Fairchild IR Presentation October 2011

7/31/2019 Fairchild IR Presentation October 2011

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www.fairchildsemi.com1

Fairchild SemiconductorInternational, Inc.

October 2011

Investor Presentation


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Notes on Forward Looking Statementsand Non-GAAP Measures

Comments in this presentation other than statements of historical fact may constitute forwardlooking statements and are based on Fairchild s management s estimates and projections and aresubject to various risks and uncertainties

These risks and uncertainties are described in the Company s periodic reports and other filings withthe Securities and Exchange Commission (see the Risk Factors section) and are available athttp://sec.gov and investor.fairchildsemi.com

Actual results may differ materially from those projected in the forward looking statements

Some data in this presentation may include non-GAAP measures that we believe provide usefulinformation about the operating performance of our businesses that should be considered byinvestors in conjunction with GAAP measures that we also provide. You can find a reconciliationof non-GAAP to comparable GAAP measures at the Investor Relations section of our web site athttp://investor.fairchildsemi.com

Recent additions to our website at http:// investor.fairchildsemi.com

Updated Financials (through current quarter with segment revenue/gross margin breakouts)

Quarterly Fact Sheet with current quarter highlights

This investor presentation
http://sec.gov/http://investor.fairchildsemi.com/http://investor.fairchildsemi.com/http://investor.fairchildsemi.com/http://investor.fairchildsemi.com/http://sec.gov/


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Fairchild Overview


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Wireless Convergence and EnergyEfficiency mega-trends

Power silicon content growsfaster than end market sales premium paid for efficiency

Segment structure increases ourapps knowledge and ability tosell solutions

Large customers dominate these

markets and align well withFairchild s strengths in SCM,global presence and wide productbreadth

Markets That Drive Our Business


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Shift to Industry Leading CustomersTop Tier Customers Drive Sales & Margin Growth

Significant shift to fast-growing,industry leading customers

Minimize exposure to low-margin, non-strategic tier 3customers

0% 20% 40% 60% 80% 100%

Q4 04

Q3 10

64%

79%

36%

21%

Ratio of Total Sales by Tier

Tier 1 & 2 Tier 3

-40.0%

-30.0%

-20.0%

-10.0%

0.0%

10.0%

20.0%

Tier 1 & 2 Tier 3

5 Year Revenue CAGR by Tier

Total High Mgn Low Mgn


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0 50 100 150 200 250 300 350 400 450

Q3 05

Q3 10

Sales Growth by Margin

Low Mgn High Mgn

Headwinds to Revenue Growth SubsideLower Margin Business Has Been Pruned

Reduced low margin (



Double-Digit Sales Growth EnablersSemiconductor Sales $ Growth - Handsets

Power management is a critical enabler to increased functionality = high value Smartphones contain 3X semi content as feature phones - $35B Semi TAM in 2013 Move to standard USB and automatic accessory detection shifts more BOM to semis

0% 10% 20% 30% 40%

Voltage Regulators

Interface

Amplifiers

Smartphones

Handsets

36%

34%

27%

24%

5%

2007 - 2013 CAGR Handset - 5% CAGRSmartphone -24% CAGR

FCS SAM 27%+CAGR

Source: iSuppli - Aug 2010

Switch & Mobile Power Salesin 2010 expected to be up 21%from 2009 and 10% from 2008



0% 5% 10% 15% 20% 25%

Power MOSFETs

Notebooks

Computers

24%

23%

11%

2007 - 2013 CAGR

Double-Digit Sales Growth EnablersSemiconductor Sales $ Growth - Computers

Power management key to battery life - $3B power transistor TAM in 2013 Power MOSFET performance and integration drive share gains Technology leadership in silicon and packages enable strong sales & margin growth

Computers 11%CAGR

Notebooks 23% CAGR

FCS SAM 24%CAGR

Source: iSuppli - Aug 2010

LV MOSFET 2010 results

expected to be up 40% YoYand GM up 400 bps from 2008



0% 5% 10% 15% 20% 25% 30% 35% 40%

Inverter-based Dishwasher (units)

Inverter-based Refrigerators (units)

Inverter-based Washing Machine (units)

Inverter-based Room A/C (units)

Major Home Appliances (units)

39%

16%

14%

14%

3%

2008 - 2013 CAGR

Double-Digit Sales Growth EnablersUnit Sales Growth Major Home Appliances (MHA)

Conversion to inverter- based motors opens huge new market to our SPMsjust 15%of MHA expected to be inverter-based in 2011 - $2B Semi TAM in 2013

SPMs provide complete power management solution that reduces risk and decreasestime to marketenables our customers to meet/exceed new efficiency standards

MHA - 3% CAGR

Inverter-basedappliances -

14 39%CAGR

Source: IMS -Jul 2010

SPM sales for 2010 expected

to increase >60% from 2008



16% 17% 18% 19% 20% 21%

Power Analog

Power Discrete

LCD/PDP TVs

18%

18%

21%

2007 - 2013 CAGR

Double-Digit Sales Growth EnablersSemiconductor Sales $ Growth LCD/PDP TVs

Power mgmt is a critical enabler for LED backlighting , a key feature in LCD TVsdue to higher refresh rates, better color & 3D capability - $5B power semi TAM in 2013

Power conv analog and small form factor MOSFETs enable efficient & thin designsSource: iSuppli - Aug 2010

Panel TVs - 21%CAGR

Power Semis -18%

CAGR

Power conversion sales for2010 expected to be up 11%

from 2008



Double-Digit Sales Growth EnablersSemiconductor Sales $ Growth Automotive

Power modules used to improve fuel efficiency and increase reliability - $2B powersemi TAM in 2013

Fairchild is the leader in supplying power modules for the electronic Power Steering(EPS) market that provides as much as a 10% improvement in fuel efficiency

