ECE 4100/6100 (1)

Multicore: Commercial Processors

ECE 4100/6100 (2)

Some Examples

• Desktop and Server/Enterprise Space– Intel

– AMD

– SUN Microsystems

• The Embedded Space: Freescale Semiconductor

ECE 4100/6100 (3)

Focus

• The Chip Level Architecture– What do we have on chip?

• The Core Architecture– Note the presence/absence/configuration of concepts

studied earlier in class– Rationalize the design decisions that led to the

preceding– What can/should we expect next?

• Building systems using multicore chips

ECE 4100/6100 (4)

The Intel Core Duo Processor Series

ECE 4100/6100 (5)

Intel Core Duo

Homogeneous cores Bus based on chip interconnect Shared Memory Traditional I/O

Classic OOO: Reservation Stations, Issue ports, Schedulers…etc

Large, shared set associative, prefetch, etc.

Source: Intel Corp.

ECE 4100/6100 (6)

Intel Core Duo: Vital Stats

• 151 million transistors; Shared 2 MB L2 cache• Each core has a 12 stage pipeline (Yonah)• Low-power (less than 25 watts) Dual Core microprocessor• Supports Intel’s Vanderpool virtualization technology• EM64T (Intel x86-64 extensions) is not supported

– Desktop market – not severe due to lack of OS and software– Sossaman processor for servers, which is based on Yonah, also

lacks EM64T-support severe disadvantage• Communication between the L2 cache and both execution

cores is handled by an arbitration bus unit– Eliminates cache coherency traffic over the FSB– Raises the core-to-L2 latency– The increase in clock frequency offsets the impact

• Core processors communicate with the system chipset over a 667 MT/s front side bus (FSB), up from 533 MT/s used by the fastest Pentium M.

• Intel Core Solo uses the same two-core die as the Core Duo, but features only one active core– Chips failing quality control can be sold – Core 2 Duo processors will also include the ability to disable one

core to conserve power

ECE 4100/6100 (7)

The Core™ micro-architecture

Source: Ars Technica

ECE 4100/6100 (8)

The Core Execution core

Source: Ars Technica

ECE 4100/6100 (9)

Intel Core Duo

• High memory latency due to the lack of on-die memory controller (further aggravated by system-chipset's use of DDR-II RAM)

• Main-memory transactions have to pass through the Northbridge of the chipset– Higher latency compared to the AMD's Turion platform. – Weakness shared by the entire line of Pentium

processors– L2-cache is quite effective at hiding main-memory

latency• Execution units

– Three 64-bit integer exec units • one CIU (complex) + two SIU (simple)

– Two FPUs– Poor Floating Point Unit (FPU) throughput

• Limited to little "performance per watt" in single threaded applications compared to its predecessor.

ECE 4100/6100 (10)

Core 2 Duo and Core Duo

• Very similar architectures• Bump in the processor speed• Increase in Level 2 cache. (2MB to 4MB)• Both chips have a 65-nm process technology

architecture and support a 667 MHz front-side-bus (FSB).• 14 stage pipeline

Source: Intel Corp.

ECE 4100/6100 (11)

Intel® CoreTM2 Duo Processor

Process Technology 65 nm

Number of Processor Cores 2

L2 Cache Size (shared between 2 processor cores) Up to 4MB

Transistor Gate Height / Gate Oxide Thickness (65 nm)

1.2 nm

Transistor Gate Length (for 65nm Process Technology)

35 nm

Line Width 65 nm

Number of Transistors 291 million

Processor Die Size 143 mm2

Average Power <1.1 Watt

ECE 4100/6100 (12)

Intel Core 2 Duo

Source: Hard Core Hardware

ECE 4100/6100 (13)

Wide Dynamic Execution

Source: Bit Tech

ECE 4100/6100 (14)

Wide Dynamic Execution

Source: Bit Tech

ECE 4100/6100 (15)

Wide Dynamic Execution

• Pipe width of 4 execution units per chip (Pentium M/Pentium 4 Netburst have 3)

• Delivery of more instructions per clock cycle• Pipeline depth of 14 vs. 31 in Pentium Prescott 4

– Compromise between efficient execution of short instructions and long instructions

• Ops fusion– Less work for the processor pipeline to run– Micro-ops fusion

• fuse together repetitive instructions in x86 code – Macro-ops fusion

• works on the x86 instructions themselves, not just their micro derivatives.

