Embedded Developer: May 2015

Embedded IoT Security

Revolution in Embedded Power

From the Earthrsquos Core to the ARMreg Core

A Tale of TwoLAYERSCAPES

MAY

201

5

CLICK HERECLICK HERE CLICK HERE

CONTENTS

Your Guide to Embedded MCUs and Development Tools

w w w e m b e d d e d d e v e l o p e r c o m

Everything yoursquore looking for in one place

4

6

18

14

26

32

TECH TRENDSTap Tap Tech A Developerrsquos Take on the IoT

TECH REPORTVerifiable Securityfor the Embedded Internet of Things

EEWEB FEATUREDesigning with the ldquoThingsrdquoof the ldquoInternet of Thingsrdquo

TECH REPORTImplementing the Software BackdoorThe Growing Need to Protect Your Code

COVER STORYA Tale of Two LayerscapesFrom the Earthrsquos Core to the ARM Core

TECH SERIESThe Power Revolution is HereGaN FETs Defeat Silicon in Power Characteristics

Figure13 213 Package13 resistance13 and13 inductance13 comparison13 between13 eGaN13 FETs13 and13 MOSFET13 packages13 [2]13

By Dave Hughes ndash CEO of HCC Embeddeddavehhcc-embeddedcom

The IoT is dragging embedded developers into the network security debate Interconnectivity threatens user data in ways that were not yet imagined ten years ago and dependable solutions that minimize the risk to companies and their customers are now a requirement As embedded devices become increasingly networked there is a growing risk that poor software quality could affect the quality of the final product and the security of customersrsquo data

SECURITYfor the Embedded Internet of Things

Verifiable

CONTENTS

CONTENTS

3

44

The Internet of Things

Today Irsquod like to talk about something near and dear to my heart the Internet of Thingsmdashor

in shorthand IoT Itrsquos become a hot topic recently because it embodies the future that everyone always dreamed of From being able to make sure you closed your garage when you left for work to having your medical status continuously updated to your doctor there are so many potential concepts associated with IoT that I could write another article by just listing a small portion of them

So what are the benefits of the IoT Well that depends some things help people live more efficiently and smarter like the Nest thermostat and some things could help save lives like a drug delivery system that can be remotely controlled by a doctor assuring that a patient gets proper dosage of their medicine With Bluetooth Low Energy (BLE) location beacons have become more popular allowing people to inexpensively track anything from their car keys to their kids Other items are purely products of convenience if your fridge tells you that you need to buy milk or even somehow buys it for you thatrsquos great but not necessarily a life changer

Therersquos always the opposite side of the coinmdashin this case there are quite a few

challenges to overcome From a purely technical point of view security is paramount as many IoT products track very personal information such as location over time eating habits and medications I donrsquot know about you but to me thatrsquos kind of creepy Also you have all of these devices trying to talk to each other but as of now there are no real standards and communications are infrequently incompatible

From an economic perspective how much is all of this going to cost Not just upfront cost but issues due to obsolescence For example my house was built in the lsquo80s and I wouldnrsquot be surprised if my fridge was bought by the original owners Is it beautiful and modern No Does it work Yes Do I ever have to unplug it and plug it back in to get it to start working again No Do I want a fridge that tells me when I need more apples Yes And therersquos the rub

The Internet of Things is an opportunity to make awesome things but my task to developers is to prioritize security Irsquom tired of getting new credit cards and the same goes to making sure my fridge isnrsquot as out of date as my cellphone

By Josh Bishop

TapTapTech

Sponsored by

With Bluetooth Low Energy (BLE) location beacons have become more popular allowing people to inexpensively track anything from their car keys to their kids

5

TECH TRENDS

5









By Josh Bishop

TapTapTech

Sponsored by


66

By Johan Strydom VP of Applications Engineering Efficient Power Conversion Corporation

Over the past five years GaN power FETs have shown to

have an undisputed technical advantage over silicon

Starting with a fundamental materialsrsquo limit advantage

that is three orders of magnitude better than silicon [1] it was

possible to construct initial devices that already had better

electrical characteristics than the state-of-the-art silicon [2]

GaN also showed much lower parasitic device capacitance

values for the same device on-resistancemdashan example from

2010 shown in Figure 1

Figure 1 Switching FOM RDS(on) vs QGD for different power transistors [2]


is Here

The GaN

POWER REVOLUTION

7

TECH SERIES

7













is Here

The GaN

POWER REVOLUTION

88

But beyond pure electrical device parameters these eGaNreg FETs being wafer-level chip-scale packages (WLCSPs) also have far lower package parasitics [2] when compared to silicon MOSFET packages In particular common-source inductance as well as drain- and source-lead inductances have a significant impact on the in-circuit performance of a power MOSFET Devices have been package-limited ever since the leaded SO-8 package was first superseded as a power MOSFET package [3] and as devices keep improving so does the need for improved packaging

Another advantage that eGaN FET wafer-level chip-scale packages offer over power MOSFET packages is lower thermal resistance through the top side of the device (junction-to-case) while having comparable thermal resistance down into the printed circuit board


Figure 2 Package resistance and inductance comparison between eGaN FETs and MOSFET packages [2]

