Filter_GSGS8EAF_FM.0007.3.pdf

Wireless Development CentreInterference Mitigation Filter OEM General Specification

Dataset Name: GSGS8EAF Document Status: ApprovedStream: 00 Issue: 07.3Issue date: March 15, 2004Security status: ProprietaryAuthor: Kathleen Neild

DISCLAIMER:Refer to the Revision History section of this document for information about the status of this document. Any hard-copy of this document or unlocked softcopy must be regarded as an uncontrolled copy.

PROPRIETARY:The information contained in this document is the property of Nortel Networks. Except as specifically authorized inwriting by Nortel Networks the holder of this document: (1) shall keep all information contained herein confidentialand shall protect same in whole or in part from disclosure and dissemination to all third parties and (2) shall use samefor operation and maintenance purposes only.

2003Nortel Networks All rights reserved

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Interference Mitigation Filter GSGS8EAFOEM General Specification Stream: 00 Issue: 07.3

Publication historyThe latest controlled release of this document is located in DDME under the Dataset Name. Please check DDME for the latest stream and issue of this document.

All other soft and hard copies are uncontrolled.

It is the responsibility of the reader to ensure that the latest release of this document is being used.

Key ReviewersRecommendation from the members on the key reviewers list is a crucial step in ensuring that this general specification document is ready for final approval. Key reviewers have been selected due to their impact on the design of the interference mitigation filter.

Approval RecordThe release of this document has been reviewed and approved for distribution and use by the following:

Function Printed Name Document FunctionRF Systems Sarika Kapil Consultant

RF Hardware Advisor Mark Willetts ConsultantMechanical Mike Berry Consultant

Supply Management Rex Arguelles ConsultantSupply Management Elio Querin Consultant

RF Hardware Jason Yamazaki ConsultantRF Systems James Loo ConsultantSafety Prime Patrick Ma Consultant

Regulatory Prime Thomas Wong ConsultantPLM Matt Conrod Consultant

Function Printed NameOriginator/Decision Maker Kathleen Neild

Functional Manager/Approver Brad CarlsonRF Modules/ Ratifer Ed Geeraert

BTS Systems/ Ratifier Tom Danshin


Revision History

Stream/issue Revision Date Reason for Change Author/Department00/00.01 10/20/98 Initial release of document Lee Ager 2M2200/00.02 10/21/98 Edits as per key reviewers Lee Ager 2M2200/00.04 11/20/98 Edits as per vendor review Lee Ager 2M2200/00.05 11/27/98 Includes variant frequencies Lee Ager 2M2200/00.06 12/03/98 Edits as per key reviewers Lee Ager 2M2200/00.08 12/05/98 Edits as per key reviewers Lee Ager 2M2200/01 12/22/98 Released into DDME Lee Ager 2M2200/01.01 03/23/99 Update to mechanical drawings Lee Ager 2M2100/02 03/31/99 Edits as per key reviewers Lee Ager 2M2100/02.01 05/18/99 Includes only four variants to be quali-

fied.Lee Ager 2M21

00/03 05/21/99 Updates as per key reviewers Lee Ager 2M2100/04 06/17/99 change of pecs Lee Ager 2M2100/05 10/02/99 Update electrical specs Lee Ager 2M2100/06 01/10/00 Update to mechanical drawings Lee Ager 2M2300/06.1 23/06/03 As per CR Q00687953 Updated to

remove grounding cableUpdated Key ReviewersUpdated Table 1 IMF Variants to add CDMA Channel numbersAdded Figure 5 Three Carrier with Duplexer and Figure 6 Three Carrier without DuplexerAs per CR Q00687953 Removed Fig-ure 8 Grounding DiagramTable 5 Climatic Requirements removed Low Temperature Re-start and High Temperature Re-start8.3 Product Safety updated the CSA and UL requirements

Kathleen Neild 2U41

00/06.2 2/07/03 Updated Table 1 from internal review Kathleen Neild 2U4100/07 17/07/03 Approved version submitted to DDME Kathleen Neild 2U4100/07.1 02/04/04 Added B-Band variant of IMF Sarika Kapil 2U41


Major revisions will be marked by a change bar on the left of the table.

00/07.2 03/11/04 Updated specs the following specs for NTGS8Exx:- Clarified Passband max ripple.- Increased Passband max integrated mean square phase error spec.- Clarified Passband max insertion loss spec.- Increased the spec for the return loss.- Increased the spec for channel passband max group delay variation and reduced the spec for the absolute group delay at passband center fre-quency.- Reduced the number of required temperature cycles.- Changed the connector requirement.- The maximum passive intermodula-tion products spec is no longer appli-cable for this IMF.

Sarika Kapil 2U41

00/07.3 03/15/04 - The PEC for NTGS8Exx is officially NTGS8912. Updated all references of the NTGS8Exx with NTGS8912.- Added Matt Conrod to the consultant list.

Sarika Kapil 2U41

Stream/issue Revision Date Reason for Change Author/Department


PrefaceThis document describes the general specifications of the 800 MHz Interference Mitigation Filter (IMF) which will operate in the cellular frequency band.

Any errors or omissions should be referred to the author so that these errors can be corrected in future issues of this document.


