 - S1 (1)
Reference Mode DescriptionS1.1 1 CSI Mode (2-MP ADAS Tx compatible) (2)
S1.2 2 RAW12 / LF (DS90UB913A compatible)S1.3 3 RAW12 / HF (DS90UB913A compatible)S1.4 4 RAW10 (DS90UB913A compatible) (Default)
Table 1-16. Control SW-DIP2 - SW1
Reference Signal Input = L Input = H Description
SW1.1 TESTEN For Normal operation(Default) Test Mode enable Test Mode
SW1.2 PDB Device is powered down Device is enabled (Default) Power-down Mode
Table 1-17. LEDs
Reference LED Name DescriptionD2 GPIO0 Illuminates if GPIO0 is OND3 GPIO1 Illuminates if GPIO1 is OND4 GPIO2 Illuminates if GPIO2 is OND5 GPIO3 Illuminates if GPIO3 is OND6 GPIO4 Illuminates if GPIO48 is OND7 GPIO5 Illuminates if GPIO5 is OND8 GPIO6 Illuminates if GPIO6 is OND9 GPIO7 Illuminates if GPIO7 is OND11 VDD_EXT Illuminates if 12V Power is applied to DC-IN J24D12 VDD5V Illuminates on +5VD13 VFEED_POC Illuminates if VFEED_POC Power is OND14 VDDIO Illuminates on VDDIO Power
1.9 Enable and ResetThere are two device enable and reset/power-down options for the EVM.• RC timing option: The C65 external capacitor and R17 pull-up resistor connected to the PDB pin ramp
time after the device is powered on.• External control option: A push-button (S2) or SW1 position 2 is available for the manual control of the
PBD signal.
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1.10 ALP Software Setup
1.10.1 System Requirements
Operating System: Windows 7 64-bitUSB: USB2ANYUSB2ANY Firmware Version: 2.5.2.0
USB: Aardvark I2C/SPI host adapterp/n TP240141
1.10.2 Download ContentsLatest TI Analog LaunchPAD can be downloaded from: http://www.ti.com/tool/alp.
Download and extract the zip file to a temporary location that can be deleted later.
The following installation instructions are for a PC running Windows 7 64-bit Operating System.
1.10.3 Installation of the ALP SoftwareExecute the ALP Setup Wizard program called “ALPF_setup_v_x_x_x.exe” that was extracted to atemporary location on the local drive of your PC.
There are 7 steps to the installation once the setup wizard is started:1. Select the "Next" button.2. Select “I accept the agreement” and then select the “Next” button.3. Select the location to install the ALP software and then select the “Next” button.4. Select the location for the start menu shortcut and then select the “Next” button.5. There will then be a screen that allows the creation of a desktop icon. After selecting the desired
choices select the “Next” button.6. Select the “Install” button, and the software will then be installed to the selected location.7. Uncheck “Launch Analog LaunchPAD” and select the “Finish” button. The ALP software will start if
“Launch Analog LaunchPAD” is checked, but it will not be useful until the USB driver is installed andboard is attached.
Power the DS90UB96X-Q1 EVM board with a 12 VDC power supply.
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1.10.4 Startup - Software DescriptionMake sure all the software has been installed and the hardware is powered on and connected to the PC.Execute “Analog LaunchPAD” shortcut from the start menu. The default start menu location is under AllPrograms > Texas Instruments > Analog LaunchPAD vx.x.x > Analog LaunchPAD to start MainGUI.exe.
Figure 1-5. Launching ALP
The application should come up in the state shown in the figure below. If it does not, see Section 1.11,“Troubleshooting ALP Software”.
Under the Devices tab click on “DS90UB96X” to select the device and open up the device profile and itsassociated tabs.
Figure 1-6. Initial ALP Screen
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After selecting the DS90UB96X, the following screen shown in Figure 1-7 should appear.
Figure 1-7. Follow-up Screen
1.10.5 Information TabThe Information tab is shown below.
Figure 1-8. ALP Information Tab
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1.10.6 Registers TabThe Register tab is shown in Figure 1-9.
Figure 1-9. ALP Registers Tab
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1.10.7 Registers Tab - Address 0x00 Selected
Address 0x00 selected as shown in Figure 1-10. Note that the “Value:” box, , will now showthe hex value of that register.
Figure 1-10. ALP Device ID Selected
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1.10.8 Registers Tab - Address 0x00 ExpandedBy double clicking on the Address bar
or a single click on . Address 0x00 expanded reveals contents by bits. Any register address displayedcan be expanded.
Figure 1-11. ALP Device ID Expanded
Any RW Type register, , can be written into by writing the hex value into the “Value:” box,or putting the pointer into the individual register bit(s) box by a left mouse click to put a check mark(indicating a “1”) or unchecking to remove the check mark (indicating a “0”). Click the “Apply” button towrite to the register, and “refresh” to see the new value of the selected (highlighted) register.
The box toggles on every mouse click.
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1.10.9 Scripting TabThe Scripting tab is shown below.
Figure 1-12. ALP Scripting Tab
The script window provides a full Python scripting environment which can be for running scripts andinteracting with the device in an interactive or automated fashion.
WARNINGDirectly interacting with devices either through registermodifications or calling device support library functions can effectthe performance and/or functionality of the user interface and mayeven crash the ALP Framework application.
1.10.10 Sample ALP Python Script
1.10.10.1 Initialization# 964_RX0_init_CSI0.py
# board.devAddr = 0x7a
# To configure GPIO0 to bring out Lock for Port0,print "configure GPIO0 to bring out Lock for Port0"board.WriteReg(0x10,0x81)time.sleep(0.1)
# To configure GPIO1 to bring out Lock for Port1,print "configure GPIO1 to bring out Lock for Port1"board.WriteReg(0x11,0x85)time.sleep(0.1)
# To configure GPIO2 to bring out Lock for Port2,
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print "configure GPIO2 to bring out Lock for Port2"board.WriteReg(0x12,0x89)time.sleep(0.1)
# To configure GPIO3 to bring out Lock for Port3,print "configure GPIO3 to bring out Lock for Port3"board.WriteReg(0x13,0x8D)time.sleep(0.1)
print "CSI_PORT_SEL"board.WriteReg(0x32,0x01) # CSI0 selecttime.sleep(0.1)
print "CSI_PLL_CTL"board.WriteReg(0x1f,0x02) # CSI0 800mbpstime.sleep(0.1)
print "CSI_EN"board.WriteReg(0x33,0x1) # CSI_EN & CSI0 4Ltime.sleep(0.1)
print "FWD_PORT"board.WriteReg(0x20,0xe0) # forwarding of RX 0 to CSI0time.sleep(0.1)
print "FPD3_PORT_SEL"board.WriteReg(0x4c,0x01) # RX_PORT0time.sleep(0.1)
print "enable pass throu"board.WriteReg(0x58,0x58) # enable pass throutime.sleep(0.1)
board.WriteReg(0x5c,0x18) #print "SER_ALIAS_ID 0x5c value ", hex(board.ReadReg(0x5c))time.sleep(0.1)
board.WriteReg(0x5d,0x60) #print "SlaveID[0] 0x5d value ", hex(board.ReadReg(0x5d))time.sleep(0.1)
board.WriteReg(0x65,0x60) #print "SlaveAlias[0] 0x65 value ", hex(board.ReadReg(0x65))time.sleep(0.1)
print "FV_POLARITY"board.WriteReg(0x7c,0x01) # FV active lowtime.sleep(0.1)
print "YUV422 DT"board.WriteReg(0x70,0x1f) # VC0 and CSI0 datatype 0x1f yuv422_10btime.sleep(0.1)
print "FPD_MODE"board.WriteReg(0x6d,0x7f) # 913A 10-bit modetime.sleep(0.1)
########################################################## 964_RX1_init_CSI0.py
print "CSI_PORT_SEL"board.WriteReg(0x32,0x01) # CSI0 selecttime.sleep(0.1)
print "CSI_PLL_CTL"board.WriteReg(0x1f,0x02) # CSI0 800mbps
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time.sleep(0.1)
print "CSI_EN"board.WriteReg(0x33,0x1) # CSI_EN & CSI0 4Ltime.sleep(0.1)
print "FWD_PORT"board.WriteReg(0x20,0xd0) # forwarding of RX 1 to CSI0time.sleep(0.1)
print "FPD3_PORT_SEL"board.WriteReg(0x4c,0x12) # RX_PORT1time.sleep(0.1)
print "enable pass throu"board.WriteReg(0x58,0x58) # enable pass throutime.sleep(0.1)
board.WriteReg(0x5c,0x1a) #print "SER_ALIAS_ID 0x5c value ", hex(board.ReadReg(0x5c))time.sleep(0.1)
board.WriteReg(0x5d,0x60) #print "SlaveID[0] 0x5d value ", hex(board.ReadReg(0x5d))time.sleep(0.1)
board.WriteReg(0x65,0x62) #print "SlaveAlias[0] 0x65 value ", hex(board.ReadReg(0x65))time.sleep(0.1)
print "FV_POLARITY"board.WriteReg(0x7c,0x01) # FV active lowtime.sleep(0.1)
print "YUV422 DT"board.WriteReg(0x70,0x5f) # VC1 and CSI0 datatype 0x1f yuv422_10btime.sleep(0.1)
print "FPD_MODE"board.WriteReg(0x6d,0x7f) # 913A 10-bit modetime.sleep(0.1)
########################################################## 964_RX2_init_CSI0.py
print "CSI_PORT_SEL"board.WriteReg(0x32,0x01) # CSI0 selecttime.sleep(0.1)
print "CSI_PLL_CTL"board.WriteReg(0x1f,0x02) # CSI0 800mbpstime.sleep(0.1)
print "CSI_EN"board.WriteReg(0x33,0x1) # CSI_EN & CSI0 4Ltime.sleep(0.1)
print "FWD_PORT"board.WriteReg(0x20,0xb0) # forwarding of RX 2 to CSI0time.sleep(0.1)
print "FPD3_PORT_SEL"board.WriteReg(0x4c,0x24) # RX_PORT2time.sleep(0.1)
print "enable pass throu"
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board.WriteReg(0x58,0x58) # enable pass throutime.sleep(0.1)
board.WriteReg(0x5c,0x1c) #print "SER_ALIAS_ID 0x5c value ", hex(board.ReadReg(0x5c))time.sleep(0.1)
board.WriteReg(0x5d,0x60) #print "SlaveID[0] 0x5d value ", hex(board.ReadReg(0x5d))time.sleep(0.1)
board.WriteReg(0x65,0x66) #print "SlaveAlias[0] 0x65 value ", hex(board.ReadReg(0x65))time.sleep(0.1)
print "FV_POLARITY"board.WriteReg(0x7c,0x01) # FV active lowtime.sleep(0.1)
print "YUV422 DT"board.WriteReg(0x70,0x9f) # VC2 and CSI0 datatype 0x1f yuv422_10btime.sleep(0.1)
print "FPD_MODE"board.WriteReg(0x6d,0x7f) # 913A 10-bit modetime.sleep(0.1)
########################################################## 964_RX3_init_CSI0.py
print "CSI_PORT_SEL"board.WriteReg(0x32,0x01) # CSI0 selecttime.sleep(0.1)
print "CSI_PLL_CTL"board.WriteReg(0x1f,0x02) # CSI0 800mbpstime.sleep(0.1)
print "CSI_EN"board.WriteReg(0x33,0x1) # CSI_EN & CSI0 4Ltime.sleep(0.1)
print "FWD_PORT"board.WriteReg(0x20,0x70) # forwarding of RX 3 to CSI0time.sleep(0.1)
print "FPD3_PORT_SEL"board.WriteReg(0x4c,0x38) # RX_PORT3time.sleep(0.1)
print "enable pass throu"board.WriteReg(0x58,0x58) # enable pass throutime.sleep(0.1)
board.WriteReg(0x5c,0x1e) #print "SER_ALIAS_ID 0x5c value ", hex(board.ReadReg(0x5c))time.sleep(0.1)
board.WriteReg(0x5d,0x60) #print "SlaveID[0] 0x5d value ", hex(board.ReadReg(0x5d))time.sleep(0.1)
board.WriteReg(0x65,0x68) #print "SlaveAlias[0] 0x65 value ", hex(board.ReadReg(0x65))time.sleep(0.1)
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print "FV_POLARITY"board.WriteReg(0x7c,0x01) #time.sleep(0.1)
print "YUV422 DT"board.WriteReg(0x70,0xdf) # VC3 and CSI0 datatype 0x1f yuv422_10btime.sleep(0.1)
print "FPD_MODE"board.WriteReg(0x6d,0x7f) # 913A 10-bit modetime.sleep(0.1)
#########################################################
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1.11 Troubleshooting ALP Software
1.11.1 ALP Loads the Incorrect ProfileIf ALP opens with the incorrect profile loaded the correct profile can be loaded from theUSB2ANY/Aardvark Setup found under the tools menu.
