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Dynamic stress around two holesburied in a functionally gradedpiezoelectric material layer underelectro-elastic wavesXue-Qian Fang a , Jin-Xi Liu a , Xiao-Hua Wang b & Le-Le Zhang aa Department of Engineering Mechanics, Shijiazhuang RailwayInstitute, Shijiazhuang 050043, P.R. Chinab School of Computing and Informatics, Shijiazhuang RailwayInstitute, Shijiazhuang 050043, P.R. ChinaPublished online: 22 Mar 2010.
To cite this article: Xue-Qian Fang , Jin-Xi Liu , Xiao-Hua Wang & Le-Le Zhang (2010): Dynamicstress around two holes buried in a functionally graded piezoelectric material layer under electro-elastic waves, Philosophical Magazine Letters, 90:5, 361-380
To link to this article: http://dx.doi.org/10.1080/09500831003680752
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Philosophical Magazine LettersVol. 90, No. 5, May 2010, 361–380
Dynamic stress around two holes buried in a functionally graded
piezoelectric material layer under electro-elastic waves
Xue-Qian Fanga*, Jin-Xi Liua, Xiao-Hua Wangb and Le-Le Zhanga
aDepartment of Engineering Mechanics, Shijiazhuang Railway Institute, Shijiazhuang050043, P.R. China; bSchool of Computing and Informatics, Shijiazhuang Railway
Institute, Shijiazhuang 050043, P.R. China
(Received 21 August 2009; final version received 3 February 2010)
A theoretical method is presented to study the multiple scatteringof electro-elastic waves resulting from two subsurface holes in a function-ally graded piezoelectric material (FGPM) layer bonded to a homogeneouspiezoelectric material, and the dynamic stress around the holes is alsopresented. The analytical solutions of wave fields are expressed byemploying wave function expansion method, and the expanded modecoefficients are determined by satisfying the boundary conditions at thesurface and around the holes. The mechanical and electrical boundaryconditions at the free surface of the structure are satisfied by using theimage method. Analyses show that the piezoelectric property and thedistance between the two holes express great effect on the dynamic stressaround the holes, and the effect increases with the decrease of the thicknessof FGPM layer. If the material properties of the homogeneous piezoelectricmaterial are greater than those at the surface of the structure, the dynamicstress increases dramatically due to the piezoelectric property and thedistance between the two holes. The angular distribution of electricdisplacement under different parameters is also presented. The accuracyand efficiency of the solving method are demonstrated by the comparisonof selected results with the solutions obtained by using finite elementsoftware ANSYS.
Keywords: functionally graded piezoelectric material layer; two circularholes; dynamic stress concentration factor; image method
1. Introduction
Piezoelectric materials have long been attractive materials in the smart systemsof aerospace, automotive, medical, and electronic fields due to the intrinsic couplingcharacteristics between their electric and mechanical fields. However, as piezoelectricmaterials are being extensively used as actuators or transducers in the technologiesof smart and adaptive systems, the mechanical reliability and durability of thesematerials become increasingly important. To meet the demand of advancedpiezoelectric materials in lifetime and reliability and with the help of the development
*Corresponding author. Email: [email protected]
ISSN 0950–0839 print/ISSN 1362–3036 online
� 2010 Taylor & Francis
DOI: 10.1080/09500831003680752
http://www.informaworld.com
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in modern material processing technology, the concept of functionally gradedmaterials has recently been extended into the piezoelectric materials [1]. Wavetheory can simulate many types of loading (static loading, dynamic loading,coupling loading, and so on). The study of wave propagation in functionallygraded piezoelectric material (FGPMs) layers can provide great help in obtaininghigher strength and toughness of materials. It is also a theoretical backgroundof the non-destructive analysis of FGPM microstructures by using ultrasonictechnique.
Numerical modeling, simulation, and analysis of FGPMs with discontinuities,such as holes, cracks, and inclusions have attracted lots of interests in recent years.Understanding how geometrical discontinuities influence the stress distributionin FGPMs is critical for design applications. A considerable amount of work hasbeen completed with regard to the determination of static stress concentrationfactors for common discontinuities [2–5]. The understanding of dynamic stressin FGPMs subjected to dynamic loading is more important to many areas of designincluding crashworthiness, high-speed impact, and transportation of hazardousmaterials. However, considering the complexity of wave scattering resulting from thenon-homogeneous property of FGPMs and the complexity of multiple scatteringfrom the scatterer and the boundary, relatively little work has been done with regardto the wave propagation in FGPMs. Recently, Chen et al. [6] have considered theelectromechanical impact response of FGPMs with a crack using integral transformtechnique. Ma et al. [7] have investigated the stress and electric displacementintensity factors of two collinear cracks subjected to anti-plane shear waves inFGPMs. Most recently, Fang et al. have studied the dynamic stress from a circularcavity [8] and a circular inclusion [9] buried in a FGPM layer, and both thedisplacement field and the piezoelectric field were considered. In engineering,investigation on two discontinuities exist in FGPMs is more representative.However, the multiple interactions of electro-elastic waves between the two holesin a FGPM layer make this problem more complex.
The main objective of this article is to investigate the multiple scattering ofelectro-elastic waves resulting from two subsurface holes in a FGPM layer bondedto a homogeneous piezoelectric material, and the mutual influence of the two holesare also considered. The incidence of anti-plane shear waves at the surface of thestructure is applied, and both the displacement field and piezoelectric field inFGPMs are presented. The mechanical and electrical boundary conditions at the freesurface are satisfied by using the image method. Wave function expansion method isapplied to express the wave fields and electric potentials [10]. The expanded modecoefficients are determined by satisfying the boundary conditions at the free surfaceand around the two holes. Addition theorem for Bessel functions is used toaccomplish the translation between different coordinate systems of the actual andimage holes. The analytical solutions of the dynamic stress concentration factor(DSCF) and electric displacement around the holes are presented, and the numericalsolutions are graphically illustrated. The ANSYS program (copyright by SAS IP,Inc.) is used to validate the solving method in this article. The effects of thepiezoelectric property, the incident wave number and the relative position of the twosubsurface holes in the FGPM layer on the DSCFs and electric displacement arealso analyzed.