Table of ContentsPublication history.................................................................................................................. 3

Key Reviewers............................................................................................................. 3Approval Record ......................................................................................................... 3

Revision History...................................................................................................................... 4Preface ..................................................................................................................................... 5Table of Contents.................................................................................................................... 6List of Figures ......................................................................................................................... 8List of Tables........................................................................................................................... 9Related Documents .............................................................................................................. 10Glossary................................................................................................................................. 121.0) IMF Design Requirements ............................................................................................. 14

1.1) Scope.................................................................................................................. 141.2) General Product Architecture.............................................................................. 14

2.0) General Description ....................................................................................................... 172.1) Principal Functions.............................................................................................. 172.2) Feature List ......................................................................................................... 172.3) Product Identification .......................................................................................... 17

3.0) Block Diagram ............................................................................................................... 183.1) Block Diagram..................................................................................................... 18

4.0) Mechanical Specifications ............................................................................................. 194.1) General ............................................................................................................... 194.2) Construction and Design..................................................................................... 194.3) IMF Physical Dimensions.................................................................................... 194.4) Weight................................................................................................................. 214.5) Grounding Strategy............................................................................................. 214.6) Paint/Finish ......................................................................................................... 214.7) Product Marking.................................................................................................. 21

4.7.1) Product Identification Label - Rear Vendor Identification Label ........... 224.7.2) Serial/PEC/Release (SPR) Label......................................................... 224.7.3) Warranty Void Label............................................................................. 234.7.4) Passband Identification Label ............................................................. 234.7.5) Interface Panel Identification................................................................ 23

5.0) Electrical Specifications ................................................................................................. 245.1) General ............................................................................................................... 24

5.1.1) Operating Conditions ........................................................................... 245.1.2) IMF Operating Specifications ............................................................... 265.1.3) Interface Specifications ........................................................................ 27

6.0) Environmental Specifications......................................................................................... 286.1) Climatic Requirements........................................................................................ 286.2) Structural Dynamics Requirements .................................................................... 30

7.0) Electromagnetic Environment........................................................................................ 327.1) Direct/Indirect Electrostatic Discharge Immunity ................................................ 327.2) Radiated Immunity .............................................................................................. 32


8.0) Regulatory Requirements .............................................................................................. 338.1) General ............................................................................................................... 338.2) Electromagnetic Interference .............................................................................. 33

8.2.1) Radiated Emissions ............................................................................. 338.3) Product Safety .................................................................................................... 338.4) Materials Flammability ........................................................................................ 33

9.0) Quality Assurance and Qualification.............................................................................. 349.1) General ............................................................................................................... 349.2) Vendor Supplied Data......................................................................................... 349.3) Production Test Plan........................................................................................... 349.4) Product Qualification Tests ................................................................................. 349.5) Acceptance Testing ............................................................................................ 349.6) Traceability.......................................................................................................... 359.7) Reliability Monitor................................................................................................ 359.8) Workmanship Evaluation .................................................................................... 35

10.0) Preparation For Delivery.............................................................................................. 3610.1) Packaging ......................................................................................................... 36

11.0) Product Changes ......................................................................................................... 3712.0) Reliability Assurance ................................................................................................... 38

12.1) Reliability........................................................................................................... 3812.2) Product Reliability Growth................................................................................. 3812.3) Shipped Product Quality Level.......................................................................... 3812.4) Statistical Process Monitoring........................................................................... 39


List of FiguresFigure 1: Single Carrier Block Diagram ................................................................................. 15Figure 2: Two Carrier Block Diagram..................................................................................... 15Figure 3: Single Carrier Block without Duplexer .................................................................... 16Figure 4: Two Carrier Block without Duplexer ....................................................................... 16Figure 5: IMF Block Diagram ................................................................................................. 18Figure 6: General IMF Envelope Drawing.............................................................................. 19Figure 7: IMF Dimensions...................................................................................................... 19Figure 8: Grounding Diagram ................................................................................................ 19Figure 9: Preferred Connector Locations............................................................................... 19Figure 10: Labelling Diagram................................................................................................. 20Figure 11: Warranty Label ..................................................................................................... 23


List of TablesTable 1: Product Structure .................................................................................................... 17Table 2: Identification Labels ................................................................................................ 23Table 3: Summary of Operating Conditions........................................................................... 24Table 4: Physical Interface..................................................................................................... 27Table 5: Climatic Requirements............................................................................................. 28Table 6: Dynamic Requirements............................................................................................ 30


Related DocumentsThe following documents, of the issue in effect on the date of purchase order, form part of this specification to the extent specified herein:[1] Network Equipment - Building System, Generic Equipment Requirements, Bellcore GR-

63-CORE, Issue 1, October 1995.[2] Reliability Prediction Procedure for Electronic Equipment, Bellcore Technical Advisory

TA-NWT-000332, Issue 4, September 1992.[3] Electromagnetic Compatibility and Electrical Safety Generic Criteria for Network Tele-

communication Equipment, Bellcore, GR-1089-CORE, Issue 1, November 1994 and re-vision 1, December 96.

[4] General Requirements of OEM Material, NPS50561 General specification, Issue 3.[5] FCC, Part 15 of Title 47, Code of Federal Regulations, Title 47 - Telecommunications,

Part 15.[6] FCC, Part 22, Subpart H, Broadband PCS.[7] NT Corporate Standard 2701.01, Visual Determination and Instrumental Evaluation of

NT Standard Colours.[8] NT Corporate Standard 5014.00, Serialization Codes for Telecommunication Products.[9] NT Corporate Standard 9017.00, Vendor Labels.[10] NT Corporate Standard 9101.00, Product Safety and Policy Objective.[11] NT Corporate Standard 9101.01, Product Safety Reference data.[12] Safety of Information Technology Equipment, UL 1950, Third Edition.[13] Underwriter Laboratories (UL) Standard UL94.V1.[14] Electromagnetic Compatibility for Electrical and Electronic Equipment, Part 5: Surge Im-

munity Requirements, IEC 801-5.[15] CISPR Publication 22, First Edition 1985, Second impression 1991, International Spe-

cial Committee on Radio Interference.[16] EIA-TIA-422-B, 1993, Electrical Characteristics of Balanced Voltage Interface Circuitry[17] Can/CSA-C22.2, No. 950-95, Safety of Information Technology Equipment, Including