0% 2% 4% 6% 8% 10% 12% 14% 16%

Power Modules

Power Discrete

Automotive

16%

6%

5%

2007 - 2013 CAGR Automotive 5%CAGR

Power Discrete 6% CAGR

Power ModuleSAM 16%+CAGR

Source: iSuppli - Aug 2010, IMS Jul 2010

Auto sales for 2010 expectedto be up 36% from 2008



Our SAM Supports Double-Digit Sales Growth

Power management and wireless convergence continue to grow rapidly Our SAM outgrows the end markets significantly due to the higher value our

customers place on performance, size and efficiency

Source: iSuppli - Aug 2010, IMS Jul 2010

0% 5% 10% 15% 20% 25% 30% 35% 40%

Power Modules for Industrial Motors

Inverter-based Washing Machines

Inverter-based Room A/C

Inverter-based Refrigerators

Automotive Power Modules

Panel TV Power SemisNotebook Power MOSFETs

Power Modules for Renewable Energy

Smartphone Amplifiers

Smartphone Interface

Smartphone Voltage Regulators

Inverter-based Dishwashers

13%

14%

14%

16%

16%

18%

24%

26%

27%

34%

36%

39%

2007 - 2013 CAGR

More than 60% of Our Q2 2010 Sales

support these SAMs Huge Growth

Potential



Mobile, Computing, Consumer &

Communications (MCCC) GroupOverview



MCCC Business Overview

MCCC

42%PCIA47%

SPG11%

Sales - 2010

Wirelessconvergenceand need for

greaterefficiency in

lower voltageapplications

EnergyRegulations

MobileComputing

Telecom &Server High

EfficiencyPower Supplies

Consumerelectronics

Handsets andwireless

What Drives Our Business?

Focus on leadership power efficiency in DC:DC applications Solutions with increasingly small form factors Portfolio of products to service OEM s & ODM s needs



Mobile Trends

Smartphone user experience and energy efficiency driving IC growth

OEM competition driving differentiation and IC opportunity

Increasing OEM requirement for broad based IP suppliers

Quality of supply critical differentiator

Three of four of the world s largest SC consumers are now handset OEMs

Strong Market Growth with 28% SAM CAGR

*Q2 iSuppli Mobile Std Linear+logic+MOSFET 2010-2013 CAGR



Mobile Revenue and IP Growth

The 6 year CAGR is 21% for the signal path and power management focus areas

The IP portfolio has grown from simple functions 6 years ago to more complex powermanagement and signal path functions today

Power

Logic

Signal

MOSFET

2004 2010

I P B l o c k s

MOSFET

Analog Swch

Tiny Logic

Analog Swch

Analog ASSP

USB 2.0

Audio Amp

LDO

Buck DC-DC

Boost DC:DC

RF DC:DC

Chargers

MUS

MOSFET

Tiny Logic

$0

$50

$100

$150

$200

$250

$300

$350

2004 2010

Signal

Power

Logic

MOSFET



Our Customers

Content in most of the Smart Phones at each OEM

Content in many handset reference designs



Focus Areas in Smart Phones

Power for CPU DrivenSubsystems, IO Power

Transceivers, OVP,Charging, Detection

Class A/B. D, G AmplifiersCODECs, Mic. ADC,Subsystems

DC/DC for 2/3G PARF Transceiver DC/DC

WLED Drivers with DC/DCLighting Management Units

Tiny Logic Gates, BuffersMicropak2 packaging

Audio, Video, USBCamera, MemoryMIPI

IntelliMAX LoadswitchesUSB Charging, Fuel Gauging

Low RDSon, smallPackaging

Switching, VideoFiltering/Drivers, uSerDes

PLLs, Reset Timers, I2CControl Translators, Sensors

ASSP

Sensors

LED Driver

BasebandProcessor

USBXcvr

Charger

ApplicationProcessor

DisplayMemoryCamera

Switching

RF Transceiver

RF Pwr Mgt

WiFiBlue Tooth

GPS

AudioCoDec

A m p

l i f i e r s

DigitalMic

USBMux

Power Management ICs

VideoFilter/driver

Tiny Logic MOSFET
http://images.google.com/imgres?imgurl=http://de.bluewin.ch/internetzugang/images/symbol_usb.jpg&imgrefurl=http://msn83235502.fotopages.com/?&page=1&h=65&w=133&sz=3&hl=en&start=3&tbnid=hJIhRVX_e_KK2M:&tbnh=45&tbnw=92&prev=/images?q=usb+symbol&gbv=2&ndsp=20&hl=en&sa=X



Analog Switches

Audio Jack:Detect and configure for3 or 4 pole headset

Route audio to eitherspeakers or headphones

Switch composite videoor MIC to accessory plug

MIPI / Camera:Route & isolateMIPI interface todual cameras ordisplays whilemaintainingsignal integrity

Dual SIM:Sharing onebaseband port withtwo SIM cards

Dual Microphone:Switch & isolate betweentwo microphones for noisecancellation

Source: iSuppli 2010

Mobile Handset Feature Forecast 2010 - 2012

Fairchild Semiconductor is a globalleader in innovative Analog Switchsolutions designed to route, switch,isolate, protect and detect an arrayof signals in mobile devices.

PowerManagement

AudioJack

Detection

MIPISwitch

AudioSwitch

DBTV

TVSwitch

SIM

SIM

RF

DualSIM

SwitchDualMIC

Switch

Processor

0

200

400

600

800

1000

1200

1400

1600

MusicPlayback

(Audio Jack)

Camera(>3Meg)

(MIPI/Camera)

Dual SIM DualMicrophone

M o

b i l e H

a n d s e

t S A M



USB Solutions for Handsets

Smart Phones Feature Phones Low Cost Phones

USB Accessory DetectionBattery Charger DetectionSwitching/RoutingHandles 3 or more types of media (Audio, Video, Data, etc)

Battery Charger DetectionSwitching/RoutingHandles 2-3 types of media

Switching/RoutingHandles 1-2 type(s) of media

239M Handsets in 2010* 706M Handsets in 2010* 328M Handsets in 2010*

Three out of four mobile handsets utilize a USB Port*

F a i r c h

i l d

S o l u t i o n s

* Source : iSuppli 2010



33% 3yr CAGR* Fast growing, semi custom space Reset Timers Series; hardware reset for

software lock up Temperature Sensors; provide thermalprotection

I/O Level Shifters for I2C, SD Memoryand SIM cards

Clock buffering and distribution Baseband / Application Processor I/O

expansion

ASSP SolutionsASSPs Enable Smart Phone Applications

Ambient Light

Proximity

Temperature

Compass

Motion / Acceleration

Inclination

Current & Voltage

Timing

Mobile ASSP Solutions


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Mobile Audio

Investment started in 2009 with purchase of Leadis Audio IP and Team

Focused on proving competitive IP and selection as audio supplier at majorhandset suppliers

