EFERENCE MTG-TAS-F-II-URD-2451 - European Space...

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MTG-TAS-F-II-URD-2451

DATE : 04/07/2013

ISSUE : 01 Page : 2/36

THALES ALENIA SPACE INTERNAL This document is not to be reproduced, modified, adapted, published, translated in any material form in whole or in part nor disclosed to any third party without the prior written permission of

Thales Alenia Space.

2013, Thales Alenia Space Template 83230326-DOC-TAS-EN/002

CHANGE RECORDS

ISSUE DATE § CHANGE RECORDS AUTHOR

1 04/07/2013 Initial issue C.Meuland

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DISTRIBUTION LIST

Company Name

ESA

KT

OHB

TAS

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TABLE OF CONTENTS

1. INTRODUCTION..................................................................................................................................................8

1.1 Purpose ............................................ ..........................................................................................................8

1.2 Field of application............................... .....................................................................................................8

1.3 Rules for the writing of the document .............. ......................................................................................8

2. GENERAL PRESENTATION OF THE FCI & IRS CRYOSTATS THE RMAL LINK ASSEMBLIES ..................9

2.1 Perspectives of the FCI & IRS Cryostats Thermal Lin k Assemblies....................................... .............9

2.2 Definition of the market ........................... .................................................................................................9

2.3 Definitions of the functions of the FCI & IRS Cryos tats Thermal Link Assemblies ....................... ....9

2.4 Reference frames ................................... ...................................................................................................9

3. DOCUMENTARY REFERENCE SYSTEM........................................................................................................10

3.1 Applicable documents ............................... .............................................................................................10

3.2 Applicable Norms and Standards..................... .....................................................................................10

3.3 Reference documents................................ .............................................................................................10

3.4 Order of precedence ................................ ...............................................................................................10

4. TERMS, DEFINITIONS, ABBREVIATED TERMS AND SYMBOLS .. ..............................................................11

5. SYSTEM ARCHITECTURE AND DEFINITIONS ................ ..............................................................................12

5.1 Links designation.................................. ..................................................................................................12

5.2 Thermal contacts faces designation ................. ....................................................................................13

5.3 Thermal conductance definition..................... .......................................................................................13

6. GENERAL REQUIREMENTS ............................... ............................................................................................14

7. ENVIRONMENTAL REQUIREMENTS......................... .....................................................................................15

7.1 Mechanical environment ............................. ...........................................................................................15

7.2 Thermal environment................................ ..............................................................................................15

7.3 Depressurisation ................................... ..................................................................................................15

7.4 EMC/ESD environments ............................... ..........................................................................................15

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7.5 Radiation environments ............................. ............................................................................................15

7.6 Cleanliness environments........................... ...........................................................................................16

8. OPERATIONAL REQUIREMENTS........................... ........................................................................................17

8.1 Life cycle ......................................... .........................................................................................................17 8.1.1 Ground life cycle ...................................................................................................................................17 8.1.2 Launch life cycle....................................................................................................................................18 8.1.3 In-orbit life cycle ....................................................................................................................................18

9. FUNCTIONAL REQUIREMENTS............................ ..........................................................................................20

10. OPERATIONAL REQUIREMENTS ........................... ...................................................................................21

10.1 Environments....................................... ....................................................................................................21 10.1.1 Mechanical environment...................................................................................................................21 10.1.2 Thermal environment........................................................................................................................24

11. PERFORMANCE REQUIREMENTS ............................................................................................................25

11.1 Mechanical Requirements ............................ ..........................................................................................25 11.1.1 Stiffness requirements ......................................................................................................................25

11.2 Thermal Requirements ............................... ............................................................................................26 11.2.1 FCI specific thermal requirements....................................................................................................26 11.2.2 IRS specific thermal requirements....................................................................................................27 11.2.3 FCI & IRS common thermal requirements........................................................................................28

11.3 Electrical Requirements ............................ .............................................................................................29

11.4 Cleanliness Requirements ........................... ..........................................................................................29

12. DESIGN REQUIREMENTS...........................................................................................................................30

12.1 Cleanliness........................................ .......................................................................................................30

12.2 Mechanical design requirement...................... .......................................................................................30

12.3 Thermal design requirement ......................... .........................................................................................30

12.4 Transport, handling and storage .................... .......................................................................................30

13. INTERFACE REQUIREMENTS ....................................................................................................................31