Electrical Business Equipment, A National Standard of Canada.[18] Basic Environmental Testing Procedures, Tests A: Cold, IEC 68-2-1, fifth edition, 1990.[19] Basic Environmental Testing Procedures, Tests B: Dry Heat, IEC 68-2-2, Second Im-

pression, 1987.[20] Basic Environmental Testing Procedures, Tests N: Change of Temperature, IEC 68-2-

14, fifth edition, 1984.[21] Basic Environmental Testing Procedures, Tests Ea and guidance: Shock, IEC 68-2-27,

third edition, 1987.[22] Basic Environmental Testing Procedures, Test Ee and guidance: Bounce: IEC 68-2-55,


first edition, 1987.[23] Basic Environmental Testing Procedures, Electrostatic discharge immunity, IEC 1000-

4-2, first edition, 1995.[24] Basic Environmental Testing Procedures, Electrical fast transient/burst immunity test,

IEC 1000-4-4, first edition, 1995.[25] Degree of Protection Provided by Enclosures, IEC 60529, second edition, 1989.[26] Basic Environmental Testing Procedures, Testing and Measurement Techniques :

Surge Immunity, IEC 1000-4-5, 1995.[27] Bell Canada Design Standard for Electromagnetic Compatibility Requirements and Test

Methods, TAD 8465, Issue 3, March 1992.[28] General Requirements for OEM Equipment, NPS50561, Issue 3, April 91.


Glossary

Term/Abbreviation Meaning

A ascii formatA band North American cellular tx frequencies 869.04 - 879.99 MHz and 890.01

- 891.48 MHzAM amplitude modulationB band North American cellular tx frequencies 880.02 - 889.98 MHz and 892.51

- 893.97 MHzBTS 800 CDMA base stationC CelsiusCDMA code division multiple accessCF centre frequencycm centimetersCPC common product codeCpk capability indexCRC cyclic redundancy checkDC direct current E electricEEPROM electronically erasable and programmable read only memoryEMC electromagnetic compatibilityESD electrostatic dischargeg gramGS general specificationI integer formatI2C inter integrated circuitIMF interference mitigation filterIP3 input 3rd order intercept pointkg kilogramskmph kilometres per hourlbs poundsLNA low noise amplifierm metermA milliampereMHz megahertzmV millivolts


ms millisecondNF noise figureOEM original equipment manufacturerPA power amplifierPCS personal communication systemp-p peak to peakrad radiansrms root mean squareRF radio frequencyRx receiverI8 signed integer formatSCHPA single carrier high power amplifierSCPA single carrier power amplifierSFRM single carrier RF module of BTS systemSPR serial/PEC/release codeTx transmitterP microprocessor in TRMs microsecondW microwattV voltsVrms root mean squared voltageVSWR voltage standing wave ratioW watts

Term/Abbreviation Meaning

IMF Design Requirements page 15


1.0 IMF Design Requirements1.1 ScopeThis general specification describes the interference mitigation filter (IMF) for the cellular frequency band. This document is intended to be used by the vendor as a specification guideline in designing and manufacturing the IMF.

1.2 General Product ArchitectureThe IMF is intended to be used in the cellular environment when the CDMA base station has been identified to cause interference to other cellular systems.

Although the duplexer, post HPA, provides CDMA receive band filtering, the IMF provides additional rejection of the CDMA transmit spurious noise over the receive or transmit bands of other collocated cellular systems.

The five available variants are as follows,Table 1: IMF Variants

The first two variants are deployed in the cellular, transmit A band (A band) and provide high rejection for the North American SMR frequencies (856 - 866 MHz, 896 - 906 MHz). These two variants provide adequate filtering for deployment of the first (starting at primary channel) four contiguous channels in the A band with the current 25 W SCPA.

The last three variants are deployed in the transmit, cellular B band (B band ) and provide high rejection for the international GSM frequencies (890 - 915 MHz). These three variants provide adequate filtering for deployment of the first (starting at the primary channel) six contiguous channels in the B band with the current 75W PA (MCPA).

The unit, NTGS8EAF, may also provide adequate filtering for a 100 W PA. This remark is supported by data from the evaluation of a prototype 100 W PA (SCHPA).

CDMA Channels PEC Centre Frequency (MHz)157, 199, 241- 42 channel spacing 160, 201, 242 - 41 channel spacing

NTGS8EBD 875.97

199, 241, 283 - 42 channel spacing201, 242, 283 - 41 channel spacing

NTGS8EBE 877.23


NTGS8EAF 882.78


NTGS8EAG 884.04


NTGS8912 886.56

IMF Design Requirements


Although there are five variants, there are only two configurable designs to be qualified for the first four variants. The A band design is tunable over both A band variants and the B band design is tunable over both B band variants. Note that the IMF filters will be configurable by IMF vendor only and not by customer or field personnel. A configurable design refers to a common filter housing, ceramic puck support structure and ceramic puck profile and temperature compensation.

There are six possible electrical locations for the IMF; between the HPA and duplexer (Figure 1 ), between the two channel combiner and duplexer (Figure 2 ), between the HPA and antenna (Figure 3 ) , between the two channel combiner and antenna (Figure 4 ), between the Multi-Channel Power Amplifier and duplexer (Figure 5 ) or between the Multi-Channel Power Amplifier and antenna (Figure 6 ).