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2. Wave motion equations in FGPMs and their solutions
Consider a FGPM layer bonded to a homogeneous piezoelectric material, asdepicted in Figure 1. The mechanical and electrical short conditions at the free surfaceare considered. c144, e
115, "
111, and �
1 are the elastic stiffness, piezoelectric constant,dielectric constant, and density of materials at the surface of FGPM layer, and c244,e215, "
211, and �2 those of the homogeneous piezoelectric material. The material
properties in FGPM layer vary smoothly along the x direction. Let two circular holeslie in the FGPM layer. The radii of the two holes are a and b, respectively. The distancebetween the centers of the two holes is d. The distances between the centers of thetwo holes and the upper edge of the layer are the same, and denoted as h1, and thatbetween the centers of the holes and the lower edge of the FGPM layer is h2.
All materials exhibit transversely isotropic behavior and are polarized in thez-direction. Let an anti-plane shear wave with frequency ! hit the surface of theFGPM layer in the positive x-direction. A state of anti-plane strain is consideredsuch that the piezoelectric solids experience displacement only in the z-direction.The governing equations can be simplified, if we are only interested in theout-of-plane displacement component and in-plane electric components, i.e.
ux ¼ uy ¼ 0, u ¼ uzðx, y, tÞ, ð1Þ
Ex ¼ Exðx, y, tÞ, Ey ¼ Eyðx, y, tÞ, Ez ¼ 0, ð2Þ
in which the electric field intensities Ex and Ev are related to the electric potential �by the following relations:
Ex ¼ �@�
@x, Ey ¼ �
@�
@y: ð3Þ
The mechanically and electrically coupled constitutive equations can be writtenas follows:
�zx ¼ c44ðxÞ@u
@xþ e15ðxÞ
@�
@x, �zy ¼ c44ðxÞ
@u
@yþ e15ðxÞ
@�
@y, ð4Þ
Dx ¼ e15ðxÞ@u
@x� "11ðxÞ
@�
@x, Dy ¼ e15ðxÞ
@u
@y� "11ðxÞ
@�
@y, ð5Þ
ax
ay
bx
by
1h
2h
aobo
Anti-plane shear waves
Distribution of material properties
aθarbθ br
d
Figure 1. Schematic representation of the subsurface holes and the incident elastic waves ina FGPM layer.
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where �zi, u, Dj, and � ( j¼ x, y) are the shear stress, anti-plane displacement, in-planeelectric displacement, and electric potential, respectively; c44(x) is the elastic stiffnessof graded materials measured in a constant electric field, "11(x) is the dielectricconstant of graded materials measured in constant strain, and e15(x) is the
piezoelectric constant of graded materials.The anti-plane governing equation and Maxwell’s equation in FGPMs are
described as follows:
@�zx@xþ@�zy@y¼ �ðxÞ
@2u
@t2, ð6Þ
@Dx
@xþ@Dy
@y¼ 0: ð7Þ
Substituting Equations (4) and (5) into (6) and (7), the following equations can beobtained:
@c44ðxÞ
@x
@u
@xþ c44ðxÞ
@2u
@x2þ@e15ðxÞ
@x
@�
@xþ e15ðxÞ
@2�
@x2þ c44ðxÞ
@2u
@y2þ e15ðxÞ
@2�
@y2¼ �ðxÞ
@2u
@t2,
ð8Þ
@e15ðxÞ
@x
@u
@xþ e15ðxÞ
@2u
@x2�@"11ðxÞ
@x
@�
@x� "11ðxÞ
@2�
@x2þ e15ðxÞ
@2u
@y2� "11ðxÞ
@2�
@y2¼ 0: ð9Þ
For mathematical convenience, it is assumed that all material properties varycontinuously, and have the same exponential function distribution along the x
direction in the layer, i.e.
c44ðxÞ ¼ c044e2�x, e15ðxÞ ¼ e015e
2�x, "11ðxÞ ¼ "011e
2�x, �ðxÞ ¼ �0e2�x: ð10Þ
According to the continuous condition of the material properties in the layer andat the position of x¼ h2, the constants �, c044, e015, "
011, and �0can be calculated
as follows:
� ¼1
2ðh1 þ h2Þln
c244c144
� �, ð11Þ
c044 ¼ c144e2�h1 , e015 ¼ e115e
2�h1 , "011 ¼ "111e
2�h1 , �0 ¼ �1e2�h1 : ð12Þ
In the above formulations, it is assumed that the ratio c244=c144 is equal to e215=e
115,
"211="111, and �2/�1. Though the variations are unrealistic, it would allow us to
comprehend the effects of material properties of FGPMs and the distance betweenthe two holes on the dynamic stress around the holes, and can provide references
for the non-destructive detection in FGPMs.Substituting Equation (10) into (8) and (9), the following equations are obtained:
2�c044@u
@xþ c044r
2uþ 2�e015@�
@xþ e015r
2� ¼ 2��0@2u
@t2, ð13Þ
2�e015@u
@xþ e015r
2u ¼ 2�"011@�
@xþ "011r
2�: ð14Þ
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Here, r2 ¼ @2=@x2 þ @2=@y2 is the two-dimensional Laplace operator in the variables
x and y.Assume that another electro-elastic field is expressed as follows:
¼ �� �1u, ð15Þwhere �1 ¼ e015="
011.