• Instruction loads and micro-ops can be reduced by approximately 15% and 10%, respectively

ECE 4100/6100 (16)

Intelligent Power Capability

Source: Bit Tech

ECE 4100/6100 (17)

• SpeedStep technology – Dyamic clock speed reduction– Intel mobile processors include this already– Enhanced SpeedStep used in Core 2 Duo

• Controller that turns on sections of the processor as needed. One core can be shut down for single-threaded applications

• Power consumption decreased by enhancements to Intel's 65nm process node – use Low-K dielectrics and strained silicon– use low-leakage and "sleep" transistors

Intelligent Power Capability

ECE 4100/6100 (18)

Advanced Smart Cache

Source: Bit Tech

ECE 4100/6100 (19)

Advanced Smart Cache

• Both cores share data stored in the L2 cache via an arbitration bus unit embedded in the cache. – Dynamically allocates cache space between the two cores,

minimising bus traffic by allowing both cores to access one copy of data

• Does larger L2 cache matter?– Studies point out that improvements in execution time are low

from a 2MB to 4MB for most applications (2-4%)

Source: Bit Tech

ECE 4100/6100 (20)

Smart Memory Access

Source: Bit Tech

ECE 4100/6100 (21)

Smart Memory Access

• Improved prefetch units• Memory disambiguation

– Allows re-ordering instructions more efficiently

Source: Ars TechnicaExample from

http://arstechnica.com/articles/paedia/cpu/core.ars/8

Execution without memory disambiguation

Memory AliasingExecution with and without memory disambiguation

ECE 4100/6100 (22)

Advanced Digital Media Boost

Source: Bit Tech

ECE 4100/6100 (23)

Advanced Digital Media Boost

• Streaming SIMD Extension (SSE) instructions– SSE instructions are an extension of the

standard x86 instruction set. – Utilized in multimedia encoding, decoding,

image manipulation and encryption

• SSE instructions are 128-bit.– Up from 64-bits – Double the SSE performance over previous

generation

ECE 4100/6100 (24)

Comparison of SSE to prior processors

Source: Ars Technica

ECE 4100/6100 (25)

Intel Conroe Vs Presler

• What is the major difference?– Shared L2 versus separate caches

Conroe Presler

Source: Bit Tech

ECE 4100/6100 (26)

Intel’s Roadmap for Multicore

Source: Adapted from Tom’s Hardware

2006 20082007

SC 1MB

DC 2MB

DC 2/4MB shared

DC 3 MB/6 MB shared

(45nm)

2006 20082007

DC 2/4MB

DC 2/4MB shared

DC 4MB

DC 3MB /6MB shared (45nm)

2006 20082007

DC 2MB

DC 4MB

DC 16MB

QC 4MB

QC 8/16MB shared

8C 12MB shared (45nm)

SC 512KB/ 1/ 2MB

8C 12MB shared (45nm)

De

skto

p p

roce

sso

rs

Mo

bile

p

roce

sso

rs

En

terp

rise

p

roce

sso

rs

• Drivers are – Market segments– More cache– More cores

• 80 core processor prototype has been designed!

