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Home > Documents > ECI QUALI-LINE PRIMÅ brochure · 2020. 7. 31. · ECI QUALI-LINE PRIMÅ brochure Author: ECI...

ECI QUALI-LINE PRIMÅ brochure · 2020. 7. 31. · ECI QUALI-LINE PRIMÅ brochure Author: ECI...

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Modern logic and memory devices require complex structures of Copper layers and vias which function like highways to transport electrons between chip components and transistors. Today’s leading logic processors require more than 10 metal layers incorporating about 30 miles of interconnect wires. Leading chipmakers have succeeded in extending the Cu interconnects up to 5nm and beyond. To enable this progress, new ECD chemistries and processes have been developed. The QUALI-LINE ® PRIMÅ analyzer provides on-line chemical metrology of BEOL Cu ECD processes for Logic and Memory devices: Optimized fill of Via/Trench structures Complies with tight tolerance specs for successful deposition of each layer Supports ultra-low/traditional/high Cu concentration chemistries Maximizes Yield and Reliability Sets a new standard for accuracy/ repeatability specs for Cu chemistries Fast analysis of all main components, including super-fast, independent Cu and Acid analysis which is important when Cu range is less then 10g/L By-products analysis for chipmakers who extend the life of their plating bath – DRAM, NAND Rapid Conversion to HVM The QUALI-LINE PRIMÅ analyzer configuration can be easily rolled-out from R&D to high volume manufacturing Minimal consumption of reagents and parts No additional chemicals required (all reagents are chemistry components) Predictive maintenance using a new Analyzer Health Monitor (AHM) system Newly Designed Platform The QUALI-LINE PRIMÅ analyzer is designed for reliable performance over time and application • Minimal, predictable maintenance • Utilizes ECI Technology’s wide library of Cu ECD applications Low Cost per Analysis Simplified Process Control Rapid Ramp-up to High-Volume Manufacturing Comprehensive Control of Chemistry Analysis of Byproduct QUALI-LINE ® PRIMÅ Online Chemical Management System for Cu Interconnects Enabling Precise Plating for Sub-10nm Devices
Transcript
  • Modern logic and memory devices require complex structures of Copper layers and vias which function like highways to transport electrons between chip components and transistors.

    Today’s leading logic processors require more than 10 metal layers incorporating about 30 miles of interconnect wires. Leading chipmakers have succeeded in extending the Cu interconnects up to 5nm and beyond. To enable this progress, new ECD chemistries and processes have been developed.

    The QUALI-LINE® PRIMÅ analyzer provides on-line chemical metrology of BEOL Cu ECD processes for Logic and Memory devices:• Optimized fill of Via/Trench structures• Complies with tight tolerance specs for successful

    deposition of each layer• Supports ultra-low/traditional/high Cu concentration

    chemistries

    Maximizes Yield and Reliability• Sets a new standard for accuracy/ repeatability specs

    for Cu chemistries• Fast analysis of all main components, including super-fast,

    independent Cu and Acid analysis which is important when Cu range is less then 10g/L

    • By-products analysis for chipmakers who extend the life of their plating bath – DRAM, NAND

    Rapid Conversion to HVM• The QUALI-LINE PRIMÅ analyzer configuration can be

    easily rolled-out from R&D to high volume manufacturing• Minimal consumption of reagents and parts• No additional chemicals required (all reagents are

    chemistry components)• Predictive maintenance using a new Analyzer Health

    Monitor (AHM) system

    Newly Designed Platform• The QUALI-LINE PRIMÅ analyzer is designed for reliable

    performance over time and application• Minimal, predictable maintenance• Utilizes ECI Technology’s wide library of Cu ECD applications

    Low Cost per Analysis

    Simplified Process Control

    Rapid Ramp-up to High-Volume Manufacturing

    Comprehensive Control of Chemistry

    Analysis of Byproduct

    QUALI-LINE® PRIMÅOnline Chemical Management System for Cu Interconnects

    Enabling Precise Plating forSub-10nm Devices

  • We Keep Your Chemistry Right™

    QUALI-LINE® PRIMÅ is a registered trademark of ECI Technology, Inc. All other trademarks are the property of their respective owners. ECI Technology reserves the right to change specifications without notice. © 2020 ECI Technology, Inc. All rights reserved. 2020.06

    Analysis of known Good and Bad Bath from customer site

    Features• Automatic Standard Generation (ASG), with validation and calibration • Flexible modular design • The most advanced by-products analysis• Intelligent self-diagnostics• NOWPak® reagent delivery system available• Optional dosing/replenishment system• Optional SECS/GEM• MTBF > 2160 hour, MTTR < 2 hours• Complies with the industry safety standards: S2/S8 and CE

    Specifications*

    Component Type Component Accuracy (%) RSD (%)

    OrganicAccelerator 3 2

    Leveler 3 2

    Suppressor 3 2

    InorganicCopper 3 1.5

    Acid 3 1.5

    Chloride 3 2

    By-Products

    ABP 5 5

    SBP 5 5

    BPA 5 5*Chemistry Dependent

    Results shows tank analysis accuracy and RSD < 3% using ASG for > 6 months

    Suppressor Accelerator Leveler

    Con

    cent

    ratio

    n

    AcceleratorTime

    LevelerSuppressor0.8

    0.9

    1

    1.1

    3/02/201610:54:48 AM

    3/02/201611:45:59 AM

    3/02/201612:37:05 PM

    3/02/20163:10:25 PM

    3/02/20164:01:18 PM

    3/02/20164:52:07 PM

    By-P

    rodu

    ct S

    igna

    l

    STD Good Bad

    Good

    BadBy-

    Prod

    uct S

    igna

    l

    3/02/201910:54:48 AM

    3/02/201911:45:59 AM

    3/02/201912:37:05 PM

    3/02/20193:10:25 PM

    3/02/20194:01:18 PM

    3/02/20194:52:07 PM

    Backed by ECI Technology’s Global SupportContact us for more details. Call or visit us online:

    Headquarters (USA)

    ECI Technology60 Gordon Drive, TotowaNew Jersey, 07512T: +1 (973) 890-1114E: [email protected]

    www.ecitechnology.com

    Global Offices

    Japan T: +81-45-620-4661E: [email protected]

    KoreaT: +82-31-262-8503E: [email protected]

    TaiwanT: +011-886-03-573-5899E: [email protected]

    Distribution Partners

    Cerma Precision, Inc. – JapanT: +03-3643-2921E: [email protected]

    ISI – IsraelT: +972-3-9232202E: [email protected]

    TELTEC North – GermanyT: +49-7-903-91-44-0E: [email protected] 

    TELTEC South – FranceT: +33-467-22-40-00E: [email protected]

    WESI Technology – ChinaT: +86-21-5058-0051E: [email protected]

    WKK DISTRIBUTION LTD.Hong KongT: +852-2357-8888E: [email protected]

    WKK SINGAPORET: +65 6741 7322DDI: +65 6469 6506E: [email protected]


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