Electronics & Semiconductor Development NX CAE A...

Unrestricted © Siemens AG 2014 All rights reserved. Smarter decisions, better products.

NX CAE

A Modern Simulation Environment

Electronics & Semiconductor Development

Unrestricted © Siemens AG 2014 All rights reserved.

Siemens PLM Software

• The ‘Profit Window’ is narrow

for Electronics and Computer

manufacturers

• Time-to-Market tends to grow

due to increased complexity

• Time-in-Market continues to

shorten

Consumer and Industrial Electronics Already Have a

Narrow ‘Profit Window’



Early Concept Analysis

Virtual testing allows

early concepts to be

refined, reducing

physical tests



Simulation Trends

Earlier and faster iterations

More complex phenomena

Larger models, systems

Increasing amounts of data



Geometry

Dust Analysis

Clearance Analysis

ECAD Updates

PCB Thermal Analysis

Transient PCB Heat Transfer Analysis

Structural Analysis

Life Analysis

Cooling Analysis

YY- Stress PSD

RMS=19.7 MPa

Simulation Challenges Today

Complex Workflows

Analysis Data



People

• Expert analysts

Simulation

Data

• Work in progress

• Variants

Simulation Today

Lack of a Cohesive Environment

Simulation

Processes

• Capture

• Re-use

Simulation

Software

• Various pre/post tools

• Many solvers



Evolution of the Role of CAE

Modern Simulation Environments

“CAE is evolving from being a set of

‘black box tools’ for highly

specialized individuals toward a

group productivity environment

that delivers strategic competitive

advantages to the business by

supporting simulation-driven design.”



People:

• Expert analysts

Simulation

Data


• Variants

Modern CAE Environment

Delivering Competitive Advantages

Simulation

Processes

• Capture

• Re-use

Modern

Simulation

Environment

People

• Expert analysts

• Designers /

Design

Engineers



People

• Expert analysts

• Designers /

Design

Engineers

Simulation

Data


• Variants

Modern CAE Environment

Delivering Competitive Advantages

Simulation

Processes

• Capture

• Re-use

SPM

KBE

Modern

Simulation

Environment

Smarter

Decisions

Training

Support

SDM



Elements of a Modern Simulation Environment

Integrated Modeling and Solutions

Multi-Discipline Simulation and Optimization

System Level Modeling and Simulation

Simulation Data and Process Management




Aligned with Electronics Simulation Trends

Earlier and faster iterations

More complex phenomena

Larger models, systems

Increasing amounts of data







NX CAE


Data Management & Automation Simulation Driven Design

Flow Motion

Simulation Modeling Structural

Multiphysics

Thermal

Optimization



Designer

Embedded in NX CAD

Simulation wizards

Part validation

Stress & vibration

Guided process

NX Nastran solver

Design Engineer

Embedded in NX CAD

Part / assembly validation

Statics / modal / thermal

Motion analysis

Clearance & interference

NX Nastran solver

Expert Analyst

Works with Non-NX geometry

Modern, role-based interface

Superior geometry editing

Powerful FE modeling tools

Linear, dynamics, non-linear,

thermal, flow, motion,

optimization, multiphysics

NX Nastran + Multiple solver

environments

Problem Complexity

User

Scalable Simulation Capabilities

For all User Levels



Global NX CAE Customers

Electronics and Semiconductors

Advantest Alpine Electronics ALPS Electric Amphenol Analogic

Applied Materials ASML Bose Camera Dynamics Canon

Casio Computer Cisco Systems Com Dev Dalsa Semi Datalogic

Eastman Kodak Electro Scientific Electrolux EMS Technologies Enplas Semi

Ericsson Foster Electric Freescale Semi Fuji Electric Fujitsu

Funai Electric Futaba Grupo SEB Haier Hitachi

IBM Japan Radio Juki Kenwood Konica Minolta

Kyocera LAM Research Leica Lexmark LG Electronics

Matsushita Methode Electronics Mitsubishi Electric Mitsumi Electric Multitest

NEC Netel Communication Nikon Nokia Oki Electric

Olympus Onkyo Panasonic Parker SSD Drives Pentax

Philips Pioneer Radiacon y Microndas Ricoh Rohm

Samsung Sanyo Seagate Seiko Sharp

Shure Siemens AG Sony Telephonics Corp Thomson

Toshiba Tyco Electronics Wincor Nixdorf Xerox Yokogawa Electric

•Reduced physical

prototypes by 30%

• Improved time to

market and product

quality

“Since introducing NX, we

are able to perform

repeated simulations

during the design stage.

This has helped us

reduce our development

lead times and lower

prototyping costs.”

Shinji Yoda General Manager

System-LSI Design Support

Department

“The ability to work in a

highly integrated

environment, where design

concepts could be quickly

evaluated against all

requirements, was critical to

the success of this program.”