From Equations (13) and (14), the following equations can be obtained:
r2uþ 2�@u
@x¼
1
c2SH
@2u
@t2, ð16Þ
2�@
@xþ r2 ¼ 0, ð17Þ
where cSH ¼ffiffiffiffiffiffiffiffiffiffiffiffi�e=�0
pwith �e ¼ c044 þ ðe
015Þ
2=ð"011Þ being the wave speed of electro-
elastic waves.The steady solution of this problem is investigated. Assuming that u ¼ u0Ue�i!t,
Equation (16) can be changed into
r2Uþ 2�@U
@xþ k2U ¼ 0, ð18Þ
where ! is the frequency of the incident waves, and k ¼ !=cSH is the wave number
of incident waves.To solve Equation (18), the solution can be proposed as follows:
U ¼ e��xwðx, yÞ, ð19Þ
where w(x, y) is the function introduced for derivation.Substituting Equation (19) into (18), one can see that the function w(x, y) should
satisfy the following equation:
r2wþ �2w ¼ 0, ð20Þ
where � ¼ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiðk2 � �2Þ
p. It is noted that k4� should be satisfied.
According to Equations (15)–(17), one can see that there exist electro-elastic
waves with the form of u ¼ u0Ue�i!t ¼ u0 expð��xÞeið�x�!tÞ, which denotes the
propagating wave with its amplitude of vibration attenuating in the xdirection.Similarly, the solution of in Equation (17) has the following form:
¼ 0e��xeiði�x�!tÞ: ð21Þ
Note that all field quantities have the same time variation e�i!t that is suppressed
in all subsequent representations for notational convenience.According to Equations (17) and (20), the general solutions of the scattered field
of electro-elastic waves resulting from the embedded holes in FGPMs can be
described, using wave function expansion method [10], as follows:
us ¼ e��r cos X1
n¼�1
anHð1Þn ð�rÞe
in, ð22Þ
s ¼ e��r cos X1
n¼�1
bnHð1Þn ði�rÞe
in, ð23Þ
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where (r, ) is the corresponding cylindrical coordinate system shown in Figure 1,Hð1Þn ð�Þ is the nth Hankel function of the first kind, and an and bn determined bysatisfying the boundary conditions are the mode coefficients of the scattered waves.Note that Hankel function Hð1Þn ð�Þ denotes the outgoing wave and satisfies theradiation condition at infinity. The solution of the scattered–reflected waves has thesame form as that of the scattered waves [8].
3. Boundary conditions of this structure
The mechanical and electrically open conditions at the free surface of the FGPM
layer can be given as follows:
�xzð�h1, yÞ ¼ 0, Dxð�h1, yÞ ¼ 0: ð24Þ
Without loss of generality, the case that the two holes are free of traction isinvestigated. For the holes, the boundary conditions around it are that the radialshear stress is equal to zero, and the electric potential and normal electricdisplacement are continuous. They can be expressed as follows:
�rzjr¼p¼@ut
@r
����r¼p
þ �2@�t
@r
����r¼p
¼ 0, ð p ¼ a, bÞ, ð25Þ
Djr¼p¼ e15@ut
@r
����r¼p
�"11@�t
@r
����r¼p
¼ �"0@�I
@r
����r¼p
, ð p ¼ a, bÞ, ð26Þ
�tjr¼p ¼ �Ijr¼p, ð p ¼ a, bÞ, ð27Þ
where �2 ¼ e015=c044 and �3 ¼ "
011="0. Superscripts t and I denote the total wave field
and the electric potential inside the holes. Note that "0 ¼ 8:85� 10�12 F=m is thedielectric constant of vacuum.
4. The multiple scattering of electro-elastic waves around the two holes and
the total wave field
Consider the electro-elastic waves propagating along the positive x direction in the
FGPM structure. In the local coordinate systems (rp, p) of the holes, the incidentwaves can be expanded as follows [10].
uðinÞ1p ¼ u0e
��xpþh1ði���Þei�xp ¼ u0e��rp cos pþh1ði���Þ
X1n¼�1
inJnð�rpÞeinp , ð p ¼ a, bÞ,
ð28Þ
where u0 is the amplitude of the incident waves, � is the wave number of thepropagating waves, and Jnð�Þ is the nth Bessel function of the first kind. Note that a
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and b denote, respectively, the two holes in Figure 1, and the superscript (in) denotes
the incident waves.Similarly, the incident field (in) is expressed as follows:
ðinÞ1p ¼ �1u0e��ðxpþ2h1Þe��xp ¼ �1u0e
��ðrp cos pþ2h1ÞX1
n¼�1
inJnði�rpÞeinp , ð p ¼ a, bÞ:
ð29Þ
In the local coordinate systems (rp, p) of the holes, the scattered field can be
described as follows:
uðsÞ1p ¼ e��rp cos p
X1l¼1
X1n¼�1
Aln1H
ð1Þn ð�rpÞe
inp
¼ e��rp cos pX1
n¼�1
�Apn1H
ð1Þn ð�rpÞe
inp , ð p ¼ a, bÞ, ð30Þ
ðsÞ1p ¼ �1e��rp cos p
X1l¼1
X1n¼�1
Bln1H
ð1Þn ði�rpÞe
inp
¼ �1e��rp cos p
X1n¼�1
�Bpn1H
ð1Þn ði�rpÞe
inp , ð p ¼ a, bÞ, ð31Þ
where �An ¼P1
l¼1 Aln and �Bn ¼
P1l¼1 B
ln are the total scattering coefficients of the
two holes. Note that l denotes the lth mode coefficients of scattered waves.When the electro-elastic wave propagates in the FGPM layer, it is scattered by
the two holes at first. Then, the outgoing scattered wave from one hole is not only
reflected on the straight surface ðxa ¼ xb ¼ �h1Þ, but is scattered by the other hole.
In addition, the scattered and reflected waves at the surface are scattered by the two
holes again. This complex phenomenon is shown in Figure 1.To satisfy the mechanical and electrical boundary conditions at the free surface,
the image method is applied. In Figure 2, the reflected waves at the edge of FGPM
layer are described by the scattered waves resulting from the virtual image holes.
The distance between the virtual image holes and the straight boundary is also h1.
