+ All Categories
Home > Documents > Electroplating process

Electroplating process

Date post: 30-Dec-2016
Category:
Upload: trantu
View: 217 times
Download: 0 times
Share this document with a friend
2
U.S. Patent 5,858,119. Jan. 12, 1999 M.D. Mayne, Las Cruces, N.M. A method of cleaning contami- nants from an ion exchange resin comprising introducing the resin to a cleaning vessel; introducing cleaning chemicals and water to the cleaning vessel, wherein a carrier medium is formed; draw- ing off carrier medium without resin; and recirculating the ion exchange resin and carrier me- dium. PMCOAnD ALUMINUM U.S. Patent 5,858,133. Jan. 12, 1999 S.G. Keener, assignor to McDonnell Douglas Corp., Long Beach, Calif A method for preparing precoated aluminum alloy articles. CONTROWNfi SOLUTION IN CONTINUOUS .. CTIIOPLAnNfl U.S. Patent 5,858,196. Jan. 12, 1999 Y. Ikenaga, assignor to Kawasaki Steel Corp., Hyogo, Japan A method of controlling a compo- nent concentration of a plating so- lution in continuous electroplat- ing of a metallic strip using a metal feeding device and an acid feeding device for feeding at least one metal and an acid, respec- tively, so that when a total amount of the plating solution varies from a preselected target value a feedback control changes it to a corrected target value. ANODIZING PIIOC... U.S. Patent 5,858,197. Jan. 12, 1999 H. Takahashi, assignor to Canon KK, Tokyo A process for manufacturing a substrate for an ink jet-recording head using anodic oxidation. IUCTIIOPLAnN8 PIIOa.. U.S. Patent 5,858,198. Jan. 12, 1999 S.M. Florio et al., assignors to Shipley Co. L.L.C., Marlborough, Mass. A process for depositing metal on the walls of openings passing through a metal-clad nonmetallic planar substrate having top and bottom planar surfaces compris- ing providing a dispersion of car- bonaceous particles in an aqueous medium within a treatment con- tainer; contacting the substrate with the dispersion to form a po- rous coating; saturating the po- rous carbonaceous coating with ifl1)D®1]!\1: © n 0 © I) C·rtAi.,l, not from our plAtinum elA" .no",. Qu.r.ntH th.t .U the joint. nev.r toueh." th, ItAr. eopp.r .I.etro",•• I"lip I!www.plaleworld.comllarryk... lml We cuatom tabricate your anode troa our platinum clad niobium atock; 125 or 250 microinch platinum clad, ainqla or double aided platinum, aolid or expanded meah, titanium/niobiuu trame and lead. Call ua tor written quote. Jaaaica NY 718-481-8141 Fax 718-481-9859'" Evaluate &Control any Plating Solution Easy, Accurate, Effective Affordable & Cost Efficient Single Source· complete selection of models plus rectifiers, agitators, anodes, cathodes & much more Immediate delivery Call forFREE Brochure Kocour 4800 outh 51. Louis Ave. Chicago. IL 60632 Tel: 773-847-1111 Fax: 773-847.3399 hllp:llwww.kocoumel.com ISO Circle 036 on reader information card Circle 039 on reader Information card 78 Metal Finishing
Transcript

U.S. Patent 5,858,119. Jan. 12, 1999M.D. Mayne, Las Cruces, N.M.A method of cleaning contami­nants from an ion exchange resincomprising introducing the resinto a cleaning vessel; introducingcleaning chemicals and water tothe cleaning vessel, wherein acarrier medium is formed; draw­ing off carrier medium withoutresin; and recirculating the ionexchange resin and carrier me­dium.

PMCOAnD ALUMINUMU.S. Patent 5,858,133. Jan. 12, 1999S.G. Keener, assignor to McDonnellDouglas Corp., Long Beach, Calif

A method for preparing precoatedaluminum alloy articles.

CONTROWNfi SOLUTION INCONTINUOUS..CTIIOPLAnNflU.S. Patent 5,858,196. Jan. 12, 1999Y. Ikenaga, assignor to KawasakiSteel Corp., Hyogo, JapanA method of controlling a compo­nent concentration ofa plating so­lution in continuous electroplat­ing of a metallic strip using ametal feeding device and an acidfeeding device for feeding at leastone metal and an acid, respec­tively, so that when a totalamount of the plating solutionvaries from a preselected targetvalue a feedback control changesit to a corrected target value.