Figure 1: Single Carrier Block Diagram

Figure 2: Two Carrier Block Diagram

Figure 3: Single Carrier Block without Duplexer

HPA IMF Duplexer

HPA #1

IMF Duplexer

HPA #2

Combiner

HPA IMF

IMF Design Requirements page 17


Figure 4: Two Carrier Block without Duplexer

Figure 5: Three Carrier Block with Duplexer

Figure 6: Three Carrier Block without Duplexer

HPA #1

IMF

HPA #2

Combiner

MPAM IMF DPM

MPAM IMF

General Description


2.0 General Description2.1 Principal Functions1. High rejection over the SMR frequency band (856 - 866 MHz, 896 - 901 MHz), GSM

receive band (890 - 915 MHz) and other cellular system frequency bands.

2.2 Feature List1. Low insertion loss throughout entire passband bandwidth.

2. Low phase, amplitude ripple and integrated mean square phase error over entire passband.

3. Low group delay over the entire passband.

4. Environmentally hardened module.

2.3 Product Identification

Note

1. Release number will be provided by the Nortel Component Engineering Department, W469.

Centre Frequency

(MHz)

Engineering Code

Common Product

Code875.97 NTGS8EBD A0769989

877.23 NTGS8EBE A0769990

882.78 NTGS8EAF A0769981

884.04 NTGS8EAG A0769982

886.56 NTGS8912 A0554976

Table 2: Product Structure

Block Diagram page 19


3.0 Block Diagram 3.1 Block DiagramThe IMF is passive filter with one input and one output connection. The IMF passband is at least three CDMA channels wide (3.78 MHz) and the passband must be configurable over the entire relevant band.

Figure 7: IMF Block Diagram

Output portInput portFrom Combiner or HPA To Duplexer

Mechanical Specifications


4.0 Mechanical Specifications4.1 GeneralThe following section provides the mechanical specifications for all IMF. Refer to ADGS8EAF latest stream and issue for the exact requirements.

Figure 8: General IMF Envelope Drawing

4.2 Construction and DesignIt shall be the responsibility of the IMF supplier to obtain from the NORTEL Component Engineering Department all required information regarding items referred to by the CPC or specification number.

Mechanical Specifications page 21


4.3 IMF Physical DimensionsFigure 9: IMF Dimensions



Figure 10: Preferred Connector Locations



Figure 11: Labelling Diagram

Front Face

Back Face

F1 Tx Out

F2 Tx In

Product Identification Label

Band Label

SPR Label

IMF



The IMF supplier shall comply with the dimensional requirements as shown in Figure 9 , all dimensions which are underlined are critical while dimensions not underlined can be negotiated with Nortel. Connectors shown in Figure 10 are in the preferred sequence and preferred locations although these may vary with Nortel approval. All dimensions are given in inches with a tolerance of 0.005 inches for all dimensions in the range of 0 - 11.999 inches; a tolerance of 0.01 inches for dimensions in the range of 12 - 23.999 inches unless otherwise specified.

The IMF form factor must be approved by Nortel.

4.4 WeightThe IMF shall not exceed 17.5 lbs(8 kg).

4.5 Grounding StrategyGrounding to the tray is provided through the PEM screws at the front of the unit.

4.6 Paint/FinishPretreatment: Conform to Nortel Finish #1003 Specification Section 5, Appendix A

Top Coat: Black Mini Texture, Nortel Finish 1003 Specification, per Observational Standard S-30501

4.7 Product MarkingThe manufacturing labels described in the following sections shall be situated as shown in Figure 11 . The labels shall be affixed using a pressure sensitive adhesive. Any adhesive which is found to secure the labels permanently during the product life is acceptable. Artwork shall be plotted with a minimum resolution of 600 dots per inch. The edges of borders shall be clean cut and as free from feathering as good commercial practice will permit. All label designs shall be submitted to NORTEL for approval prior to production.

4.7.1 Product Identification Label - Rear Vendor Identification Label

The rear product identification label for the IMF will include:

-Vendor Model Number which is arbitrarily chosen by the vendor.



-Vendor Product Serial Number which is arbitrarily chosen by the vendor and compliant to the guidelines defined in the Nortel Corporate Standard 5014.00, Serialization Codes for Telecommunications Products. The vendor must utilize an ISO accredited resource to control their serial numbers. They must have the capability to ensure there are no duplicate serial numbers generated.

-Nortel Common Product Code (CPC) which is compliant to the guidelines defined in the Nortel Corporate Standard 1517.00 - Labels and Marking. See Table 1, IMF Product Structure, for appropriate 8 digit alpha-numeric CPC.

-Product Engineering Code (PEC) which is compliant to the guidelines defined in the Nortel Corporate Standard 1517.00 - Labels and Marking. See Table 1, IMF Product Structure, for appropriate 8 digit alpha-numeric PEC.

-Nortel Current Release (Rel XX) which is compliant to the guidelines defined in the Nortel Corporate Standard 1517.00 - Labels and Marking, where XX is a two-digit number assigned by the Nortel Component Engineering.

-Product Manufacturing Date Code. This label shall indicate the week and year of manufacture of the IMF. The week format shall follow the Nortel Week Calendar for the given year. Refer to the Nortel Corporate Standard 1516.00 - Product Date Codes, for additional guidelines.

-Description of the IMF.

The specific rear panel location, orientation and size of the label is at the discretion of the vendor but subject to approval by Nortel Component Engineering. Use Nortel Corporate Standard 1517.00 - Labels and Marking (Section 4.5).

4.7.2 Serial/PEC/Release (SPR) Label

The Serial/PEC/Release (SPR) barcode label is used for asset and product management by NORTEL.

The label shall be affixed to the IMF module as shown in Figure 11 .

-Contact Nortel Component Engineering Prime for the appropriate serial number.