The magnitudes of the incident waves and scattered waves of the actual and image
holes are the same, however, the directions of them are opposite. So, the boundary
conditions at the free surface can be satisfied.For the image holes, the waves propagate in the negative x0 direction, and can be
expressed as follows:
uðinÞ2p ¼ u0e
�x0pþh1ði���Þe�i�x0p ¼ u0e
�x0pþh1ði���ÞX1
n¼�1
i�nJnð�r0pÞe
in0p , ð p ¼ a, bÞ, ð32Þ
ðinÞ2p ¼ �1u0e�x0p�2�h1e�iði�Þx
0p ¼ �1u0e
�x0p�2�h1X1
n¼�1
i�nJnði�r0pÞe
in0p , ð p ¼ a, bÞ: ð33Þ
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Likewise, in the local coordinate systems ðr0p, 0pÞ, the scattered fields resulting
from the image holes can be described as follows:
uðsÞ2p ¼ e�r
0p cos
0p
X1n¼�1
�Apn2H
ð1Þn ð�r
0pÞe
in0p , ð p ¼ a, bÞ, ð34Þ
ðsÞ2p ¼ �1e�r0p cos
0p
X1n¼�1
�Bpn2H
ð1Þn ði�r
0pÞe
in0p , ð p ¼ a, bÞ: ð35Þ
where �Apn2 and �B
pn2 determined by satisfying the boundary conditions are the
scattering mode coefficients resulting from the image holes.From Equations (28), (29), (32), and (33), the total incident fields of elastic
and electro-elastic waves, the original incident wave plus their image as the reflected
wave from the free surface, are written as, respectively,
uðinÞ ¼ uðinÞ1p þ u
ðinÞ2p , ð p ¼ a, bÞ: ð36Þ
�ðinÞ ¼ �1 uðinÞ1p þ u
ðinÞ2p
� �þ ðinÞ1p þ
ðinÞ2p , ð p ¼ a, bÞ: ð37Þ
Then, the total elastic field u(t) and total electro-elastic field �ðtÞ around the two
holes are produced by the superposition of the incident fields, the scattered fields,
and the reflected fields at the free surface, i.e.
uðtÞ ¼ uðinÞ þ uðsÞ1a þ u
ðsÞ1b þ u
ðsÞ2a þ u
ðsÞ2b , ð38Þ
�ðtÞ ¼ �ðinÞ þ �1 uðsÞ1a þ u
ðsÞ1b þ u
ðsÞ2a þ u
ðsÞ2b
� �þ ðsÞ1a þ
ðsÞ2a þ
ðsÞ1b þ
ðsÞ2b : ð39Þ
ax
ay
bx
by
1h
2h aobo
bx′
bo′
ax′
ay′ao′by′
ar
aθ
br
bθ
br′
bθ ′ ar′aθ′1h
Figure 2. Sketch of the image method at the surface of FGPMs.
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Now, from the boundary conditions (24) at the surface of the structure, thefollowing can be obtained:
@uðtÞ
@x¼@�ðtÞ
@x¼ 0, at x ¼ �b: ð40Þ
From Equations (36) and (37), it is clear that the total incident fields havesatisfied these conditions.
Applying the boundary conditions (40) to Equations (38) and (39), and from thefact that ra ¼ r0a, rb ¼ r0b,
0a ¼ � a, and
0b ¼ � b on the plane boundary of the
semi-infinite structure, and the identity Hð1Þn ein ¼ Hð1Þ�n, the following relationsbetween the total mode coefficients of scattered waves are obtained:
�Apn2 ¼ �
�Apn1,
�Bpn2 ¼ �
�Bpn1: ð41Þ
From Equation (41), the relations between the total scattering coefficients of theimage holes and those of the actual holes are obtained.
Then, by using the following translational addition theorems of Besselfunctions [11]
Hð1Þn ðkr2Þein2 ¼
X1m¼�1
eiðn�mÞ1,2Hð1Þm�nðkr1,2ÞJmðkr1Þeim1 , ð42Þ
the scattered fields uðsÞ2p and ðsÞ2p of the image holes can be represented in the local
coordinate systems (rp, p). After some manipulations, the total scattered fieldsaround the actual holes a and b are, respectively, expressed as follows:
uðsÞa ¼ uðsÞ1a þ u
ðsÞ2a þ u
ðsÞ1b þ u
ðsÞ2b
¼ e��ra cos aX1
n¼�1
�Aan1H
ð1Þn ð�raÞe
ina þX1
n¼�1
X1m¼�1
�Abm1hð1ÞmnJnð�raÞe
ina
" #
þ e�ð2h1þra cos aÞX1
n¼�1
X1m¼�1
�Aam1�hð2ÞmnJnðkraÞe
ina þX1
n¼�1
X1m¼�1
�Abm1�hð3ÞmnJnðkraÞe
ina
" #,
ð43Þ ðsÞa ¼
ðsÞ1a þ
ðsÞ2a þ
ðsÞ1b þ
ðsÞ2b
¼ e��ra cos aX1
n¼�1
�Ban1H
ð1Þn ði�raÞe
ina þX1
n¼�1
�Bbn1hð4ÞmnJnði�raÞe
ina
" #
þ e�ð2h1þra cos aÞX1
n¼�1
X1m¼�1
�Bam1�hð5ÞmnJnði�raÞe
ina þX1
n¼�1
X1m¼�1
�Bbm1�hð6ÞmnJnði�raÞe
ina
" #,
ð44ÞuðsÞb ¼ u
ðsÞ1b þ u
ðsÞ2b þ u
ðsÞ1a þ u
ðsÞ2a
¼ e��rb cos bX1
n¼�1
�Abn1H
ð1Þn ð�rbÞe
inb þX1
n¼�1
�Aan1hð7Þmnð�rbÞe
inb
" #
þ e�ð2h1þrb cos bÞX1
n¼�1
X1m¼�1
�Abm1�hð8ÞmnJnð�rbÞe
inb þX1
n¼�1
X1m¼�1
�Aam1�hð9ÞmnJnð�rbÞe
inb
" #,
ð45Þ
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ðsÞb ¼ ðsÞ1b þ
ðsÞ2b þ
ðsÞ1a þ
ðsÞ2a
¼ e��rb cos bX1
n¼�1
�Bbn1H
ð1Þn ði�rbÞe
inb þX1
n¼�1
�Ban1hð10Þmn ði�rbÞe
inb
" #
þ e�ð2h1þrb cos bÞX1
n¼�1
X1m¼�1
�Bbm1�hð11Þmn Jnði�rbÞe
inb þX1
n¼�1
X1m¼�1
�Bam1�hð12Þmn Jnði�rbÞe
inb
" #,
ð46Þ
where �hðiÞmn ði ¼ 1, 2, . . . , 12Þ are shown in the Appendix.Inside the two holes, the elastic wave field vanishes, and only the electric field
exists. The electric potential inside the actual holes is standing wave, and is expressed
as follows:
�Ip ¼ �1X1
n¼�1
Cpn1Jnði�rpÞe
inp , ð p ¼ a, bÞ, ð47Þ
where Cpn1 are the mode coefficients of the electric potential inside the actual holes.