ANODIZING PIIOC...U.S. Patent 5,858,197. Jan. 12, 1999H. Takahashi, assignor to CanonKK, Tokyo

A process for manufacturing asubstrate for an ink jet-recordinghead using anodic oxidation.

IUCTIIOPLAnN8 PIIOa..U.S. Patent 5,858,198. Jan. 12, 1999S.M. Florio et al., assignors toShipley Co. L.L.C., Marlborough,Mass.A process for depositing metal onthe walls of openings passingthrough a metal-clad nonmetallicplanar substrate having top andbottom planar surfaces compris­ing providing a dispersion of car­bonaceous particles in an aqueousmedium within a treatment con­tainer; contacting the substratewith the dispersion to form a po­rous coating; saturating the po­rous carbonaceous coating with

Wl®~l]l~ ifl1)D®1]!\1: © n 0 ~@L?

© I) l]l~)jIltll]l@)\1:n®l]l ~

C·rtAi.,l,not from ourplAtinum elA".no",.

Qu.r.ntHth.t .U thejoint. nev.rtoueh." th,ItAr. eopp.r.I.etro",••

I"lip I!www.plaleworld.comllarryk...lml

We cuatom tabricate your anode troa our platinumclad niobium atock; 125 or 250 microinch platinumclad, ainqla or double aided platinum, aolid orexpanded meah, titanium/niobiuu trame and lead.

Call ua tor written quote.

~.,. Jaaaica NY 718-481-8141 Fax 718-481-9859'"

• Evaluate &Control any PlatingSolution

• Easy, Accurate, Effective• Affordable & Cost Efficient• Single Source· complete selection

of models plus rectifiers, agitators,anodes, cathodes & much moreImmediate delivery

Call forFREE Brochure

Kocour4800 outh 51. Louis Ave.

Chicago. IL 60632Tel: 773-847-1111

Fax: 773-847.3399hllp:llwww.kocoumel.com

~ISO~~IQ~

Circle 036 on reader information card Circle 039 on reader Information card

78 Metal Finishing

~t;(/f\J-l'".,..l'..J.l.· •• '

an etchant for the metal claddingand maintaining contact for atleast 30 sec; removing the carbo­naceous coating with a liquidspray under a pressure of 15 to 50psi and electroplating metal on atleast those portions of the sub­strate with the carbonaceouscoating from an electrolytic metalplating solution.

APP"''IUS fOR IIAIIU.AC1UIllNeMnALUC..-u.s. Patent 5,858,200. Jan. 12, 1999T. Takahashi et aZ., assignors toBridgestoTU! Metalpha Corp., Tokyo

A method of manufacturing abundle of metallic fibers from adrawn multifiber wire, whichdrawn wire includes a plurality ofmetallic fibers and a metallic ma-

trix member having a higher dis­solvability than the metallic fiber,wherein the drawn wire is contin­uously conveyed through a plural­ity of electrolytic baths arrangedin series in a conveying directionof the wire, so as to remove thematrix member by electrolyticdissolution.

VAPOll~""'"

U.S. Patent 5,858,456. Jan. 12, 1999J. Nordlander, assignor to AppliedVacuum Technologies AB,Linkoping, SwedenA method ofcoating an object hav­ing a first surface to be coatedcomprising providing an evapora­tion chamber containing a sourceof metal having a first surface;creating a vacuum in the evapora-

tion chamber; coating the objectby placing the object in the evap­oration chamber so that the firstsurface of the object is opposed tothe first surface of the source ofmetal and is separated by a dis­tance, which is the same as or lessthan a largest diameter of the firstsurface of the object to be coated.

IILUOIIOIIASTOI_ coan_IlAVI... H.H THICIUI..U.S. Patent 5,858,467. Jan. 12, 1999D. Lenti et aZ., assignors toAusimont S.p.A., ItalyA process for preparing concen­trated and stable aqueous coatingcompositions based on fiuoroelas­tomer, capable of giving a protec­tive layer having high thicknesswithout the formation of sagging

. n "'est ChambersCorrosw ~l

Singleton CCT® ChAMbER

.:. Available with ControlledRelative Humidity

+ Tested & Certified Priorto Shipment

lSingleton3280 W. 67th Place, Cleveland, OH 44102

2161651-7800 • 2161651-4247www.singleton.corp

.) Performs New CyclicCorrosion Tests

.) Low Profile Design foreasy access

.. Test to ASTM, SAE, ISOSpecifications

Circle 034 on reader Information card Circle 058 on reader Information c.rd

October 1991 71


Recommended