14. VERIFICATION AND TEST REQUIREMENTS ................. ...........................................................................32

14.1 Verification ....................................... ........................................................................................................32

14.2 Test specific requirement.......................... .............................................................................................33 14.2.1 Mechanical tests ...............................................................................................................................33 14.2.2 Thermal tests ....................................................................................................................................33

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15. STORAGE, SHIPMENT, HANDLING, ON-GROUND OPERATIONS.. ........................................................34

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Table of Figures and tables

FIGURE 1 : FCI TLA PRESENTATION ..................................................................................................12 FIGURE 2 : IRS TLA PRESENTATION..................................................................................................12

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1. INTRODUCTION

1.1 Purpose

This User Requirement Document (URD) concerns the Flexible Combined Imager (FCI) and Infra-Red Sounder (IRS) Cryostats Thermal Links Assemblies (TLA) to provide to THALES ALENIA SPACE as part of the contract METEOSAT THIRD GENERATION (MTG). The URD constitutes the technical appendix of a contract that links the Contractor to THALES ALENIA SPACE, called hereafter the Customer. It is a document that expresses the needs of the product that THALES ALENIA SPACE wishes acquire. The URD specifies the services that the product shall provide to its users. In particular, it describes the performances and constraints that the product shall meet. The Contractor shall provide a product that shall be compliant with the THALES ALENIA SPACE requirements described in this URD. The validation of the product shall be performed according to the URD. On the technical point of view, the acceptance of the product shall be based on criteria that are defined in relation to the URD.

1.2 Field of application

This document is applicable to the supplier or contractor and its team charged with designing, developing, integrating, verifying and validating the FCI & IRS Cryostats TLA. The URD is used during all the development phases up to the acceptance of the product by THALES ALENIA SPACE.

1.3 Rules for the writing of the document

This document use international measure standards such as: • meter (m) is the unit of size, • second (s) is the unit for time, • euro (€) is the unit for cost, • kilogram (kg) is the unit for weight or mass, • degree Celsius (°C) is the unit for temperature, • cube meter (m3) is the unit for volume.

The text which is not labelled shall be considered as an explanation, which may be needed for better reader understanding and can help to clarify possible different interpretation, although it should be aimed that all requirement are worded as unambiguous, and verifiable. A labelling convention is used throughout this document.

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2. GENERAL PRESENTATION OF THE FCI & IRS CRYOSTATS THERMAL LINK ASSEMBLIES

2.1 Perspectives of the FCI & IRS Cryostats Thermal Link Assemblies

The FCI & IRS Cryostats TLA are parts of the cryogenic chain of the MTG FCI and IRS instruments. The FCI & IRS Cryostats TLA allow to connect the infer-red detectors with the cold fingers of the compressors in order to cool down at cryogenic temperatures the infra-red detectors and the focal planes with a minimum of gradient.

2.2 Definition of the market

METEOSAT THIRD GENERATION is inscribed within new projects conducted by the European Space Agency. All ESA technical standards will be used to study, develop, manufacture and validate the models. All European rules, laws and directives will be applied to this project.

2.3 Definitions of the functions of the FCI & IRS C ryostats Thermal Link Assemblies

The FCI & IRS Cryostats TLA allow to connect the infra-red detectors with the Cold Fingers Cold Tips of cryogenic coolers with a minimum of gradient with the capability to be assemblied and disassemblied at ambient temperature.

2.4 Reference frames

# Reference [MTG-II-TLA-CRY-URD-REQ-001]

The OBA FCI-TA Mounting Frame (R_OBA_FCITA), as described in [AD-29C], shall be used to define the FCI TLA location.

*


The IRS-TA Mounting Frame (R_IMF_IRS_PL), as described in [AD-29C], shall be used to define the IRS TLA location.

*

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3. DOCUMENTARY REFERENCE SYSTEM

This chapter provides the list of applicable and reference documents.

3.1 Applicable documents

Refer to list provided within the dedicated FCI & IRS TLA Specific SOW, document reference MTG-TAS-F-II-SW-2450.

3.2 Applicable Norms and Standards

Refer to list provided within the dedicated FCI & IRS TLA Specific SOW, document reference MTG-TAS-F-II-SW-2450.

