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FIDES

FIDES : general presentation

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Content

êWhy FIDESêContextêMethodology

l Basic modelsl Technology contributionl Use contributionl Process factor

ê FIDES engineeringêConclusions

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Why FIDES

ê Existing predictive reliability methods are inadequatel MIL-HDBK-217 is widely obsolete

l Not updated since 1991 / 1995,l Not adapted for civil application and pessimistic for civil

components,…l IEC 62380 TR Ed.1 (RDF 2003) or PRISM® / 217+® don’t propose

complete answersl Not adapted for complex mission profile,l Not adapted for rugged environment (humidity, vibration,…,),l Unable to sort by COTS manufacturers,l …

military equipmentMIL HDBK

217F (Pi Q=10)

MIL HDBK217F

with correctionPRISM

(217plus) Field return

MTBF (in hours) 3063 19036 59673 169895

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Component20%

Process80%

Context

Specification 8%

Design 16%

Manufacturing 24% System

Integration 12%

Exploitation & Maintenance

20%

Support Activities

20%

Fides default failure distributionthrough life cycle

(example)

Weighting between component & process

(example)

Intrinsic failures (FE, BE, …) are not the main causes of equipment failures

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Context : new approach for reliability prediction FIDES

METHODOLOGYMETHODOLOGY

for reliabilityfor reliabilityASSESSMENTASSESSMENT

for reliabilityfor reliabilityENGINEERINGENGINEERING

FIDES

• Results of a study which has begun in 2001 on the aegis of the French MOD

•Developed by 8 industrialists from the field of aeronautics and defense

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What is FIDES

êWhat is FIDES ?l FIDES is a new reliability methodology for electronic

systems using COTS,l The first FIDES Guide 2004 issue A “Reliability

Methodology for Electronic Systems” was published in 2004, new edition FIDES 2009, standard UTE C-80811 since 2005 (in english & french),

l This Guide is an answer to two strong needs :l To have realistic reliability prediction during the development

of an electronic productl To provide engineering process and tools to assess

equipment system reliability

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FIDES for what

ê FIDES proposes a new reliability methodology for systems using COTSl As accurate as possible,l Useful for building and evaluating the reliability of

systems,l Usable for many items , including COTS families,

Parts Boards Sub-assemblies

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What is FIDES

ê The FIDES methodologyl Include new technologies,

l Take into account all the influences on reliability like :l Technologies,l Application (naval, airborne, avionics, automotive,…),l Life cycle (specification, design, manufacture, system

integration, maintenance),l Actual use conditions (thermal, mechanical, electrical,…),l Overstresses.

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What is FIDES

Technologies

Process Use

Reliability

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The methodology

TECHNOLOGY

PROCESS

RELIABILITY

USE

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FIDES Methodology : Models

ê FIDES models: partsl Integrated circuits, ASIC, Discrete parts, LED, Opto, Resistors, Fuses, Ceramic

capacitors, Aluminum capacitors, Tantalum capacitors, Magnetic parts (inductors & transformers), Piezoelectric parts (oscillators & quartz), Hermetically Sealed Electromechanical Relays, Switches, PCB, Connectors, Hybrids & MCM, Hyper frequency parts

ê FIDES models: cardl COTS cards

ê FIDES models: sub-assemblyl LCD screens, Hard disks, CRT monitors, AC/DC & DC/DC converters,

Li & Ni Energy storage modules, Fans, Pressure sensors, Keyboards

ê FIDES models : part count

NB : XXX : news models in FIDES 2009 guide

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FIDES Generic Models

ê Generic Model

( ) ProcessPart_MfgInducedtressPhysical_Sitem .ππ.πλλ .∑=

Specific modelisation : EOS, TOS, MOS.