Figure 3 Package thermal resistance comparison between eGaN FETs and typical MOSFET packages [4]

10 nH LLOOP 04 nH LLOOP

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13


Junction-to-board (PCB) thermal resistance Junction-to-Case thermal resistance

(junction-to-board) as shown in Figure 3 This allows a significant increase in the power loss handling capability which is becoming more and more important as converter power density increases

With the package parasitic reduction that eGaN FETs offer the need for improved printed circuit board (PCB) layout was identified as it has now become a limiting factor to in-circuit performance This resulted in the development of an optimum power loop layout [5] that not only reduced the switch node voltage overshoot during hard switching but also further improved in circuit efficiency as shown in Figure 4

The next step in GaN power FET technology came through monolithic device integration [6] This not only allowed the creation of two isolated

Figure13 413 Impact13 of13 power13 loop13 inductance13 (LLOOP)13 on13 circuit13 efficiency13 and13 switch-shy‐node13 voltage13 overshoot13 [5]13

1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13

Figure 4 Impact of power loop inductance (LLOOP) on circuit efficiency and switch-node voltage overshoot [5]

JUNCTION-TO-BOARD (PCB) THERMAL RESISTANCEJUNCTION-TO-CASE THERMAL RESISTANCE

9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010

Figure 7 Cost comparison between eGaN FETs and power MOSFETs with similar voltage and RDS(on) ratings [9]

Figure 8 Cost comparison between eGaN FETs and power MOSFETs

power FET devices on a single die but paved the way for future more complex integrated circuit development This first integrated half-bridge in GaN [7] further reduced parasitic package inductance between devices and allowed unprecedented switching performance as shown in Figure 5

More recently eGaNreg FET technology itself has started its inevitable progression toward its material limit though the introduction of the fourth generation of devices [8] This new family of eGaN FETs is keeping Moorersquos Law alive with significant gains in key switching figures of merit that widen the performance gap with the power MOSFET in

Figure 6 Experimental efficiency results for VIN = 48V to 12VOUT buck converters showing a 60 reduction in converter losses with eGaN FETs compared to silicon MOSFETs [8]

high frequency power conversion An example is shown in Figure 6

But what about cost From the start the goal at EPC has been to develop a high performance replacement for the silicon MOSFET at lower cost This approach necessitated the development of enhancement-mode devices to allow for direct adoption and use of the same silicon substrates that MOSFETs use as starting material Add to this a fabrication process with inherently fewer steps and a chip-scale package that is inherently lower cost due to the elimination of the package then the resultant cost structure should result in a device that is lower cost than silicon at comparable volume [9]

Figure 6 Experimental efficiency results for VIN = 48 V to 12 VOUT buck converters showing a 60 reduction in converter losses with eGaN FETs compared to silicon MOSFETs [8]

Starting13 Material13 Epi13 GrowthWafer13 FabTestAssembly

OVERALL

2014 2016lower lower

~higherlowersamelower

lowersamelower

~same

lower~higher

Fig 7 Cost comparison between eGaN FETs and power MOSFETs with similar voltage and RDS(on) ratings [9]


Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG

(typ 5V) Device Area Price

Comparison (1K Units)

EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036

MOSFET A 60 V 35 42 mΩ 7 Nc 35 nC 19 nC 31 mm2 $038

EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038

MOSFET B 100 V 56 88 mΩ 65 nC 13 nC 28 nC 325 mm2 $040

Forecasts are one thing but cost parity between GaN FETs and MOSFETs is now a reality In April EPC introduced a new line of eGaN FETs that are not only higher performance but also lower cost than their aging silicon counterparts [10] In Figure 8 60V and 100V eGaN FETs are compared against MOSFETs with the same nominal voltage and on-resistance ratings It can be seen that even though eGaN FETs have about 10x lower switching charge than the MOSFETs the low volume and high volume pricing is uniformly lower than the slower and larger MOSFETs Thus for the first time in 60 years a technology has higher performance and lower cost than silicon

Figure 5 Typical Waveforms for VIN = 12V to 12V25A (1MHz) Monolithic buck converter showing rising and falling switch node edges (3Vdiv and 5nsdiv) [7]

11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary

In summary the development of eGaN FET technology over the last five years has resulted in power devices that are technically superior to silicon MOSFETs in all aspects from pure electrical performance to package parasitics and thermal resistance Furthermore as the technology matures it will realize further device integration as well as continued improvements to the device figures of merit

With a cost structure that is already lower than that of silicon the GaN revolution is here There are no more reasons to choose a MOSFET when eGaN FETs can be used To show this point some example applications of where GaN is already displacing silicon will be presented in upcoming articles Please visit epc-cocom for more information

References

[1]ldquoIs it the End of the Road for Silicon in Power Conversionrdquo Efficient Power Conversion Corporation Application Note AN001 Available httpepc-cocomepcDesignSupportApplicationNotesAN001-IsittheEndoftheRoadforSiliconaspx

[2] Strydom Johan ldquoThe eGaN FET-Silicon power Shoot-Out Part 1 Comparing Figure of Merit (FOM)rdquo Power Electronics Technology September 1 2010 Available httppowerelectronicscomdiscrete-power-semisegantm-silicon-power-shoot-out-part-1-comparing-figure-merit-fom