Figure 1-13. USB2ANY Setup
Highlight the incorrect profile in the Defined ALP Devices list and press the remove button.
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Figure 1-14. Remove Incorrect Profile
Find the correct profile under the Select a Daughter Board list, highlight the profile and press Add.
Figure 1-15. Add Correct Profile
Select Ok and the correct profile should now be loaded.
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Figure 1-16. Finish Setup
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1.11.2 ALP does not detect the EVMIf the following window opens after starting the ALP software, double check the hardware setup.
Figure 1-17. ALP No Devices Error
It may also be that the USB2ANY driver is not installed. Check the device manager. There should be a“HID-compliant device” under the “Human Interface Devices” as shown below.
Figure 1-18. Windows 7, ALP USB2ANY Driver
The software should start with only “DS90UB96X” in the “Devices” pull down menu. If there are moredevices then the software is most likely in demo mode. When the ALP is operating in demo mode there isa “(Demo Mode)” indication in the lower left of the application status bar as shown below.
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Figure 1-19. ALP in Demo Mode
Disable the demo mode by selecting the “Preferences” pull down menu and un-checking “Enable DemoMode”.
Figure 1-20. ALP Preferences Menu
After demo mode is disabled, the ALP software will poll the ALP hardware. The ALP software will updateand have only “DS90UB96X” under the “Devices” pull down menu.
DS90UB96X EVM Board
Contents of Demo KitFPD-Link III + PoC
Camera Sensor + Serializer Board
MIPI CSI-2Applications Processor
Display
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1.12 Typical Connection and Test EquipmentThe following is a list of typical test equipment that may be used to monitor the MIPI CSI-2 signals fromthe DS90UB96X-Q1:1. Logic Analyzer2. Any SCOPE with a bandwidth of at least 4 GHz for observing differential signals.3. UNH-IOL MIPI D-PHY Reference Termination Board (RTB)4. UNH-IOL MIPI D-PHY/CSI/DSI Probing Board5. UNH-IOL CSIGUI Tool
1.13 Termination DeviceA termination device is required in order to properly monitor and measure the transmission of the MIPIDPHY signals. The termination device should support the change of signals as it switches between LPand HS modes. This can be provided by either a CSI-2 receiver or a dedicated dynamic termination board.The recommended termination board is the UNH-IOL MIPI D-PHY Reference Termination Board (RTB).
1.14 Typical Test SetupFigure 1-21 and Figure 1-22 illustrate the typical test setups used to measure and evaluate DS90UB96X-Q1.
Figure 1-21. Typical Test Setup for Application
The picture below shows a typical test set up using a video generator and logic analyzer.
MIPI CSI-2
Logic Analyzer / Oscilloscope
Camera Sensor + Serializer Board
DS90UB96X EVM Board
Contents of Demo KitFPD-Link III + PoC
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Figure 1-22. Typical Test Setup for Evaluation
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1.15 Equipment References
NOTE: Please note that the following references are supplied only as a courtesy to our valuedcustomers. It is not intended to be an endorsement of any particular equipment or supplier.
Logic Analyzer:Keysight Technologies
www.keysight.com
MIPI Test Fixtures:University of New Hampshire InterOperability Laboratory (UNH-IOL)
www.iol.unh.edu/services/testing/mipi/fixtures.php
Aardvark I2C/SPI Host Adapter Part Number: TP240141www.totalphase.com/products/aardvark_i2cspi
1.16 Cable ReferencesFAKRA coaxial cable:www.leoni-automotive-cables.com
Rosenberger FAKRA connector:http://www.rosenberger.com/en/products/automotive/fakra.php
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1.17 Bill of Materials
Table 1-18. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-001
Item Qty Designator Part Number Manufacturer Description1 1 PCB SV601176 Any Printed Circuit Board2 8 C1, C6, C12, C20, C26,
C31, C42, C43CL21A106KAFN3NE Samsung Electro-
MechanicsCAP, CERM, 10 µF, 25 V,
+/- 10%, X5R, 08053 8 C3, C8, C14, C22, C28,
C33, C44, C114C1005JB1V105K050BC TDK CAP, CERM, 1 µF, 35 V,
+/- 10%, JB, 04024 15 C4, C9, C15, C23, C29,
C34, C45, C47, C53,C63, C64, C80, C81,
C94, C95
CGA2B3X7R1H104K050BB
TDK CAP, CERM, 0.1 µF, 50V, +/- 10%, X7R, AEC-Q200 Grade 1, 0402
5 16 C5, C10, C11, C16, C17,C18, C19, C24, C25,C30, C35, C36, C41,
C46, C52, C58
GCM155R71H103KA55D MuRata CAP, CERM, 0.01uF,50V, +/-10%, C0G/NP0,
0402
6 5 C37, C50, C59, C132,C133
0603YC104JAT2A AVX CAP, CERM, 0.1uF, 16V,+/-5%, X7R, 0603
7 1 C38 0805YD225KAT2A AVX CAP, CERM, 2.2uF, 16V,+/-10%, X5R, 0805
8 2 C39, C55 06035A221FAT2A AVX CAP, CERM, 220pF, 50V,+/-1%, C0G/NP0, 0603
9 1 C40 C1608X7R1H103K080AA TDK CAP, CERM, 0.01 µF, 50V, +/- 10%, X7R, 0603
10 5 C48, C104, C112, C119,C120
293D226X0025D2TE3 Vishay-Sprague CAP, TA, 22uF, 25V, +/-20%, 0.7 ohm, SMD
11 1 C49 GRM21BR71C105KA01L MuRata CAP, CERM, 1 µF, 16 V,+/- 10%, X7R, 0805
12 2 C51, C54 GRM1885C2A300JA01D MuRata CAP, CERM, 30pF, 100V,+/-5%, C0G/NP0, 0603
13 1 C56 GRM188R71A474KA61D MuRata CAP, CERM, 0.47uF,10V, +/-10%, X7R, 0603
14 1 C57 C0603X222K5RACTU Kemet CAP, CERM, 2200pF,50V, +/-10%, X7R, 0603
15 1 C60 06031C103KAT2A AVX CAP, CERM, 0.01 µF,100 V, +/- 10%, X7R,
060316 15 C61, C62, C101, C103,
C105, C109, C115, C116,C118, C125, C126, C129,
C130, C134, C135
GRM155R71C104KA88D MuRata CAP, CERM, 0.1uF, 16V,+/-10%, X7R, 0402
17 5 C65, C108, C117, C127,C131
GRM21BR71A106KE51L MuRata CAP, CERM, 10uF, 10V,+/-10%, X7R, 0805
18 4 C67, C68, C69, C70 GRM1555C1E4R7CA01D MuRata CAP, CERM, 4.7pF, 25V,+/-5%, C0G/NP0, 0402
19 8 C72, C74, C76, C78,C86, C88, C90, C92
C1005X7R1H104K050BB TDK CAP, CERM, 0.1 µF, 50V, +/- 10%, X7R, 0402
20 8 C73, C75, C77, C79,C87, C89, C91, C93
GRM188R61E475KE11D Murata Electronics NorthAmerica
CAP CER 4.7UF 25V10% X5R 0603
21 4 C82, C83, C96, C97 C1005X7R1H473K050BB TDK CAP, CERM, 0.047 µF,50 V, +/- 10%, X7R, 0402
22 4 C84, C85, C98, C99 GRM1555C1H241JA01D MuRata CAP, CERM, 240 pF, 50V, +/- 5%, C0G/NP0,
040223 1 C100 GRM1555C1H100JA01D MuRata CAP, CERM, 10pF, 50V,
+/-5%, C0G/NP0, 040224 2 C102, C111 C1608X7R1C105K TDK CAP, CERM, 1uF, 16V,
+/-10%, X7R, 0603
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Table 1-18. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-001 (continued)Item Qty Designator Part Number Manufacturer Description25 1 C106 T495D107M016ATE100 Kemet CAP, TA, 100uF, 16V, +/-