2010 Customer Driven Products Include:

CODEC /

ADC

DigitalMicrophone IC

(PGA + ADC) w/ low sleep current

and EnhancedSNR

Class D and G AudioSubsystem w/ Pop and

Click reduction

Class D Speaker Amp w/ Battery Boost for Power

Mgt

Class G HeadphoneAmp w/ Integrated

Buck for Power Mgt

Dig Mic = Digital Microphone ICSub = Audio SubsystemSPA = Speaker AmplifierHPA = Headphone Amplifier

Source: Fairchild

SPA

HPA

S u b s y s t e m

Dig Mic IC

Mobile Audio Focus SAM ($M)

$ M

0

100

200

300

400500

2010 2011 2012 2013 2014

Dig Mic

Sub

SPA

HPA
http://images.google.com/imgres?imgurl=http://www.made-in-china.com/image/2f0j00mBEQHzMJrhqNM/Earphone-E-5601-.jpg&imgrefurl=http://www.made-in-china.com/showroom/emaxtech/product-detailwonQzYMOEHcj/China-Earphone-E-5601-.html&usg=__nLodA7jIo5Ysg_PaiPznA5kCp-s=&h=398&w=400&sz=28&hl=en&start=36&tbnid=MNLdtFKTO-OFFM:&tbnh=123&tbnw=124&prev=/images?q=earphone&gbv=2&ndsp=20&hl=en&sa=N&start=20http://images.google.com/imgres?imgurl=https://academictech.doit.wisc.edu/ORFI/otr/creating/speakers.png&imgrefurl=http://forums.savage2.com/showthread.php?p=270641&usg=__AozdrWvnbD1uTsm5nqIE7QlvMDs=&h=137&w=137&sz=3&hl=en&start=28&tbnid=32FuiwC-vQUNUM:&tbnh=93&tbnw=93&prev=/images?q=microphone+symbol&gbv=2&ndsp=20&hl=en&sa=N&start=20


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Core Power Management

Step-down DC/DC for SDFlash Memory Cards

Low noise regulators for Proximityand accelerometers

Step-Up DC/DCconverter of USB-OTG

Multi-Channel + Mixed Signal forImage sensor modules

Handset features and usage patterns continue to increase demands on energy efficiency Continues to drive adoption of switching DC/DC across a wider range of voltages Fast growing High Performance Analog Segment through 2014 (21% CAGR*)

Li-IonBattery

3.2V 4.2V

DC/DC 3.0V SDRAM

DC/DC Applicationprocessor

DC/DC 2.9V GPS receiverDC/DC 1.1V BaseBand DSPDC/DC 2.6V ImageSensorDC/DC 1.6V RF TransceiverDC/DC 2.8V FLASH memoryDC/DC 12V LCD DisplayDC/DC 30V LED BacklightDC/DC 2.0V PLLDC/DC RF PADC/DC WiFisub

systemDC/DC Audio AmplifierDC/DC AccelerometerDC/DC Hall SensorDC/DC KeyboardDC/DC I/ODC/DC 3.0V Touchscreen

*Q2 2010 iSuppli 2010-2014


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3G/4G Smart Phone

BasebandChipset

3G PA

470nH

1

10

64

Li-Ion Battery

11

RFTransceiver

VOUT_SNS

SW

GND

PVIN

EN

VCONDAC

RF_IN

P_DET

3GPIO

FAN5902/4/5

+ 200 Minutes More Talk Time+ 140 Minutes More Access Time

34% adoption today to 85% in 2013Over 40% CAGR

Runs 50%

Cooler

Multi-Band RF Power Management

Switching Regulator for RF Saves Power, Extends Battery Life


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LV MOSFET Trends

Process Technology Continues to Drive Cost and Performance

Packaging Technology Shift Enabled by Process Drives Power Density

Performance Segments Require Power Density Improvements

Efficiency Gains are Highly Valued

Good Market Growth at 8% SAM CAGR

Source: WSTS Fukuoka May 28 th 2010 projection 2010 - 2013

P T h l D i


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0.01

0.1

1

1994 1996 1998 2000 2002 2004 2006 2008 2010 2012

Process Technology DrivesCost and Performance

UltraFETTrench-

-10M cellPlanar

-Trench

-Oxide Charge Balance

Key:

-PT1

PT3-

-PT8

PT4- -RP5

PT6-PT7 Sync-

PT10-

30V Die Size for 3mohm Die, (cm2)

20% Average DieSize Reduction perTechnology Node

Enables :

-Die Cost Reduction(Margin

Improvement)

-Smaller PackageFootprint

(Market Share)


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Power Density

2 X D-Pak 130 mm 2

Power Stage 30 mm

2 X 3X3 PQFN 21 mm

2X 5x6 PQFN 60 mm

Old Approach New Approach

20A DC/DC

2 X SO-8 60 mm 2


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Power Density Improves Over 8X

SO-8

Q JA = 74.2C/W

P d = 56 mW/mm 2

30 mm 2

Power 33

Q JA = 59.5C/W

P d = 190 mW/mm 2

11 mm 2

Power 56

Q JA = 48.6C/W

P d = 86 mW/mm 2

30 mm 2

Power 22

Q JA = 65.8C/W

P d = 475 mW/mm 2

4 mm2

Transitions Power56 to Power33 SO8 to Power33 Power33 to Power22 and Power Stage Duals


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MOSFET Power in Notebook Computers

Focus AreasNotebook VcorePowerStage 5x6 Duals 30VPower33 NCH 30V sub 3mOhmPower56 30VPT8S

Notebook DC:DC/BatteryPowerStage Dual 30V 3x3,3x4.5, 5x6Power33 NCH 30V 3-30mOhmPower56 NCH 30V 3-15mOhmPower33 PCH 30V ST3Power33 NCH 30V Dual Cool TM