[3] Pavier M Sawle A Woodworth A Monteiro R Chiu J Blake C ldquoHigh frequency DCDC power conversion the influence of package parasiticsrdquo Applied Power Electronics Conference and Exposition 2003 APEC lsquo03 vol2 no pp699 -704 vol2 9-13 Feb 2003

[4] Reusch D Strydom J Lidow A ldquoHighly efficient gallium nitride transistors designed for high power density and high output current DC-DC convertersrdquo Electronics and Application Conference and Exposition (PEAC) pp456-461 5-8 Nov 2014

[5] Reusch D Strydom J ldquoUnderstanding the Effect of PCB Layout on circuit performance in a high-frequency gallium-nitride-based point of load converterrdquo Power Electronics IEEE Transactions on vol29 no4 pp2008-2015 April 2014

[6] ldquoGaN Integration for Higher DC-DC Efficiency and Power Densityrdquo Efficient Power Conversion Corporation Application Note AN018 epccocomepcDesignSupportApplicationNotesAN018-GaNIntegrationforHigherDC-DCEfficiencyandPowerDensityaspx

[7] Development Board EPC9036 Quick Start Guide Efficient Power Conversion Corporation Available httpepc-cocomepcPortals0epcdocumentsguidesepc9036_qsgpdf

[8] Lidow Alex (2014 Oct 30) How to GaN Gen-4 eGaN FETs [online] Available httpwwweewebcomblogalex_lidowhow-to-gan-gen-4-egan-fets

[9] Lidow Alex (2014 Nov 21) The eGaN supply chain [online] Available httpwwwpowerguruorgthe-egan-fet-supply-chain

[10] EPC20356 Press Release Efficient Power Conversion Corporation Available wwwepc-cocom

eGaNreg is a registered trademark of Efficient Power Conversion Corporation

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TodayJOIN THEEVOLUTION

Learn more

1945

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1414

and Your OrganizationIt is common for burrowing animalsmdashmoles gophers etcmdashto build a second secret tunnel to escape predators We humans behave similarly building secondary portals not only as a means of escape but as an entryway into our constructs taking the form of a door to the back porch or a backdoor embedded in code creating a point of access that could circumvent existing access controls

The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616

A software backdoor is a secret way into a system that nobody else knows about creating a remotely exploitable vulnerability that could compromise a target device network or application

On a regular basis there are news headlines about the three-letter acronym organizations accused of leveraging backdoors to undertake cybercrime missions for geopolitical purposes against military forces financial institutions and even the infrastructure of an entire country We also read about hackers targeting companies for monetary gain or to create havoc as a means of political expression

But not all backdoors are used for malicious acts and in most cases it isnrsquot secret spy organizations or notorious hacker groups that developers must worry about Instead it is their peers

An engineer may create a backdoor with the intent of using it for debugging purposes which is innocent enough but these backdoors may not have been closed if the employee decides to change jobs They donrsquot let you make a copy of the office keys for a reason

Similarly an embedded systems developer may also view a backdoor as a kind of ldquomaster passwordrdquo used for the maintenance and upkeep of a system Perhaps it was included in the code as a workaround solution to authorize modifications because the developers realized that some programs needed to be able to change a devicersquos settings automatically While they may have intended to disable the backdoor at some point with everyone being super busy that may not have happened

There also have been instances where a code-smith saw a backdoor as an insurance policy One engineer nearing retirement got wind that he was about to be laid off Being largely unsupervised when he created a daemon to act as a conduit between two applications he made sure that it did a bit more it also permitted unauthorized entry bypassing security mechanisms and allowing remote root logins

When the day of reckoning arrived he showed his boss the backdoor he had created and claimed to have done the same thing numerous times in the past Rather than go through all of the code this fellow had created over the years or initiate public criminal prosecution that could scare off major customers he was offered an early retirement package and made to promise that nothing funny would show up in the future Which

he knew would not happen because he had only created one backdoor

For years the isolation of the embedded world provided the best defense against things like backdoors but today with the advent of ldquoInternet of Thingsrdquo connectivity that is no longer the case Whatrsquos more now that much of embedded software is open source another misconception is that having more people looking at code is enough in itself to guarantee better quality control and better security The thinking goes something like this because an open source-based development process is collaborative more people are at work solving issues like bugs flaws and vulnerabilities such as backdoors put there by the developers themselves

Unfortunately in any system open or closed vulnerabilities will still exist and can be exploited by those with knowledge of their existence Note too that when a lot of people have access to the source code some of them could be potential attackers Even with many eyes looking at code open source components should be rigorously tested and a design process used that incorporates code review to prevent or remove problems at the coding levelmdashsince the idea is to find things like potential backdoors while the code is being built not after it is built Finding these problems at the earliest possible point will result in less testing later on and less impact on cost and schedule

Static analysis tools provide a means for analyzing code without having to run the code These tools use well-defined programming rules not only to discover defects and catch security flaws but also to ensure higher quality software throughout the development process Rogue Wave Softwarersquos Klockworkreg analysis and productivity tool puts static code analysis at the desktop identifying critical safety reliability and coding standards issues in front of developersrsquo eyes as code is being written before it becomes reality