-Contact Nortel Component Engineering Prime for the two digit numeric release number.

-See Table 1, IMF Product Structure, for appropriate 8 digit alpha-numeric PEC.

Contact Nortel Component Engineering Prime for SPR label requirements and standards reference internal drawing numbers 3298-01a.



4.7.3 Warranty Void Label

The Warranty Void Label shall be affixed over a screw head or package joint so that the label must be removed to gain access to the internal portion of the module. Any material and adhesive combination which ensures destruction of the label upon removal is acceptable. An example of content of label is shown in Figure 12 .

Figure 12: Warranty Label

4.7.4 Passband Identification Label

The module band type identification label shall be affixed to the IMF as shown in Figure 11 . The label shall contain the following information, in Table 3, which is referenced to the module band type:

4.7.5 Interface Panel Identification

All RF connectors will be identified as Approximate location for placement is given, precise location is at discretion of the supplier

Font: Univers 67

Size: 11pt

Color: Font - BTS Light Grey, Pantone 427C (Nortel Observational Standard S-33470)

Background - Black, Pantone process black C

PEC LabelNTGS8EBD 875.97 MHz

NTGS8EBE 877.23 MHz

NTGS8EAF 882.78 MHz

NTGS8EAG 884.04 MHz

NTGS8912 886.56 MHz

Table 3: Identification Labels

Warranty void if seal

broken.

Electrical Specifications page 27


5.0 Electrical Specifications5.1 GeneralThe following section provides the electrical specifications for interference mitigation filter. The IMF must meet all electrical specifications defined herein for all environmental, material and manufacturing variations to a 95% confidence factor. The intent of the 95% confidence factor is to remove the measurement uncertainty of the measurement equipment out of the test results.

5.1.1 Operating Conditions

The IMF shall start and operate within its electrical specifications over any combination of the following conditions:

Notes

1. The effective peak power resulting from the conditions stated in the peak power specification must not create arching within the IMF with peak power and average power applied.

Parameter Specification 1

Max Tx Input Power - Peak Conditions

(Note 1,4)

Average =100 W Average = 130 W (Note 5)

peak to average ratio =11.76 dBPeak to average ratio = 11 dB

(Note 6)Source match = 20 dB

Load match = 9 dBAltitude = 1800 m

Temp = 85 CCDMA source (Note 4)

Max Tx Output Power(Note 2 )

100 W 130 W (Note 5)

Temperature (Case)(Note 3)

min. -40 Cmax. +85 C

max. +75 C (Note 7)Table 4: Summary of Operating Conditions

Electrical Specifications


2. VSWR at antenna port of 1.5:1

3. The electrical specifications must be also satisfied for all environmental conditions outlined in section 6.0 - Environmental Specifications.

4. CDMA sources is as follows,

Chip rate = 1.2288 Mchips/sWalsh codes = 0 (pilot), 1 (paging), 32 (sync), [3,5,7,9 ..., 63] (31 traffic channels)

Pilot = 20 % of total powerPaging = 3dB higher that any single traffic channelSync = 3dB lower than any single traffic channelTraffic channels = equal powerAll zero data pattern for pilotRandom data pattern for all other channels

5. The max Tx input and output power for the NTGS8912 will be 130 W rather than 100 W.

6. The peak to average ratio will be 11 dB rather than 11.76 dB for the NTGS8912.

7. The highest temperature will be + 75 C for outdoor deployment of the NTGS8912.



5.1.2 IMF Operating Specifications

Parameter Specification Comment

A Band Configurable Bandwidth 869.0 - 880.0 MHz

B Band Configurable Bandwidth 880.0 - 893.5 MHz

Absolute Minimum Passband 3.78 MHz Note 1

Passband Max. Ripple 0.30 dB0.60 dB/channel

Note 1, 5Note 1, 5

Passband Max. Integrated Mean Square Phase Error

0.0004 rad2

0.008 rad2 (for NTGS8912)

Note 1, 2, 3

Passband Max. Insertion Loss 1.05 dB1.2 dB

Note 1, 2Note 6

Passband Min. Return Loss 15 dB14 dB (for

NTGS8912)

20 dB at room temperature18 dB at room tempera-ture (for NTGS8912)

Frequency Selectivity for any TX Chan-nel with reference to Passband over the following frequency ranges (note 6):

DC - 776 MHz776 - 820 MHz820 - 824 MHz824 - 834 MHz834 - 849 MHz856 - 866 MHz

890 - 915 MHz (NTGS8912 only)890 - 915 MHz (NTGS8EAG only)890 - 915 MHz (NTGS8EAF only)

896 - 906 MHz (NTGS8EBD, NTGS8EBE only)

920 - 1710 MHz1710 - 1790 MHz

1710 - 1720 MHz (NTGS8EAF only)1720 - 1790 MHz (NTGS8EAF only)

1790 - 2000 MHz2600 - 2690 MHZ

60 dB40 dB62 dB85 dB90 dB65 dB55 dB80 dB65 dB

38 dB77 dB77 dB98 dB40 dB56 dB

CDMA RX BandCDMA RX BandSMR Rx Band GSM GSMSMR Tx Band

DCSDCSDCS

Electrical Specifications


Notes

1. Over entire operational temperature

2. Over entire channel passband.

3. Integrated Mean Square Phase Error is defined as the integral, over any 1.26 MHz interval in the passband, of the square of the difference between the phase and a straight line spanning the passband which minimizes the integral.

4. Produced with two +44 dBm tones with any separation applied at the Tx input port. This specification is not applicable to the NTGS8912.