ECE 4100/6100 (27)

Intel Chipset Example

Source: Extreme Tech

ECE 4100/6100 (28)

References and Links• http://www.intel.com/products/processor/coreduo/• http://en.wikipedia.org/wiki/Intel_Core• http://www.hothardware.com/viewarticle.aspx?articleid=845&cid=1• http://www.bit-tech.net/hardware/2006/03/10/intel_core_microarchitecture/• http://www.bit-tech.net/hardware/2006/05/19/intel_core_duo_t2600_on_the_desk

top• http://www.bit-tech.net/hardware/2006/07/14/intel_core_2_duo_processors/• http://www.hardcoreware.net/reviews/review-347-1.htm• http://www.trustedreviews.com/cpu-memory/review/2006/08/28/Intel-Core-2-Du

o-Merom-Notebooks/p1• http://www.trustedreviews.com/cpu-memory/review/2006/07/14/Intel-Core-2-Du

o-Conroe-E6400-E6600-E6700-X6800/p1• http://techreport.com/reviews/2006q2/core-duo/index.x?pg=1• http://arstechnica.com/articles/paedia/cpu/core.ars/1• http://www.anandtech.com/mobile/showdoc.aspx?i=2663&p=4• http://www.extremetech.com/article2/0,1697,1988794,00.asp• http://www.coreduoinfo.com/blog/about-intel-core-duo/• http://67.91.114.164/intel_c2d_info.htm• http://www.pcper.com/article.php?aid=272&type=expert

ECE 4100/6100 (29)

AMD MultiCore Processors

ECE 4100/6100 (30)

Dual Core AMD Opteron

Source: AMD

ECE 4100/6100 (31)

AMD Multicore (Dualcore) Opteron

• Two AMD Opteron CPU cores on a single die– Each has 1MB L2 cache

• 90nm, ~205 million transistors– Approximately same die

size as 130nm single-core AMD Opteron processor

• 95 watt power envelope– fits into 90nm power

infrastructure• Introduced with “K8”

Revision E core in April 2005

Core 0

Northbridge

1-MB L2

Core 11-MB L2

Source: AMD

ECE 4100/6100 (32)

Opteron Core Pipeline

Source: Chip Architect

ECE 4100/6100 (33)

AMD Opteron Processor Core Architecture

AGUAGU

Int Decode & Rename

FADD FMISCFMUL

44-entryLoad/Store

Queue

36-entry FP scheduler

FP Decode & Rename

ALU

AGU

ALU

MULT

ALU

Res Res Res

L1Icache64KB

L1Dcache64KB

FetchBranch

Prediction

Instruction Control Unit (72 entries)

Fastpath Microcode EngineScan/Align/Decode

µops

Source: The 3D shop

ECE 4100/6100 (34)

Dual Core AMD Opteron• AMD64 technology

– Runs 32-bit applications and is 64-bit capable– Compatible with the x86 software infrastructure– Enables a single architecture across 32- and 64-bit

environments• Direct Connect Architecture

– NUMA system • Each processor shares its memory with other

processors in the system– Integrated Memory Controller on-die

• DDR2 DRAM memory controller offers memory BW up to 10.7 GB/s per processor

– HyperTransport• Point-to-point interconnect can be used to build a

mesh of multiple-processor Opteron systems• Scalable bandwidth interconnect between processors,

I/O subsystems, and other chipsets• 24.0 GB/s peak bandwidth per processor

ECE 4100/6100 (35)

Dual Core AMD Opteron

• Not a simple aggregation of K8 cores– Integrated the cores for efficiency

• Dual-core Opteron acts very much like a SMP system

• Compatible with existing single-threaded, multi-threaded (hyperthreaded) software

• MOESI coherency protocol (O – “Owns”)– Updates through system request interface

• SSE3 support with 10 new instructions. • Quad-core upgradeability• Hardware assisted AMD Virtualization• Optimized Power Management

ECE 4100/6100 (36)

Dual Core AMD Opteron

Source: Elec Design

ECE 4100/6100 (37)

AMD Opteron (SOI)

Source: Chip Architect

ECE 4100/6100 (38)