Klockwork also delivers application security to prevent malicious attacks through code refactoring which cleans up the code structure to reduce future costs The software offers reporting and metrics to understand and prioritize issues across an entire development team With Klockwork the user is given the code architecture to visualize and optimize software design as well as code review to get teams working faster towards delivering the best code possible

For more information visit httpwwwklocworkcom

Not all backdoors are used for malicious acts and in most cases it isnrsquot secret

spy organizations or notorious hacker groups that developers must worry

about Instead it is their peers

A COMMON MISCONCEPTION having more people looking at code

is enough in itself to guarantee better quality control and better security

httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020

Where Are the Security Problems

Security industry discussions and standards focus mostly on the integrity of encryption algorithms and protocols Although these algorithms have evolved over time there is little evidence that major security breaches can be attributed to breaking the algorithms themselves Most high-profile security breaches have come from three main sources insiders divulging secrets poor system management and badly or inappropriately written softwareThe first two sources can only be dealt with by the organizations responsible for the security of information and there are no easy solutions However some industries have control over software processes and there are many proven standards for this A quick review of some well-known recent security issues leads to interesting conclusions

What Drives Quality Standards

Software quality is generally implemented according to the needs of vertical industries Those vertical markets that have an interest or requirement that their products are reliable and have standards for developing software like medical automotive aerospace etcSecurity does not fit the scope of any single vertical market Various groups have been established to ensure that the algorithms used are sufficient and that the communication protocols are robust But no area has specified that a particular software development standard should be required or stated what that standard should be This means all efforts are focused on the algorithms and how fast they are In general software quality is neglected and not often discussed in security verification suites that check if the algorithm is implemented correctly

Are Appropriate Methods Available

In the absence of any body to set quality standards for network security software what standards should be expected of software that protects our personal data Full safety processes like those used in the aerospace industry is probably not an appropriate way forward though many aspects are relevant Below is a tabular summary of the methods and measures that could be proposed as a minimum of what should be expected of such software The set of measures used would vary to meet different needs but the general principles of creating high-quality software are similar

Table 1 Table 2

Software Security Issue Contributing Factors

OpenSSL

bull No software design

bull No traceable test cases

bull No boundary case analysis

bull No software life cycle

Apple SSLbull Static analysis

bull Code structure

GCC SSL

bull No design



bull In short ndash no software lifecycle

BASH

bull System too complex

ndash Too easy for application to get security access

ndash Too many possible applications that could have holes

US POS (Point-of-Sale) bull Badly structured system

Measure Relevance

Requirements Spec Make sure the product does what the customer expects

Design Derived from requirements

Coding Standard Ensure code is written to best industry practices

Static Code analysisApply variety of metrics and tests to ensure code is of quality that will foster long-term stability

Dynamic Code Analysis Ensure all code is tested and executes correctly and excludes all redundancy

Traceable Test Cases Ensure result matches the requirements

Software Life CycleEnsure all the correct steps are followed for all elements of the software and that there is a process for change This is the thing that makes it all come together

A recent spate of high-profile network security breaches with devices using software such as OpenSSL has highlighted serious risks that companies may be exposing themselves and their customers to Many of the defects discovered have occurred as a consequence of a lack of rigor in the software development life cycle process The issue of process must be addressed if application developers want to demonstrate that their product is secure

21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222

For example the standards used in some parts of the medical industry originated in the standards created for industrial control systems

Dealing with System Design Issues

At least one recent major failure was caused when a lsquoPoint-of-Salersquo (POS) computer was reverse engineered and used to access a central database Regardless of the quality of the software deployed this type of attack can only be protected against by a well thought out system design In this case the quality of the algorithm was not particularly relevant to the security breach experienced Every system is different and as such general guidelines are not easy to assess The problem is further complicated by the variety of skill sets required A security assessment is carried out on equipment that is complex in its own right and not the

development which are defined by IEC 61508 and other similar standards Research data shows that not only does this reduce defects significantly but in many cases it can reduce the cost of software management over its life cycle The recent Heartbleed defect is a case in point The information publically available states the software did not check the scope of a protocol variable and then processed it blindly Standard V model development would include unit testing and boundary case analysistesting that would have instantly alerted developers to the issue This detection would have been reinforced by other requirements of the life-cycle process The costs incurred financially for the industry to fix this problem are staggering never mind the impact such breaches have to a companyrsquos reputation There are other elements of the V model process that would have picked up these kinds of issues even where problems have occurred in professionally developed solutions For example a well-designed static analysis tool would have detected Applersquos recent issue with their TLS software Software cannot be treated in isolation The whole system design must be considered Even if it was possible to create a perfect TLS implementation would that mean the system was secure Possibly more secure but if a defect was

located elsewhere in the target system (eg in the TCPIP stack) then it could possibly expose memory Certainly it is less likely this kind of fault would yield sensitive data but such a system cannot be considered completely secureThe Internet is now the basis for our financial system and all financial systems operate on trust If the industry continues to stumble from one crisis to another without addressing quality and security it undermines the trust individuals have in the system This could have far reaching consequences for developers of embedded applications Developers of networked applications should adjust their approach to quality as soon as possible to avert a confidence crisis

natural domain of a security expertSome of the guiding principles and rationale for system security are summarized in the table below