5. Variation between maximum and minimum insertion loss in passband.

6. The insertion loss for the NTGS8912 is 1.2 dB measured as the average insertion loss/channel.

5.1.3 Interface Specifications

Notes

Maximum Passive Intermodulation Prod-ucts (falling with 890 - 915 MHz and 855 - 866 MHz)

-87 dBm Note 4

Channel Passband Max. Group Delay Variation

75 nsec300 nsec

Over 95% of passbandFor entire passband of the NTGS8912.

Absolute Group delay at passband Centre Frequency

Maximum 305 nSMinimum 255 nSMaximum 250 nSMinimum 175 ns

For all other variants

For NTGS8912

Signal Description Connector Type (Note 1)

Tx In From HPA/Combiner or MPAM F2 N type

Tx Out To Duplexer F1 N type

Table 5: Physical Interface

Parameter Specification Comment



1. A female N type, tarnish resistant, connector with 50 microinch gold over non nickel center pin and 200 microinch silver (or non nickel plating) over brass body. The connector must IP67 quality; to ensure environmental and EMI containment the connector mounting must also be an IP67 quality. The N type connectors shall be Rosenberger or Huber & Suhner components or equivalent manufacturer provided it meets the above detailed specification.

Environmental Specifications


6.0 Environmental SpecificationsThe IMF is intended primarily for use in the MetroCell product, and as such it must allow the entire RF module to pass the testing specified in the BTS Product Specification Agreement. The pertinent requirements are documented below. The IMF shall be capable of meeting all electrical specifications over the following environmental conditions.

6.1 Climatic RequirementsThe IMF is intended to withstand the environments encountered during use, shipping andinstallation.

The applicable standards are:

Environmental Standards: Bellcore GR-63-CORE, Issue 1

Test Method Standard: IEC 68-2

Test Name Requirement and Source Test MethodHigh Temperature Operation

This product shall be able to operate within specification at 85C.

IEC 68-2-2 Test Bd: Dry Heat. Test duration is 2 hours. The functional performance of the unit must be monitored for the duration of the test.

Low Temperature Operation

This product shall be able to operate within specification at 40C.

IEC 68-2-1 Test Ab: Cold. Test dura-tion is 2 hours. The functional perfor-mance of the unit must be monitored for the duration of the test.

Altitude This product shall be able to operate within specification from 60m below sea level to 1800m above sea level in accordance with Bellcore GR-63-CORE Section 4.1.3.

IEC 68-2-13

Operating Relative Humidity

This product shall be able to operate at 5% to 95% humidity (but not exceed-ing 0.024 kg of water per 1kg of dry air) in accordance with Bellcore GR-63-CORE Section 4.1.2.

The test procedure for operating rela-tive humidity is defined by IEC 68-2-3 Test Ca: Damp Heat Steady State.

Table 6: Climatic Requirements

Environmental Specifications page 33


Rate of Change of Temperature

This product shall be able to operate during temperature changes of 30C per hour in accordance with Bellcore GR-63-CORE Section 4.1.2. This rate is applicable at the system level. At this time, the temperature rate of change applicable to the IMF, in its application, is unknown but is expected to increase.

The test procedure for rate of change is defined by Bellcore GR-63-CORE section 5.1.2.

Temperature Cycling

This product shall be able to operate at -40C and 85C when being subjected to 20 cycles between these tempera-tures.Temperature dwell periods at each temperature extreme shall be 1 hour.

IEC 68-2-14, 5th edition, 1984 includ-ing amendment 1, April 1986.

High Temperature Storage and Thermal Shock

The product must be exposed to 70C for 72 hours, followed by a successful functional test, in accordance with Bellcore GR-63-CORE Section 4.1.1.2.

The test procedure for high tempera-ture storage is defined by Bellcore GR-63-CORE Section 5.1.1.2.

Low Temperature Storage and Thermal Shock

The product must be exposed to -40C for 72 hours, followed by a successful functional test, in accordance with Bellcore GR-63-CORE Section 4.1.1.1.

The test procedure for low temperature storage is defined by Bellcore GR-63-CORE Section 5.1.1.1.

High Humidity Stor-age

The product must not sustain any dam-age or deterioration after 96 hours of exposure to 40C at 90-95% RH, fol-lowed by a successful functional test, in accordance with Bellcore GR-63-CORE Section 4.1.1.3.

The test procedure for high humidity storage is defined by Bellcore GR-63-CORE Section 5.1.1.3.

Dust Tightness(Protection)

The product shall be weathertight with respect to dust accumulation after being exposed to wind driven dust according to Bellcore GR-487-CORE section 3.29

The test procedure for dust tightness is defined as per Bellcore GR-487-CORE section 3.29.

Water Tightness(Protection)

The product shall be able to withstand water intrusion as per Bellcore GR-487-CORE section 3.27 and IEC 60529 Second Edition Nov. 89- IP66, Clause 6 with respect to protection of equipment against ingress of water with harmful effects.

The test procedure for water tightness is defined as per IEC 60529 Second Edition Nov. 89-IP66 Clause 6 and Bellcore GR-487-CORE section 3.27 with no water ingress into the module

Test Name Requirement and Source Test Method


Environmental Specifications


6.2 Structural Dynamics RequirementsThe applicable standards are:

Mechanical standards: Bellcore GR-63-CORE, Issue 1 Test method standard: IEC 68-2

The table below summarizes the mechanical requirements.

Corrosion Resis-tance- Salt Fog

The product shall be able to withstand corrosion as per Bellcore GR-487-CORE section 3.35.

The test procedure for corrosion resis-tance is defined in Bellcore GR-487-CORE section 3.35.