Specific modelisation for quality

management of COTS manufacturing

Reliability engineering

Physical contribution to the reliability

Process audit (Design, manufacturing and use of the product

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πππλλ InducedocessingmanufacturPartPhysical ⋅⋅⋅= Pr_

The methodology: basic model

Where,

λ : total failure rate (in fit, 1 failure per 109 hours)λPhysical : Physical contribution : tables + used constraintsπPart_manufacturing : Part production quality/reliability levelπProcess : Quality and technical control of the development, manufacturing

and maintenance process for products containing COTS

πInduced : Induced factors (overstress) i.e. effects of accidental damage according to type of application, COTS sensitivity factor, location and robustness control => questionnaire

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The methodology:Technology

TECHNOLOGY

PROCESS

RELIABILITY

USE

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( )

Π⋅= ∑

onscontributiPhysicalonacceleratiPhysical

_0λλ

Basic failure rate for each part type e.g. resistors, capacitors, inductors, switches, optoelectronics, I.C. and discrete semiconductors (die & package) => table

Acceleration factor (sensitivity to rated physical contributors e.g. electrical, thermal cycling, humidity, mechanical and chemical constraints) => mission profile

0λ

onacceleratiΠ

2- The methodology: physical contributors

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2- The methodology: USE

TECHNOLOGY

PROCESS

RELIABILITY

USE

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Life Profile: General description

ê We have to identify:

l Precise type of platform integrating the productl The location of the product in the platforml Geographical area or climatic consideredl Type of use (condition of use)

ê For example, the same product used in two different geographical areas can constitute two different types of use

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Life Profile: General description

ê How to build the Life Profile ?l Use case identification l Identification of the factors of variability in each use casel Establishment of the life profile for each use casel Relative weighting of each use casel Profiles gathering of each use case to reach a single profile

ê It is better to use several life profilesê A typical life profile must be a profile of system level

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Life Profile: Phases Choice

ê Phases choice must describe as completely as possible the various operating situations

ê To distinguish a specific phase each time the environmental conditions significantly change at the level of the encountered constraints

ê The identification of the operating situations must be firstly performed at the system level and then at equipment level

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Life Profile: Phase’s Duration

ê Recommendations : the life profiles are built over a 1 year duration : 8760 hoursl 24 hours per daysl 730 hours per month (average)l 8760 hours per year

ê “Calendar hours” is used

ê The duration must be selected in order to be realistic

ê The phase’s duration of each are expressed in hours

ê Objective: To produce failure rates expressed in FIT (1 FIT accounts for 1 failure by 10 -9 hours)

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ê FIDES treats the accidental overstress not listed like such

Examples :

l A road roller rolls on the equipment : if there is overstress, it (in theory) will be identified ð Not treated by FIDES

l The equipment is disconnected when switched-on: there is risk of overstress (if the equipment is not planned for) and this overstress is not listedð Treated by FIDES

2-The methodology: induced factor (Πinduced)

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2-The methodology: induced factor (Πinduced)

êWhat is an accidental overstress?l An accidental overstress is an event which is out a

normal usage of the system (EOS, MOS, TOS ).

êCriteria to appreciate the severity in term of exposure to overstress :

l Sensitivity of the COTS (technology, …)l Policy of overstress integration in product developmentl operating environment of the application (example MOS are

more important in mobile than fixed application)l Position of the item in the equipment or system

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ê Induced factor (Πinduit) includes four under-factors:

l Placement in the application (in particular: interface or not)

l The type of application, which defines the exposure to the overstress

l Efforts of hardening made under development (construction of the robustness)

l The technology sensitivity to the overstress

FIDES Contributors : Induced Factor

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ê The induced factor of FIDES considers overstress :l Electrical (E.O.S)

l Mechanical (M.O.S)

l Thermal (T.O.S)

ê It must be evaluated for each life profile phase

ê It can vary from 1 (the best) to 100 (the worst) : In reality à from 1 to 10

FIDES Contributors : Induced Factor

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FIDES Contributors : Induced Factor

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FIDES Contributors : Induced Factor

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The methodology: process factor

TECHNOLOGY

PROCESS

RELIABILITY

USE

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The methodology: process factor

êProcess factor Π ProcesslReliability process management (audit)

êΠ ProcesslIs representative of the quality and technical control of the reliability in the product life cycle (from specification to maintenance),lCan be assessed through an audit of the reliability process during the whole lifecycle of an equipment or system.

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The methodology: process factor

ê Building reliability:l 200 recommendations related to activities for the whole life cycle,

• Specification,• Design, • Manufacturing, • System Integration, • Maintenance, • Support activities (Quality and Human Resources)

ê This engineering allows:l Calculation of process factor : π process to assess global reliability,l Identification of life cycle activities where reliability needs improvement.

