DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
– ASIC 26– View, Dimensions & Marking– Delayering– Main Blocks Identification– Process Identification– Cross-Section – Process Characteristics
– MEMS oscillator 40– View, Dimensions & Marking– Sensing Area Details– Cross-Section– Process Characteristics
4. Manufacturing Process Flow 51– Global Overview– ASIC Process Flow– ASIC Wafer Fabrication Unit– MEMS oscillator Process Flow– MEMS oscillator Wafer Fabrication Unit– Packaging Process Flow – Packaging Assembly Unit
5. Cost Analysis 61– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC 66
– ASIC Front-End Cost– MEMS oscillator 69
– MEMS Front-End Cost– MEMS Front-End Cost per process steps– MEMS Front-End Cost per equipment– MEMS Front-End Cost per materials– MEMS Probe Test & Dicing Cost– MEMS WLP Cost– MEMS Wafer & Die Cost
– Packaging Cost 80– ASIC WLP Cost– Final WLP Cost– Packaging cost per process step– Back-End : Final Test & Dicing Cost
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