20%, 0.1 ohm, SMD26 1 C107 GRM32ER61C476ME15L MuRata CAP, CERM, 47uF, 16V,
+/-20%, X5R, 121027 1 C110 GRM155R71H332KA01D MuRata CAP, CERM, 3300pF,
50V, +/-10%, X7R, 040228 4 C113, C123, C124, C128 GRM21BR71C475KA73L MuRata CAP, CERM, 4.7uF, 16V,
+/-10%, X7R, 080529 1 C121 293D225X9025A2TE3 Vishay-Sprague CAP, TA, 2.2uF, 25V, +/-
10%, 6.3 ohm, SMD30 1 C122 06031C103JAT2A AVX CAP, CERM, 0.01uF,
100V, +/-5%, X7R, 060331 4 C162, C163, C164, C165 08051C472KAT2A AVX CAP, CERM, 4700 pF,
100 V, +/- 10%, X7R,0805
32 4 CN1, CN2, CN3, CN4 59S10H-40ML5-Z Rosenberger Connector, HF, 50 Ohm,TH
33 10 D1, D2, D3, D4, D5, D6,D7, D8, D9, D16
150060VS75000 Wurth Elektronik eiSos LED, Green, SMD
34 1 D10 1N5819HW-7-F Diodes Inc. Diode, Schottky, 40V, 1A,SOD-123
35 3 D11, D12, D14 150060SS75000 Wurth Elektronik eiSos LED, Super Red, SMD36 1 D13 LTST-C190KFKT Lite-On LED, Orange, SMD37 1 D15 1SMB5922BT3G ON Semiconductor Diode, Zener, 7.5 V, 550
mW, SMB38 1 F1 0440002.WR Littelfuse Fuse, 2 A, 32 V, SMD39 1 FB1 BK1608HS600-T Taiyo Yuden Ferrite Bead, 60 ohm @
100 MHz, 0.8 A, 060340 8 J1, J12, J14, J16, J19,
J28, J29, J30TSW-103-07-G-S Samtec, Inc. Header, TH, 100mil, 3x1,
Gold plated, 230 milabove insulator
41 1 J2 TSW-108-07-G-D Samtec Header, 100mil, 8x2,Gold, TH
42 17 J3, J8, J9, J10, J11, J13,J15, J17, J18, J20, J21,J22, J23, J25, J26, J27,
J34
5-146261-1 TE Connectivity Header, 100mil, 2x1, Goldplated, TH
43 2 J4, J5 0022112042 Molex Header, 100mil, 4x1,White, TH
44 2 J6, J7 QSH-020-01-H-D-DP-A Samtec Receptacle, Differential,0.5mm, 10 pair x2, Gold,
SMT45 1 J24 PJ-102A CUI Inc. Connector, DC Jack
2.1X5.5 mm, TH46 1 J32 TSW-104-07-G-D Samtec Header, 100mil, 4x2,
Gold, TH47 1 J33 TSW-104-07-G-S Samtec Header, 100mil, 4x1,
Gold, TH48 1 J35 TSW-102-07-G-D Samtec Header, 100mil, 2x2,
Gold, TH49 1 J36 1734035-2 TE Connectivity Connector, Receptacle,
Mini-USB Type B, R/A,Top Mount SMT
50 7 L1, L2, L3, L4, L5, L6, L8 BLM18SG121TN1D MuRata Ferrite Bead, 120 ohm @100 MHz, 3 A, 0603
51 4 L11, L12, L21, L22 BLM18AG102SN1D MuRata Ferrite Bead, 1000 ohm@ 100 MHz, 0.4 A, 0603
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Table 1-18. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-001 (continued)Item Qty Designator Part Number Manufacturer Description52 4 L13, L15, L23, L25 1008PS-472KLB Coilcraft Inductor, Shielded,
Ferrite, 4.7 µH, 0.7 A,0.35 ohm, SMD
53 4 L14, L16, L24, L26 MSS7341T-104MLB Coilcraft Inductor, Shielded DrumCore, Ferrite, 100 µH, 0.7
A, 0.28 ohm, SMD54 4 L17, L18, L27, L28 BLM15HD182SN1D MuRata Ferrite Bead, 1800 ohm
@ 100 MHz, 0.2 A, 040255 1 L31 7440650047 Wurth Elektronik Inductor, Shielded Drum
Core, Ferrite, 4.7 µH, 4.2A, 0.02 ohm, SMD
56 1 LBL1 THT-13-457-10 Brady Thermal TransferPrintable Labels, 1.250"
W x 0.250" H - 10,000 perroll
57 2 Q1, Q2 BSS138 Fairchild Semiconductor MOSFET, N-CH, 50 V,0.22 A, SOT-23
58 14 R1, R3, R11, R25, R26,R27, R28, R34, R36,
R41, R110, R119, R128,R155
ERJ-2GE0R00X Panasonic RES, 0 ohm, 5%,0.063W, 0402
59 1 R2 CRCW0402100RFKED Vishay-Dale RES, 100 ohm, 1%,0.063W, 0402
60 1 R4 CRCW0402470RJNED Vishay-Dale RES, 470 ohm, 5%,0.063W, 0402
61 3 R5, R16, R17 CRCW040210K0JNED Vishay-Dale RES, 10k ohm, 5%,0.063W, 0402
62 5 R6, R97, R105, R118,R122
CRCW0402100KJNED Vishay-Dale RES, 100k ohm, 5%,0.063W, 0402
63 1 R7 CRCW040282K5FKED Vishay-Dale RES, 82.5 k, 1%, 0.063W, 0402
64 1 R8 CRCW040268K1FKED Vishay-Dale RES, 68.1 k, 1%, 0.063W, 0402
65 1 R9 CRCW040256K2FKED Vishay-Dale RES, 56.2 k, 1%, 0.063W, 0402
66 1 R10 CRCW040213K3FKED Vishay-Dale RES, 13.3 k, 1%, 0.063W, 0402
67 1 R13 CRCW0402102KFKED Vishay-Dale RES, 102 k, 1%, 0.063W, 0402
68 1 R14 CRCW0402137KFKED Vishay-Dale RES, 137 k, 1%, 0.063W, 0402
69 1 R15 CRCW0402210KFKED Vishay-Dale RES, 210 k, 1%, 0.063W, 0402
70 7 R20, R21, R22, R23,R76, R102, R115
CRCW04024K70JNED Vishay-Dale RES, 4.7k ohm, 5%,0.063W, 0402
71 1 R29 CRCW040240K2FKED Vishay-Dale RES, 40.2 k, 1%, 0.063W, 0402
72 15 R58, R59, R72, R73,R88, R90, R96, R99,
R106, R108, R109, R112,R120, R121, R129
CRCW06030000Z0EA Vishay-Dale RES, 0 ohm, 5%, 0.1W,0603
73 11 R60, R61, R62, R63,R64, R65, R66, R67,R125, R126, R127
CRCW0402220RJNED Vishay-Dale RES, 220, 5%, 0.063 W,0402
74 8 R68, R69, R70, R71,R80, R81, R82, R83
ERJ-3EKF1001V Panasonic RES, 1.00 k, 1%, 0.1 W,0603
75 4 R74, R75, R84, R85 CRCW040257R6FKED Vishay-Dale RES, 57.6, 1%, 0.063 W,0402
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DS90UB96X-Q1EVM User's Guide
Table 1-18. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-001 (continued)Item Qty Designator Part Number Manufacturer Description76 2 R77, R147 CRCW040233R0JNED Vishay-Dale RES, 33 ohm, 5%,
0.063W, 040277 4 R78, R79, R86, R87 CRCW0402200RJNED Vishay-Dale RES, 200, 5%, 0.063 W,
040278 6 R89, R95, R98, R103,
R107, R154CRCW040210K0FKED Vishay-Dale RES, 10.0k ohm, 1%,
0.063W, 040279 3 R91, R100, R111 CRCW040229K4FKED Vishay-Dale RES, 29.4 k, 1%, 0.063
W, 040280 1 R92 CRCW0402124KFKED Vishay-Dale RES, 124k ohm, 1%,
0.063W, 040281 1 R93 CRCW040222K1FKED Vishay-Dale RES, 22.1k ohm, 1%,
0.063W, 040282 4 R94, R101, R104, R114 CRCW04023K24FKED Vishay-Dale RES, 3.24k ohm, 1%,
0.063W, 040283 1 R113 CRCW04021K87FKED Vishay-Dale RES, 1.87k ohm, 1%,
0.063W, 040284 1 R116 CRCW04024K99FKED Vishay-Dale RES, 4.99k ohm, 1%,
0.063W, 040285 2 R123, R124 CRCW04022K40JNED Vishay-Dale RES, 2.4 k, 5%, 0.063 W,
040286 1 R148 CRCW04021K50JNED Vishay-Dale RES, 1.5k ohm, 5%,
0.063W, 040287 2 R149, R153 CRCW040233K0JNED Vishay-Dale RES, 33k ohm, 5%,
0.063W, 040288 1 R150 CRCW06031M20JNEA Vishay-Dale RES, 1.2Meg ohm, 5%,
0.1W, 060389 1 R152 CRCW0603200RFKEA Vishay-Dale RES, 200 ohm, 1%,
0.1W, 060390 1 S1 219-4LPST CTS Electrocomponents Switch, SPST 4 Pos, Top
Actuated, SMT91 2 S2, S3 KSR221GLFS C and K Components Switch, Normally open,
2.3N force, 200koperations, SMD
92 15 SH-J1, SH-J2, SH-J3,SH-J4, SH-J5, SH-J6,SH-J7, SH-J8, SH-J9,
SH-J10, SH-J11, SH-J12,SH-J13, SH-J14, SH-J15
SPC02SYAN Sullins ConnectorSolutions
Shunt, 100mil, FlashGold, Black
93 1 SW1 219-2LPST CTS Electrocomponents Switch, Slide, SPST 2poles, SMT
94 1 T1 ACM9070-701-2PL TDK Common Mode Filter forPower Line
95 1 U1 DS90UB964TRGCRQ1 Texas Instruments FPD-Link III Camera HubDeserializer, RGC0064G
96 3 U2, U4, U6 LM2941LD/NOPB Texas Instruments 1A Low DropoutAdjustable Regulator, 8-
pin LLP, Pb-Free97 1 U3 TPS54225PWPR Texas Instruments 4.5V to 18V Input, 2-A
Synchronous Step-DownSWIFT™ Converter,
PWP0014E98 1 U5 TPS74801TDRCRQ1 Texas Instruments Single Output LDO, 1.5 A,
Adjustable 0.8 to 3.6 VOutput, 0.8 to 5.5 V Input,with Programmable Soft