Greg HoughtonSenior Engineer











Leverage geometry for faster CAE analysis modeling

Fast, easy-to-use geometry tools

Automatic clean up of CAD models

Rapid, robust midsurfacing

Quick creation of fluid domain

Associative to design for rapid updates

Open, multi-CAE solver support(Nastran, ANSYS, Abaqus, LS-Dyna)



The Traditional CAE Process

Find &

Import Data Repair & Edit Geometry Mesh

Loads &

BCs

Part

DesignAnalysis Modeling Solve Evaluate



Traditional CAE Process

NX CAE vs. Traditional CAE

Faster initial iteration

Rapid update for later

iterations



Integrated Geometry Access

Integrated into both NX and

Teamcenter

Instant access to the correct model

definition

Eliminates risk of translating geometry

Locate and re-use existing models

Reduces time to start process of CAE

modelling



Integrated Geometry Tools

CAE performed on a geometry variant

Intuitive and fast direct geometry editing

with Synchronous Technology

Create the geometry required for CAE

quickly

NX ease-of-use combined with user roles

to tailor UI



Rapid creation of fluid geometry

Surface wrap fluid domain

Quickly creates meshable fluid domain

geometry

“Wraps” interior of complex assemblies

Benefits:

Greatly simplifies fluid domain creation

in complex parts or assemblies

From hours to seconds

Associativity to design is unique to NX



Meshes the most challenging

geometry

Best-in-class tet mesher

NX knowledge based approach to

meshing and geometry simplification

Robust automatic and manual mesh

options for 1D, 2D and 3D meshes

Efficient connection modeling

Comprehensive Meshing



Rapid Iteration of CAE Models

Adapt quickly to changes in

geometry

Geometry edits and mesh associativity to

design geometry

Reduce build time for subsequent model

iterations

Analysts able to perform geometry

changes for what-if analysis



Simulation Modeling

Examples

Defeaturing imported geometry using Synchronous

Technology

Fast, accurate mid-surfacing

Surface wrapping for fast, accurate fluid domain geometry

Fluid domain creating and meshing

ST Plastic Case.mp4

Modeling Demo.mp4

NXCAE9_PL_AdvSurfaceWrap_short2.mp4

SurfaceWrap-ThermalCamera.mp4



KEF

Case Study

Business challenges:

Achieve ongoing innovation

Establish new concepts quickly in order to claim

intellectual property rights

Extend sound technology while adhering to cost targets

Keys to success:

Linking mechanical models and FEA models

Establishing data history and associativity

Easily creating sophisticated surfaces

Results:

Easy and quick path to FEA models

Rapid product development, which enables faster

process to new patent applications

Significantly reduced prototypes and associated costs

Robust modeling of abstract ideas, resulting in greater

innovation

Two or three new loudspeaker ranges per year (the

equivalent of 25-30 new products annually)

“The NX associated modeling and

meshing capability represents an

extremely powerful tool.”

Mark Dodd

Head of Group

Research










Geometry

Dust Analysis

Clearance Analysis

ECAD Updates

PCB Thermal Analysis

Transient PCB Heat Transfer Analysis

Structural Analysis

Life Analysis

Cooling Analysis

YY- Stress PSD

RMS=19.7 MPa

Many Types of Analyses

Analysis Data




Structural, thermal, flow and motion

Geometry and FE parameter

optimization

Streamlined multiphysics solutions

Scalable performance on HPC

Broad range of physics simulation solutions in a single environment



NX CAE

Solutions for Electronics in One Environment

OptimizationStructuralThermal

ManagementMechatronics

Stress / Strain

Drop test

Vibration

Dynamic

response

Durability

Test correlation

Geometry

Thermal / flow

characteristics

FE parameters

Thermal-Flow

Steady-state

Transient

Convection

Conjugate Heat

Transfer

Co-simulate

motion with

control systems

Rigid & flexible

bodies

Package space



Structural Analysis

Understand structural performance of external and interior components

Applications

Drop test

Vibration

Product life

Manufacturing

Capabilities

Linear &

nonlinear

Dynamics

Durability

Test correlation

Composites



Device

• Thermal imaging camera for

detecting heat

Load

• Drop from a height of 1 meter

• Assume lands on side with

screen

Evaluate

• Stress and deflections of

internal boards

Structural Analysis

Example: Drop of Thermal Camera



Structural Analysis


Nonlinearities

Elastic-plastic case

material (polycarbonate)

Contact between case and

ground

Large displacement

Initial conditions

Velocity at impact of 4427

mm/sec



Stress at contact

• Max Von Mises:

• Corner of camera screen

• 70 MPa at .0017 sec

Structural Analysis


Von Mises Stress at .0017 sec



Structural Analysis

Example: FADEC Dynamic Performance

Purpose

• Full Authority Digital Electronics Control

(FADEC) is computer to control aircraft

engine performance

• Subject to engine unbalance loads

(harmonic)

Load Definition

• Apply base excitation loads to brackets

• Loads represent motion of engine case

in operation

• Obtain from engine model or test

Evaluate

• Peak acceleration loads on PCB

• Stress in brackets

Engine

unbalance load



Structural Analysis


VM Stress at 90 Hz (psi) Z Acceleration (g)

Contour Response at 90 Hz (5400 RPM)