Conclusion

Many organizations use open-source software in applications supporting millions of usersrsquo valuable data The intention of this article is not to criticize open-source software indeed open-source providers are usually completely transparent about the processes used to develop the software However the responsibility for security and quality is with the developing organization They must ask the question if the software they are proposing to use has been developed using an appropriate process ndash regardless of who developed itThe aerospace industrial medical and transport industries already use software processes based on V model

Table 3

System Design Issue Mitigation

Software AuthenticationEnsure the hardware only operates with authenticated software and ensure that new releases of software will only work with authentic hardware

Software IntegrityEnsure the software has not been modified by any external party

Software SecureEnsure the software cannot be read by a third party (this makes constructing attacks more difficult)

System Complexity

Minimize risk of back doors and unforeseen consequences by having the security component do security ndash no more or less than it needs to Also minimize the effort required to develop secure software to the required level

23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26


By Glenn ImObersteg Convergence Promotions LLC

A Tale of Two

LAYERSCAPESA Journey Between the Realms of Hardware and Software

A Google search of Layerscape last month turned up a strange anomaly there are really two Layerscapesmdashone is a software-based program and the other is an applications processor One Layerscape requires high-speed networking and communications technology to perform and the other was designed to provide high-speed networking and communications for similar data-intensive applications

Microsoft Researchrsquos Layerscape is a cloud-based Earth visualization tool built on the same technology as their WorldWide Telescope Freescalersquos LayerscapeTM is the underlying system architecture of the next-generation

QorIQTM LS series SoCs Coincidence Divergence Do these two seemingly disparate products intersect at a point

in space or time This article will take the reader on a journey to the fascinating worlds of

both the virtual and the actual

COVER STORY

27



A Tale of Two







28

From the ocean depths in the Mariana Trench to the high desert of Sonora California Microsoftrsquos Layerscape has enabled scientists and researchers to visualize complex data about planet Earth in three-dimensional space and time By virtually peeling back the layers of the earth from the upper atmosphere to the earthrsquos core Layerscape lets scientists share and explore 3D4D visualizations of complex datasets via Microsoftrsquos WorldWide Telescope (WWT) visualization engine The Layerscape visualization engine harnesses a PCrsquos graphics processor which in turn enables scientists to visualize large amounts of datamdashnot from the bridge of a starship but from the confines of their offices

Imagine the endless applications opened up by Layerscape scientists could visualize historical surface temperatures seismic activity wind patterns or even track antelope migratory patterns across the African plains Users can opt to render their conclusions in a narrative view by placing their ldquovirtual eyerdquo anywhere and connecting together a sequence of perspectives and automated transitionsmdashcreating a narrative from the data

No less innovative than visualizing a trip to outer space or beneath the Earthrsquos core is the new Freescale Layerscapetrade architecture

Freescalersquos new Layerscape is touted as the ldquoindustryrsquos first software-aware core-agnostic networking architecture to offer unprecedented efficiency and scalerdquo and the first processor in the QorIQ LS1 family is the recently-released LS1021A communications processor The architecture is ideal for hardware virtualization solutions among other applications

Incorporating dual ARMreg Cortexreg-A7 cores running up to 10GHz the Layerscape LS1021A processor is engineered to deliver CoreMarkreg performance of over 5000 as well as virtualization support and advanced security features The Layerscape also offers the broadest array of high-speed interconnects and optimized peripheral features ever offered in a sub-3W processor

Users can opt to render their conclusions in a narrative view by placing their ldquovirtual eyerdquo anywhere and connecting together a sequence of perspectives and automated transitionsmdashcreating a narrative from the data

Modules built to accommodate outer and inner space applications

Incorporating the Layerscape architecture into your next design can be easier than imagined This is made possible by the recent launch of the TQMLS102xA a compact (55mm x 44mm) rugged embedded module based on the LS102xA Layerscape processor family by TQ-Group By connecting the dual core ARM Cortextrade-A7 on the module to the quick communication unit this combination forms an ideal platform for even the most stringent requirements and most demanding applications

The first processor of this category in the sector the LS102xA together with the new ARMreg based bus system ldquoCache Coherent Interconnectrdquo (CCI400) supports fast data transfer and virtualization The new Layerscape architecture makes it possible to ideally link the ARMreg computing core with the selection of interfaces of the Freescalersquos QorlQ communication processors This allows developers to create applications which require both lower energy consumption and also meet the demand for more secure and faster data communication

The Layerscape LS1021A processor is engineered to deliver CoreMarkreg performance of over 5000 as well as virtualization support and advanced security features

Travel from the upper reaches of the atmosphere to the center of the Earthrsquos core with Microsoftrsquos Layerscape software visualization

Layerscape is a three-part program part one is the WorldWide Telescope visualization engine an application that enables the seamless viewing of the earth the solar system and outer space Install the WWT program and your computer seamlessly operates as a virtual telescope combining the best imagery from the worldrsquos ground- and space-based telescopes to offer an unparalleled view of the earth and universe Part two is a community website that allows users to share their content and experiences with their peers The third part is a tool built on Microsoft Excel so if your data is already in an Excel spreadsheet you simply click a few buttons to send it to the visualization engine For more information on Layerscape and the WWT see the Getting Started section of this article to discover how you can start building your own virtual tours and experience the endless possibilities the universe holds for you