Start, 10-pin SON (DRC),-40 to 105 degC, Green
(RoHS & no Sb/Br)
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DS90UB96X-Q1EVM User's Guide
Table 1-18. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-001 (continued)Item Qty Designator Part Number Manufacturer Description99 1 U7 TPS767D318PWP Texas Instruments Dual Output LDO, 1 A,
Fixed 1.8, 3.3 V Output,2.7 to 10 V Input, 28-pinHTSSOP (PWP), -40 to125 degC, Green (RoHS
& no Sb/Br)100 1 U8 TPD4E004DRYR Texas Instruments ESD-Protection Array for
High-Speed DataInterfaces, 4 Channels, -
40 to +85 degC, 6-pinSON (DRY), Green(RoHS & no Sb/Br)
101 1 U9 TPS73533DRBR Texas Instruments 500mA, Low QuiescentCurrent, Ultra-Low Noise,High PSRR Low-Dropout
Linear Regulator,DRB0008A
102 1 U10 MSP430F5529IPN Texas Instruments 25 MHz Mixed SignalMicrocontroller with 128KB Flash, 8192 B SRAMand 63 GPIOs, -40 to 85degC, 80-pin QFP (PN),
Green (RoHS & no Sb/Br)103 1 U11 TCA9406DCUR Texas Instruments TCA9406 Dual
Bidirectional 1-MHz I2C-BUS and SMBus VoltageLevel-Translator, 1.65 to3.6 V, -40 to 85 degC, 8-pin US8 (DCU), Green
(RoHS & no Sb/Br)104 1 Y1 KC5032A25.0000CMGE0
0AVX OSC, 25 MHz, 1.6 to 5.5
V, SMD105 1 Y2 ABM3-25.000MHZ-D2Y-T Abracon Corporation Crystal, 25 MHz, 18 pF,
SMD106 1 Y3 ABM3-24.000MHZ-D2Y-T Abracon Corporation Crystal, 24 MHz, 18 pF,
SMD107 0 C2, C7, C13, C21, C27,
C32CL21A106KAFN3NE Samsung Electro-
MechanicsCAP, CERM, 10 µF, 25 V,
+/- 10%, X5R, 0805108 0 C66, C71 GRM1555C1H270JA01D MuRata CAP, CERM, 27 pF, 50 V,
+/- 5%, C0G/NP0, 0402109 0 J31 QTH-020-04-L-D-DP-A Samtec Header(shrouded),
0.5mm, 10 pair x 2, Gold,SMT
110 0 J37 TSW-104-07-G-D Samtec Header, 100mil, 4x2,Gold, TH
111 0 J38 TSW-104-07-G-S Samtec Header, 100mil, 4x1,Gold, TH
112 0 J39 TSW-102-07-G-D Samtec Header, 100mil, 2x2,Gold, TH
113 0 L19, L20, L29, L30 DLW21SN900HQ2L MuRata Coupled inductor, 0.28 A,0.41 ohm, +/- 25%, SMD
114 0 R12, R18, R19, R31,R32, R33, R35, R37,R38, R39, R40, R43,R44, R45, R47, R48,R49, R50, R51, R52,R53, R54, R55, R56,
R57, R146, R151
ERJ-2GE0R00X Panasonic RES, 0 ohm, 5%,0.063W, 0402
115 0 R24, R30, R117 CRCW040210K0FKED Vishay-Dale RES, 10.0k ohm, 1%,0.063W, 0402
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Table 1-18. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-001 (continued)Item Qty Designator Part Number Manufacturer Description116 0 R42, R46 CRCW06030000Z0EA Vishay-Dale RES, 0 ohm, 5%, 0.1W,
0603117 0 R130, R131, R132, R133,
R134, R135, R136, R137,R138, R139, R140, R141,R142, R143, R144, R145
ERJ-1GE0R00C Panasonic RES, 0, 5%, 0.05 W,0201
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DS90UB96X-Q1EVM User's Guide
Table 1-19. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-002
Item Qty Designator Part Number Manufacturer Description1 1 PCB SV601176 Any Printed Circuit Board2 7 C1, C6, C12, C20, C26,
C31, C42CL21A106KAFN3NE Samsung CAP, CERM, 10 µF, 25 V,
+/- 10%, X5R, 08053 8 C3, C8, C14, C22, C28,
C33, C44, C114C1005JB1V105K050BC TDK CAP, CERM, 1 µF, 35 V,
+/- 10%, JB, 04024 15 C4, C9, C15, C23, C29,
C34, C45, C47, C53, C63,C64, C80, C81, C94, C95
CGA2B3X7R1H104K050BB
TDK CAP, CERM, 0.1 µF, 50 V,+/- 10%, X7R, AEC-Q200
Grade 1, 04025 16 C5, C10, C11, C16, C17,
C18, C19, C24, C25, C30,C35, C36, C41, C46, C52,
C58
GCM155R71H103KA55D MuRata CAP, CERM, 0.01uF, 50V,+/-10%, C0G/NP0, 0402
6 5 C37, C50, C59, C132,C133
0603YC104JAT2A AVX CAP, CERM, 0.1uF, 16V,+/-5%, X7R, 0603
7 1 C38 0805YD225KAT2A AVX CAP, CERM, 2.2uF, 16V,+/-10%, X5R, 0805
8 2 C39, C55 06035A221FAT2A AVX CAP, CERM, 220pF, 50V,+/-1%, C0G/NP0, 0603
9 1 C40 C1608X7R1H103K080AA TDK CAP, CERM, 0.01 µF, 50V, +/- 10%, X7R, 0603
10 5 C48, C104, C112, C119,C120
293D226X0025D2TE3 Vishay-Sprague CAP, TA, 22uF, 25V, +/-20%, 0.7 ohm, SMD
11 1 C49 GRM21BR71C105KA01L MuRata CAP, CERM, 1 µF, 16 V,+/- 10%, X7R, 0805
12 2 C51, C54 GRM1885C2A300JA01D MuRata CAP, CERM, 30pF, 100V,+/-5%, C0G/NP0, 0603
13 1 C56 GRM188R71A474KA61D MuRata CAP, CERM, 0.47uF, 10V,+/-10%, X7R, 0603
14 1 C57 C0603X222K5RACTU Kemet CAP, CERM, 2200pF, 50V,+/-10%, X7R, 0603
15 1 C60 06031C103KAT2A AVX CAP, CERM, 0.01 µF, 100V, +/- 10%, X7R, 0603
16 15 C61, C62, C101, C103,C105, C109, C115, C116,C118, C125, C126, C129,
C130, C134, C135
GRM155R71C104KA88D MuRata CAP, CERM, 0.1uF, 16V,+/-10%, X7R, 0402
17 5 C65, C108, C117, C127,C131
GRM21BR71A106KE51L MuRata CAP, CERM, 10uF, 10V,+/-10%, X7R, 0805
18 4 C67, C68, C69, C70 GRM1555C1E4R7CA01D MuRata CAP, CERM, 4.7pF, 25V,+/-5%, C0G/NP0, 0402
19 8 C72, C74, C76, C78, C86,C88, C90, C92
C1005X7R1H104K050BB TDK CAP, CERM, 0.1 µF, 50 V,+/- 10%, X7R, 0402
20 8 C73, C75, C77, C79, C87,C89, C91, C93
GRM188R61E475KE11D Murata Electronics NorthAmerica
CAP CER 4.7UF 25V 10%X5R 0603
21 4 C82, C83, C96, C97 C1005X7R1H473K050BB TDK CAP, CERM, 0.047 µF, 50V, +/- 10%, X7R, 0402
22 4 C84, C85, C98, C99 GRM1555C1H241JA01D MuRata CAP, CERM, 240 pF, 50 V,+/- 5%, C0G/NP0, 0402
23 1 C100 GRM1555C1H100JA01D MuRata CAP, CERM, 10pF, 50V,+/-5%, C0G/NP0, 0402
24 2 C102, C111 C1608X7R1C105K TDK CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603
25 1 C106 T495D107M016ATE100 Kemet CAP, TA, 100uF, 16V, +/-20%, 0.1 ohm, SMD
26 1 C107 GRM32ER61C476ME15L MuRata CAP, CERM, 47uF, 16V,+/-20%, X5R, 1210
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DS90UB96X-Q1EVM User's Guide
Table 1-19. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-002 (continued)Item Qty Designator Part Number Manufacturer Description27 1 C110 GRM155R71H332KA01D MuRata CAP, CERM, 3300pF, 50V,
+/-10%, X7R, 040228 4 C113, C123, C124, C128 GRM21BR71C475KA73L MuRata CAP, CERM, 4.7uF, 16V,
+/-10%, X7R, 080529 1 C121 293D225X9025A2TE3 Vishay-Sprague CAP, TA, 2.2uF, 25V, +/-
10%, 6.3 ohm, SMD30 1 C122 06031C103JAT2A AVX CAP, CERM, 0.01uF, 100V,
+/-5%, X7R, 060331 4 C162, C163, C164, C165 08051C472KAT2A AVX CAP, CERM, 4700 pF, 100
V, +/- 10%, X7R, 080532 4 CN1, CN2, CN3, CN4 59S10H-40ML5-Z Rosenberger Connector, HF, 50 Ohm,
TH33 10 D1, D2, D3, D4, D5, D6,
D7, D8, D9, D16150060VS75000 Wurth Elektronik eiSos LED, Green, SMD
34 1 D10 1N5819HW-7-F Diodes Inc. Diode, Schottky, 40V, 1A,SOD-123
35 3 D11, D12, D14 150060SS75000 Wurth Elektronik eiSos LED, Super Red, SMD36 1 D13 LTST-C190KFKT Lite-On LED, Orange, SMD37 1 D15 1SMB5922BT3G ON Semiconductor Diode, Zener, 7.5 V, 550
mW, SMB38 1 F1 0440002.WR Littelfuse Fuse, 2 A, 32 V, SMD39 1 FB1 BK1608HS600-T Taiyo Yuden Ferrite Bead, 60 ohm @
100 MHz, 0.8 A, 060340 8 J1, J12, J14, J16, J19, J28,
J29, J30TSW-103-07-G-S Samtec, Inc. Header, TH, 100mil, 3x1,