Structural Analysis


VM Stress in Bracket Acceleration on PCB



Thermal Management

Predict thermal performance of components and the entire system

Applications

Electronic

systems cooling

Fan operating

conditions

Heat sink

modeling

Spacecraft

thermal

performance

Capabilities

Seamless, 2-

way coupling of

thermal and flow

solutions

Bi-directional

interface to EDA

design systems

Fan catalog



Electronic Systems Cooling

Example: Spatially Varying Thermal Conductivity

PCB Assembly

Compute

ConductivityReview

Discretization

Export ESC Model

Obtain Temperature Results



Thermal Management

Examples:



Thermal Analysis

Examples

Electronic systems cooling example

Electronics_demo.mp4



Mechatronics

Simulate interaction between mechanical systems and controls

Applications

Printer

mechanisms

Robots

Cameras

Sunroofs

Disk drives

Capabilities

Multi-body

dynamics

Rigid & flexible

bodies

Interference

checking



Motion Analysis

Examples

Co-simulation of sunroof motion with a control system

Co-simulation of sunroof motion with a collision control system

Sunroof1.mp4

Sunroof2.mp4



Optimization

Actively drive design using simulation

Applications

Increase airflow

Optimize

component

placement

Improve structural

performance

Correlate to test

results

Capabilities

Geometry

optimization

Thermal / flow

characteristics

FE parameter

optimization



Optimization

Examples

Optimize chip position on board based on temperature

GeomOptDemo-4.mp4



NASA Jet Propulsion Laboratory (JPL)

Case Study

Business challenge:

Tighter schedules

Large daily temperature swings during the

life of the mission

Keys to Success:

Single software platform (NX) from design

through manufacturing

Multi-discipline simulation with NX CAE

Results:

Faster design-analysis redesign iterations

More confidence in the hardware

modeling, the design implementation, and

mission simulations

NX was able to evaluate the thermal

control system’s performance under

conditions that JPL could not

simulate with physical testing.










NX CAE


Analogous to CAD assembly

Individual FE component models

Assembly model instances FE

components

Supports very large models

Distributed CAE Assembly Model



NX CAE

Test-Model Correlation

Quantitatively and qualitatively compare simulation with physical test

Correlate analysis with physical test

Correlate analysis with analysis

Ensure accuracy of reduced DOF

models

Pre-test planning to optimize sensor

locations

Optimize analysis model to better

reflect reality











Intelligent integration between design & simulation processes



Teamcenter for Simulation

External Reviews Show as Best Solution

Rated 5 vendors

(Altair, Ansys, Dassault/Simulia, MSC,

Siemens PLM)

Siemens PLM scored highest overall

Siemens PLM scored highest in each of

the four categories



Late Feedback to Designer

Late Feedback to Designer

The CAE Bottleneck

Designer

Designer

DesignerDesigner

Designer

Designer

Analyst

Analyst

http://upload.wikimedia.org/wikipedia/commons/6/60/User.svg




































http://upload.wikimedia.org/wikipedia/commons/1/12/User_icon_2.svg





Automation tools that can drive complex

analysis

Common architecture allowing plug-ins

Managed environment to distribute

process automation to enterprise

Guide designers through basic

simulation tasks

Automate simulation processes for analysts and designers



Simulation Knowledge Capture

Designer

Designer

DesignerDesigner

Designer

Designer

Analyst

Analyst

Simulation knowledge transfer

via automated NX process

More robust designs passed to

simulation for detailed analysis

…Through Automated NX Simulation

Processes Created by CAE Analysts









































Design Automation Associates

Case Study

Business challenge:

• Time-consuming, iterative analyses

required for engineered-to-order products

Business challenge:

• Integrated NX modeling and analysis

functionality

• NX Open embedded application

programming interface

Results:

• 40-hour iterative analysis process drops to

15 minutes

• Automated processes can be run by non-

analysts; NX users need little additional

training

• Less hand calculation reduces error

"The NX toolset is world-class

functionality."

John Lambert

President, CEO



Automation

Examples

Automated structural analysis of a circuit board

DAADemo.mp4



Integrated Modeling and

Solutions

Multi-Discipline Simulation

and Optimization

System Level Modeling and

Simulation

Simulation Data and Process

Management

NX CAE – A Modern Simulation Environment



Why Siemens?

A Heritage of Leading CAE Solutions

Nastran

NX CAE

NX Nastran

Teamcenter Simulation

Process Management



Why Siemens?

Major Investments in CAE for Product Development

“The integration of product development, simulation and

validation is now at the top of our agenda.”

Anton Huber, CEO

Siemens Industry Automation

“We are investing heavily in CAE … for multi-disciplinary

analysis throughout the product definition cycle.”

Chuck Grindstaff, CEO




Siemens acquires LMS International

Based on system simulation and test

Enabling mission-critical applications

and best practices

Embracing open strategies

Supported by world-class engineering

services

Providing unprecedented value to

customers

Providing a closed-loop, systems-driven product development solution



System Validation & Optimization

Collaboration between Imagine.Lab and NX CAE

Architecture & Sizing

Imagine.Lab

Detailed Design Validation & Optimization

NX CAD/CAE

System Integration &

Validation

Imagine.Lab




for Electronics & Semiconductor Development

Smarter decisions, better products

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