3.3 Reference documents

Source document are the input of the present document. If one of these documents is updated, relevant requirements in the present document may change accordingly. ID DRL ref Title Reference RD01 MTG FCI Cryostat User Requirements Document (URD) MTG-TAS-F-CI-RS-0810 RD02 MTG FCI Cryostat Interface Requirements Document (IRD) MTG-TAS-F-CI-IS-0811 RD03 MTG IRS DEA User Requirements Document (URD) MTG-KT-IR-RS-0006 RD04 MTG IRS DEA Interface Requirements Document (IRD) MTG-KT-IR-RS-0001

3.4 Order of precedence

The TRD specifies the solution that has been selected by the contractor to cover THALES ALENIA SPACE needs (cf. URD and IRD) and the development of the product is performed according to the TRD requirements. Any detected inconsistency between TRD and URD shall be transmitted to THALES ALENIA SPACE for its treatment. For the contractual point of view with respect to THALES ALENIA SPACE, by lack of precision, the URD has precedence on the TRD.

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4. TERMS, DEFINITIONS, ABBREVIATED TERMS AND SYMBOL S

All acronyms and abbreviations are listed in document [AD-26C-01]. Specific terminology: TLA : Thermal Link Assembly

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5. SYSTEM ARCHITECTURE AND DEFINITIONS

5.1 Links designation

The Thermal Links Assembly joins the 2 Cold Tips to the Detectors with an additional point on the focal plane. The number of detectors is equal to 2 for IRS (LWIR Detector & MWIR Detector) and 4 for FCI (IR1 DA, IR2 DA, IR3 DA & NIR DA). The additional interface available on the Cold Plate (CP) for FCI and on the Cold Box (CB) for IRS can also be a mechanical one in order to allow compliance wrt Detectors and Cold Tips reduced loads constraints.

T_CT1 T_CT2

T_IF

T_CT1 T_CT2

T_IR1 T_IR2 T_IR3 T_IR4 T_CP

Figure 1 : FCI TLA presentation

Figure 2 : IRS TLA presentation

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5.2 Thermal contacts faces designation

Each thermal contact face of the end-fitting of TLA are designated as follows (see figures): - Thermal contact between TLA / Cold Tips : TLA-CT-(N°CT).(N°Face)

� At Cold Tip 1 side : � TLA-CT-1.1 & TLA-CT-1.2, � At Cold Tip 2 side : � TLA-CT-2.1 & TLA-CT-2.2,

- Thermal contact between TLA / Detectors: TLA-DA-(DA Name) � For FCI : TLA-DA-IR1, TLA-DA-IR2, TLA-DA-IR3, TLA-DA-NIR, � For IRS : TLA-DA-LWIR & TLA-DA-MWIR

- Thermal Contact between TLA / Cold Plate or Cold Box : � For FCI : TLA-CP, � For IRS : TLA-CB.

Nota: Thermal contact faces exact definitions and localizations are given in [AD-03-IITLA-02]. Thermal conductance definition

Thermal conductance (including contact conductance) between two thermal contact faces is to be understood as the transiting flux divided by the difference between average temperatures of each face. For thermal contact at Cold Tip sides, a single average will be made for TLA-CT-1.1 and TLA-CT-1.2 and for TLA-CT-2.1 and TLA-CT-2.2.

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6. GENERAL REQUIREMENTS


If not explicitly stated, all the requirements contained in the present document have to be considered as applicable over the complete mission lifetime.

*

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7. ENVIRONMENTAL REQUIREMENTS

7.1 Mechanical environment


The TLA shall withstand the mechanical environments defined in [AD-36C].

*

7.2 Thermal environment


The TLA shall be designed to withstand the thermal environment as defined in [AD-36C].

*

7.3 Depressurisation


The TLA shall be designed to withstand the depressurisation profiles described in [AD-36C].

*

7.4 EMC/ESD environments


TLA design and performances shall be compatible with EMC/ESD environments defined in [AD-37C].

*

7.5 Radiation environments


TLA design and performances shall be compatible with radiation environments defined in [AD-36C] with an aluminium thickness shield equivalent to 3.8mm (TBC).

*

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7.6 Cleanliness environments


TLA design and performances shall be compatible with cleanliness environments (particular and molecular) as defined in [AD-60-I].

*


When delivered, the contamination level of the TLA shall be less than: � Contamination by molecules: 5.10-8 g/cm² (TBC), � Contamination by particles: 100 ppm (TBC).