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FIDES Engineering

TECHNOLOGY

PROCESS

RELIABILITY

USE

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Reliability Engineering

ê FIDES makes it possible “to quantify” :l Impact of Life Profile on equipment reliability:

è Life Profile

l Reliabilty impact of a component policy:è Pi_Part_Manufacturing factor

l Impact of a strategy at implementation processes level (development, manufacture, and use) of the components in the equipment:è Pi_Process factor

l Impact of accidental overstress: è Pi_Induced factor

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Reliability Engineering

ê AND, FIDES gives :

l Technological guidelines in term of design

è Example : evaluation of the impact penalizing of certain technological families on the reliability of complete equipment

l A realistic value (with narrow margin) of the equipment reliability

è That allows to justify the obtaining an estimated reliability claimed in the requirements

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Reliability Engineering

ê FIDES reliability engineering :l «FIDES must cover the whole of the industrialists' needs concerning the

reliability»

l FIDES Guide :l 1 guide of Reliability Assessmentl 1 guide of Audit and Reliability Engineering

l Taking into account of all the factors which influence reliabilityl A changing methodology: new technologies, new modelisationsl Provides the tools and criteria allowing to assess the level of control of

reliability of an equipment supplier and thus his credibility

FIDES = EVALUATE + BUILD upstream

RELIABILITY CONTROL

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Conclusions

TECHNOLOGY

PROCESS

RELIABILITY

USE

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Support of FIDES

ê FIDES is distributed for free (except UTE version of the document)ê This structure takes place in a well known and recognized for

many years French association dedicated to reliability and safety: the IMDR (www.imdr.eu)

ê This structure is operational with 3 Working Groups :l FIDES evolutionsl FIDES international promotionl Guides of best practice and application to other domains

ê More than 30 companies registeredê Only French members for the moment, but the whole group agree

to become international

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FIDES web site

l The address of the FIDES web site will be :

« fides-reliability.org »

l This web site will provide in English :l Access to guides and tools,l Information on developments, methods, … l Events, links, news, important experiences,l A forum allowing all the users to discuss and exchange data,l A protected access area to allow working groups to exchange data, l A direct contact to the consortium FIDES for any question,l ………………and all you could suggest,

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FIDES tools

ê Today available toolsl The FIDES Group has developed tools for an easy

application of the methodology

l These tools can be downloaded directly at http://www.fides-reliability.org

l Module FIDES2009 are available in commercial software :l RELEXl RAM COMMANDERl FIABILITYl CARE

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Positions of French contractors

l French MOD (DGA)l The FIDES Guide was integrated in the RNPA (Programs of

Armament Standard Referential). It is quoted as a reference method in multiple new projects of armament.

l French spatial Agency (CNES)l This Agency realized a detailed evaluation of FIDES

methodology. This evaluation concluded that FIDES can be used for space applications (see publications in " Actualités composants du CNES " n°17 in October, 2004 and n°18 in January, 2005).

l EDF groupl EDF R&D realized an evaluation of the method, and has

regular contacts with FIDES Group.

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Positions of French contractors

l AIRBUS l AIRBUS asks for a predictive reliability evaluation without

requiring a method. FIDES is referenced and can be recommended.

l Automotivel FIDES group worked in partnership with the French Bureau of

Automotive Standardization (BNA) and contacts with SIA

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êFIDES provides

l A method for reliability assessmentl A method for reliability engineering

êFIDES aims to cover all the industrial needs in matter of reliability prediction

êFIDES has potential for evolution

l Integration of new technology without field experiencel Easy update of models

Conclusion

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Conclusion

l Takes into accountoverstress, mission profile(even for dormantapplications), parts quality

l FIDES is able to improvereliability by contributorsanalysis, and πprocess auditcheck list

l Excellent models coverage:Asics, switch, hybrids, HF/RFcomponents, …

l A maintenance structure iscreated to updatemethodology

l Usable for all applicationfields whose space one’s

êMajor experimentation conclusions

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Conclusions

Why to use FIDES ?

ê FIDES deals with recent technologies and components

ê FIDES life profile can be adapted to all our applications

ê FIDES allows to do reliability engineering

ê FIDES is living, not frozen, open to improvement andsupported by an independent structure and benefit fromthe experience of several companies

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FIDES

Thank you for your attention