5. Determination of scattering mode coefficients and DSCF
By substituting the expressions of wave fields into the boundary conditions of the
two actual holes, one can obtain a set of system of linear equations for the unknown
total scattering coefficients �Aan1,
�Abn1,
�Ban1,
�Bbn1,
�Can1,
�Cbn1
� . Multiplying by e�is at both
sides of these linear equations, and then integrating from � to , the following
simplified formula can be obtained:
ð1þ �1�2Þ e��a cos a �a cos a F1aH
�Aas1 þ F1a
J
X1m¼�1
�hð1Þms�Abm1
!"(
þ G1aH
�Aas1 þ G1a
J
X1m¼�1
�hð1Þms�Abm1
#
þ e�ð2h1þa cos aÞ �a cos aF1aJ
X1m¼�1
�hð2Þms�Aam1 þ
X1m¼�1
�hð3Þms�Abm1
!"
þ G1aJ
X1m¼�1
�hð2Þms�Aam1 þ
X1m¼�1
�hð3Þms�Abm1
!#)
þ �1�2 e��a cos a �a cos a F2aH
�Bas1 þ F2a
J
X1m¼�1
�hð4Þms�Bbm1
!"(
þ G2aH
�Bas1 þ G2a
J
X1m¼�1
�hð4Þms�Bbm1
#
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þ e�ð2h1þa cos aÞ �a cos aF2aJ
X1m¼�1
�hð5Þms�Bam1 þ
X1m¼�1
�hð6Þms�Abm1
!"
þ G2aJ
X1m¼�1
�hð5Þms�Bam1 þ
X1m¼�1
�hð6Þms�Abm1
!#)
¼ �ð1þ �1�2Þ ise��a cos aþh1ði���Þ þ i�se�a cos aþh1ð��i�Þ �
F1aJ
� �1�2 ise��ða cos aþ2h1Þ þ i�se�a cos a �
F2aJ ; ð48Þ
ð1þ �1�2Þ e��a cos b �a cos b F1bH
�Abs1 þ F1b
J
X1m¼�1
�hð7Þms�Aam1
!"(
þ G1bH
�Abs1 þ G1b
J
X1m¼�1
�hð7Þms�Aam1
#
þ e�ð2h1þa cos bÞ �a cos bF1bJ
X1m¼�1
�hð8Þms�Abm1 þ
X1m¼�1
�hð9Þms�Aam1
!"
þ G1bJ
X1m¼�1
�hð8Þms�Abm1 þ
X1m¼�1
�hð9Þms�Aam1
!#)
þ �1�2 e��a cos b �a cos b F2bH
�Bbs1 þ F2a
J
X1m¼�1
�hð10Þms�Bam1
!"(
þ G2bH
�Bbs1 þ G2b
J
X1m¼�1
�hð10Þms�Bam1
#
þ e�ð2h1þa cos aÞ �a cos aF2aJ
X1m¼�1
�hð11Þms�Bam1 þ
X1m¼�1
�hð12Þms�Abm1
!"
þ G2bJ
X1m¼�1
�hð11Þms�Bam1 þ
X1m¼�1
�hð12Þms�Abm1
!#)
¼ �ð1þ �1�2Þ ise��b cos bþh1ði���Þ þ i�se�b cos bþh1ð��i�Þ �
F1bJ
� �1�2 ise��ðb cos b�h1Þ þ i�se�ðb cos bþ2h1Þ �
F2bJ ; ð49Þ
�3 e��a cos a �a cos a F2aH
�Bas1 þ F2a
J
X1m¼�1
�hð4Þms�Bbm1
!"(
þG2aH
�Bas1 þ G2a
J
X1m¼�1
�hð4Þms�Bbm1
#
þ e�ð2h1þa cos aÞ �a cos aF2aJ
X1m¼�1
�hð5Þms�Bam1 þ
X1m¼�1
�hð6Þms�Abm1
!"
þG2aJ
X1m¼�1
�hð5Þms�Bam1 þ
X1m¼�1
�hð6Þms�Abm1
!#)
� Cas1G
2aJ ¼ ��3 ise��ða cos a��h1Þ þ i�se�ða cos aþ2h1Þ
�F2aJ
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�3 e��b cos b �b cos b F2bH
�Bbs1 þ F2b
J
X1m¼�1
�hð10Þms�Bam1
!"(
þG2bH
�Bbs1 þ G2b
J
X1m¼�1
�hð10Þms�Bam1
#
þ e�ð2h1þb cos bÞ �b cos bF2bJ
X1m¼�1
�hð11Þms�Bbm1 þ
X1m¼�1
�hð12Þms�Aam1
!"
þG2bJ
X1m¼�1
�hð11Þms�Bbm1 þ
X1m¼�1
�hð12Þms�Aam1
!#)
� Cbs1G
2bJ ¼ ��3 ise��ðb cos b��h1Þ þ i�se�ðb cos bþ2h1Þ
� F2bJ ; ð50Þ
e��a cos a �Aas1F
1aH þ F1a
J
X1m¼�1
�hð1Þms�Abm1
!(
þ e�ð2h1þa cos aÞF1aJ
X1m¼�1
�hð2Þms�Aam1 þ
X1m¼�1
�hð3Þms�Abm1
!)