*


The material used shall meet the following outgassing criteria:

Mass of material concerned (g) CVCM (%) TML (%) > 100 < 0.01 <0.1

10-100 < 0.05 < 1 < 10 < 0.1 < 1

Table Outgassing requirement

Note: CVCM defines the percentage of Collected Volatile Condensable Material, and TML is the Total Mass Loss

*


The materials not compliant with the preceding requirements shall be submitted to a bake-out. Also, when contamination predictions exceed the allocated contamination budget, a bakeout shall be performed (see AD-60I).

*

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8. OPERATIONAL REQUIREMENTS

8.1 Life cycle

The TLA life cycles after delivery are the following: - A ground life cycle including: carrying of the equipments, integration of the equipments on the cryostat,

radiometric and environmental test in the instrument configuration, radiometric and environmental tests in the satellite configuration, different storage phases,

- A launch life cycle, - An in-orbit life cycle.


During the whole life cycle, the TLA shall be operated without degradation considering icing effects (chemical effects…).

*

8.1.1 Ground life cycle


The TLA shall be designed so that required performances are met throughout the ground lifetime defined hereafter: � 5 years for AIT at instrument and satellite level, � 10 years on ground storage, as specified in [AD-33c],

*


For FM models using refurbished EM models, the on-ground lifetime shall be extended by 4 years (TBC) or the Contractor shall guarantee the minimum lifetime defined in lifetime requirement starting from the delivery of the refurbished model.

*


The TLA designs shall be compatible with the following atmospheric conditions during transport: � Pressure: Atmospheric conditions, � Relative humidity: 55% ±10%, � Air temperature [+5°C, +35°C].

*


The TLA designs shall be compatible with the following atmospheric conditions during AIT activities (including on launch site):

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� Pressure: Atmospheric conditions, � Relative humidity: 55% ±10%, � Air temperature [+19°C, +25°C].

*


The TLA designs shall be compatible with following atmospheric conditions during storage at unit level (TLA packed with nitrogen at pressure environment): � Pressure: Atmospheric conditions, � Relative humidity: < 10%, � Air temperature [+20°C, +22°C].

*


The TLA designs shall be compatible with 10-8mbar vacuum environment for ground testing.

*


In ground life cycle, the TLA shall withstand a number of 280 deep thermal cycles without suffering any performance degradation. Deep thermal cycle is to be considered as thermal cycle between qualification min and max temperatures as per [MTG-II-TLA-CRY-URD-REQ-032].

*

8.1.2 Launch life cycle

No specific requirement

8.1.3 In-orbit life cycle


The TLA shall be designed so that required performances are met throughout the in-orbit life time defined hereafter: � 8.5 years specified in on-orbit lifetime as defined in [AD-33c].

*


The TLA designs shall be compatible with a 10-8mbar vacuum environment for flight operational conditions.

*

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In-orbital life cycle, the TLA shall withstand a number of 20 deep thermal cycles without suffering any performance degradation. Deep thermal cycle is to be considered as thermal cycle between qualification min and max temperatures as per [MTG-II-TLA-CRY-URD-REQ-032].

*

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9. FUNCTIONAL REQUIREMENTS


The Thermal Links Assemblies shall support the following main primary functions: - FP1: to provide the “Mechanical function”

- FP1.1 : to provide “Mechanical disturbances management function“, - FP1.2 : to provide “Microvibrations management function“,

- FP2 : to provide the “Thermal function” - FP2.1 : to provide “Thermal conductive coupling function”, - FP2.2 : to provide “Thermal radiative decoupling function”.

*


The Thermal Links Assemblies shall support the following main constraint functions: - FC1 : to be Environment adapted, - FC2 : to be Launcher adapted, - FC3 : to be Operable, - FC4 : to be Moniterable, - FC5 : to be Reliable, - FC6 : to be Available, - FC7 : to be Maintainable, - FC8 : to be Safe.

*


The Thermal Links Assemblies shall support the following main support functions: - FS1 : to be adapted to the mechanical interfaces, - FS2 : to be adapted to the thermal interfaces.