Test Name Requirement and Source Test MethodPackaged Drop The packaged product shall sustain no

physical or functional damage after being subjected to a series of free falls onto a hard surface in accordance with Bellcore GR-63-CORE Section 4.3.1, Category A

The test procedure for handling drop is defined by Bellcore GR-63-CORE Section 5.3.1.

Transportation Shock

The packaged equipment shall func-tion within specification after the application of the following shock pulses:

50 g, 11 ms, half sine pulse

3 successive shocks in each direction of 3 mutually perpendicular axes (18 shocks total).

Test method: IEC 68-2-27 [7], Test Ea Shock

Transportation Bounce

The packaged product shall sustain no physical or functional damage after being subjected to repeated impact loads. IEC-68-2-55, Test Ee:Method A, 1.1 to 1.2g, 6 sides with a 90C hor-izontal rotation 1/2 thru each side. 180 minutes total test time.

IEC-68-2-55 Test Ee

Table 7: Dynamic Requirements



Environmental Specifications page 35


Unpackaged Shock/Drop

This product shall not sustain any physical damage or deterioration in functional performance when sub-jected to unpackaged drop tests in accordance with Bellcore GR-63-CORE Section 4.3.2.

This package shall not be dropped directly on connectors as they would be expected to be damaged. The test procedure for unpackaged drop is defined by Bellcore GR-CORE Sec-tion 5.3.2

Shock (Module) The unpackaged product shall be able to withstand three 30g, 11ms, 1/2 sine shock pulses in each direction of the three mutually perpendicular axes. (18 shocks total)

IEC 68-2-27 Test Ea

Operational Vibra-tion

This product shall have no damage or loss of function while being subjected to vibrations of magnitude1.0 g peak acceleration applied over the fre-quency range of 5 - 200Hz, @ 0.25 octaves/minute in accordance with Bellcore GR-63-CORE Section 4.4.3.

The test procedure for Office Vibration is defined by Bellcore GR-63-CORE Section 5.4.2-Alternative Test Proce-dure for Electronic Subassemblies Only.

Transportation Vibration

The product shall have no physical or functional damage after being subject to vibrations in each axis in accor-dance with Bellcore GR-63-CORE Section 4.4.4.-Curve 2

The test procedure for Shipping Vibra-tion is defined by Bellcore GR-63-CORE Section 5.4.3.


Table 7: Dynamic Requirements

Electromagnetic Environment


7.0 Electromagnetic EnvironmentThe IMF shall meet all electromagnetic standards detailed in this section.

7.1 Direct/Indirect Electrostatic Discharge ImmunityThe IMF shall be able to withstand, without damage, direct contact ESD up to 8kV at any contact point other than connector pins. The IMF shall be able to withstand direct air discharges upto 15kV, without damage, to any point except connector pins. Contact discharges shall be applied in indirect mode of application up to 8 kV. The suitable tests method are defined in IEC-1000-4-2.

7.2 Radiated ImmunityThe IMF shall meet the radiated immunity requirements at a system level, in section 3.3.1 of the Bellcore document GR-1089-CORE, with a 3 dB test margin. The test signal is detailed in section 3.3 and the test procedure is found in section 3.4.

10 kHz - 1 GHz, when the interfering RF is modulated with an 80% AM 1 kHz tone.

1 GHz - 10 GHz, when the interfering RF is pulse modulated with 1s pulsewidth and 1 kHz repetition.

7.3 Electrical Fast TransientThe IMF shall withstand Electrical Fast Transients with no perceptible loss of operation when subjected to disturbance on Antenna port. The requirement is IEC-1000-4-4 level 2 with a suitable test method provided by that document.

Regulatory Requirements page 37


8.0 Regulatory Requirements8.1 GeneralThe IMF shall meet all Regulatory standards detailed in this section when integrated into the RFM at a system level. All regulatory requirements and standards shall be met at the system level, when incorporated into Nortels product, over any combination of the operating conditions outlined in this document for all IMF configurations. Nortel will provide system level data that verifies regulatory compliance. The vendor shall ensure that corrections to the IMF will be made if non-compliances are found that are directly related to their design. Changes to the IMF must continue to conform to these requirements and will be managed by a Change Review process.

8.2 Electromagnetic Interference

8.2.1 Radiated Emissions

The IMF shall comply with FCC part 15 and CISPR 22 Class B limits when integrated in to a Nortel system. Emissions levels shall not exceed 6 dB below the limits specified.

The IMF shall not exceed 6 dB below the radiated emissions requirements for doors closed, class B equipment in sections 3.2.1 and 3.2.2 in the Bellcore document GR-1089-CORE.

Also, the radiated emission levels should not exceed 6 dB below the objective specified in Bell Canada TAD 8465 section E1B which is similar to GR-1089-CORE but with different limits depending on the distance.

8.3 Product SafetyThe IMF shall be designed to meet and comply with the requirements of CSA-C22.2 No. 60950 / UL 60950, since it will be evaluated in the end-use system to this standard. The IMF shall also meet the requirements of IEC 60950.

8.4 Materials FlammabilityAll IMF configurations shall comply with Bellcore GR-63-CORE, Section 4.2.3-Use of Fire-Resistance Materials, Components, Wiring and Cables

Quality Assurance and Qualification


9.0 Quality Assurance and Qualification9.1 GeneralRequirements for quality assurance and qualification shall be in accordance with NPS50561, except as specified differently in the section.

9.2 Vendor Supplied DataEach IMF shall be supplied (upon request) with test data as a proof of their performance. The test data must consist of all electrical parameters (at room temperature), serial number, CPC, date of testing and name of person performing the test. The supplier must maintain this data on their premises in an electronic format agreeable to the Nortel Component Engineering.