Gold plated, 230 mil aboveinsulator
41 1 J2 TSW-108-07-G-D Samtec Header, 100mil, 8x2, Gold,TH
42 17 J3, J8, J9, J10, J11, J13,J15, J17, J18, J20, J21,J22, J23, J25, J26, J27,
J34
5-146261-1 TE Connectivity Header, 100mil, 2x1, Goldplated, TH
43 2 J4, J5 0022112042 Molex Header, 100mil, 4x1, White,TH
44 2 J6, J7 QSH-020-01-H-D-DP-A Samtec Receptacle, Differential,0.5mm, 10 pair x2, Gold,
SMT45 1 J24 PJ-102A CUI Inc. Connector, DC Jack
2.1X5.5 mm, TH46 1 J31 QTH-020-04-L-D-DP-A Samtec Header(shrouded), 0.5mm,
10 pair x 2, Gold, SMT47 1 J32 TSW-104-07-G-D Samtec Header, 100mil, 4x2, Gold,
TH48 1 J33 TSW-104-07-G-S Samtec Header, 100mil, 4x1, Gold,
TH49 1 J35 TSW-102-07-G-D Samtec Header, 100mil, 2x2, Gold,
TH50 1 J36 1734035-2 TE Connectivity Connector, Receptacle,
Mini-USB Type B, R/A, TopMount SMT
51 7 L1, L2, L3, L4, L5, L6, L8 BLM18SG121TN1D MuRata Ferrite Bead, 120 ohm @100 MHz, 3 A, 0603
52 4 L11, L12, L21, L22 BLM18AG102SN1D MuRata Ferrite Bead, 1000 ohm @100 MHz, 0.4 A, 0603
53 4 L13, L15, L23, L25 1008PS-472KLB Coilcraft Inductor, Shielded, Ferrite,4.7 µH, 0.7 A, 0.35 ohm,
SMD
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DS90UB96X-Q1EVM User's Guide
Table 1-19. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-002 (continued)Item Qty Designator Part Number Manufacturer Description54 4 L14, L16, L24, L26 MSS7341T-104MLB Coilcraft Inductor, Shielded Drum
Core, Ferrite, 100 µH, 0.7A, 0.28 ohm, SMD
55 4 L17, L18, L27, L28 BLM15HD182SN1D MuRata Ferrite Bead, 1800 ohm @100 MHz, 0.2 A, 0402
56 1 L31 7440650047 Wurth Elektronik Inductor, Shielded DrumCore, Ferrite, 4.7 µH, 4.2 A,
0.02 ohm, SMD57 1 LBL1 THT-13-457-10 Brady Thermal Transfer Printable
Labels, 1.250" W x 0.250"H - 10,000 per roll
58 2 Q1, Q2 BSS138 Fairchild Semiconductor MOSFET, N-CH, 50 V, 0.22A, SOT-23
59 15 R1, R3, R11, R25, R26,R27, R28, R34, R36, R39,R41, R110, R119, R128,
R155
ERJ-2GE0R00X Panasonic RES, 0 ohm, 5%, 0.063W,0402
60 1 R2 CRCW0402100RFKED Vishay-Dale RES, 100 ohm, 1%,0.063W, 0402
61 1 R4 CRCW0402470RJNED Vishay-Dale RES, 470 ohm, 5%,0.063W, 0402
62 3 R5, R16, R17 CRCW040210K0JNED Vishay-Dale RES, 10k ohm, 5%,0.063W, 0402
63 5 R6, R97, R105, R118,R122
CRCW0402100KJNED Vishay-Dale RES, 100k ohm, 5%,0.063W, 0402
64 1 R7 CRCW040282K5FKED Vishay-Dale RES, 82.5 k, 1%, 0.063 W,0402
65 1 R8 CRCW040268K1FKED Vishay-Dale RES, 68.1 k, 1%, 0.063 W,0402
66 1 R9 CRCW040256K2FKED Vishay-Dale RES, 56.2 k, 1%, 0.063 W,0402
67 1 R10 CRCW040213K3FKED Vishay-Dale RES, 13.3 k, 1%, 0.063 W,0402
68 1 R13 CRCW0402102KFKED Vishay-Dale RES, 102 k, 1%, 0.063 W,0402
69 1 R14 CRCW0402137KFKED Vishay-Dale RES, 137 k, 1%, 0.063 W,0402
70 1 R15 CRCW0402210KFKED Vishay-Dale RES, 210 k, 1%, 0.063 W,0402
71 7 R20, R21, R22, R23, R76,R102, R115
CRCW04024K70JNED Vishay-Dale RES, 4.7k ohm, 5%,0.063W, 0402
72 1 R29 CRCW040240K2FKED Vishay-Dale RES, 40.2 k, 1%, 0.063 W,0402
73 15 R58, R59, R72, R73, R88,R90, R96, R99, R106,
R108, R109, R112, R120,R121, R129
CRCW06030000Z0EA Vishay-Dale RES, 0 ohm, 5%, 0.1W,0603
74 11 R60, R61, R62, R63, R64,R65, R66, R67, R125,
R126, R127
CRCW0402220RJNED Vishay-Dale RES, 220, 5%, 0.063 W,0402
75 8 R68, R69, R70, R71, R80,R81, R82, R83
ERJ-3EKF1001V Panasonic RES, 1.00 k, 1%, 0.1 W,0603
76 4 R74, R75, R84, R85 CRCW040257R6FKED Vishay-Dale RES, 57.6, 1%, 0.063 W,0402
77 2 R77, R147 CRCW040233R0JNED Vishay-Dale RES, 33 ohm, 5%, 0.063W,0402
78 4 R78, R79, R86, R87 CRCW0402200RJNED Vishay-Dale RES, 200, 5%, 0.063 W,0402
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DS90UB96X-Q1EVM User's Guide
Table 1-19. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-002 (continued)Item Qty Designator Part Number Manufacturer Description79 6 R89, R95, R98, R103,
R107, R154CRCW040210K0FKED Vishay-Dale RES, 10.0k ohm, 1%,
0.063W, 040280 3 R91, R100, R111 CRCW040229K4FKED Vishay-Dale RES, 29.4 k, 1%, 0.063 W,
040281 1 R92 CRCW0402124KFKED Vishay-Dale RES, 124k ohm, 1%,
0.063W, 040282 1 R93 CRCW040222K1FKED Vishay-Dale RES, 22.1k ohm, 1%,
0.063W, 040283 4 R94, R101, R104, R114 CRCW04023K24FKED Vishay-Dale RES, 3.24k ohm, 1%,
0.063W, 040284 1 R113 CRCW04021K87FKED Vishay-Dale RES, 1.87k ohm, 1%,
0.063W, 040285 1 R116 CRCW04024K99FKED Vishay-Dale RES, 4.99k ohm, 1%,
0.063W, 040286 2 R123, R124 CRCW04022K40JNED Vishay-Dale RES, 2.4 k, 5%, 0.063 W,
040287 16 R130, R131, R132, R133,
R134, R135, R136, R137,R138, R139, R140, R141,R142, R143, R144, R145
ERJ-1GE0R00C Panasonic RES, 0, 5%, 0.05 W, 0201
88 1 R148 CRCW04021K50JNED Vishay-Dale RES, 1.5k ohm, 5%,0.063W, 0402
89 2 R149, R153 CRCW040233K0JNED Vishay-Dale RES, 33k ohm, 5%,0.063W, 0402
90 1 R150 CRCW06031M20JNEA Vishay-Dale RES, 1.2Meg ohm, 5%,0.1W, 0603
91 1 R152 CRCW0603200RFKEA Vishay-Dale RES, 200 ohm, 1%, 0.1W,0603
92 1 S1 219-4LPST CTS Electrocomponents Switch, SPST 4 Pos, TopActuated, SMT
93 2 S2, S3 KSR221GLFS C and K Components Switch, Normally open,2.3N force, 200koperations, SMD
94 15 SH-J1, SH-J2, SH-J3, SH-J4, SH-J5, SH-J6, SH-J7,
SH-J8, SH-J9, SH-J10, SH-J11, SH-J12, SH-J13, SH-
J14, SH-J15
SPC02SYAN Sullins Connector Solutions Shunt, 100mil, Flash Gold,Black
95 1 SW1 219-2LPST CTS Electrocomponents Switch, Slide, SPST 2poles, SMT
96 1 T1 ACM9070-701-2PL TDK Common Mode Filter forPower Line
97 1 U1 DS90UB964TRGCRQ1 Texas Instruments FPD-Link III Camera HubDeserializer, RGC0064G
98 3 U2, U4, U6 LM2941LD/NOPB Texas Instruments 1A Low Dropout AdjustableRegulator, 8-pin LLP, Pb-
Free99 1 U3 TPS54225PWPR Texas Instruments 4.5V to 18V Input, 2-A
Synchronous Step-DownSWIFT™ Converter,
PWP0014E100 1 U5 TPS74801TDRCRQ1 Texas Instruments Single Output LDO, 1.5 A,
Adjustable 0.8 to 3.6 VOutput, 0.8 to 5.5 V Input,with Programmable Soft
Start, 10-pin SON (DRC), -40 to 105 degC, Green
(RoHS & no Sb/Br)
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DS90UB96X-Q1EVM User's Guide
Table 1-19. BOM for DS90UB96X-Q1EVM Assembly Variant SV601176-002 (continued)Item Qty Designator Part Number Manufacturer Description101 1 U7 TPS767D318PWP Texas Instruments Dual Output LDO, 1 A,
Fixed 1.8, 3.3 V Output, 2.7to 10 V Input, 28-pin
HTSSOP (PWP), -40 to125 degC, Green (RoHS &
no Sb/Br)102 1 U8 TPD4E004DRYR Texas Instruments ESD-Protection Array for
High-Speed DataInterfaces, 4 Channels, -40
to +85 degC, 6-pin SON(DRY), Green (RoHS & no
Sb/Br)103 1 U9 TPS73533DRBR Texas Instruments 500mA, Low Quiescent
Current, Ultra-Low Noise,High PSRR Low-Dropout
Linear Regulator,DRB0008A
104 1 U10 MSP430F5529IPN Texas Instruments 25 MHz Mixed SignalMicrocontroller with 128 KBFlash, 8192 B SRAM and
