CSE477 L01 Introduction.1 Irwin&Vijay, PSU, 2002
ECE484 VLSI Digital Circuits
Fall 2017
Lecture 01: Introduction
Adapted from slides provided by Mary Jane Irwin.
[Adapted from Rabaey’s Digital Integrated Circuits, ©2002, J. Rabaey et al.]
CSE477 L01 Introduction.2 Irwin&Vijay, PSU, 2002
Course Contents
Introduction to digital integrated circuits
CMOS devices and manufacturing technology. CMOS logic gates and their layout. Propagation delay, noise margins, and power dissipation. Combinational (e.g., arithmetic) and sequential circuit design.
Course goals
Ability to design and implement CMOS digital circuits and optimize them with respect to different constraints: size (cost), speed, power dissipation, and reliability
Course prerequisites
ECE 326. Electronic Circuit Design
ECE 282. Logic Design of Digital Systems
CSE477 L01 Introduction.3 Irwin&Vijay, PSU, 2002
Course Administration
Instructor: George L. Engel [email protected] www.ee.siue.edu/~gengel
TA: Sri Kandula [email protected]
Labs: Need university account.
CSE477 L01 Introduction.4 Irwin&Vijay, PSU, 2002
Background from ECE282 and ECE326
Basic circuit theory
resistance, capacitance, inductance
MOS gate characteristics
Hardware description language
VHDL or verilog
Logic design
logical minimization, FSMs, component design
CSE477 L01 Introduction.5 Irwin&Vijay, PSU, 2002
Transistor Revolution
Transistor –Bardeen (Bell Labs) in 1947
Bipolar transistor – Schockley in 1949
First bipolar digital logic gate – Harris in 1956
First monolithic IC – Jack Kilby in 1959
First commercial IC logic gates – Fairchild 1960
TTL – 1962 into the 1990’s
ECL – 1974 into the 1980’s
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MOSFET Technology
MOSFET transistor - Lilienfeld (Canada) in 1925 and Heil (England) in 1935
CMOS – 1960’s, but plagued with manufacturing problems
PMOS in 1960’s (calculators)
NMOS in 1970’s (4004, 8080) – for speed
CMOS in 1980’s – preferred MOSFET technology because of power benefits
BiCMOS, Gallium-Arsenide, Silicon-Germanium
SOI, Copper-Low K, …
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Moore’s Law
In 1965, Gordon Moore predicted that the number of transistors that can be integrated on a die would double every 18 to 14 months (i.e., grow exponentially with time).
Amazingly visionary – million transistor/chip barrier was crossed in the 1980’s.
2300 transistors, 1 MHz clock (Intel 4004) - 1971
16 Million transistors (Ultra Sparc III)
42 Million, 2 GHz clock (Intel P4) - 2001
140 Million transistor (HP PA-8500)
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Intel 4004 Microprocessor
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Intel Pentium (IV) Microprocessor
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State-of-the Art: Lead Microprocessors
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Moore’s Law in Microprocessors
4004 8008
8080 8085 8086
286 386
486 Pentium® proc
P6
0.001
0.01
0.1
1
10
100
1000
1970 1980 1990 2000 2010
Year
Tra
nsis
tors
(M
T)
2X growth in 1.96 years!
Transistors on lead microprocessors double every 2 years
Courtesy, Intel
CSE477 L01 Introduction.12 Irwin&Vijay, PSU, 2002
64
256
1,000
4,000
16,000
64,000
256,000
1,000,000
4,000,000
16,000,000
64,000,000
10
100
1000
10000
100000
1000000
10000000
100000000
1980 1983 1986 1989 1992 1995 1998 2001 2004 2007 2010
Year
Kb
it c
ap
acit
y/c
hip
Evolution in DRAM Chip Capacity
1.6-2.4 m
1.0-1.2 m
0.7-0.8 m
0.5-0.6 m
0.35-0.4 m
0.18-0.25 m
0.13 m
0.1 m
0.07 m
human memory
human DNA
encyclopedia
2 hrs CD audio
30 sec HDTV
book
page
4X growth every 3 years!