From virtual to actual Freescalersquos LayerscapeTM offers a grounded approach to communications and hardware visualization

COVER STORY

29














30

TQMLS102xA Dual Core ARMreg Cortexreg-A7

Embedded Module with Freescale QorIQTM LS102xA ldquoLayerscaperdquo

QorIQTM high-speed communication technology combined with a dual core ARMreg Cortexreg-A7 for superior networking and data processing

The TQMLS102xA minimodule is based on the LS102xA processor from Freescale and combines the ARM core architecture with the QorIQ high-speed communication technology and is the ideal solution for applications requiring superior networking and data processing

The dual core ARMreg Cortexreg-A7 core provides a cache Coherent Interconnect bus system and a clock rate up to 2 x 10 GHz guaranteeing the embedded module provides a balanced ratio between high performance and power dissipation

KEY FEATURES AND BENEFITS

bull Integrated graphics controller

bull QorIQTM QUICC Engine

bull High-speed communication via 3x Gigabit Ethernet 2x PCle and 1x USB 30 interface

bull Low power consumption (typ 3 W)

bull ECC protection

bull Cache Coherent Interconnect bus system

bull IEEE 1588 hardware support

bull Security functions (optional)

bull Extended temperature ranges

The TQMLS102xA embedded module is ideal for the demands of systems developers who want to develop highly efficient platforms on the latest system architecture for processing high data volume The LS102xA system-on-chip provides a dual-core ARMreg Cortexreg-A7 CPU with ECC-protected L1 and L2 cache for maximum reliability

More Performance Less Power

With its compact size and an average power consumption of 3 to 5W the TQMLS102xA embedded module is an ideal platform for applications in network technology industrial control systems M2M and Internet of Things (IoT) gateways With the LCD controllers integrated into the LS1021A processor system developments can also be made which meet the high demands on user-friendliness with a touchscreen display

Bring on the Software

A Linux BSP has been developed for the specific module and mainboard interfaces Versions with QNX Green Hills VxWorks and PikeOS are also planned for the near future for applications requiring safety and security capabilities

Freescale the Freescale logo and QorIQ are trademarks of Freescale Semiconductor Inc Reg US Pat amp Tm Off Layerscape is a trademark of Freescale Semiconductor Inc The Power Architecture and Powerorg word marks and the Power and Powerorg logos and related marks are trademarks and service marks licensed by Powerorg ARM is the registered trademark of ARM Limited All other product or service names are the property of their respective owners copy 2013 Freescale Semiconductor Inc

Microsoft Excel Layerscape WorldWide Telescope and other products including Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States andor other countries

Getting Started Launching the Layerscape Programs

To register for Microsoftrsquos Layerscape to create and share 3D virtual tours and collaborate with the Earth-science community you can register at httpresearchmicrosoftcom

To launch your own hardware-based mission we recommend the TQ-System STKLS102xA starter kit equipped with the TQMLS102xA dual core ARMreg Cortexreg-A7 module with Freescale QorIQ LS102xA ldquoLayerscaperdquo

The components contained in the starter kit constitute a modular system enabling you to develop your own designs Development of graphic interfaces can be started immediately using the prepared combination of a closed display unit and starter kit that are matched to each other

For more information on the starter kit or to order modules please go to wwwembeddedmodulesnet or contact Vaughn Orchard at vaughnconvergencepromotionscom

Phone (508) 209-0294

The new Layerscape architecture makes it possible to ideally link the ARMreg computing core with the selection of interfaces of the Freescalersquos QorlQ communication processors

httpwwwembeddedmodulesnet

vaughnconvergencepromotionscom

COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232

Internet of ThingsEmbedded developers are working hard to keep pace with the IoT market buzz and the imminent demand for devices such as MCUs to drive their IoT and M2M applications With deadlines looming resources scarce and costs spiraling out of control the embedded development community needs economical and time-saving solutions

By Vaughn Orchard Convergence Promotions

THINGS

Designing with the

in theWITH CERTIFICATIONS IN MEDICINE AVIATION AND AUTOMOTIVE THE DEVELOPMENT AND PRODUCTION PROCESSES AT TQ CAN BE COORDINATED TO MEET THE SECTOR-SPECIFIC DEMANDS

33

EEWEB FEATURE

33



THINGS

Designing with the


3434

IoT Drives an Increase in Demand for MCUs

Reports predicting the resurgence of microcontroller sales in the coming years are keeping pace with the market buzz about the demand due to the impact of the Internet of Things Market data in the 2015 McClean Report states that ldquoMicrocontroller shipments surged 16 in 2014 to a new record high of 186 billion units surpassing the previous annual peak of 173 billion set in 2012ldquo IC Insights asserts that much of this growth is with MCUs that will potentially connect within the IoT Thatrsquos a huge number of smart devices and the main discussions are on how the field is split between 8-bit and 32-bit devices Wearables or smart homes might only require 8-bit MCUs but once a gateway enters the picture with its attendant security and computing requirements the application is sure to fall into the 32-bit MCU space This is the space where expanded memory requirements and advanced peripherals complicate the development processmdashstressing budget constraints resources and deadlines