N VDC Notebook/TabletPowerStage Duals 25VPower33 NCH 25V Dual Cool TM

Power33 PCH 25V ST3Power22 NCH 25V PT7CSP 20V NCH Zener PT7Power33 NCH 100V (LED BLU)

LV MOSFET Content $3.05 in 2013

Cost Effective Performance as Small as Possible


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MOSFET Power in LED LCD TVs

34

Focus Areas

LED BLU : Main Switching FETN-CH PT5 100VN-CH PT5 150VN-CH PT7 40VPower33, Power56, SOT223and DPAK

LED BLU : Sync MOSFETN-CH PT5 100VN-CH PT5 150VN-CH PT5 200VPower33, SOT223 and DPAK

T-Con Board & Video Board :PowerStageDuals 30VPower33 NCH 30V PT7

Analog

Micom

RF Tuner

PCIInterface

Analog/ Digital I/O

AMP

Source driver

Display

Rectifier

PFC

LLC

Stand by

WLED backlight& Optical structure

Video BoardSMPS

Timing controller

Boost

Boost

Buckboost

Buck

VCOM Buffer

Gamma corrector

Level shifter

GPM

T-Con Board

LED driver board

Isolated DCDC

G a t e

d r i v e r

Buck

PM IC

LED Backlight

Buck

LDO

LDOLDO

LV MOSFET Content $0.68 Today Growing to $1.33 in 2013

Efficient and Reliable Performance as Cool as Possible


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MOSFET Power in Power Over Ethernet

Focus Areas

Power Sourcing Equipment CircuitIsolation switch with wide SOASOT223Power 33

Powered Device CircuitIsolation switchSSOT3SSOT6

Powered Device DC-DCPrimary Switch 150VPower56, power33, SSOT3, SSOT6,SO8, DPAKSynchronous rectifier30V SO8, SSOT6, power33, power 56

Powered Device BridgeSSOT3SO8 DualMLP QuadPower33

LV MOSFET Content $0.50 per port

High Levels of Reliability as Small as Possible


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MOSFET Power in Servers

36

Focus Areas

Server Vcore/DDRPowerStage56 25VPower33 25V PT8+Power56 25V PT7/8+Power56/33 Dual CoolDrMOS Multi-Chip-Module

Server POLsPowerStage56/34/33Power33 PT7/8Power56 PT7/8TinyBuck Integrated solution

CPU 1 CPU 2

DIMM 1

DIMM 4

DIMM 3

DIMM 2

2.5 HDD

Romley VR Block Diagram12-19-07

1.0V AUX1.0V @ 1.2A

12V3

Zoar

1.8V AUX1.8V @ 0.8A Zoar-Eathernet

IBMC1.2V AUX1.2V @ 0.8A

5VSBVR12 Dual SVID

Vccp @ 126AVsa @ 3A

12V1a

DDR3 VDDQ1.5V@ 70A

CPU PLL1.8V @ 1.2A

12V1b

CPU VTT1.05V @ 25A

1.5V STBY1.5V @ 0.4A

KEY

VRLoadVR12 SVID combo

VR controler

Jaketown (CPU)VCCP

VSAVTT

VPLL

VDDR01

DDR3 (4 DIMMs)VDDQ

VTT

VDDR23

DDR3 (4 DIMMs)VDDQ

VTTDDR3 Vtt0.75V@ 1.1A

OPTIONAL 12VSOURCE

OPTIONAL 12VSOURCE

VR12 Dual SVIDVccp @ 126AVsa @ 3A

12V2a12V2b

Jaketown (CPU)

VCCPVSA

VTT

VPLL

VDDR01

DDR3 (4 DIMMs)VDDQ

VTT

VDDR23

DDR3 (4 DIMMs)VDDQ

VTT

OPTIONAL 12VSOURCE

OPTIONAL 12VSOURCE

Pattsburg (PCH)

1.5V

1.1V STBY

1.1V

1.5V STBY

1.1V STBY

1.1V @ 1.1A

1.1V PBG1.1V@ 21A

5VSB

3.3V STBY3.3V@ 0.4A

12V3

PCI

CPU PLL1.8V @ 1.2A

DDR3 Vtt0.75V@ 1.1A

DDR3 Vtt0.75V@ 1.1A

DDR3 Vtt0.75V@ 1.1A

DDR3 VDDQ1.5V@ 70A

DDR3 VDDQ1.5V@ 70A

DDR3 VDDQ1.5V@ 70A

Note: All currents are TDC (Thermal Design Current)

LV MOSFET content grows from< $0.50 to > $5.00 in 2013

Most Efficient Performance as Small as Possible


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Dual Cool vs. DirectFET

Small Can

7.2m

3x32.4m

3x37.2m

ComponentArea:49mm 2 ComponentArea:21.5mm 2

MediumCan

2.4m

70

72

74

76

78

80

82

84

86

88

90

92

94

0 5 10 15 20 25 30

P o w e r E f

f i c i e n c y %

Load (A)

1Phase CCM- Heatsink, No Air

MOSFETS: FDMC3020DC 3x3 HS, FDMC2512SDC 3x3 LS

MOSFETS: IRF6710S HS, IRF6795 LS

MOSFETS: FDMC3020DC 3x3 HS, FDMC2502SDC 5x6 LS

Dual Cool Runs Cooler

Dual Cool is Smaller

Dual Cool is More Efficient

Dual Cool 3x3 and 5x6 ramp in 2011Lead applications are performance computing

Dual Cool TMDirect FET

DirectFET is a registered trademark of International Rectifier

Fairchild

Fairchild

IR

PowerStage Clip vs TI Stacked


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PowerStage Clip vs. TI Stackedvs. Renesas

Fairchild:75 C @ 25A

TI Stacked:99 C @ 25A

Renesas:108 C @ 25A

LateralStacked Silicon

processexhibits higherringing than

Shielded-GateTrench

Technology

FairchildFDMS3600S

and

FDMS3602S

Under typical application conditions, Asymmetric duals in 5x6

Power Stage is more efficient

Power Stage runs cooler

Power Stage low ringing, no snubber

0

1

2

3

4

5

6

7

8

9

10

68

70

72

74

76

78

80

82

84

86

88

90

92

0 5 10 15 20 25

E f f i c i e n c y

( % )