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Die Size Growth
4004 8008
8080 8085
8086 286
386 486 Pentium ® proc
P6
1
10
100
1970 1980 1990 2000 2010
Year
Die
siz
e (
mm
)
~7% growth per year
~2X growth in 10 years
Die size grows by 14% to satisfy Moore’s Law
Courtesy, Intel
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Clock Frequency
Lead microprocessors frequency doubles every 2 years
P6
Pentium ® proc 486
386 286 8086 8085
8080
8008 4004
0.1
1
10
100
1000
10000
1970 1980 1990 2000 2010
Year
Fre
qu
en
cy (
Mh
z)
2X every 2 years
Courtesy, Intel
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Power Dissipation
P6 Pentium ® proc
486
386 286 8086
8085 8080
8008 4004
0.1
1
10
100
1971 1974 1978 1985 1992 2000 Year
Po
wer
(Watt
s)
Lead Microprocessors power continues to increase
Courtesy, Intel
Power delivery and dissipation will be prohibitive
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Power Density
4004 8008
8080
8085
8086
286 386
486 Pentium® proc
P6
1
10
100
1000
10000
1970 1980 1990 2000 2010
Year
Po
wer
Den
sit
y (
W/c
m2)
Hot Plate
Nuclear
Reactor
Rocket
Nozzle
Power density too high to keep junctions at low temp
Courtesy, Intel
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Design Productivity Trends
2003
19
81
19
83
1985
1987
1989
1991
1993
1995
1997
1999
2001
2005
2007
20
09
Logic Tr./Chip
Tr./Staff Month.
x x x
x x x
x
21%/Yr. compound Productivity growth rate
x
58%/Yr. compounded Complexity growth rate
10,000
1,000
100
10
1
0.1
0.01
0.001
Lo
gic
Tra
ns
isto
r p
er
Ch
ip (M
)
0.01
0.1
1
10
100
1,000
10,000
100,000
Pro
du
cti
vit
y
(K)
Tra
ns
./S
taff
- M
o.
Co
mp
lex
ity
Courtesy, ITRS Roadmap
Complexity outpaces design productivity
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Technology Directions: SIA Roadmap
Year 1999 2002 2005 2008 2011 2014
Feature size (nm) 180 130 100 70 50 35
Mtrans/cm2 7 14-26 47 115 284 701
Chip size (mm2) 170 170-214 235 269 308 354
Signal pins/chip 768 1024 1024 1280 1408 1472
Clock rate (MHz) 600 800 1100 1400 1800 2200
Wiring levels 6-7 7-8 8-9 9 9-10 10
Power supply (V) 1.8 1.5 1.2 0.9 0.6 0.6
High-perf power (W) 90 130 160 170 174 183
Battery power (W) 1.4 2.0 2.4 2.0 2.2 2.4
For Cost-Performance MPU (L1 on-chip SRAM cache; 32KB/1999
doubling every two years)
http://www.itrs.net/ntrs/publntrs.nsf
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Why Scaling?
Technology shrinks by ~0.7 per generation
With every generation can integrate 2x more functions on a chip; chip cost does not increase significantly
Cost of a function decreases by 2x
But …
How to design chips with more and more functions?
Design engineering population does not double every two years…
Hence, a need for more efficient design methods
Exploit different levels of abstraction
CSE477 L01 Introduction.20 Irwin&Vijay, PSU, 2002
Design Abstraction Levels
SYSTEM
GATE
CIRCUIT
Vout Vin
CIRCUIT
Vout Vin
MODULE
+
DEVICE
n+
S D
n+
G
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Major Design Challenges
Microscopic issues
ultra-high speeds
power dissipation and supply rail drop
growing importance of interconnect
noise, crosstalk
reliability, manufacturability
clock distribution
Macroscopic issues
time-to-market
design complexity (millions of gates)
high levels of abstractions
reuse and IP, portability
systems on a chip (SoC)
tool interoperability
Year Tech. Complexity Frequency 3 Yr. Design Staff Size
Staff Costs
1997 0.35 13 M Tr. 400 MHz 210 $90 M
1998 0.25 20 M Tr. 500 MHz 270 $120 M
1999 0.18 32 M Tr. 600 MHz 360 $160 M
2002 0.13 130 M Tr. 800 MHz 800 $360 M