Assembling Your IoT Application

In many cases the challenge of getting your application to market on time can be resolved by deciding to buy a tested certified solution versus having to build your next IoT application from the ground up Designing with an embedded module can be easier less expensive and quicker to deploy in your embedded IoT applications In addition embedded modules are

Small and energy efficientMany of the TQ-Systems modules have the smallest footprint of any module in the embedded industry and low-power consumption is at the forefront of all our design considerations

EasierBuilding a new embedded device from the ground up is an enormous challenge and carries a lot of risk Embedded development can be made much easier by leveraging existing solutions from a reliable supplier

QuickerDeployment of a production-ready module and BSP eliminates 6 to 12 months from your development timeline

Less expensiveSave substantial non-recurring engineering costs by eliminating specification parts selection schematic layout validation operating system porting efforts and certification

Reliable If your system is going to be operational for more than the next few years you will need to use a supplier that guarantees end-of-life obsolescence management and can protect your products from obsolete components extensive redesigns unsafe sources and costly brokerware

A Diverse Portfolio

With a diverse portfolio ranging from ARMreg to x86 and power architecture-based modules and platforms from partners such as Intelreg FreescaleTM and Texas InstrumentsmdashTQ-Systems is the ideal partner for embedded modules designed to IoT gateway specifications and applications such as medicine transport and logistics smart building and M2M With certifications in medicine aviation and automotive the development and production processes at TQ can be coordinated to meet the sector-specific demands All the services are offered modularly for both component parts and whole devices and systems Some of the modules and single board products available for IoT and M2M applications are

TQMa28 Embedded Module with ARM9trade Freescale iMX283 An ultra-compact TQ Embedded processor module for creating intelligent networked devices this module contains a low-power high-performance applications processor optimized for the general embedded industrial market and makes the ideal IoT gateway

SBCa335x ldquoBoxer Boardrdquo with TIrsquos ARMreg Cortexreg-A8 processorThe Boxer Board is based on the Sitaratrade AM3352 or AM3354 processors (800 MHz ARMreg Cortexreg- A8 Core) from Texas Instruments Its compact and rugged design of only 48rdquo (12 cm) x 32rdquo (8 cm) temperature range of -20degC to +70degC and low-power consumption (typ 2 W) makes the Boxer Board

DESIGNING WITH AN EMBEDDED MODULE CAN BE EASIER LESS EXPENSIVE AND QUICKER TO DEPLOY IN YOUR EMBEDDED IOT APPLICATIONS

The TQMa28 is the industryrsquos smallest module and at 1024ldquo x 1576ldquo is ideal for applications when size is a major consideration

35

EEWEB FEATURE

35










A Diverse Portfolio






httpwwwembeddedmodulesnethttpwwwtq-groupcom

3636

Putting Security First

Security experts have long warned of the potential risk of large numbers of unsecured devices connecting to the Internet and MCU manufacturers and their embedded module suppliers have worked together to manufacture secure products Some of the embedded modules from TQ-Systems capable of providing ample security protection in IoT applications are TQMLS102xA Embedded Module with Freescale QorIQ LS1021A Freescalersquos communications processor provides outstanding performance efficiency and reliability for IoT gateways It also has all CPU pins available at the Tyco connectors extremely compact high-speed communication via Ethernet PCIe and USB 20 low-power consumption (typically 3W) and is designed with QorIQTM Trust Architecture and ARMreg TrustZonereg

TQMa6x Embedded Module with Freescale iXM6reg

With optional memory and extended temperature range this module is designed built and tested to industrial standards and has advanced security features supporting high assurance boot cryptographic cipher engines random number generator and tamper detection

suitable for industrial applications in the smallest of spaces It provides pin-compatibility with the Raspberry Pi B+ so adding capes and hats is a breeze

The Boxer Board is ideal for developers who want the ease of programming with a Raspberry Pi or other DIY Board but require a rugged industrial-grade and production-ready solution

TQMxE38M Embedded Module with Intelreg Atomtrade E3800 (Bay Trail)Equipped with an Intel Atom from the E3800 range Trusted Platform Module (TPM) 12 as well as the Intel IoT Gateway software solution this module contains all the aspects of data pre-processing (analysis and filtering) and secure data communication as well as the secure device update and management

Developers searching for MCUs that are engineered to shorten design cycles and speed time-to-market for their next design should consider embedded modules as a viable solution For more information on TQ-Groupslsquo products in North America go to wwwembeddedmodulesnet For Europe and APAC go to wwwTQ-Groupcom

The TQMs6x Embedded Module with its advanced security features is designed and built to the most demanding industrial standards