*

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10. OPERATIONAL REQUIREMENTS

10.1 Environments

10.1.1 Mechanical environment


For TLA, launch quasi-static qualifications levels are given in the following table: (TBC)

Axes Level (g) ⊥ (Cold Finger longitudinal Axis) 50

// (Cold Finger perpendicular Axes) 50

*


For TLA, launch sine vibrations qualifications levels are given in the following table: (TBC)

Frequency // Axes (CF perpendicular axes)

⊥⊥⊥⊥ Axis (CF longitudinal axis)

5-100 Hz 50 50

Sweep rate: 2 Octave / minutes (TBC)

*


The TLA shall withstand the following qualification random vibration input levels (TBC) :

Random Qualification Levels Out of plane level

(Cold Fingers longitudinal axis) In-plane level

(Cold Fingers perpendicular axes) 20 – 100 Hz +6 dB/Oct (TBC) 20 – 100 Hz +6 dB/Oct (TBC) 100 – 500 Hz 1 g²/Hz (TBC) 100 – 500 Hz 1 g²/Hz (TBC) 500 – 2000 Hz -6 dB/Oct (TBC) 500 – 2000 Hz -6 dB/Oct (TBC)

Duration 240 seconds Duration 240 seconds

*

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The TLA shall withstand the following qualification shock vibration levels (TBC) :

Frequency (Hz) SRS (Q=10) Qualification Levels (on each axis) (X, Y & Z R_OBA_FCITA / X, Y & Z R_IMF_IRS_PL)

100 5 g 1000 500 g 10000 500 g

*

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For TLA, the relative displacements between the focal planes (DA, Cold Plate I/F or Cold Box I/F) end-fitting (fixed condition) and the Cold Tip end-fittings (moving parts) during launch are as described here-below (all values to be considered as qualification levels): � Maximum displacement is ±6mm all axes (TBC), � Each axis shall be tested separately, � The cumulated number of cycles for the 3 axes is given in function of relative displacements in the figure

and table hereafter, � Dynamic relative displacements to be cumulated over static displacement as per [MTG-II-TLA-CRY-URD-

REQ-047]

� The frequency ranges associated with maximal relative displacements for frequency < 100Hz are given

hereafter:

*


For TLA, the total added duration of launch environment for each axis is of 20 minutes (TBC), with continuous segments of 240 seconds (TBC) (several tests on ground + launch).

*

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10.1.2 Thermal environment


Thermal links shall not show any performance degradation after being submitted to the thermal environment defined below. (TBC) For FCI:

Acceptance Qualification Thermal Environment Min. Max. Min. Max.

TLA Cold Tip I/F 48K 313K 43K 318K TLA Detectors I/F 51K 313K 46K 318K

For IRS:

Acceptance Qualification Thermal Environment Min. Max. Min. Max.

TLA Cold Tip I/F 45K 313K 40K 318K TLA Detectors I/F 48K 313K 43K 318K

*

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11. PERFORMANCE REQUIREMENTS

11.1 Mechanical Requirements

11.1.1 Stiffness requirements


For an average link temperature within [55K-60K] for FCI and [50K-55K] for IRS (TBC), the static stiffness of TLA assembly shall be less than :

- 2N/mm (TBC) along Y & Z Axes R_OBA_FCITA / X & Z Axes R_IMF_IRS_PL, - 6N/mm (TBC) along X Axis R_OBA_FCITA / Y Axis R_IMF_IRS_PL.

*

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11.2 Thermal Requirements

11.2.1 FCI specific thermal requirements


By considering temperatures and fluxes interface conditions, specified herebelow, the temperature at Cold Tip (T_CT1) of operating Cold Finger (T_CT1) shall be higher than: T_CT1 > T_DA – 3.2K . With:

− T_CT1 : the temperature at operating CFA Cold Tip

− T_CT2 : the temperature at non-operating CFA Cold Tip = 60K

− T_DA_IR1, T_DA_IR2, T_DA_IR3 and T_DA_NIR : the temperature at each detector TRP = 60K

− T_CP-TLA : the temperature on Cold Plate (CP) at TLA mechanical interface = 80K

− ΦIR1, ΦIR2, ΦIR3 and ΦNIR : the conductive flux from each detector at detector / STLA interface

• ΦIR1 = ΦIR2 = ΦIR3 = ΦNIR = ΦNom + (ΦCP-TLA max - ΦCP-TLA)/4

• ΦNom = 313mW (TBC)

− ΦCP-TLA, the conductive flux from Cold Plate at CP/TLA mechanical interface

− ΦCP-TLA, the specified conductive flux from Cold Plate at CP/TLA mechanical interface shall be included in the range : 230mW < ΦCP_TLA < 370mW (TBC)

− ΦCT2 : the conductive flux from non operating CFA Cold Tip at CFA/TLA mechanical interface = 800mW (TBC)

− ΦRad, the total radiative flux on TLA = 100mW (TBC) Nota:

o The ΦRad flux has to be spread on all the TLA parts.

o The ΦRad flux is established on a basis of an emissivity of 0.03 and an associated TLA external surface of 0.027262 m².

o According to the supplier proposed design (emissivity & surface), the ΦRad flux value could be recomputed.