þ e��a cos a F2aH
�Bas1 þ F2a
J
X1m¼�1
�hð4Þms�Bbm1
!
þ e�ð2h1þa cos aÞF2aJ
X1m¼�1
�hð5Þms�Bam1 þ
X1m¼�1
�hð6Þms�Abm1
!� Ca
s1F2aJ
¼ �u0 ise��a cos aþh1ði���Þ þ i�se�a cos aþh1ð��i�Þ �
F1aJ
�þ ise��ða cos a��h1Þ þ i�se�ða cos aþ2h1Þ �
F2aJ
; ð51Þ
e��b cos b �Abs1F
1bH þ F1b
J
X1m¼�1
�hð7Þms�Aam1
!(
þ e�ð2h1þb cos bÞF1bJ
X1m¼�1
�hð8Þms�Abm1 þ
X1m¼�1
�hð9Þms�Aam1
!)
þ e��b cos b F2bH
�Bbs1 þ F2b
J
X1m¼�1
�hð10Þms�Bam1
!
þ e�ð2h1þb cos bÞF2bJ
X1m¼�1
�hð11Þms�Bbm1 þ
X1m¼�1
�hð12Þms�Aam1
!� Cb
s1F2bJ
¼ �u0 ise��b cos bþh1ði���Þ þ i�se�b cos bþh1ð��i�Þ �
F1bJ
�þ ise��ða cos a��h1Þ þ i�se�ða cos aþ2h1Þ �
F2aJ
: ð52Þ
Here, the following notations are used:
F1pH ¼ Hð1Þn ð�pÞ, ð53Þ
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F1pJ ¼ Jnð�pÞ, ð54Þ
G1pH ¼ sHð1Þs ð�pÞ � �pH
ð1Þsþ1ð�pÞ
h i, ð55Þ
G1pJ ¼ sJsð�pÞ � �pJsþ1ð�pÞ½ �, ð56Þ
F2pH ¼ Hð1Þn ði�pÞ, ð57Þ
F2pJ ¼ Jnði�pÞ, ð58Þ
G2pH ¼ sHð1Þs ði�pÞ � i�pHð1Þsþ1ði�pÞ
h i, ð59Þ
G2pJ ¼ sJsði�pÞ � i�pJsþ1ði�pÞ½ �, ð p ¼ a, bÞ: ð60Þ
According to the DSCF definition, the DSCF is the ratio of the hoop shear stress
around the holes and the maximum stress resulting from the incident waves [10].
Thus, the DSCF around the circular hole in FGPMs is expressed as follows:
DSCF ¼ ��z ¼�z�0
��������: ð61Þ
Here,
�z ¼1
rc44@ut
@þ e15
@�t
@
� : ð62Þ
It should be noted that �0 ¼ u0�ek denotes the maximum stress resulting from the
incident waves.Thus, the DSCF around the hole a in FGPMs is expressed as follows:ZDSCF ¼
e2�a cos a
ka
@ut
@þe015�e
@ t
@
� �
¼e�a cos a
kaeh1ði���Þ �a sin a
X1n¼�1
inJnð�aÞeina þ
X1n¼�1
inþ1nJnð�aÞeina
" #(
þ e2�a cos a�h1ði���Þ ��a sin aX1
n¼�1
i�nJnð�aÞeina þ
X1n¼�1
i1�nnJnð�aÞeina
" #
þ �a sin aX1
n¼�1
Aan1H
ð1Þn ð�aÞe
ina þX1
n¼�1
X1m¼�1
�Abm1hð1ÞmnJnð�aÞe
ina
!"
þX1
n¼�1
inAan1H
ð1Þn ð�aÞe
ina þX1
n¼�1
X1m¼�1
in �Abm1hð1ÞmnJnð�aÞe
ina
!#
þ e2�ðh1þa cos aÞ ��a sin aX1
n¼�1
X1m¼�1
�Aam1�hð2ÞmnJnð�aÞe
ina
"
þX1
n¼�1
X1m¼�1
�Abm1�hð3ÞmnJnð�aÞe
ina
!
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þX1
n¼�1
X1m¼�1
in �Aam1�hð2ÞmnJnð�aÞe
ina þX1
n¼�1
X1m¼�1
in �Abm1�hð3ÞmnJnð�aÞe
ina
" #)
þ�1e
015
�ee�a cos a�2�h1 �a sin a
X1n¼�1
inJnði�aÞeina þ
X1n¼�1
inþ1nJnði�aÞeina
" #(
þ e2�ða cos aþh1Þ ��a sin aX1
n¼�1
i�nJnði�aÞeina þ
X1n¼�1
i1�nnJnði�aÞeina
" #
þ e�a cos a �a sin aX1
n¼�1
�Ban1H
ð1Þn ði�aÞe
ina þX1
n¼�1
�Bbn1hð4ÞmnJnði�aÞe
ina
!" #
þX1
n¼�1
in �Ban1H
ð1Þn ði�aÞe
ina þX1
n¼�1
in �Bbn1hð4ÞmnJnði�aÞe
ina
" #
þ e�ð2h1þ3a cos aÞ ��a sin aX1
n¼�1
X1m¼�1
�Bam1�hð5ÞmnJnði�aÞe
ina
"
þX1
n¼�1
X1m¼�1
�Bbm1�hð6ÞmnJnði�aÞe
ina
!