SchematicscomPutting Security First









Your Circuit Starts HereSign up to design share and collaborate

on your next projectmdashbig or small

Click Here to Sign Up

Click here

Sierra CircuitsA Complete PCB Resource

PLUS The Ground rdquo Myth in PrintedCircuits

ldquo

PCB Resin Reactor+

Ken BahlCEO of Sierra Circuits

Let There Be

How Cree reinvented the light bulb

LIGHT

David ElienVP of Marketing amp Business

Development Cree Inc

New LED Filament Tower

Cutting Edge Flatscreen Technologies

+

+

M o v i n g T o w a r d s

a Clean Energy

FUTUREmdash Hugo van Nispen COO of DNV KEMA

MCU Wars 32-bit MCU Comparison

Cutting Edge

SPICEModeling

Freescale and TI Embedded

Modules

ARMCortex

Programming

From Concept to

Reality Wolfgang Heinz-Fischer

Head of Marketing amp PR TQ-Group

Low-Power Design Techniques

TQ-Grouprsquos Comprehensive Design Process

+

+

PowerDeveloper

Octobe r 20 13

Designing forDurability

View more EEWeb magazinesmdash Click Here

CLICK HERECLICK HERE CLICK HERE

CONTENTS

Your Guide to Embedded MCUs and Development Tools

w w w e m b e d d e d d e v e l o p e r c o m

Everything yoursquore looking for in one place

4

6

18

14

26

32











Verifiable

CONTENTS

CONTENTS

3

44









By Josh Bishop

TapTapTech

Sponsored by


5

TECH TRENDS

5









By Josh Bishop

TapTapTech

Sponsored by


66













is Here

The GaN

POWER REVOLUTION

7

TECH SERIES

7













is Here

The GaN

POWER REVOLUTION

88







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



4

6

18

14

26

32











Verifiable

CONTENTS

CONTENTS

3

44









By Josh Bishop

TapTapTech

Sponsored by


5

TECH TRENDS

5









By Josh Bishop

TapTapTech

Sponsored by


66













is Here

The GaN

POWER REVOLUTION

7

TECH SERIES

7













is Here

The GaN

POWER REVOLUTION

88







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



44









By Josh Bishop

TapTapTech

Sponsored by


5

TECH TRENDS

5









By Josh Bishop

TapTapTech

Sponsored by


66













is Here

The GaN

POWER REVOLUTION

7

TECH SERIES

7













is Here

The GaN

POWER REVOLUTION

88







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



5

TECH TRENDS

5









By Josh Bishop

TapTapTech

Sponsored by


66













is Here

The GaN

POWER REVOLUTION

7

TECH SERIES

7













is Here

The GaN

POWER REVOLUTION

88







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



66













is Here

The GaN

POWER REVOLUTION

7

TECH SERIES

7













is Here

The GaN

POWER REVOLUTION

88







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



7

TECH SERIES

7













is Here

The GaN

POWER REVOLUTION

88







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



88







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



9

TECH SERIES

9







0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JBT

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJB_SiRθJB_GaN

0

05

1

15

2

25

3

0 5 10 15 20 25 30 35

RƟ

JC T

herm

al R

esis

tanc

e (deg

CW

)

Device Area (mm2)

RθJC_Si13 13 13 13 13 13 13 13 13 13 13 13 RθJC_GaN13 13 13 13 13 13 13







1013 nH13 LLOOP 13 13 13 0413 nH13 LLOOP13 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



1010










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



11

TECH SERIES

11










OVERALL



lowersamelower

~same

lower~higher



Device VDS

(MAX)RDS(on)

(max)

QOSS (typ

50BV)

QGD (typ

50BV)

QG



EPC2035 60 V 45 mΩ 3 nC 016 nC 12 nC 081 mm2 $036


EPC2036 100 V 65 mΩ 4 nC 015 nC 1 nC 081 mm2 $038




1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



1212

Summary



References

















1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13








1905


Learn more

1945

2005



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



1414


The Growing Need to

Protect YOUR CODE

15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



15

TECH REPORT

15


The Growing Need to

Protect YOUR CODE

1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



1616



















httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



httpwwwklocworkcom

17

TECH REPORT

17



















1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



1818




Verifiable

19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



19

TECH REPORT

19




Verifiable

2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



2020







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



21

TECH REPORT

21







Table 1 Table 2


OpenSSL






bull Code structure

GCC SSL

bull No design




BASH





Measure Relevance









2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



2222







Conclusion


Table 3





System Complexity


23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



23

TECH REPORT

23







Conclusion


Table 3





System Complexity


MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



MYLINK

MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



MYLINK

26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



26



A Tale of Two







COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



COVER STORY

27



A Tale of Two







28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



28














COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



COVER STORY

29














30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



30











bull ECC protection

















Phone (508) 209-0294




COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13





COVER STORY

31











bull ECC protection

















Phone (508) 209-0294


3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



3232



THINGS

Designing with the


33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



33

EEWEB FEATURE

33



THINGS

Designing with the


3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



3434










A Diverse Portfolio






35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



35

EEWEB FEATURE

35










A Diverse Portfolio







3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13




3636






















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13















Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



Click here



ldquo

PCB Resin Reactor+


Let There Be


LIGHT





+

+


a Clean Energy



Cutting Edge

SPICEModeling


Modules

ARMCortex

Programming

From Concept to





+

+

PowerDeveloper

Octobe r 20 13



Date post:	22-Jul-2016
Category:	Documents
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