63 GPIOs, -40 to 85 degC,80-pin QFP (PN), Green
(RoHS & no Sb/Br)105 1 U11 TCA9406DCUR Texas Instruments TCA9406 Dual Bidirectional
1-MHz I2C-BUS andSMBus Voltage Level-
Translator, 1.65 to 3.6 V, -40 to 85 degC, 8-pin US8(DCU), Green (RoHS & no
Sb/Br)106 1 Y1 KC5032A25.0000CMGE00 AVX OSC, 25 MHz, 1.6 to 5.5 V,
SMD107 1 Y2 ABM3-25.000MHZ-D2Y-T Abracon Corporation Crystal, 25 MHz, 18 pF,
SMD108 1 Y3 ABM3-24.000MHZ-D2Y-T Abracon Corporation Crystal, 24 MHz, 18 pF,
SMD109 0 C2, C7, C13, C21, C27,
C32, C43CL21A106KAFN3NE Samsung Electro-
MechanicsCAP, CERM, 10 µF, 25 V,
+/- 10%, X5R, 0805110 0 C66, C71 GRM1555C1H270JA01D MuRata CAP, CERM, 27 pF, 50 V,
+/- 5%, C0G/NP0, 0402111 0 J37 TSW-104-07-G-D Samtec Header, 100mil, 4x2, Gold,
TH112 0 J38 TSW-104-07-G-S Samtec Header, 100mil, 4x1, Gold,
TH113 0 J39 TSW-102-07-G-D Samtec Header, 100mil, 2x2, Gold,
TH114 0 L19, L20, L29, L30 DLW21SN900HQ2L MuRata Coupled inductor, 0.28 A,
0.41 ohm, +/- 25%, SMD115 0 R12, R18, R19, R31, R32,
R33, R35, R37, R38, R40,R43, R44, R45, R47, R48,R49, R50, R51, R52, R53,R54, R55, R56, R57, R146,
R151
ERJ-2GE0R00X Panasonic RES, 0 ohm, 5%, 0.063W,0402
116 0 R24, R30, R117 CRCW040210K0FKED Vishay-Dale RES, 10.0k ohm, 1%,0.063W, 0402
117 0 R42, R46 CRCW06030000Z0EA Vishay-Dale RES, 0 ohm, 5%, 0.1W,0603
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
1 7
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Cover Sheet_ANSI-B.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
DS90UB964Q1_EVMProject Title:Designed for: Public Release
Assembly Variant: [No Variations]
© Texas Instruments 2015
Drawn By:Engineer: Dac Tran
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Version control disabledSVN Rev:SV601176Number: Rev: A
Revision History
Revision Notes
DS90UB964Q
RIN0
25 MHz OSC
I2C
EXT C
ONN
3.3V
5V
VSS
Power
1.8V
RIN1
RIN2
RIN3
POC
CSI0
CSI1
GPIO
INTB
Power
Status LEDs
PDB
MODE
IDx
Strap Resistors / Jumpers
1.1V
GPIOn
REFCLK
I2C Connector
USB2ANY
USB
I2C Connector
9V
+12V
Supply
46 SNLU177–July 2016Submit Documentation Feedback
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PCB Schematics
Chapter 2SNLU177–July 2016
PCB Schematics
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
2 7
5/11/2016
DS90UB964Q__HUB.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
DS90UB964Q1_EVMProject Title:Designed for: Public Release
Assembly Variant: [No Variations]
© Texas Instruments 2015
Drawn By:Engineer: Dac Tran
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Version control disabledSVN Rev:SV601176Number: Rev: A
GND
RIN0_PRIN0_NRIN1_PRIN1_NRIN2_PRIN2_NRIN3_PRIN3_N
REFCLK
VDD18_PVDD18_PVDD18_P
VDD18_P
VDD18A
VDDIO
CMLOUT_PCMLOUT_N
GPIO0GPIO1GPIO2GPIO3GPIO4GPIO5GPIO6GPIO7
CSI0_D0_PCSI0_D0_NCSI0_D1_PCSI0_D1_NCSI0_D2_PCSI0_D2_NCSI0_D3_PCSI0_D3_N
CSI1_D0_PCSI1_D0_NCSI1_D1_PCSI1_D1_NCSI1_D2_PCSI1_D2_N
CSI1_D3_NCSI1_D3_P
CSI0_CLK_PCSI0_CLK_N
CSI1_CLK_PCSI1_CLK_N
I2C_SCLI2C_SDAI2C_SCL2I2C_SDA2
IDX
PDB
MODE
INTB
I2C_SCL
I2C_SDA
IDX
PDB
I2C_SCL2
I2C_SDA2
MODE
INTB
REFCLK
CSI0_D3_N
CSI1_D2_N
CSI0_D3_P
CSI0_D0_P
CSI0_D0_N
CSI0_D1_P
CSI0_D1_N
CSI0_D2_N
CSI0_D2_P
CSI1_D0_P
CSI1_D3_P
CSI1_D0_N
CSI1_D1_P
CSI1_D1_N
CSI1_D2_P
CSI1_D3_N
CSI0_CLK_P
CSI0_CLK_N
CSI1_CLK_P
CSI1_CLK_N
RIN0_P
RIN0_N
RIN1_P
RIN1_N
RIN2_P
RIN2_N
RIN3_P
RIN3_N
VDDL_1V1
VDDCSI_1V1
VDDFPD_1V1
VDDFPD18
OPEN: I2C Address = 0x30 (7'b)
GND
IDXGND
40.2kR29
0.1µF
C63
TESTEN
GND
0.1µFC59
0.01µFC60
GND
VDDIO
REFCLK
MODE
GND
VDD1V8
13.3kR10
210kR15
56.2kR9
68.1kR8
137kR14
82.5kR7
102kR13
GND
0.1µF
C64
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
J2
TSW-108-07-G-D
GND
GPIO0GPIO1GPIO2GPIO3GPIO4GPIO5GPIO6GPIO7
631
8
27 5
4
S1219-4LPST
14
SW1A219-2LPST
23
SW1B219-2LPST
GND
10kR16
10kR17
TESTENPDB
GND
10k
R5
0
R1
0R3
0
R11
4
1
2
3
J4
0022112042
GND
4.7pFC68
4.7pFC67
0R250R27
I2C_SDA
I2C_SCL
0.1µFC61
GND
4.7kR21
4.7kR20
I2C_SCLI2C_SDA
VDD_I2C
4
1
2
3
J5
0022112042
GND
4.7pFC70
4.7pFC69
0R260R28
I2C_SDA2
I2C_SCL2
0.1µFC62
GND
4.7kR23
4.7kR22
I2C_SCL2I2C_SDA2
VDD_I2C
RESERVED
RAW12 LF (913)
RAW12 HF (913)
RAW10 (913)
S2KSR221GLFS10µF
C65
VDDIO
GND
10µFC1
VDD18AVDD1V8
120 ohm
L1
1µFC3
0.1µFC4
0.01µFC5
GND
10µFC12
120 ohm
L3
VDDFPD18
0.01µFC16
0.01µFC17
0.01µFC18
0.01µFC19
1µFC14
0.1µFC15
GND
120 ohm
L5
VDD18_P
1µFC28
0.1µFC29
0.01µFC30
GND
10µFC42
VDDIO
VDD1V8VDD33
1
2
3
J1
TSW-103-07-G-S
120 ohm
L6
GND
10µFC31
VDD1V1VDDFPD_1V1
120 ohm
L4
GND
10µFC20
VDDCSI_1V1
120 ohm
L2
10µFC6
VDDL_1V1
GND
120 ohm
L8
0.01µFC10
0.01µFC11
1µFC8
0.1µFC9
0.01µFC24
0.01µFC25
1µFC22
0.1µFC23
0.01µFC35
0.01µFC36
1µFC33
0.1µFC34
1µFC44
0.1µFC45
0.01µFC46
REFCLK
MODE
IDX
10µFC26
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
1 2J3
GND
0R12
100
R2
GND
10.0kR30
10.0kR24
0R18
TESTEN
REFCLK
0R31
iLABEL "REF_CLK
INTB
470R4
GND
100kR6
VDD33
Green
21
D1
TP2
DNL
1
2
J34
SHORTED: I2C Address = 0x3d (7'b)VDD1V8
VDD1V8 VDDIO
0.01µFC41
0.01µFC52
0.01µFC58
1
23Q1
BSS138
TP1
i
LABEL "CMLOUTP"
i
LABEL "CMLOUTN"
4.7kR76
VDDIO
27pFC66
27pFC71
VDD18_P31
VDD18_P22
PDB3
TESTEN4
REFCLOCK5
INTB6
I2C_SDA27
I2C_SCL28
GPIO[0]9
GPIO[1]10
I2C_SDA11
I2C_SCL12
VDDL113
GPIO[2]14
GPIO[3]15
VDDIO16
GPIO[4]17
GPIO[5]18
GPIO[6]19
GPIO[7]20
VDD_CSI021
CSI0_CLK-22
CSI0_CLK+23
CSI0_D0-24
CSI0_D0+25
CSI0_D1-26
CSI0_D1+27
CSI0_D2-28
CSI0_D2+29
CSI0_D3-30
CSI0_D3+31
VDD18A32
VDD_CSI133
CSI1_CLK-34
CSI1_CLK+35
CSI1_D0-36
CSI1_D0+37
CSI1_D1-38
CSI1_D1+39
CSI1_D2-40
CSI1_D2+41
CSI1_D3-42
CSI1_D3+43
VDDL244
MODE45
IDX46
VDD18_P147
VDD18_P048
VDD18_FPD049
RIN0+50
RIN0-51
VDD_FPD152
RIN1+53
RIN1-54
VDD18_FPD155
LPTXP56
LPTXN57
VDD18_FPD258
RIN2+59
RIN2-60
VDD_FPD261
RIN3+62
RIN3-63
VDD18_FPD364
DAP65
U1
DS90UB964TRGCRQ1
VDD_I2C
0.1µFC470.1µFC53
E/D1
GND2
OUTPUT3
VCC4
25 MHz
Y1
KC5032A25.0000CMGE00
12
25 MHzY2
Assembly NoteZZ6
Place Jumper on J34
SH-J2
Assembly NoteZZ5
Place Jumper on J1.1-2
SH-J1
0R19
0R146
10µFC2
10µFC13
10µFC27
10µFC7
10µFC21
10µFC32
10µFC43
100 ohm diff pair. +/-5%.Resistors have to be placed close to U1.+/- 10 mil for all inter/intra pairs.
Layout note: For all differential pairs(CSI-2 and FPD) in this design follow the guidelines decribed below: Route together with controlled differential 100ohm impedance and controlled single ended 50ohm impedance. Keep away from other high speed signals. Keep lengths within 10mil of each other. Keep traces on layers adjacent to the ground plane. Keep the number of VIAS to minimum. If VIAS are used, make it symetrical through all signals. Keep diff pairs separated at least by x3 of the trace width. NO STUBS on the signal path, components should be placed such that the signals can routed in pass-through manner.
