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Update on the ESA Lead Free Control Plan (LFCP) Working Group

Barrie Dunnbarrie.dunn@esa.intMay 2011

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Main Objective of the Working Group is to publish a “Lead-free Control Plan” (LFCP)

that can be used by the Space Industry in order to:ensure that spacecraft electrical systems and related hardware comply with the contractual requirements of ECSS standards, and,assess the inherent risks with Pb-free

As of May 2011, the Plan is about 60% complete

Intention is to publish it as an ESA STR document (not a Standard, but a “good practice” document, parts of which could be formalised in the future as requirements)

Main Objective of the Working Group

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To exchange, share information, return of experience concerning Lead-Free

To identify the issues and problems to be solved regarding the concerns expressed by the CTB members

To define recommendations for solutions and answers to these concerns

The scope includes:•EEE components and COTS devices•Connectors•PCBs•Solder•Peripheral hardware : clamps, screws, pins, wires, electronic housings

Secondary Objectives :

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Chapter Titles for LFCP

Introduction (Chapter 1)

Problems associated with Lead-free (processes at higher temperatures, materials with different mech props, solderability, inspection criteria, whiskers, rework/repair, mixing of alloys, traceability, black pad, etc.) (Chapter2)

ESA Requirements (Chapter 3)

Definition of Pure Tin (Chapter 4)

Assessment of Suppliers’ LFCPs (Chapter 5)

Methods for detecting Tin and Lead (Chapter 6)

Method for Re-processing component terminations (Chapter 7)

Mitigation strategies for the avoidance of failures due to tin whiskers (Chapter 8)

Illustrations of problem situations (Annex 1)

Check List (for in-house awareness and auditing purposes) (Annex 2)

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Restriction of the use of certain hazardous substances in electrical and electronic equipment ***I

This Directive does not apply to:a) equipment which is necessary for the protection of the essential interests of the security

of Member States, including arms, munitions and war material intended for

specifically military purposes;

b) equipment designed to be sent into space;

c) equipment which is specifically designed and to be installed as part of another type of

equipment that is excluded or does not fall within the scope of this Directive, which

can fulfil its function only if it is part of that equipment, and which can be replaced

only by the same specifically designed equipment ;

d) large-scale stationary industrial tools;

e) large-scale fixed installations;

f) means of transport for persons or goods, excluding electric two-wheel vehicles which

are not type-approved.

A7-0196/2010P7_TA-ROV(2010)0431

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Lead-free Control Plan Working Group

– Flow Diagram for Plan (suggestion):

1. Procurement to define lead-free requirements 2. Incoming Inspection

of components, pcbs,terminal posts, connectors

Using: visual, swab (red means lead),

XRF, SEM-EDAX,etc.

3. Lead-free parts mayneed reprocessing

de-tin, pre-tin with solder,etc. per ECSS-Q-STD-70-08

4. Impossible to reprocessthen a Risk Assessment

is needed

5. Risk Assessmentwill include consideration of mitigation possibilities

involving: tin composition, tin thickness,substrate material, heat treatment history,

track/line spacing distance, conformal coating,environment exposure (life, temperature, cycles, etc.)

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Lead-free Control Plan Working Group

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Cross section 3

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APPENDIX 2 of LFCP:

CHECK LIST FOR CONTROLLING THE AVOIDANCE OF LEAD-FREE MATERIALS AND COMPONENTS

No. Yes No Comments

1 Is there a Materials and Processes manager to supervise

lead-free policies and forbidden materials per ECSS-Q-70B.

Do Declared Materials, Components, Processes and

Mechanical Parts Lists exist.

Does the supplier have a Lead-Free Control Plan (LFCP).

Is one individual responsible for documenting and operating

the tasks specified in the LFCP (comment on named

individual).

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Technical Tasks for WG members: Understand EU Directives

Risks and Limitations with Lead-free such as: tin whiskers, solder joint reliability, copper dissolution, cross contamination, higher processing temperatures (most of these have been researched with answers available and some have been identified for small studies by ESA)

Components and other items delivered per ECSS requirements must be without pure tin – inspection methods

Provide recommendations for reworking pure tin components

Identify other small studies where information is missing (such as the SPUR tin chemical stripping study)

Present WG Members are from: ESA (Chair), CNES, Astrium, THALES Group, SEA Ltd UK

NEW MEMBERS ARE WELCOME

1. Technical Tasks for WG members:

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Link between LFCP & PSWG ad hoc WG on “Pb free incoming inspection test

ESCC

SCSB

CTB PSWG

ECSS

Technical Authority

Discipline focal point

Ad hoc WG on Pb free incoming inspection test

Lead Free Control Plan

ECSS-Q-ST-60-13 (COTS)

RNC-CNES-Q-ST-60-100 (COTS)

Astrium, TAS, others procedures

Cooperation on Q-60 discipline

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LFCP WG Next Meetings will be in the form of small workshops at THALES, Toulouse

15th June 2011 “Re-processing of component terminations” based on existing Thales and Astrium experiences and novel ideas from industry

22nd September 2011: “Risk Assessment and Mitigation associated with lead-free and whisker growths” based on existing computer programmes and novel ideas from industry

INPUTS from both Workshops will be used for the LFCP Chapters 6, 7 and 8

All Component and Materials specialists are invited to attend, contact:

– Barrie.Dunn@esa.int

or

– Augustin.Coello-Vera@alcatelaleniaspace.com