þX1
n¼�1
X1m¼�1
in �Bam1�hð5ÞmnJnði�aÞe
ina þX1
n¼�1
X1m¼�1
in �Bbm1�hð6ÞmnJnði�aÞe
ina
):
ð63Þ
The electric displacement around the hole a is expressed as follows:
D�a ¼ e�ða cos aþ2h1Þ �a sin aX1
n¼�1
inJnði�aÞeina þ
X1n¼�1
inþ1nJnði�aÞeina
" #
� ��a sin aX1
n¼�1
i�nJnði�aÞeina þ
X1n¼�1
i1�nnJnði�aÞeina
" #
þ e�a cos a �a sin aX1
n¼�1
�Ban1H
ð1Þn ði�aÞe
ina þX1
n¼�1
�Bbn1hð4ÞmnJnði�aÞe
ina
!" #
þX1
n¼�1
in �Ban1H
ð1Þn ði�aÞe
ina þX1
n¼�1
in �Bbn1hð4ÞmnJnði�aÞe
ina
" #
þ e�ð2h1þ3a cos aÞ ��a sin aX1
n¼�1
X1m¼�1
�Bam1�hð5ÞmnJnði�aÞe
ina
"
þX1
n¼�1
X1m¼�1
�Bbm1�hð6ÞmnJnði�aÞe
ina
!
þX1
n¼�1
X1m¼�1
in �Bam1�hð5ÞmnJnði�aÞe
ina þX1
n¼�1
X1m¼�1
in �Bbm1�hð6ÞmnJnði�aÞe
ina : ð64Þ
Similarly, the electric displacement around the hole b can be obtained.
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6. Numerical examples and discussion
Fatigue failures often occur in the regions with high stress concentrations, so anunderstanding of the distribution of dynamic stress around the holes is very usefulin the structural design. According to the expression of DSCF, the DSCFs aroundthe circular holes are computed. For convenience, it is assumed that the two holes areof the same radius a.
In the following analysis, it is convenient to make the variables dimensionless.To accomplish this step, we may introduce a characteristic length a, where a is theradius of the holes. The following dimensionless variables and quantities have beenchosen for computation: the incident wave number is k� ¼ ka ¼ 0:1� 3:0, theposition of the hole beneath the surface of FGPM structure is h�1 ¼ h1=a ¼ 1:1� 5:0and h�2 ¼ h2=a ¼ 1:1� 5:0, the distance between the centers of the two holes isd� ¼ d=a ¼ 2:1� 8:0, and the ratio of the material properties of FGPMs isp ¼ c244=c
144 ¼ 0:2� 5:0.
To validate the present dynamical model, comparison with other methods isgiven in Figure 3. In Figure 3a, finite element analyzes are performed using ANSYSversion 9.0. During the modeling, the ratios of h�1 and h�2 are h�1 ¼ 1:2 and h�2 ¼ 2,respectively. The distance ratio d* is d*¼ 7.0. The ratio of the material properties ofFGPMs is p¼ 2.0. The problem is modeled in two-dimensional strain state and thefree-meshing procedure is used for meshing. The elements near the holes are taken assmall as possible in order to simulate the dynamic stress distribution near the holesmore accurately. In the grading direction, the thickness of FGPM layer is dividedinto 10 elements, and constant material properties for each element are used.An anti-plane periodic dynamic load of frequency 1.4 is applied at the surface of thestructure. The stress is normalized using Equation (61). The normalized DSCFsaround the circle hole a are shown in Figure 3a. For comparison, the DSCFsobtained from the method in this article are also plotted in this figure. The excellentagreement can be found in Figure 3a.
Figure 3. Comparison with the results obtained from other methods: (a) comparison withANSYS program and (b) comparison with Ref. [12].
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Comparison with the previous literatures is also given. Figure 3b illustrates theangular distribution of the dynamic stress around the hole a with parameters: p¼ 1.0,e15 ¼ "11 ¼ 0, h�1 ¼ 5:0, and d*¼ 8.0. p¼ 1.0 means that the functionally gradedmaterials reduce to the homogeneous materials. e15 ¼ "11 ¼ 0 implies that thepiezoelectric effect is not taken into consideration. When the distance ratio ish�1 ¼ 5:0, the effect of the surface of the structure can be ignored. When the distancebetween the two holes is d*¼ 8.0, the mutual influence of them can be ignored.It can be seen that the angular distribution of DSCFs is symmetric about bothaxes when the dimensionless wave number is small. So, the effect of the surface ondynamic stress disappears. When k*¼ 1.0, the maximum value of DSCFs isabout 2.1, and appears near the positions of ¼ =2, 3=2. Through comparison,it is found that the results coincide with those in an infinite homogeneousmaterial [8,12].
Figure 4 displays the angular distribution of the DSCFs around the circle hole awith different values of d*. It is noted that p¼ 2.0 means that the material propertiesof FGPMs increase along the x direction. p¼ 0.2 means that the material propertiesof FGPMs decrease along the x-direction. In Figure 4a, it can be seen that themaximum dynamic stress has a trend of shifting toward the illuminate side of thehole. This phenomenon is caused by the stronger scattering of electro-elastic wavesat the boundary of the hole. When the distance between the two holes becomessmaller, the maximum dynamic stresses around the hole a increases greatly. At thepositions facing the hole b, the variation of dynamic stresses is greater. Thisphenomenon is caused by the multiple scattering of electro-elastic waves between thetwo holes. At the positions near the hole b, and at the positions far from the hole b,the variation of dynamic stresses is little.
In Figure 4b, it can be seen that the maximum dynamic stress has a trend ofshifting toward the shadow side of the hole. However, due to the influence of thesurface, the dynamic stresses near the surface are still greater. The dynamic stressesnear the positions of ¼ �=2 are the maximum. Comparing with the results inFigure 4a, it is clear that the effect of the distance between the holes on the dynamicstress is greater when the material properties of FGPMs increase along thex-direction
In Figure 4c, the effect of boundary conditions disappears in this case. It can beseen that the maximum dynamic stress occurs at the position of the shadow sides.Comparing with the results in Figure 4b, it is clear that when the holes are far fromthe surface, the effect of the distance between the two holes on the dynamic stressdecreases.