Output Load (A)

Efficiency and Power Loss12V IN, 1V OUT, 300kHz

P owFairchild

RenesasTI

Components Tested:Fairchild FDMS3600SRenesas RJK0214TI CDS86350


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Market Segment Mix Improves Margin

Gross margin increases over 3 year horizon Mix of performance computing, consumer and communications increases

LV MOSFET GM Projection

2009ACT

2010EST

2011 2012 2013

Cons/Coms/Ind

PerformanceComputing

Notebook

Total

LV MOSFET Segment Mix

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

2009ACT

2010EST

2011 2012 2013

Cons/Comms/Ind

Performance Computing

Notebook


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Efficiency, Power Density, and Size are Valued inPerformance Applications of the Communications,Consumer and Computing Segments

Process and Package Technology are Key to Leadingin These Value Dimensions

Revenue Growth and Margin Expansion thatOutperforms the Low Voltage MOSFET Market

Low Voltage MOSFET Summary

MCCC Mobile Products


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MCCC Mobile ProductsExtend Battery Life, Enable Greater Functionality

MOSFET IntelliMAX Building Block Regulators ASSP Regulators

Analog Switches USB SerDes Mixed Signal ASSP

Base Band andApplication Processor

PMIC

Memory

Display

Sub DisplayLMU

Camera

Audio DataVideo

Display &Camera

uSerDes

Signal PathSubsystems

GPSPower

SubsystemsLMU

DC:DC

RF

SD cardHDMI

CameraDC:DC

Microphone

Power

P M I C


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Increasing Power Consumption

3G 3.5G Pre 4G 4G2.75G2G

GPRSUMTS

WCDMATD-SCDMA

HSDPAHSPA

GSMWiMax / WiFi

WiBroLTEEDGE

70M172M14Mbps

384K180k56k9.6k

DATA RATE (bps)

VOICESMS

InternetBrowsing

Email

Video callVideo Download

Interactive Gaming

Video ConferenceVideo Broadcast

VOIP

HDTVMultiview Video

Digital TV

10hr 5hr 2:30hr 1:00hr ?hrTalk / Connection time


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USB Switch

WLANModule

Mobile Handset Targeted Subsystems

Audio

Connectors

Distributed ArchitectureDrivers :

Dissimilar ProcessTechnology

Dissimilar IC lifecycles Optimized power

consumption/efficiency Improved Time to Market

(modularity) Differentiation (feature

sets and user experience)

FAIRCHILD FOCUS: Distributed Signal PathSubsystems and Power

OVPT

X

MU

S

BluetoothModule

SDIO

SwitchDACCodecADCAMPAMP AMP

ApplicationProcessor PMIC

BroadbandProcessor

RF Power

Chipset

LCDBacklight

Driver

DisplayGPS

Mobile TV

FeaturesMP3

Other

P

P

P1

PN

P


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Battery Life in Smartphones

Only 5 6.4 hrs of 3G talk timefor leading smartphones

Battery life gates userexperience

All 4 phones use a similar

battery with a capacity of 1400mAh More functionssame battery

form factor

10MP image sensors

Multi core apps processors

3D MEMS gyroscopes

5.0 GBit/s datarates

AMOLED WQVGA displays

8 RF Bands.

Bridging the energy gap:

Higher energy density batteries (new Chemistries) Optimized usage of features (HW & SW) More efficient conversion of battery power Lower power consuming components


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RFPA PowerManagament

Batt Mngment

ApplicationApplicationProcessorProcessor

MemoryMemoryI/OI/O

WiMaxWiMax

LightingManagement

WW--CDMACDMA

RFPARFPA

GSMGSMRFPARFPA

Core PowerManagement

Fairchild s Mobile DC/DC Products

Battery Management

Core Power

RF Power Management

Lighting

DC/DC converters for digital coresPMICs

RF DC/DC

microPMIC RF subsystem

LCD back lighting

AMOLED

LED Flash

Switching Chargers

Efficient DC/DC Conversion = Longer Battery Life
http://rds.yahoo.com/_ylt=A0WTb_322bFJwmcAEnqJzbkF;_ylu=X3oDMTBqaHBscmZmBHBvcwMxMwRzZWMDc3IEdnRpZAM-/SIG=1g59ioe1c/EXP=1236478838/**http:/images.search.yahoo.com/images/view?back=http://images.search.yahoo.com/search/images?p=usb+logo&fr=yfp-t-501&ei=utf-8&x=wrt&w=366&h=366&imgurl=www.right-click.ie/shop/images/new_usb_logo.jpg&rurl=http://www.right-click.ie/shop/images&size=12.2kB&name=new_usb_logo.jpg&p=usb+logo&type=JPG&oid=77e12d50977794a2&no=13&tt=73,671&sigr=11598v8vi&sigi=11fbb826a&sigb=12j9lbror


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Mobile Subsystem Capabilities

USB

Accessory DetectionSwitchesTransceivers (Std, full, high)Over Voltage Protection (OVP)Charging

AudioClass D AmpClass G AmpClass A/B AmpDigital Mic. ICSwitches

VideoFilter/DriversSwitchesMIPI SwitchuSerDesCamera Switches

ASSPPLL GPIO ExpandersTiny Logic SIMM Card SwitchReset Timer Memory SwitchTranslators

Display

u S e r D e s

Base Band/ApplicationProcessor

CameraSwitch

PMIC Charging/OVP

USB TRX A c c

. D e t . M U X

uSerDes

USB

Audio

Video

ASSP ASSP

Switch C O D E C

Class G

Class D

Class A/B

O V

P
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Mobile USB

Solutions for the full USB signal path USB Switches Multimedia Switches Accessory Detection Transceivers

Enable USB port sharing for data, audio,

video, and charging Reduce external components Power savings with low power modes Ultra-small packaging

Maximizing USB port functionality in mobile electronics

USB AccessoryDetectionDetect an accessory typefor automatic applicationrouting.

USBTransceiversMaximizes designflexibility andassures USBcompliance.

