© CTR Carinthian Tech Research AG
Exploiting the combination of 3D polymer and ink-jet
nanoparticle printing for innovative solutions
Alfred Binder, Matic Krivec, Ali Roshanghias
The 4th edition of the 3D Printing Electronics Conference
January 24, 2017
High Tech Campus Eindhoven
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Our Vision of 3D Prints + Functionalization
3D Prototyping Packages
Printed chip packages
• Dedicated packages need tooling
• Long lead time to test chips in application
• 3D printed package prototypes could help to
dramatically accelerate development time
and lower cost, reduce risk
Printed sensors and µ-fluidic applications
• AM methods instead of conventional micro-
manufacturing techniques
• bring idea and market of μf-MEMS closer
together
• Challenge Si or glass based micro-
manufacturing techniques
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Our hurdle – Lack of dedicated equipment
Limitation of AM equipment on market
Equipment vendors just want to cover mechanical 3D parts – no or limited hybrid techniques
Printed electronics equipment is made for 2D
Software with rigid process implementation
No multilayer technology available, BUT
DragonFly 2020 3D Printer will come in 2017
… a lot more but we talk about prototyping applications
What we have – our approach up to now…
3D Printing Inkjet Printing Photonic Curing
ProJet® 3510 HDPlus PiXDRO LP50 PulseForge 1200
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SAW Transponder
Passive device for wireless RFID and sensing
Good test vehicle because samples available
and fairly simple device
a) b) c)
Example Printed SAW Transponder/Sensor Package
Interrogation principle of SAW devices
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Example Printed SAW Transponder/Sensor Package
3D printed substrate
Ag ink-jet printed antenna structure and pads
Ag-filled adhesive for flip-chip
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SE
M M
easure
ments
F
IB M
easure
ments
Ag antenna: no Photonic Curing Ag antenna: after Photonic Curing
Example Printed SAW Transponder/Sensor Package
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The final configuration of the
SAW package prototype
Functional Testing
Example Printed SAW Transponder/Sensor Package
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What are the findings
Surface effects are a challenge
• Surface condition (printing resolution,
cleaning)
• Ag-ink works good
Electrical Interconnects
• Wirebonding not possible
• Flip-chip with conductive glue OK
• No soldering possible due to substrate
limitation
Curing
• Photonic Curing perfectly suited for 3D
printed substrates, but lamp/substrate
distance has a strong influence
Example Printed SAW Transponder/Sensor Package
Benefits
Process development takes some time, but
similar samples can be repoduced in less
than 2 days
No tooling cost and no costs for design
change
Samples are functional and can be tested
in application (with some limitation)
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Example Printed µ-Fluidic Measurement Chamber
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A microfluidic cell allows the implementation of a microfluidic enzyme-based biosensor. an enyzme (e.g. CYP2D6) will be immobilized on nanostructures (carbon nanotubes, graphene, etc.) inside this cell.
Example Printed µ-Fluidic Measurement Chamber
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Electrochemical biosensors: working principle
Baj-Rossi C., De Micheli G. and Carrara S., Electrochemical Detection of Anti-Breast-Cancer Agents in Human Serum by Cytochrome
P450-Coated Carbon Nanotubes, Sensors 2012, 12, 6520-6537.
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WE
Graphene
CE: Graphene RE : Ag
Example Printed µ-Fluidic Measurement Chamber
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• Vias diameter : 0.8 mm
• Silver-paste
• Dispensing
• Sintered at RT
• Volume resistivity 1-4*10-3
electrode
Ag paste
Cu wire
Example Printed µ-Fluidic Measurement Chamber
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Example Printed µ-Fluidic Measurement Chamber
What are the findings
Functional measurements
• Static measurements (no flow)
• With flow not stable yet
• Fluid volume well defined
Printing of Vias
• Now done using dispensing
• Integrated process needed
Accuracy of 3D printing for µ-Fluidic
• Resolution steps are a limitation in
channel size, shape optimization
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Conclusion
Demonstrators show some potential for fast prototype line featuring functionalized
(metallized) 3D shapes
Minimum viable product in Lean Startup Procedure to test hypothesis
Demonstrate basic functionality
User feedback / customer interest
Results make wish for more but we certainly need also more
materials (temperature limitation, too soft, … )
processes (vias, true 3D metallization, wirebonding, soldering capability)
software
• Compatibility with the semiconductor world
• Allowance for process interruption (for embedding discrete components)
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CTR Carinthian Tech Research AG
CTR Research Centre for Smart Sensors and Systems Integration
Location Villach / Austria
Employees 74 (14 PhD students)
excl. Master students
Turnover 2015 7,5 Mio.€
Link between Science and Industry
Industry-oriented Research & Development
COMET K1 COMPETENCE CENTRE
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Innovation through Cooperation
