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Beginning of Presentation IIT Bombay VLSI Technology (EE 669) CDEEP Autumn 2010 Prof. V. Ramgopal Rao
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Page 1: EE669 Lecture Slides Module 1

Beginning of Presentation IIT Bombay

VLSI Technology (EE 669)

CDEEP

Autumn 2010 Prof. V. Ramgopal Rao

Page 2: EE669 Lecture Slides Module 1

OVERVIEW

• Environment for VLSI Technology • Impurity Incorporation • Oxidation • Lithography • CVD Techniques • Metal Film Deposition • Plasma and Rapid Thermal Processing • Process Integration

Slide 2 IIT Bombay

Autumn 2010 Prof. V. Ramgopal Rao

Page 3: EE669 Lecture Slides Module 1

IIT Bombay IIT Bombay

PRE-REQUISITES

Bachelors degree in any branch of engineering

Slide 3

Autumn 2010 Prof. V. Ramgopal Rao

Page 4: EE669 Lecture Slides Module 1

IIT Bombay

REFERENCES

Slide 4

Autumn 2010 Prof. V. Ramgopal Rao

1. James D.Plummer, Michael D.Deal, Peter B.Griffin, Silicon VLSI Technology:

Fundamentals, Practice & Modeling, Prentice Hall.

2. The Sc ience and Eng ineer ing o f Microelectronic Fabrication, Stephen A. Campbell, Oxford University Press.

3. C.Y. Chang and S.M.Sze (Ed), ULSI Technology, McGraw Hill Companies Inc, 1996.

Page 5: EE669 Lecture Slides Module 1

IIT Bombay

REFERENCES

Slide 5

Autumn 2010 Prof. V. Ramgopal Rao

1.S.M. Sze (Ed), VLSI Technology, 2nd Edition,McGraw Hill, 1988.

2.Research Papers.

Page 6: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology

Course Code : EE 669

Department : Electrical Engg.

Instructor : Prof. V. Ramgopal Rao

E-Mail ID/ Website : [email protected]

www.ee.iitb.ac.in/~rrao/

Slide 6

Autumn 2010 Prof. V. Ramgopal Rao

Page 7: EE669 Lecture Slides Module 1

IIT Bombay

Module #1

Sub-Topics:

•World Semiconductor Industry

• MOS Transistor Basics

• Technology Scaling

• IC Fabrication Overview

VLSI Technology Module No.1 Prof. V. Ramgopal Rao

Slide 7

Page 8: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No.1 Prof. V. Ramgopal Rao

Slide 8

World Semiconductor Industry

Page 9: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 9

G.Moore, Intel

Page 10: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No.1 Prof. V. Ramgopal Rao

Slide 10

MOS Transistors-Enhancement Mode

Page 11: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 11

MOS Transistor - Saturation

Page 12: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No.1 Prof. V. Ramgopal Rao

Slide 12

I-V Characteristics

Page 13: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 13

Short-Channel Effects

Page 14: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 14

Inverter

(a) Multiplexer System

(b) Addressable array (Memory or Display)

Applications of Transistors

Page 15: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 15

Applications of Transistors

Amplifier Oscillator

Page 16: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 16

Impedance

Transformation Variable attenuator Variable phase

shifter

Applications of Transistors

Page 17: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 17

MOS Capacitors • “Metal” : metal, or

more frequently heavily doped poly-

Si

• “Oxide” : silicon dioxide, or some

other high k dielectric

• “Semiconductor” :

Si , but can also be SiGe, SiC

Page 18: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 18

Basic MOS Structure

Page 19: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 19

MOSFET Operation – Linear Region

VDS < VGS-VT

Page 20: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No.1 Prof. V. Ramgopal Rao

Slide 20

MOSFET Operation – Saturation

Page 21: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 21

NMOS Transistor Equations

Linear Region:

Saturation Region: For VDS > VGS-VT

Page 22: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 22

MOS Transistor Output Characteristics

( S. M. Sze, Physics of Semiconductor Devices, John Wiley ,1981)

Page 23: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No.1 Prof. V. Ramgopal Rao

Slide 23

MOS Transistor Subthreshold Characteristics

Subthreshold Swing:

60 – 100 mV/decade

Page 24: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 24

MOS Transistor Subthreshold Characteristics

Subthreshold Swing:

60 – 100 mV/decade

Page 25: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 25

Scaling W=0.7, L=0.7, Tox=0.7

L a t e r a l a n d v e r t i c a l dimensions reduce 30 %

Area Cap = C = (0.7 X 0.7)/0.7 = 0.7

Capacitance reduces by 30 %

Die Area = X x Y = 0.7x0.7 = 0.72 => Die area reduces by 50 %

Page 26: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 26

Scaling Vdd=0.7, Vt=0.7, T ox=0.7,

= 0.7

T= (C x Vdd )/I = 0.7, Power = CV2f = 0.7 x 0.72

0.7 = 0.72

=> Delay reduces by 30 % and Power reduces by 50 %

Page 27: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 27

Exercise

Assuming a constant scaling factor of 0.5 for various critical MOSFET parameters, calculate the performance improvement in terms of package density, power and speed for an ideal CMOS process as one scales the technologies from one generation to the next. Compare the results for the case where the scaling factor is 0.7.

Page 28: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 28

With a scaling factor of 0.5, the package density increases by 4X, Capacitance decreases by a factor: 0.5 (50% reduction) , Drive current I decreases by 0.5 (50% reduction), Delay decreases by 0.5 (or 50% ), Dynamic power: CV2f = 0.25 (decreases by 4 times)

Solution

Page 29: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 29

IC Fabrication

•Clean Room •Wafer Cleaning Technology •Oxidation •Lithography •Etching •Epitaxy •Dielectric and Polysil icon Film Deposition

Page 30: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 30

IC Fabrication…

•Diffusion and Ion Implantation Processes •Conventional and Rapid Thermal Annealing •Metallization •Planarization Techniques -Chemical-Mechanical Polishing (CMP) •Salicidation •Process Integration

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IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 31

Vt Control MOSFET –poly gate process

Page 32: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 32

Fabrication-NMOSFET (1)

(2)

(3)

Page 33: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 33

Fabrication-NMOSFET…

(4)

(5)

(6)

Page 34: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 34

Fabrication-NMOSFET (cont’d) (7)

(8)

(9)

Page 35: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 35

Fabrication-NMOSFET (cont’d)

(10)

(11)

Page 36: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No.1 Prof. V. Ramgopal Rao

Slide 36

(Stephen A. Campbell, “The science and engineering of microelectronic fabrication,” Oxford Univ. Press.)

Page 37: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 37

(Stephen A. Campbell, “The science and engineering of microelectronic fabrication,” Oxford Univ. Press.)

Page 38: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 38

(Stephen A. Campbell, “The science and engineering of microelectronic fabrication,” Oxford Univ. Press.)

Page 39: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 39

(Stephen A. Campbell, “The science and engineering of microelectronic fabrication,” Oxford Univ. Press.)

Page 40: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 40

NMOS Inverter with Depletion Load

Inverter in IC form

Page 41: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 41

Fabrication-NMOS inverter

Bird’s beak,

limitation in LOCOS

Page 42: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 42

Fabrication-NMOS inverter…

Page 43: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 43

Inverter Fabrication (Cont’d)

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IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 44

Inverter Fabrication (Cont’d)

Page 45: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 45

Inverter Fabrication (Cont’d)

Page 46: EE669 Lecture Slides Module 1

IIT Bombay

VLSI Technology Module No. 1 Prof. V. Ramgopal Rao

Slide 46

Process Integration - Exercise


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