LV MOSFET
http://images.google.com/imgres?imgurl=http://etc.usf.edu/te_WIN/hardware/i/usb2logo.gif&imgrefurl=http://etc.usf.edu/te_WIN/hardware/usb.html&usg=__4qmSM2GUjkNI6fIgap7XSrH04j8=&h=236&w=425&sz=4&hl=en&start=2&tbnid=kxCcXoWhDc-GIM:&tbnh=70&tbnw=126&prev=/images?q=high+speed+usb+logo&gbv=2&hl=en&sa=G


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LV MOSFETLeading Technology = Best in Class Margins

1998 2000 2002 2003 2005 2006 2007 2008 2009 2010 2011

Leading silicon and packagetechnology enables optimum size,performance and profitability

Move to next-gen packages lowercosts and improves performance

Technology leverage is greaterthan scale leverage

$-

$10

$20

$30

$40

$50

$60

$70

0 1 2 3 4 5 6 7Volume Scenario

P a c

k a g e

C o s

t

Next GenCurrent PkgCurrent PkgNext GenNext Gen

Long Term Die Cost Trends

Relative Package Cost Curve


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F F L di P k T h l


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Form Factor Leading Package Technology

Reference: SO-8Power 33

Power 56

Q JA = 74.2C/W

P d = 56 mW/mm 2

Q JA = 59.5C/W

Pd

= 190 mW/mm 2

Q JA = 48.6C/W

P d = 86 mW/mm 2

30 mm 230 mm 211 mm 2

Form Factors for Singles:

Power 22

Q JA = 65.8C/W

P d = 475 mW/mm2

4 mm2

A package portfolio to drive mobile computing transitions! Power56 to Power33 SO8 to Power33 Power33 to Power22 and PowerStage Duals

fi hi


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Infineon Partnership

P T h D l C l


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25A Control and Synchronous Solutions

S7.2m

Dual Cool TM 3x37.2m


30A Control and Synchronous Solutions

M

M

Power Trench Dual Cool

ComponentArea:49mm 2

ComponentArea:21.5mm 2

M2.4m

Dual Cool TM 3x3

7.2m




Shif i h F F


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Shifting the Form Factor

MLP 3x3 Dual9 mm 2

2 x SO-860 mm 2

Fairchild Integrated PowerStage Solutions


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Fairchild Integrated PowerStage SolutionsHigh Side and Low MOSFETs in a Single Package

25A Buck Converter Solution

6mm

5mm

6mm

5mm

5A Buck ConverterSolution

S08

3mm

3mm

Standard Solution: 60mm 2

PowerStage Solution: 30mm 2Better Performance, 3X Smaller Footprint

HS HS

LS

LS LS

HS

LS

HSLS

Standard Solution: 90mm 2

PowerStage Solution: 9mm 2Better Performance, 7X Smaller Footprint


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Power Conversion,Industrial & Auto (PCIA)

Group Overview


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Regulation and Policy Drives our


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g yMarkets

Eco-friendly policies are moving the market WW

Energy Labeling, Energy Efficiency Adoption of inverters in motor control applications Change from traditional lighting to LED, CFL Regional Examples:

EU: EPBD (Energy Performance of Building Directive) : All new buildingsshould consume zero energy from 2019

EU: New Energy Labeling system For Eco-Design:


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Inverter Driven Motors

Brushless DC (BLDC) motors

Improved performance andefficiency

Lowers total cost of ownership

Reduced size = raw materialsavings

Fairchild is well positioned to helpour customers capitalize on themove from Mechanical control toElectronic solutions (inverters)

Our Smart Power Modules

facilitate this transition easingthe design requirements

Our IC s can simplify thecontrol of these motors

AC BLDC

Size/Weight 100% 70% of AC @1HP55% of AC @2HP

Raw materialcost

AC >= BLDC driven by size/weight

Efficiency 40~45% 70~75%

Speed control Difficult Easy & Linear

Accuracy ofSpeed

3~5% 0.5%

Torque control Poor Controllable

Induction Motor vs BLDC Motor


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Induction Motor vs. BLDC Motor

The speed and efficiency of AC induction motor is restricted by its power source (the line voltage and frequency). The power source of BLDC motor is controlled by semiconductor devices, which can achieve

high efficiency at various speed and output load.

BLDC motor A Brushless DC motor has

permanent magnets on therotor which eliminates theproblems of inducingcurrent to the movingarmature.

An IC controller keeps thestator current in phase withthe permanent magnets ofthe rotor This requires less

current to turn the motorwith the same out force

Resulting in greaterefficiency and smallersize.

AC Induction motor The induction motor is also

known as a rotating transformer .

Power is supplied to the rotorby electromagnetic induction.

This method of transferringpower to the rotor lowersthe efficiency.

The motor turns because of themagnetic force exertedbetween a stationaryelectromagnet (stator) and therotating electromagnet (rotor).

The phase differencerequires greater current andcurrent losses to achievepower.

The stator is also powered byAC, the low frequency (50/60

Hz) requires a bigger magnetic-core and more windings tocouple the current from statorto rotor.

VAC: 110V/220V ;50/60 Hz

Inverterization Drives SAM


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-

100

200

300

400

500

2010 2011 2012 2013 2014 2015

M Units

SAM using Inverter Appliance TAM

Expansion in Appliances

Washing machines, refrigerators, airconditioners all require inverter drivenmotors to meet energy savingsregulations

Content: $2 - $20/system Our SPM solutions:

Reduce total system cost Reduce development time Optimize performance Provide higher reliability Reduce board space

In 2009, SPM revenue remained flat to2008

Expect SPM revenue to more thandouble from 2010 to 2012

Source; IMS, iSuppli, Fuji Chimera, Darnell, WSTS etc

TAM growth of end markets is modest,but Inverter % grows rapidly

TAM CAGR of 6% 2010-2015

SAM CAGR of 21% 2010-2015


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Application: Pump Drive


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SPM3

SPM5

-

10.00

20.00

30.00

40.00

50.00

2010 2011 2012 2013 2014 2015

M Units

SAM using Inverter Pump TAM

SPM2

SPM4

Application: Pump Drive

Small overall pump growth but

regulations in EU will push adoptionof BLDC inverter Working with many of the world s

leading customers Broad portfolio of SPM products to

address many needs SPM5 Circulation pump SPM4 2 General pump 1200V SPM2 3 General pump