AMD 64 bit Core

• 1MB L2 Cache• Detailed discussion of the 64-bit

core architecture at:– http://chip-architect.com/news/2003_

09_21_Detailed_Architecture_of_AMDs_64bit_Core.html

ECE 4100/6100 (39)

I/O HubI/O HubUSBUSB

PCIPCI

PCI-E Bridge

PCI-E Bridge

PCI-E Bridge

PCI-E Bridge

PCI-E Bridge

PCI-E BridgeI/O HubI/O HubI/O HubI/O Hub

PCI-E Bridge

PCI-E BridgePCI-E Bridge

PCI-E BridgePCI-E Bridge

PCI-E Bridge

Memory Controller

Hub

Memory Controller

Hub

CPUCPU CPUCPU

Multiprocessor Systems using AMD Opteron

SRQ

Crossbar

HTMem.Ctrlr

SRQ

Crossbar

HTMem.Ctrlr

CPUCPU CPUCPU CPUCPU CPUCPU 8 GB/S

8 GB/S 8 GB/S

8 GB/S

AMD64 Direct Connect Architecture

• Eliminates FSB bottleneck• HyperTransport™ Technology interconnect for

high bandwidth and low latency• Each CPU has its own memory• Each CPU can access the main memory of another

processor, transparent to the programmer Different from SMP

Legacy x86 Architecture• CPUs, Memory, I/O all share a bus• Major bottleneck to performance• Faster CPUs or more cores for performance• Symmetric Multiprocessing

Source: AMD

ECE 4100/6100 (40)

Multiprocessor Systems using AMD Opteron

Source: XBitlabs

ECE 4100/6100 (41)

Cache coherency

Source: Chip Architect

ECE 4100/6100 (42)

AMD Athlon 64 X2

Source: AMD

ECE 4100/6100 (43)

References and Links• http://techreport.com/reviews/2005q2/opteron-x75/index.x?pg=1• http://www.tomshardware.com/2005/06/03/dual_core_stress_test/index.html• http://www.a1-electronics.net/AMD_Section/CPUs/2005/AMD_Athlon64x2_Apr.sht

ml• http://en.wikipedia.org/wiki/Opteron• http://en.wikipedia.org/wiki/Athlon_64_X2• http://www.amd.com/us-en/Processors/ProductInformation/0,,30_118_8796_1430

9,00.html• http://chip-architect.com/news/

2003_09_21_Detailed_Architecture_of_AMDs_64bit_Core.html• http://firingsquad.com/hardware/amd_dual-core_opteron_875/page2.asp• http://www.xbitlabs.com/articles/cpu/display/opteron-ws_4.html• http://www.extremetech.com/article2/0,1697,1675784,00.asp• http://www.elecdesign.com/Articles/Index.cfm?AD=1&ArticleID=11991• http://www.the3dshop.com/userimages/amd_systems/opteron_dualcore.htm• http://www.nextcomputing.com/advantages/thruadv.shtml • http://arstechnica.com/news.ars/post/20060817-7535.html • http://www.bit-tech.net/hardware/2005/05/09/amd_a64x2_4800/1.html

ECE 4100/6100 (44)

SUN – UltraSPARC Multicore

ECE 4100/6100 (45)

SUN – UltraSPARC T1

• Eight cores, each 4-way threaded

• 1.2 GHz• Cache

– 16K 4-way 32B L1-I– 8K 4-way 16B L1-D– 3MB internal L2 cache

partitioned into four banks and four memory controllers.

