KIT – Universität des Landes Baden-Württemberg undnationales Forschungszentrum in der Helmholtz-Gemeinschaft

Institute for Data Processing and Electronics (IPE)

www.kit.edu

Balloon-Experiment JEM-EUSO

EC-Design Review

EC-HV Board

KIT-IPE2 20.04.23

The EC-HV Board

First Design: Single-Layer PCB, 1,5mm FR4

A. Ebersoldt

KIT-IPE3 20.04.23

The EC-HV Board

Second Design: Single-Layer PCB, 1,5mm FR4

A. Ebersoldt

KIT-IPE4 20.04.23

IPE - Experience

A. Ebersoldt

PottingUse of 2 component silicon materials.

Mass production @ IPE:Project Quench Detection(W7X, TOSKA, KATRIN, HZ-Berlin)

Company-Connection:Coating & Potting:

Balloon-ExperimentsAtmospheric measurements with MIPAS, developed @ KIT

- many flights with MIPAS flown by CNES

also in Kiruna (same as maiden flight for EUSO-Balloon)

- Flight altitude up to 40km and 18 hours

- @ IPE developed electronics:

instrument control, communication, power-management, thermal design, for balloons and aircrafts

KIT-IPE5 20.04.23

IPE Test Facilities

Climate chamber:

Vibrating table:

A. Ebersoldt

IPE assembly center for PCB and many more:

-Pick-and-Place machine-Flying-Prober-Camera inspection systems-Wire bonder-Clean room-Dry cabinets-Laser-Labeler-…

-Laboratories: -Electronics-Mechanics-Optics-Hybrid-Technology