Content $ Circulation pump : $2.5 ~ $5.0

2 General pump : $18 ~ $36 3 General pump : $27 ~ $50

TAM CAGR of 2% 2010-2015

SAM CAGR of 44% 2010-2015

Application: Fan Motors


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-

50

100

150

200

250

300

350

2010 2011 2012 2013 2014 2015

M Units

SAM using Inverter Fan TAM

Application: Fan Motors

In fans, like appliances, BLDC motor

usage is rapidly outpacing traditionalAC motors We provide both the IC control and

power train Our SPM solutions outperform IGBT

based one-chip solutions MOSFET has superior efficiency in

major fan motor area MOSFET has superior ruggedness (10

times longer short circuit time)

Our IC solutions provide customers

with a simple way to implement control BOM$ (40W ~ 70W fan motor) Module(SPM5) $1.6 ~ $3.0 Motor control IC $0.7 ~ $ 1.4

TAM CAGR of 6% 2010-2015

SAM CAGR of 18% 2010-2015


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Working Principle of IH Cooker


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Working Principle of IH Cooker

Electromagnetic Induction + Skin Effect + Heat generation in cooking vessel

Inverter Module

CookingVessel(Pot)

CeramicPlate

Work

Coil

MagneticFlux

CookingVessel(Pot) Heat loss to

air byconvection

Gas stoveHeat loss tocookingstove byconduction

Conventional Heating MethodsCooking vessel is heated though thermal conduction or radiation from heat source including combustion of gas, hotplate with heating coil and thermal radition from

Halogan. So there is some amount of thermal energy loss due to conduction or convection during thermal energy transfer from heating source.

Induction Heating MethodsOnly electromegnetic energy is transferred to cooking vessel from Induction cooker, so there is no thermal energy transfer resulting in no thermal energy loss during the process. All the transferred electromegnetic energy is used to heat the cooking vessel itself.

Heat is generatedwithin the cookingvessel by EddyCurrent


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Application: Induction Heating &


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-

50

100

150

200

250

300

2010 2011 2012 2013 2014 2015

M Units

SAM using Inverter TAM

Microwave Oven

Energy Savings and increased functionalitydriving adoption of inverters in cookingapplications

Particularly strong in Asia and EU FCS provide a broad family of IGBT s and

Drivers for these applications Content:

IH cooktop:

8 x 600V IGBT or 4 x 1200V IGBT $3.70 ~ $7.60/system

IH tabletop: 1200V IGBT, $0.60 ~ $0.95/system

MWO : 2 x 600V IGBT or 1-2 1000V IGBT,

$0.85~ $1.6/system Rice Cooker :

1000V IGBT or 1200V IGBT, $0.85 ~ $1.90/system

Key Customers Include: BSH Balay, Fagor,Midea, Fushibao, Panasonic, Hitachi, Cuckoo

TAM CAGR of 7% 2010-2015

SAM CAGR of 11% 2010-2015

World Class Standby Power


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-

1,000

2,000

3,000

4,000

5,000

6,000

7,000

8,000

9,000

10,000

30 150 500

E n e r g y S a v

i n g s /

D a y

( M W h )

Standby Power of Comparison Charger (mW)

y

Why is this important? Current specs for cell phone chargers

require


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Application: High Efficiency Computing


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and Consumer - World Class Standby Power

NB

Std by of PC

Printer

Std by of LCD TV/ LED TV LCD/LED Monitor

Green ModePWM only designfor NPB adapter w/


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pp

Strong Market Acceptance of our


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0

100

200

300

400

2010 2011 2012 2013 2014 2015

M Units

NB > 75W SAM NB TAM

0

50

100

150

2010 2011 2012 2013 2014 2015

M Units

PC Gold SAM PC TAM

Power Supplies

Computing market continues todrive towards higher efficiency atfull load while minimizing power atlow loads

FCS controllers provide a uniquefeature set:

Leading Patented Power SavingTechnology

Higher efficiency Reduced component count Easy to design

Content: $1.50-$2.00 per PC $0.65-$1.20 per NB adapter

TAM CAGR of 1% 2010-2015

SAM CAGR of 43% 2010-2015

TAM CAGR of 10% 2010-2015

SAM CAGR of 15% 2010-2015

Application: +75W NB Adapter Multiple Solutions Available


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Multiple Solutions Available

PFC + QRcombo

High SideDriver Content: $0.9~$1.2

Next gen of NB adaptor solutions to meet92%+ efficiency

High integration provides cost effectivedesign

Wider power range 75W~250W

Allows for very slim design

Syn. RectifierController

FAN6921

VDD

RES

AGNDGND

LPC

VOUTISR

R1

R2 R4

R3

1

GATE

8

3 5

7

64

Q2

FAN6204

PFC + QR combo Syn. Rectifier Controller

Content: $0.65~$0.8

Current mainstream solution for NBadaptors

Meets 90%+ efficiency, high integration ,75W~150W

Application: PC Gold


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pp

FAN6982FAN9612

FAN7621

FAN6208

12V

SG1577A3.3V

5V

SG652X

CCM PFCInterleave CRM PF C LLC

Supervisor

LLC SR

Dual Buck

FSBH0X705VSB

Standby

Content: $1.5~ $2.0

Multiple sockets necessary to meet High efficiency necessary for 80+ gold

Low standby power to meet 2013 EuP lot 6 regulation:


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Robust Auto Solutions for energy efficient applications

Engine ManagementIgnition, Glow PlugInjector control and supply

HID Lighting

Braking (ABS, ESC)

Electric pumps (water, fuel, oil)DC/DC in HEV / EV

Electric Power Steering

El. Parking Brake

Transmission andGearbox

Engine Cooling

Power Steering Types


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(HPS) Purely hydraulic power steeringPump mechanically attached to the engine.

Pump power output proportional to RPMPump must satisfy assistance at min RPM, thusat high RPM energy is wasted.