Place 10uF, 1uF, 0.1uF and 0.01uF bypass caps on bottom of board, close to U1 VDD pins
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PCB Schematics
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
3 7
5/11/2016
DS90UB964Q_CONNECTOR.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
DS90UB964Q1_EVMProject Title:Designed for: Public Release
Assembly Variant: [No Variations]
© Texas Instruments 2015
Drawn By:Engineer: Dac Tran
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Version control disabledSVN Rev:SV601176Number: Rev: A
EXP_SCL0EXP_SDA0
EXP_REF_CLK0
GND
CSI1_CLK_PCSI1_CLK_N
CSI1_D0_PCSI1_D0_N
CSI1_D1_PCSI1_D1_N
CSI1_D2_PCSI1_D2_N
CSI1_D3_PCSI1_D3_N
EXP_SCL1EXP_SDA1
EXP_REF_CLK1
GND
0R340R35
EXP_SCL0EXP_SCL1 I2C_SCL
0R360R37
EXP_SDA0EXP_SDA1 I2C_SDA
CSI1_CLK_P
CSI1_CLK_N
CSI1_D0_P
CSI1_D0_N
CSI1_D1_P
CSI1_D1_N
CSI1_D2_P
CSI1_D2_N
CSI1_D3_P
CSI1_D3_N
I2C_SCL
I2C_SDA
0
R58
VDD_3V3
VDD_1V8
0
R59
VDD_3V3
VDD_1V8
0
R42
VDD_3V3
VDD_1V8
0
R46
VDD_3V3
VDD_1V8
0R320R33
EXP_REF_CLK0EXP_REF_CLK1 REFCLK
REFCLK
0R430R44
RESETn_0RESETn_1 PDB
PDB
RESETn_0
RESETn_1
SPI_MOSI_0SPI_SCLK_0
SPI_CSn_0
SPI_MOSI_1SPI_SCLK_1
SPI_CSn_1
0R450R47
SPI_MOSI_0SPI_MOSI_1
GPIO0
0R480R49
SPI_SCLK_0SPI_SCLK_1
0R500R51
SPI_CSn_0SPI_CSn_1
GPIO1
GPIO2
0R380R39
EXP_SCL0EXP_SCL1 I2C_SCL2
0R400R41
EXP_SDA0EXP_SDA1 I2C_SDA2
I2C_SCL2
I2C_SDA2
BOTTOM MOUNT
TOP MOUNT
0R520R53
SPI_MOSI_0SPI_MOSI_1
GPIO3
0R540R55
SPI_SCLK_0SPI_SCLK_1
0R560R57
SPI_CSn_0SPI_CSn_1
GPIO4
GPIO5
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
CSI0_CLK_PCSI0_CLK_N
CSI0_D0_PCSI0_D0_N
CSI0_D1_PCSI0_D1_N
CSI0_D2_PCSI0_D2_N
CSI0_D3_PCSI0_D3_N
CSI0_CLK_P
CSI0_CLK_N
CSI0_D0_P
CSI0_D0_N
CSI0_D1_P
CSI0_D1_N
CSI0_D2_P
CSI0_D2_N
CSI0_D3_P
CSI0_D3_N
EXP_SCL0EXP_SDA0
EXP_REF_CLK0
GND
0
R72
VDD_3V3
VDD_1V8
0
R73
VDD_3V3
VDD_1V8
RESETn_0
SPI_MOSI_0SPI_SCLK_0
SPI_CSn_0
TOP MOUNT
CSI0_CLK_PCSI0_CLK_N
CSI0_D0_PCSI0_D0_N
CSI0_D1_PCSI0_D1_N
CSI0_D2_PCSI0_D2_N
CSI0_D3_PCSI0_D3_N
0 0201R1300 0201R131
0 0201R1320 0201R133
0 0201R1340 0201R135
0 0201R1360 0201R137
0 0201R1380 0201R139
CSI1_CLK_PCSI1_CLK_N
CSI1_D0_PCSI1_D0_N
0 0201R1400 0201R141
0 0201R1420 0201R143
CSI1_D1_PCSI1_D1_N
0 0201R1440 0201R145
1
3
2
4
5
7
6
8
9
11
10
12
13
15
14
16
17
19
18
20
21
23
22
24
25
27
26
28
29
31
30
32
33
35
34
36
37
39
38
40
MP1 MP2
MP3 MP4
J31
QTH-020-04-L-D-DP-AGND
1
3
2
4
5
7
6
8
9
11
10
12
13
15
14
16
17
19
18
20
21
23
22
24
25
27
26
28
29
31
30
32
33
35
34
36
37
39
38
40
MP1 MP2
MP3 MP4
J6
QSH-020-01-H-D-DP-A
1
3
2
4
5
7
6
8
9
11
10
12
13
15
14
16
17
19
18
20
21
23
22
24
25
27
26
28
29
31
30
32
33
35
34
36
37
39
38
40
MP1 MP2
MP3 MP4
J7
QSH-020-01-H-D-DP-A
GND
GND
0_CLK_P0_CLK_N
0_DO_P0_DO_N
0_D1_P0_D1_N
0_D2_P0_D2_N
0_D3_P0_D3_N
1_CLK_P1_CLK_N
1_D0_P1_D0_N
1_D1_P1_D1_N
-Remove R130-R145 for CSI2 source connected to J6/J7-Populate R130-R145 when source connected through J31** R130-R145 to be placed as near as J6/J7 to avoid stub when J31 is not in use **
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PCB Schematics
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
4 7
12/18/2015
DS90UB964Q_LED.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
DS90UB964Q1_EVMProject Title:Designed for: Public Release
Assembly Variant: [No Variations]
© Texas Instruments 2015
Drawn By:Engineer: Dac Tran
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Version control disabledSVN Rev:SV601176Number: Rev: A
Green
2 1
D2
220
R60
Green
2 1
D3
220
R61
Green
2 1
D4
220
R62
Green
2 1
D5
220
R63
GPIO0
GPIO1
GPIO2
GPIO3
GND
Green
2 1
D6
220
R64
Green
2 1
D7
220
R65
Green
2 1
D8
220
R66
Green
2 1
D9
220
R67
GPIO4
GPIO5
GPIO6
GPIO7
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
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Copyright © 2016, Texas Instruments Incorporated
PCB Schematics
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
5 7
5/11/2016
DS90UB964Q_POC.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
DS90UB964Q1_EVMProject Title:Designed for: Public Release
Assembly Variant: [No Variations]
© Texas Instruments 2015
Drawn By:Engineer: Dac Tran
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Version control disabledSVN Rev:SV601176Number: Rev: A
CAMERA 1
GND
CAMERA 2
GND
CAMERA 3
GND
RIN2_P
CAMERA 4
GND
57.6
R74
200
R78
240pF
C84
200
R79
240pF
C8557.6
R75
200
R86
240pF
C9857.6
R84
200
R87
240pF
C9957.6
R85
GNDGND
GND GND
VFEED_POC1
VFEED_POC1
1 234
L19DLW21SN900HQ2L
1.00k
R69
L14
MSS7341T-104MLB
VFEED1
GND
4.7µFC75
4.7µFC73
0.1µFC74
0.1µFC72
GND
RIN0_PRIN0_P
RIN0_NRIN0_N
0.047µF
C82
1.00k
R81
L24
MSS7341T-104MLB
VFEED3
GND
4.7µFC89
4.7µFC87
0.1µFC88
0.1µFC86
GND
RIN2_P
RIN2_NRIN2_N
1 234
L29DLW21SN900HQ2L
1.00k
R71
L16
MSS7341T-104MLB
VFEED2
GND
4.7µFC79
4.7µFC77
0.1µFC78
0.1µFC76
GND
RIN1_PRIN1_P
RIN1_NRIN1_N
1 234
L20DLW21SN900HQ2L
1.00k
R83
L26
MSS7341T-104MLB
VFEED4
GND
4.7µFC93
4.7µFC91
0.1µFC92
0.1µFC90
GND
RIN3_PRIN3_P
RIN3_NRIN3_N
1 234
L30DLW21SN900HQ2L
VFEED_POC2
VFEED_POC2
12
34
56
78
J32
4
1
2
3
J33
VFEED1
VFEED2
VFEED3
VFEED4
0.1µF
C80
0.1µF
C81
0.1µF
C94
0.1µF
C95
0.047µF
C83
0.047µF
C97
0.047µF
C96
1.00k
R68
1.00k
R70
1.00k
R82
1.00k
R80
1800 ohmL17
1800 ohmL18
1800 ohmL28
1800 ohmL27
1000 ohm
L11
1000 ohm
L12
4.7µH
L13
4.7µH
L15
1000 ohm
L21
1000 ohm
L22
4.7µH
L23
4.7µH
L25
1
2 3 4 5
CN1
59S10H-40ML5-Z
1
2 3 4 5
CN2
59S10H-40ML5-Z
1
2 3 4 5
CN3
59S10H-40ML5-Z
1
2 3 4 5
CN4
59S10H-40ML5-Z
CN1RIN0_P
CN1RIN0_N
CN2RIN1_P
CN2RIN1_N
CN4RIN3_NCN3RIN2_N
CN4RIN3_PCN3RIN2_P
SH-J6
Assembly NoteZZ7
Place Jumper on J32.7-8
SH-J5
SH-J4
SH-J3
Assembly NoteZZ8
Place Jumper on J32.5-6
Assembly NoteZZ9
Place Jumper on J32.3-4
Assembly NoteZZ10
Place Jumper on J32.1-2
Layout Note: Arrange headers as 4x3 block
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PCB Schematics
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
6 7
5/11/2016
DS90UB964Q_POWER.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
DS90UB964Q1_EVMProject Title:Designed for: Public Release
Assembly Variant: [No Variations]
© Texas Instruments 2015
Drawn By:Engineer: Dac Tran
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Version control disabledSVN Rev:SV601176Number: Rev: A
1
2
3
J12
TSW-103-07-G-S
1
3
2
J24
PJ-102A40V
D101N5819HW-7-F 22µF
C1202.2µFC121 0.1µF
C118
GND GNDGND
0.1µFC116
GND
4.7µFC123
4.99kR116
1.87kR113
GND
100k
R118
TP10
TP11
0
R119
0.1µFC125
4.7µFC124
10µFC117
10µFC127
0.1µFC126
GND
10µFC131
0.1µFC130
GND
100k
R97
GND
3300pFC110
1µFC111
10.0k
R103
10pF
C100
47µFC107
10µFC108
0.1µFC109
GND
GND
100µFC106
TP12
TP15
TP7
TP4
TP9
1
2
J17
5-146261-1
GND
1
2
3
J30
TSW-103-07-G-S
1
2
J22
5-146261-1
0
R108
0
R120
0
R129
1
2
J11
5-146261-1
0.1µF
C105
124k
R92
22.1k
R93
3.24kR104
GND
22µFC104
GND
10.0kR89
3.24kR94
GND
1
2
J9
5-146261-1
GND
1
2
J26
5-146261-1
1 2
J185-146261-1
1GND3
1EN4
1IN5
1IN6
2GND9
2EN10
2IN11
2IN12
2OUT17
2OUT18
2RESET22
1OUT23
1OUT24
1RESET28
EP29
U7A
TPS767D318PWPGND
TP14
0
R128
0.1µFC129
4.7µFC128
100k
R122
TP13
GND
0.1µFC103
0.1µFC101
1µFC102
GND
5V_SW
VDD5V
5V_LDO VDD5V 5V_SW
VDD_EXT
VDD_EXT
5V_LDO
VDD_EXT
VDD5V VDD1V1
VDD33
VDD1V8
VDD33VDD_I2CVDD1V8
i LABEL "TPS767 IN"
i LABEL "GND"
i
LABEL "5V_LDO_EN"
i
LABEL "GND"
i LABEL "5V_SW_EN"i LABEL "GND"
i LABEL "TPS_VDD11"
i LABEL "GND"
i LABEL "VDD5V"
i LABEL "GND"
iLABEL "5V_SW"
iLABEL "5V_LDO"
iLABEL "5V_REG"
i LABEL "VDD_I2C"
i LABEL "VDD1V8"
i LABEL VDD3V3"
NC1
NC2
NC7
NC8
NC13
NC14
NC15
NC16
NC19
NC20
NC21
NC25
NC26
NC27
U7B
TPS767D318PWP
i
FOR INFORMATION ONLY
1
2
J8
5-146261-1
iLABEL "VDD_EXT"
iLABEL "TPS"
1
2
J10
5-146261-1
VDD_EXT
GND
VFEED_POC1
220R126
GND
VDD5V
220R125
GND