– Data moved between the L2 and the cores using an integrated crossbar switch to provide high throughput

Source: Sun

ECE 4100/6100 (46)

SUN – UltraSPARC T1

Source: Sun

ECE 4100/6100 (47)

SUN – UltraSPARC T1 Pipeline

• T1's integer pipeline– Fetch, Thread Selection, Decode, Execute, Memory Access,

Writeback

Source: Sun

ECE 4100/6100 (48)

SUN UltraSPARC T2 – Niagara 2

Source: Sun

ECE 4100/6100 (49)

SUN UltraSPARC T2

• Ultra SPARC T2 has 8 threads/core (8 Sparc Cores)• 8 stage integer pipeline ( as opposed to 6 for T1)• Twice the performance of T1 with a transactional

workload (under the same power envelope)• Each thread, increased to 1.4 GHz from 1.2 GHz• One PCI Express port (x8 1.0)• Two 10 Gigabit Ethernet ports with packet classification

and filtering• L2 cache size increased to 4 MB shared (8-banks, 16-

way associative)• 1 floating point unit per core• Eight encryption engines • Four dual-channel FBDIMM memory controllers• 711 signal I/O,1831 total

ECE 4100/6100 (50)

UltraSparc T2 Core Microarchitecture

Source: Realworld Tech

ECE 4100/6100 (51)

UltraSparc T2 Memory System

Source: Sun

ECE 4100/6100 (52)

UltraSparc T2 Core Block Diagram

• IFU – Instruction Fetch Unit– 16 KB I$, 32B lines, 8-way SA– 64-entry fully-associative ITLB

• EXU0/1 – Integer Execution Units– 4 threads share each unit– Executes one integer instrn/cycle

• LSU – Load/Store Unit– 8KB D$, 16B lines, 4-way SA 128-

entry fully-associative– DTLB

• FGU – Floating/Graphics Unit• SPU – Stream Processing Unit

– Cryptographic acceleration• TLU – Trap Logic Unit

– Updates machine state, handles exceptions and interrupts

• MMU – Memory Management Unit– Hardware tablewalk (HWTW)– 8KB, 64KB, 4MB, 256MB pages

Source: Sun

ECE 4100/6100 (53)

UltraSparc T2 Core Pipeline

• 8 stages for integer operations:– Fetch, Cache, Pick, Decode, Execute,

Memory, Bypass, Writeback– > 3-cycle load-use– Memory (translation, tag/data access)– Bypass (late select, formatting)

• 12 stages for floating-point:– Fetch, Cache, Pick, Decode, Execute, FX1,

FX2, FX3, FX4, FX5, FB, FW– 6-cycle latency for dependent FP ops– Longer pipeline for divide/sqrt

ECE 4100/6100 (54)

References and Links

• http://realworldtech.com/page.cfm?ArticleID=RWT090406012516&p=4

• http://www.opensparc.net/cgi-bin/goto.php?w=/pubs/preszo/06/HotChips06_09_ppt_master.pdf

• http://www.freescale.com/files/netcomm/doc/fact_sheet/MPC8572FS.pdf

ECE 4100/6100 (55)

The Embedded Multicores

ECE 4100/6100 (56)

Freescale MPC8572 PowerQUICC III Processor

Source: Freescale

ECE 4100/6100 (57)

Freescale MPC8572 PowerQUICC III Processor

• Dual Embedded e500 core 36-bit physical addressing

• Double-precision floating-point• Integrated L1/L2 cache

– L1 cache—32 KB data and 32 KB– Shared L2 cache—1 MB with ECC– L2 configurable as SRAM, cache and I/O transactions

can be stashed into L2 cache regions• Integrated DDR memory controller with• full ECC support• Integrated security engine, Pattern Matching

Engine, Packet Deflate Engine• Four on-chip triple-speed Ethernet controllers

ECE 4100/6100 (58)

References and Links

• http://www.freescale.com/files/netcomm/doc/fact_sheet/MPC8572FS.pdf

ECE 4100/6100 (59)

Summary

• Multicore technology spans the product spectrum– The downward migration of leading edge technology

continues

• Architectural principles are key to – Developers: extracting performance– Designers: improving performance– Marketing: understanding new markets for performance

• Research spans the spectrum of software, security, reliability, parallelelism, virtualization and much more!