9.3 Production Test PlanThe IMF supplier testing shall be performed in accordance with the requirements specified within this document. IMF testing shall be performed in accordance with a test plan and procedures developed by the supplier and approved by NORTEL

9.4 Product Qualification TestsQualification testing shall consist of detailed measurements and environmental exposure to determine that the major components/subsystems performance characteristics have been achieved prior to conducting acceptance tests. NORTEL reserves the right to witness and monitor the qualification tests to be conducted at the suppliers facility or other NORTEL approved locations. The test plan and procedures shall include specific pass/fail criteria and shall thoroughly demonstrate complete compliance of the equipment with all applicable performance specifications.

It is the responsibility of the vendor to perform all tests necessary to verify the performance of the IMF against the specifications outlined in section 6.0, of this document, refer to the current qualification plan, OEM Module Level Qualification Plan.

9.5 Acceptance TestingEach deliverable IMF, when fabricated, shall undergo acceptance testing to verify proper workmanship, identify manufacturing defects and determine that all components of the IMF function properly before delivery.

Quality Assurance and Qualification page 39


9.6 TraceabilityFor auditing purposes, the IMF supplier shall retain all original notes, test data and prototypes for a period of one calendar year. The supplier shall supply this information to NORTEL, FCC, IC, or CSA when requested.

9.7 Reliability MonitorThe supplier shall establish a reliability program which provides for environmental stress testing on a sample basis. The test results shall be made available to NORTEL upon request.

9.8 Workmanship EvaluationThe IMF shall be dismantled, where necessary, to allow inspection. The IMF shall conform to NPS50561.

Preparation For Delivery


10.0 Preparation For Delivery10.1 PackagingItems covered by this specification shall be packaged in a manner which will provide protection against damage during shipment, handling and storage in reasonably dry, unheated quarters. Packing shall be in accordance with NPS50561.

The package label (human readable format) must be clearly present on the outside of the product packaging. The label must include the following.

-CPC-PEC-release number-date code-Nortel purchase order number-lot number-vendor name -product description

The label must be clearly visible when packages are vertically stacked. The labels must be compliant with the following standards:

Nortel Common Product Code, Corporate Standard 9017, Vendor Labels.

Nortel Product Engineering Code, Corporate Standard 9017, Vendor Labels.

Nortel Current Release Code (Contact Component Engineering Prime for current release number), Corporate Standard 9017, Vendor Labels.

Each individual package shall not exceed 30 lbs in total weight.

Product Changes page 41


11.0 Product ChangesSeller shall provide a Manufacturing Baseline defining the criteria requiring Change Management Approved by Nortel, for each Product. The Manufacturing Baseline will include (i) production processes, (ii) test processes, (iii) critical components and (iv) module pass/fail criteria, and shall be mutually agreed upon by both Parties.

Seller shall notify the Nortel component engineering prime for a Product of all changes affecting the design or manufacture of the product. Any change covered by the Manufacturing Baseline will require the written approval of the Nortel component engineer.

The Manufacturing Baseline shall at the request of either party be reviewed and if mutually agreed changed.

Approval by Nortel of a Sellers request for change shall not waive the Sellers obligation, and in no way shall relieve the Seller of their obligation, to meet or exceed all the specifications for a Product.

Reliability Assurance


12.0 Reliability AssuranceThe intent of this section to define the reliability and quality requirements for this product and to ensure that it will be able to meet all technical specifications through its life time.

12.1 ReliabilityThe vendor shall commit, on a best efforts basis to a targeted total annualized field return rate of the IMF in the first year of production of less than or equal to 2.25 %, less than or equal to 1.25 % for the second year and for on going years of less than or equal to 1.00 %. The field return rate is determined from the total failures, due to random component failure workmanship, manufacturing error and latent design flaws, of all shipped IMF product operating under normal conditions (see sections 5.0 through 8.0). The vendor shall detail a mutually acceptable method for calculating the field return rate.

The supplier will track and document all field performance data on all deployed products to customers. In the event of a product failure in the field, Nortel shall ship failed units to the supplier in a timely manner. The supplier will analyze the failed units and release a report to NORTEL describing the failures which were found. The report should include a failure log, a Pareto of failure causes and the corrective actions to be implemented.

The field return rate of the IMF for the second year of production must improve compared to the first year specifically due to improved manufacturing processes and/ or better component selection, information acquired through failure analysis which is incorporated into the production process. The product must not require re-qualification (see sections 6.0 through 8.0) to obtain the improvement in the total field return rate.

The vendor shall submit a projected rate of return report or MTBF report at the beginning of the project.

12.2 Product Reliability GrowthDuring the ongoing manufacturing of this product, it is expected, as part of a joint commitment to high quality products, that the supplier demonstrate a continual product reliability growth. The supplier will provide information on which reliability growth model will be used to demonstrate ongoing product reliability growth. The supplier must continually identify the majority contributors to poor yield on this product and take the appropriate steps to address these issues.

A report is required quarterly that illustrates the current reliability level and a list of actions that were used to create growth. The report is to be issued to Department W469 (component engineering) at Nortel.

12.3 Shipped Product Quality Level

Reliability Assurance page 43


The shipped product quality level shall be 0.8 % in the first year and 0.8 % in the following years. The shipped product quality level refers to the percentage of the annual defective product compared to the total annual shipped product which are discovered during factory audits or during product installation.

12.4 Statistical Process MonitoringThe vendor will implement Statistical Process Monitoring during production testing. Supplier must provide a quarterly report of Cpk values measured on the following critical parameters of this product: return loss (input and output), insertion loss, rejection for A band variants at 856 - 866 Mhz, rejection for A band variants at 896 - 906 MHz and rejection for B band variants at 890 - 915 MHz.

Reliability Assurance


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