− ΦCT1 : the flux on operating CFA Cold Tip at CFA/TLA mechanical interface

• ΦCT1 = ΦIR1 + ΦIR2 + ΦIR3 + ΦNIR + ΦCP-TLA + ΦCT2 + ΦRad = 2520 mW

The contact conductances are under supplier responsability.

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T_CT1 T_CT2

T_IR1 T_IR2 T_IR3 T_NIRT_CP

T_IF

ΦIR1

ΦIR2 ΦNIRΦ IR3

Φ CT1

ΦCP-TLA

ΦCT2

ΦRad

T_CT1 T_CT2

T_IR1 T_IR2 T_IR3 T_NIRT_CP

T_IF

ΦIR1

ΦIR1

ΦIR2

ΦIR2 ΦNIRΦNIRΦ IR3Φ IR3

Φ CT1Φ CT1

ΦCP-TLA

ΦCT2

ΦCT2

ΦRad

Note : Requirement is written by considering that CFA 1 is ON and CFA 2 is OFF but operating CFA may be either CFA 1 or CFA2

*

11.2.2 IRS specific thermal requirements


By considering temperatures and fluxes interface conditions, specified herebelow, the temperature at Cold Tip (T_CT1) of operating Cold Finger (T_CT1) shall be higher than: T_CT1 > T_DA -4K .

With: − T_CT1, the temperature at operating CFA Cold Tip

− T_CT2, the temperature at non-operating CFA Cold Tip = 54K

− T_DA (T_LWIR and T_MWIR), the temperature at both detectors TRP = 54.5K

− T_CB, the temperature on Cold Box (CB) at TLA mechanical interface = 100K

− ΦLWIR and ΦMWIR, the conductive flux from each detector at detector / STLA interface

− (If needed) ΦCB_TLA, the conductive flux from Cold Box at CB/TLA mechanical interface

− (If needed) ΦCB_TLA, the specified conductive flux from Cold Box at CB/TLA mechanical interface shall be included in the range : 0mW < ΦCB_TLA < 500mW (TBC)

− ΦCT2, the conductive flux from non operating CFA Cold Tip at CFA/TLA mechanical interface = 850mW (TBC) Nota:

o ΦCT2 flux has to be taken into account at the end of the inactive braid: it includes both conductive and radiative loads through this braid.

o The ΦCT2 flux is established on a basis of an emissivity of 0.03 and an associated inactive braid external surface of 0.007485 m².

o According to the supplier proposed design (emissivity & surface), the ΦCT2 flux value could be recomputed.

− ΦRad, the radiative flux onto TLA (TLA remaining parts = TLA without inactive braid) = 260mW (TBC)

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Nota:

o The ΦRad flux has to be spread on all the TLA remaining parts.

o The ΦRad flux is established on a basis of an emissivity of 0.03 and an associated TLA remaining parts external surface of 0.023168 m².

o According to the supplier proposed design (emissivity & surface), the ΦRad flux value could be recomputed.

− ΦCT1, the flux on operating CFA cold tip at CFA/TLA mechanical interface

• ΦLWIR = 520 + (ΦCB_TLAmax - ΦCB_TLA)/2

• ΦMWIR = 500 + (ΦCB_TLAmax - ΦCB_TLA)/2

• ΦCT1 = ΦLWIR + ΦMWIR + ΦCB_TLA + ΦCT2 + Φrad = 2630 mW

The contact conductances are under supplier responsability.

Note : Requirement is written by considering that CFA 1 is ON and CFA 2 is OFF but operating CFA may be either CFA 1 or CFA2

*

11.2.3 FCI & IRS common thermal requirements


To ensure radiative decoupling, the external coatings emissivity of TLA (except screws, screw compensation systems and shrinked areas) shall be lower than 0.03. Note : A radiative decoupling by double side VDG SLI is ensured by Customer around screws and screw compensation system.

*

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11.3 Electrical Requirements


Each thermal link shall have an electrical resistivity less than 20.10-3 Ohms between end-fittings.

*

11.4 Cleanliness Requirements


The thermal link shall be cleanable with isopropyl alcohol (IPA).

*


Bake-out conditions in case of use of SLI shall be [353K during 72h at 10-5 Torr] (TBC).