1V8@1A POWER SUPPLY3V3@1A POWER SUPPLY
[email protected] POWER SUPPLY
0.01µFC122
TP8
0R110
0.1µFC115
1µFC114
4.7µFC113
10.0kR117
10.0kR95
29.4kR91
5V@1A LDO POWER SUPPLY
0
R90
5V@2A SW POWER SUPPLY
22µFC112
GND
10.0kR98
3.24kR101
GND
1
2
J13
5-146261-1
GND
VDD_EXT
VFEED_LDO1
i
LABEL "VFEED_EN"
i
LABEL "GND"1
2
J15
5-146261-1
29.4kR100
9V@1A LDO POWER SUPPLY
0
R99
1
2
3
J14
TSW-103-07-G-S
VFEED_LDO1 VFEED_POC1 5V_SW
iLABEL "VFEED_SW"
iLABEL "VFEED_LDO1"iLABEL "VFEED_POC1"
Super Red
21
D11Super Red
21
D12
100k
R105
2.4kR123
2.4kR124
12
J275-146261-1
VDD5V
0R121
0R112
1
2
3
J28
TSW-103-07-G-S
i LABEL "VDD1V8"
i LABEL "GND"
1
2
3
J29
TSW-103-07-G-S
i LABEL "VDD3V3"
i LABEL "GND"
VDD_3V3
VDD_1V8 i LABEL "EXP_VDD18"
i LABEL "EXP_VDD33"
1
2
3
J19
TSW-103-07-G-S
VDD_3V3 i LABEL "EXP_VDD33"
i LABEL "TPS74801 IN"i LABEL "GND"
OrangeD13
12
43
T1ACM9070-701-2PL
1 2
J20
5-146261-1
VDDIO
220R127
GND
Super Red
21
D14
i
LABEL "12V"
0R88
0R96
22µFC119
GND
10.0kR107
3.24kR114
GND
1
2
J21
5-146261-1
GND
VDD_EXT
VFEED_LDO2
1
2
J23
5-146261-1
GND
29.4kR111
9V@1A LDO POWER SUPPLY
0
R1090R106
VFEED_LDO1
VFEED_LDO2
iLABEL "VFEED_EN"iLABEL "GND"
TP3
TP5
TP6
GND
1
2
3
J16
TSW-103-07-G-S
VFEED_LDO2 VFEED_POC2 5V_SW
iLABEL "VFEED_SW"
iLABEL "VFEED_LDO2"
iLABEL "VFEED_POC2" VFEED_POC2
VFEED_POC1
1
2
J25
5-146261-1
VFEED_LDO1VFEED_LDO2 i LABEL "VFEED_LDO2"
i LABEL "VFEED_LDO1"
i
LABEL "VDD_EXT"
i
LABEL "5V"
i
LABEL "VFEED_POC"
i
LABEL "VDDIO"
GND
iLABEL "VDD_EXT" i LABEL "GND"
1 2
3 4
J35
TSW-102-07-G-D
VFEED_POC2
VFEED_POC1
VDD_EXT
VFEED_POC1VFEED_POC2
i
LABEL "VDD_EXT"
i
LABEL "VFEED_POC1"
i
LABEL "VFEED_POC2"
4.7µH
L31
F1
0440002.WR
4.7kR115
4.7kR102
IN3
OUT5
GND7
ADJ8
ON/OFF1
DAP
9
NC4
NC6
GND2
U2 LM2941LD/NOPB
VO1
VFB2
VREG53
SS4
GND5
PG6
EN7
PGND18
PGND29
SW110
SW211
VBST12
VIN13
VCC14
PAD
15
U3 TPS54225PWPR
IN3
OUT5
GND7
ADJ8
ON/OFF1
DAP
9
NC4
NC6
GND2
U4 LM2941LD/NOPB
IN3
OUT5
GND7
ADJ8
ON/OFF1
DAP
9
NC4
NC6
GND2
U6 LM2941LD/NOPB
IN1
IN2
PG3
BIAS4
EN5
GND6
SS7
FB8
OUT9
OUT10
EP11
U5
TPS74801TDRCRQ1
Assembly NoteZZ11
Place Jumper on J8
SH-J8
Assembly NoteZZ12
Place Jumper on J9
SH-J7
Assembly NoteZZ14
Place Jumper on J13
SH-J11
Assembly NoteZZ15
Place Jumper on J21
SH-J14
Assembly NoteZZ16
Place Jumper on J30.1-2
SH-J15
Assembly NoteZZ19
Place Jumper on J16.2-3
SH-J13
Assembly NoteZZ18
Place Jumper on J14.2-3
SH-J12
Assembly NoteZZ17
Place Jumper on J12.2-3
SH-J10
Assembly NoteZZ13
Place Jumper on J10
SH-J9
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Copyright © 2016, Texas Instruments Incorporated
PCB Schematics
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
7 7
5/11/2016
DS90UB964Q_MSP430.SchDoc
Sheet Title:
Size:
Mod. Date:
File:Sheet: of
B http://www.ti.comContact: http://www.ti.com/support
DS90UB964Q1_EVMProject Title:Designed for: Public Release
Assembly Variant: [No Variations]
© Texas Instruments 2015
Drawn By:Engineer: Dac Tran
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
Version control disabledSVN Rev:SV601176Number: Rev: A
P6.4/CB4/A41
P6.5/CB5/A52
P6.6/CB6/A63
P6.7/CB7/A74
P7.0/CB8/A125
P7.1/CB9/A136
P7.2/CB10/A147
P7.3/CB11/A158
P5.0/A8/VREF+/VEREF+9
P5.1/A9/VREF-/VEREF-10
AVCC111
P5.4/XIN12
P5.5/XOUT13
AVSS114
P8.015
P8.116
P8.217
DVCC118
DVSS119
VCORE20
P1.0/TA0CLK/ACLK21
P1.1/TA0.022
P1.2/TA0.123
P1.3/TA0.224
P1.4/TA0.325
P1.5/TA0.426
P1.6/TA1CLK/CBOUT27
P1.7/TA1.028
P2.0/TA1.129
P2.1/TA1.230
P2.2/TA2CLK/SMCLK31
P2.3/TA2.032
P2.4/TA2.133
P2.5/TA2.234
P2.6/RTCCLK/DMAE035
P2.7/UCB0STE/UCA0CLK36
P3.0/UCB0SIMO/UCB0SDA37
P3.1/UCB0SOMI/UCB0SCL38
P3.2/UCB0CLK/UCA0STE39
P3.3/UCA0TXD/UCA0SIMO40
P3.4/UCA0RXD/UCA0SOMI41
P3.5/TB0.542
P3.6/TB0.643
P3.7/TB0OUTH/SVMOUT44
P4.0/PM_UCB1STE/PM_UCA1CLK45
P4.1/PM_UCB1SIMO/PM_UCB1SDA46
P4.2/PM_UCB1SOMI/PM_UCB1SCL47
P4.3/PM_UCB1CLK/PM_UCA1STE48
DVSS249
DVCC250
P4.4/PM_UCA1TXD/PM_UCA1SIMO51
P4.5/PM_UCA1RXD/PM_UCA1SOMI52
P4.6/PM_NONE53
P4.7/PM_NONE54
P5.6/TB0.055
P5.7/TB0.156
P7.4/TB0.257
P7.5/TB0.358
P7.6/TB0.459
P7.7/TB0CLK/MCLK60
VSSU61
PU.0/DP62
PUR63
PU.1/DM64
VBUS65
VUSB66
V1867
AVSS268
P5.2/XT2IN69
P5.3/XT2OUT70
TEST/SBWTCK71
PJ.0/TDO72
PJ.1/TDI/TCLK73
PJ.2/TMS74
PJ.3/TCK75
RST/NMI/SBWTDIO76
P6.0/CB0/A077
P6.1/CB1/A178
P6.2/CB2/A279
P6.3/CB3/A380
U10
MSP430F5529IPN
+3.3V
+3.3V
GND
GND
DP
PUR
DM
VBUS
VUSB
GPIO1/I2C(SCL)
GPIO0/I2C(SDA)
GPIO6/PWM1/SPI(CS)
+3.3V
GPIO2/SPI(SCLK)
GPIO5/SPI(SOMI)/UART(RXD)
GPIO4/SPI(SIMO)/UART(TXD)
30pF
C51
30pF
C54
2200pFC57
GND
33kR153
0.1µFC132
0.1µFC133
0.47µFC56
GND
GND
200R152
0.1µFC50
GND
GND
1 2
3 4
J39
TSW-102-07-G-D
GPIO7/PWM0 GPIO3/PWM2
EFC0/GPIO12/CLOCK
GPIO11/VEREF+
GPIO10/VEREF-
GPIO8/ADC3
GPIO9/ADC2
1
23
Q2
BSL
2
3
4
1
5
J36
USB Mini Type B
VBUS
DM
DP
PUR
VUSB
33
R14733
R77
0.1µFC37
GND
1.2MegR150
GND
1.5k
R148
33k
R149
GND
220pFC39
GND
USB PORT
GND
OUT1
NC2
NR3
GND4
EN5
NC6
NC7
IN8
PAD9
U9
TPS73533DRBR7.5V
D15
60 ohm
FB1
GNDGND
GND GND
VBUS
0.01µFC40
GND
1µFC49
GPIO5/SPI(SOMI)/UART(RXD)
GPIO4/SPI(SIMO)/UART(TXD)
GPIO2/SPI(SCLK)
GPIO6/PWM1/SPI(CS)
USB-TO-3.3V REGULATORNOTE: NO POWER DISTRIBUTION SWITCH NEEDED FOR EXT 3.3V SUPPLY
LEVEL SHIFTER
HEADER FOR SPI MODE COMMUNICATION
4
1
2
3
J38
TSW-104-07-G-S
GND
2.2µFC38
+3.3V
GND
GPIO7/PWM0
GPIO3/PWM2
EFC0/GPIO12/CLOCK
GPIO11/VEREF+
GPIO10/VEREF-
GPIO8/ADC3
GPIO9/ADC2
1 2
3 4
5 6
7 8
J37
Receptacle for 4x2 header in case any of the USB2ANY GPIOs are to be used. Leave as DNP at assembly.
220pFC55
GND
22µFC48
12
24 MHzY3
Green
21
D16
S3
KSR221GLFS
SDA_B1
GND2
VCCA3
SDA_A4
SCL_A5
OE6
VCCB7
SCL_B8
U11
TCA9406DCUR
GND
0.1µFC134
0.1µFC135
VDD_I2C
GPIO0/I2C(SDA)
GPIO1/I2C(SCL)
I2C_SDA
I2C_SCL
GND
0
R155
10.0k
R154
+3.3V
IO11
IO22
GND3
IO34
IO45
VCC6
U8
TPD4E004DRYR
0R151
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Copyright © 2016, Texas Instruments Incorporated
PCB Schematics
53SNLU177–July 2016Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Board Layout
Chapter 3SNLU177–July 2016
Board Layout
Figure 3-1. Top Overlay
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54 SNLU177–July 2016Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Board Layout
Figure 3-2. Top Solder
Figure 3-3. Top Layer 1
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55SNLU177–July 2016Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Board Layout
Figure 3-4. Layer 2
Figure 3-5. Layer 3
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56 SNLU177–July 2016Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Board Layout
Figure 3-6. Layer 4
Figure 3-7. Layer 5
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57SNLU177–July 2016Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Board Layout
Figure 3-8. Bottom Layer 6
Figure 3-9. Bottom solder
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Copyright © 2016, Texas Instruments Incorporated
Board Layout
Figure 3-10. Bottom Overlay
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Copyright © 2016, Texas Instruments Incorporated
Board Layout
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.
2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.
3 Regulatory Notices:3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.
FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:
• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.
Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.
Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur
3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社東京都新宿区西新宿6丁目24番1号西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.
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SPACER6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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