In Figure 4d, the value of h�2 becomes great. Comparing with the results inFigure 4c, it is clear that the dynamic stress around the hole a decreases with theincrease of h�2. The effect of the distance between the two holes also decreases.So, the dynamic stress decreases with the increase of thickness of FGPMs.
Comparing the results in Figure 4e with those in Figure 4a, it can be seen that theboundary effect at the surface disappear, and the maximum dynamic stress occurs atthe positions near ¼ �=2. With the increase of the buried depth of the subsurfaceholes, the effect of the distance between the two holes decreases. Comparing withthe results in Figure 3b, it is clear that the dynamic stress increases due to thepiezoelectric properties of FGPMs.
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Figure 4f is the case of higher frequencies. Comparing with the results inFigure 4e, it can be seen that the dynamic stress increases with the increase of wavefrequency. The effect of the distance between the two holes also increases with thewave frequency.
Figure 5 shows the angular distribution of the electric displacements aroundthe circle hole a with different values of d*. In Figure 5a, it can be seen that when the
Figure 4. Angular distribution of DSCF around the hole a in FGPM layer; 1 d*¼ 7.0;2 d*¼ 2.5. (a) k� ¼ 1:0, h�1 ¼ 1:2, h�2 ¼ 1:2, p ¼ 2:0; (b) k� ¼ 1:0, h�1 ¼ 1:2, h�2 ¼ 1:2, p ¼ 0:2;(c) k� ¼ 1:0, h�1 ¼ 5:0, h�2 ¼ 1:2, p ¼ 0:2; (d) k� ¼ 1:0, h�1 ¼ 5:0, h�2 ¼ 5:0, p ¼ 0:2;(e) k� ¼ 1:0, h�1 ¼ 5:0, h�2 ¼ 5:0, p ¼ 2:0; (f) k� ¼ 1:5, h�1 ¼ 5:0, h�2 ¼ 5:0, p ¼ 2:0.
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material is homogeneous, the electric displacement is symmetrical about the x- andy-axes. The electric displacements around the hole are much less than the DSCFsaround the hole. The distance between the two holes expresses little effect onthe electric displacements around the hole. In Figure 5b, it can be seen that themaximum electric displacement occurs near the illuminate side of the hole whenp¼ 2.0. Comparing with the results in Figure 4a, it is clear that the effect of thedistance between the two holes on the electric displacement is less than that onthe dynamic stress. When p¼ 0.2, it can be seen that the distribution of electricdisplacement express little variation. It is also found that the effect of the distancebetween the two holes on the electric displacement is very little when p¼ 0.2.
7. Conclusions
The propagation and multiple scattering of electro-elastic waves in a FGPM layerwith two circular holes are investigated theoretically by employing image methodand wave functions expansion method. The analytical and numerical solutions ofthis problem are presented. For the homogeneous materials, our results are in good
Figure 5. Angular distribution of electric displacement around the hole a in FGPM layer;1 d*¼ 7.0; 2 d*¼ 2.5. (a) k� ¼ 1:0, h�1 ¼ 5:0, h�2 ¼ 5:0, p ¼ 1:0; (b) k� ¼ 1:0, h�1 ¼ 1:5,h�2 ¼ 5:0, p ¼ 2:0; (c) k� ¼ 1:0, h�1 ¼ 5:0, h�2 ¼ 5:0, p ¼ 0:2.
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agreement with the solutions in previous literatures. Comparing with the solutionin the static case, analysis shows that the piezoelectric property has great effect on thedynamic stress in the region of higher frequencies. In the dynamic case, the obtainedresults are validated by comparison with those from ANSYS program.
In contrast to the case of the single hole in FGPMs, it is found that the distancebetween the two holes expresses great effect on the dynamic stress at the oppositepositions of the holes. When the material properties of FGPMs increase along thex-direction, the effect of the distance between the two holes on the dynamic stressis greater. With the increase of the buried depth of the holes, the effect of the distancebetween the two holes on the dynamic stress decreases. When the thickness of thefunctionally graded layer is small, the dynamic stresses near the surface and theopposite sides of the two holes increases greatly. With the increases of wavefrequency, the effect of the distance between the two holes on the dynamic stressincreases. The effects of the piezoelectric property, the incident wave number, andthe relative position of the two subsurface holes in the FGPM layer on the dynamicstress is greater than that on the electric displacement.
Acknowledgements
This work is supported by the National Natural Science Foundation of China (Foundationnos. 10672108, 10972147).
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Appendix
�hðiÞmn ði ¼ 1, 2, . . . , 6Þ are expressed as follows:
�hð1Þmn ¼ e�iðn�mÞabHð1Þn�mð�dabÞ, ðA1Þ
�hð2Þmn ¼ ð�1ÞnþmH
ð1Þnþmð�daa0 Þ, ðA2Þ
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�hð3Þmn ¼ e�iðn�mÞab0Hð1Þn�mð�dab0 Þ, ðA3Þ
�hð4Þmn ¼ e�iðn�mÞabHð1Þn�mði�dabÞ, ðA4Þ
�hð5Þmn ¼ ð�1ÞnþmH
ð1Þnþmði�daa0 Þ, ðA5Þ
�hð6Þmn ¼ e�iðn�mÞab0Hð1Þn�mði�dab0 Þ, ðA6Þ
�hð7Þmn ¼ e�iðn�mÞbaHð1Þn�mð�dbaÞ, ðA7Þ
�hð8Þmn ¼ ð�1ÞnþmHð1Þnþmð�dbb0 Þ, ðA8Þ
�hð9Þmn ¼ e�iðn�mÞba0Hð1Þn�mð�dba0 Þ, ðA9Þ
�hð10Þmn ¼ e�iðn�mÞbaHð1Þn�mði�dbaÞ, ðA10Þ
�hð11Þmn ¼ ð�1ÞnþmHð1Þnþmði�dbb0 Þ, ðA11Þ
�hð12Þmn ¼ e�iðn�mÞba0Hð1Þn�mði�dba0 Þ, ðA12Þ
where dij denotes the distance between the holes ða, b, a0, b0Þ.
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