Pulleys and belt from enginecrankshaft power the pump

Pump for HPS has to be beside theengine, thus requiring long hoses.

Reservoir

EHPSPump mounted locallyPump powered by an electrical motor

only upon demand

EPSNo Pump, no hydraulic fluid.An electrical motor provides assistance upon demand

Electric motor


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Application: Automotive PowerM d l f EPS


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0

510

15

20

25

30

35

4045

2010 2011 2012 2013 2014 2015

Module SAM EPS TAM

M Units

Modules for EPS

$12 to $25 per system / vehicle

2009: Fairchild sold modules for300k vehicles

2010: Modules for 900k vehicles willbe sold by end of the year

3 platforms and 5 car models

Outlook 2012: 2-3M Fairchild APMmodules 9 platforms with 20 car models will be in

production by end 2012

Other hydraulic systems are all

potential opportunities

TAM CAGR of 11% 2010-2015

SAM CAGR of 18% 2010-2015

Application: Automotive IGBTsf I iti S t


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for Ignition Systems Fairchild supports the full

portfolio of IGBTs for Ignitionsystems

Fairchild Ignition IGBT products: Improve thermal management

in a reduced footprint Facilitate high system reliability

Best in class energy handlingcapability

Simplify design Improve fuel efficiency

Fairchild is the number onesupplier across all ignitionarchitectures, from Coil on Plugto advanced multispark Switchon Plug systems

EngineControl

IgnitionSwitch

IgnitionCoil

SparkPlug

Application: Automotive IGBTs forIg iti S t


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Ignition Systems

Strong growth:

2009: 61Mu/year (Y-on-Y growth) Forecast 2010: 94Mu/year 2012: targeting > 110Mu/year

Content: $2 to $10 for a 4 cylinder

gasoline vehicle

Further growth will be fueled by: New technologies allowing for reduced die

size hence smaller packages

New Smart Ignition and Ignitor Moduleproducts

EcoSPARKdeliversbenchmarkenergycapability perunit area

0

20,000

40,000

60,000

80,000

100,000

Ignition IGBT Sales History

Calendar Year

Y e a r l y

U n

i t e s

( I n M u

)

PCIA Summary


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y

PCIA are in a Target Rich environment While many of our end markets have single digit TAM

growth Energy efficiency is driving double digit SAM growth.

Our technology should allow us to take significant market positions We have a unique combination of IC, Discrete and Packaging

capabilities to create value added products


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Finance Overview

Highlights of the Quarter Q3 2011


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Sales were $403m, down 7% QoQ and 3% YoY strong mobile analog sales offset by weak demand in consumer,computing, appliance and solar sectors

PCIA sales were down 10% QoQ but up 5% YoY due weaker demand from consumer, computing, appliance and solarcustomers as they continue to reduce inventory MCCC sales were f lat QoQ due as strong mobile analog sales wereoffset by weaker demand in the consumer and computing sectors

Adjusted gross margin was 36%, down 120 bps QoQ and 50 bps YoY lower factory loadings plus roughly a 1percentage point impact from 8 fab start costs caused margins to decrease

Distribution POS was down 9% QoQ causing channel inventory to increase from the prior quarterfactory loadings havebeen reduced to drive an expected reduction in channel inventory in Q4

Internal inventory increased 2% in dollars

Generated $19m in free cash flow (cash from operations capex) and ended Q3 with $165m in net cash

Pricing was down less than 1% QoQ

Utilization decreased to roughly 80%virtually all lead times are at normal levels

Q4 Forward Guidance


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Sales expected to be $350 370mcurrent scheduled backlog nearlycovers the low end of this range

Gross margin expected to be 32 34% due to reduced factory loadings asinventories are reduced

R&D and SG&A forecast to remain roughly flat QoQ at $92m

Adjusted tax rate forecast to be between 15% +/-3%


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Adjusted EPS


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j

Factors Driving Future Gross MarginExpansion


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Accelerate the development of new products that offer higher valueadd to our customers

Leverage current manufacturing footprint through existing factoryconsolidation plan and continued 8 wafer conversions

Continued proliferation of lean manufacturing efforts throughout theorganization

Pricing management through effective inventory and product lifecycle management

Effective management of capital expenditures Leverage bulk purchasing opportunities Continually raise the acceptance threshold for new projects

Expansion

Product Mix: 250 300 bps

Cost: 100 150 bpsMFG Optimization: 100 150 bps


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Free Cash Flow


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4 Qtr Rolling FCF % Revenue


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g

Debt Composition & Trend


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0

200,000

400,000

600,000

800,000

1,000,000

1,200,000

1997 1999 2001 2007 2008 2009 2010 2011

Drawn Revolver Term Loan Convert High Yield

Net Debt & Interest Trend


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0.0%

1.0%

2.0%

3.0%

4.0%

5.0%

6.0%

7.0%

8.0%

9.0%

-$700.0

-$600.0

-$500.0

-$400.0

-$300.0

-$200.0

-$100.0

$0.0

$100.0

$200.0

$300.0

1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 Q1 '11 Q2 '11 Q3 '11

Net Cash Interest % of Revenue

Why Fairchild is Winning


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Focus on Large, Industry-Leading Customers in Fast-

Growing Markets

World-class SCM and WW

Reach Make Fairchild a GoodFit in the Top 3 5 SupplierEcoSystem

Great Technology& IP Creates

Higher Barriersand Strong

Growth in TargetMargin Band

Disciplined SCM,Capex & Asset

Mgmt GeneratesHigher ROI &

Cashflow

BaseBandandApplicationProcessor

PMIC

Memory

Display

Sub DisplayLMU

Camera

Audio DataVideo

Display &Camera

uSerDes

Signal PathSubsystems

GPSPower

SubsystemsLMU

DC:DC

RF

SDcardHDMI

CameraDC:DC

Microphone

Power

P M I C

SPMs

Dual Cool TM

MLP Duals
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Follow us on Twitter @ twitter.com/fairchildSemi

View product and company videos , listen to podcasts and comment on our blog @www.fairchildsemi.com/engineeringconnections

Visit us on Facebook @ www.facebook.com/FairchildSemiconductor
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Fairchild IR Presentation October 2011

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