*

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12. DESIGN REQUIREMENTS

12.1 Cleanliness


Each link out-gassing rate shall be compliant with the following values: � TML<0.1%, � CVCM<0.01%.

*


Links design and chosen materials shall not generate particulate contamination.

*

12.2 Mechanical design requirement


In ground life cycle, the TLA shall be mountable and dismountable at least 30 times (TBC) at ambient temperature whatever the number of deep thermal cycles underwent and this without any performance degradation.

*

12.3 Thermal design requirement


Links design shall ensure that no internal thermo-elastic constraints are generated when thermally cycled as per [AD-03-IITLA-01].

*

12.4 Transport, handling and storage


Dismountability of the SLI covering TLA (if needed) shall be ensured without thermal link damage.

*

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13. INTERFACE REQUIREMENTS


The FCI and IRS thermal links design and geometry shall be respectively consistent with [AD-03-IITLA-02].

*


Each TLA shall meet performance requirements with a static relative displacement between both Cold Tips end-fittings in all axes of ±1mm (TBC).

*


TLA shall meet performance requirements with a static relative displacement between both Detectors end-fittings in all axes of ±0.5mm (TBC).

*


The TLA interfaces with each detector shall be compliant with [AD-03-IITLA-02] (TBC).

*


Thermal test configuration shall ensure homogeneous heat flux condition over the whole of TLA-CT area.

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Thermal test configuration shall ensure homogeneous heat flux condition over the whole TLA-DA area.

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DATE : 04/07/2013

ISSUE : 01 Page : 32/36




14. VERIFICATION AND TEST REQUIREMENTS

14.1 Verification


The TLA contractor shall perform verification according to: - [AD-58C] : MTG Requirements & Verification Management Process, - [AD-02-IITLA-02] : Specific Statement of Work for FCI & IRS Cryostats TLA.

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DATE : 04/07/2013

ISSUE : 01 Page : 33/36




14.2 Test specific requirement

14.2.1 Mechanical tests


For all configurations of mechanical tests, the nominal position of the thermal(s) link(s) shall be the position given in the Interface Requirement Document [AD-03-IITLA-02] with cumulated static displacement (according to §6), which corresponds to the theoretical flight position.

*

14.2.2 Thermal tests


For each configuration test of thermal gradient measurement, an uncertainty budget, to be applied to final gradient measured value, shall be given and properly justified.

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For each configuration test of thermal gradient measurement, relative uncertainty budget shall be less than 5%.

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DATE : 04/07/2013

ISSUE : 01 Page : 34/36




15. STORAGE, SHIPMENT, HANDLING, ON-GROUND OPERATIO NS

The requirements of section §3.7 and §3.13 of [AD-33C] are applicable to the Thermal Links Assemblies.


The design of the Thermal Links Assemblies shall enable the integration, the hand transportation and the access to the interfaces with Detectors and Cold Tips for the operators during system AIT.

*


The Thermal Links Assemblies shall be designed to be integrated (assembly and disassembly) during the AIT phase through a diameter equal to 94mm for FCI and xx mm for IRS (see AD-03-IITLA-02).

*


All necessary hooking points or tools for handling shall be provided and marked as such for any handling operation during transport, storage, integration and ground tests.

*

Note: If special tools are needed they will be isolated in order not to cause short circuits.


The Thermal Links Assemblies shall be protected during storage, shipment, handling and on-ground operations, so that it does not undergo mechanical or thermal conditions levels that exceed acceptance levels specified herein.

*


For storage phase, the Thermal Links Assemblies shall be packed in a packing filled and sealed with nitrogen atmosphere under ambient pressure.

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The Thermal Links Assemblies packing, when filled and sealed with nitrogen atmosphere under ambient pressure shall guarantee the nitrogen presence inside the packing for a period greater than 1 year.

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DATE : 04/07/2013

ISSUE : 01 Page : 35/36





Environmental control shall be implemented to prevent any performance degradation.

*


All parts, materials and processes selected for the Thermal Links Assemblies shall demonstrate compatibility with such extended required storage durations with minimum refurbishment.

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Adhesives, coatings and non metallic materials selection shall take into account the required storage period.

*


The need for intervention on the Thermal Links Assemblies during the storage period shall be minimized by design.

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REFERENCE :


DATE : 04/07/2013

ISSUE : 01 Page : 36/36




END OF DOCUMENT

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