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Simplifying the Complexities of MulticoreProcessors with COTS Single BoardComputer Solutions

Speaker:

Glenn Beck - Segment Marketing Manager - Single Board

Computing and Aerospace & Defense Markets- FreescaleSemiconductor

Haritha Treadway- Product Manager at Eurotech Inc.

Adam Auer- Marketing Manager with the Embedded Computingbusiness of Emerson Network Power

Moderator:

Chris Ciufo, OpenSystems Media

TM


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TMFreescale, the Freescale logo, AltiVec, CodeWarrior and PowerQUICC are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. CoreNet, QorIQ and QUICC Engine aretrademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. The Power Architecture and Power.org word marks and the Power andPower.org logos and related marks are trademarks and service marks licensed by Power.org. 2011 Freescale Semiconductor, Inc.

Simplifying the Complexities ofQorIQ Multicore Processors withCOTS Single Board Computer Solutions

17 February, 2011


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TM

3

Introduction QorIQ Processors from Freescale

Freescale, Glenn Beck

Roadmap

Creating High Assurance Computing

COM Express Platform: Right Fit for QorIQProcessorsEurotech, Haritha Treadway

Embedded Pin-Out for COM Express Platform

Emerson, Adam Auer Questions and Answers


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Single Board Computing Market Dynamics

OEM Dynamics Hardware engineering resources are at 25% of OEMs. Software and

Systems engineers now make up the majority. This is at a historical low. Complexities of processors increasing rapidly

o Multicore processors with memory subsystems, high-speed IO, hardwareacceleration on a single device

o High-speed IO

Memories have moved from DDR1 to DDR3 in just a few years

PCI to PCI Expressgen 1 to gen 2. (5 GHz) On board Gigabit Ethernet and 10G Ethernet

Need to get more products to the market faster with more capability atlower development cost

SBC Ecosystem Dynamics Has the expertise to deal with high-speed design and multicore processors

Module offering provides customers semicustom capability to make theirproducts unique for a variety of markets

Module standardization allows for multi-performance capability

Improves the time to market and lowers the development cost


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55

Power ArchitectureProcessor Roadmap

Power SensitiveApplications5W

Value Pricedfor Power/PerformanceApplications10W

Performance atReasonable Power15 W

High Performancewithin EmbeddedPower Budget of30W

PowerQUICC I

PowerQUICC II

PowerQUICC II Pro

PowerQUICC III

e600 +SoC

DecreasingPo

wer

QorIQ P2P2020/P2010P2040

QorIQ P3P3041

QorIQ P4P4080P4040

MulticoreNext Gen ProcessTrust Arch

Trust ArchitectureMore cores

Increase FP PerfNext Gen processSecurity plus

Next Gen Core

Increase FP PerfSecurity plus

QorIQ P5P5020P5010


High Performance

within EmbeddedPower Budget of30W 64-bit Cores

P1010/P1014P1020/P1011P1021/P1012P1022/P1013P1023/P1017

IncreasingPerform

ance

Increasing Performance

QorIQ P1


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66

Power ArchitectureProcessor Roadmap

Power SensitiveApplications5W

Value Pricedfor Power/PerformanceApplications10W

Performance atReasonable Power15 W

High Performancewithin EmbeddedPower Budget of30W

PowerQUICC I

PowerQUICC II

PowerQUICC II Pro

PowerQUICC III

e600 +Soc

DecreasingPo

wer

QorIQP2020/P2011O2040

QorIQ P3P3041

QorIQ P4P4080P4040

MulticoreNext Gen ProcessTrust Arch

Trust ArchMore cores


Next Gen Core

Increase FP PerfSecurity plus

QorIQ P5P5020P5010


High Performance

within EmbeddedPower Budget of30W 64-bit Cores

IncreasingPerform

ance

Increasing Performance

AltiVec

AltiVec

AltiVec

AltiVec

P1010/P1014P1020/P1011P1021/P1012P1022/P1013P1023/P1017

QorIQ P1


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7

Balanced SoC Architecture

FrameManager

Parse, Classify,Distribute

Buffer

RapidIO

MessageUnit (RMU)

2x DMA

PCIe

18-Lane 5GHz SerDes

PCIe SRIOPCIe

CoreNet

1024 KBFrontsideL3 Cache

64-bitDDR-2 / 3

Memory Controller

SRIO

Watchpoint

CrossTrigger

PerfMonitor

CoreNetTrace

Aurora

Security4.0

PatternMatchEngine

2.0

QueueMgr.

BufferMgr.

eLBC

TestPort/

SAP

1GE 1GE

1GE 1GE10GE

1024 KBFrontsideL3 Cache

64-bitDDR-2 / 3

Memory Controller

PAMU

Coherency FabricPAMUPAMUPAMU PAMU

PeripheralAccess Mgmt Unit

eOpenPIC

Power Mgmt

2x USB 2.0/ULPI

SD/MMC

Clocks/Reset

2x DUART

4x I2C

SPI

GPIO

PreBoot Loader

Security Monitor

Internal BootROM

CCSR

Power Architecture

e500-mc Core

D-Cache I-Cache

128 KBBacksideL2 Cache 32 KB 32 KB

FrameManager

Parse, Classify,Distribute

Buffer

1GE 1GE

1GE 1GE10GE

Real Time Debug

QorIQ P4080Multicore Processor

Power Architecturetechnology: superscalarOOO transactions

Memory Hierarchy: L1 L2 L3 Main Memory

High-speed IO: Gen 2 PCI Express, RapidIO,Gig and 10G Ethernet

Embedded IOs: UARTs, SPI, USB, GPIO

Hardware accelerators: SEC, Pattern MatchingEngine, Data Path Acceleration Architecture

Assured Computing: Secure Boot, Separationof Domains and threat detection


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High Assurance Platform - Security in a Connected WorldKey Capabilities of the High Assurance PlatformR HAP

Embedded Security Module provides hardware-based protection of cryptographic keys,

stores measurements of device state and helps to prove to a third party that the device istrustworthy.

Device Hardware Security hardware memory partition provides a secure connection tothe ESM to guard against unauthorized access and separation of resources to isolatedifferent security domains.

Software Measurement - At boot time and at runtime, a HAP device measures software in atrusted manner before that software is allowed to execute.

Separation of Domains - Software can be run free from interference or threat from othersoftware running in other domains on the same device.

Remote Attestation - When connecting to a network, a HAP device provides proof of itsstate to HAP network devices and servers, which can then make a determination about thetrustworthiness of the HAP device and, based on that determination, allow access,quarantine or remediate the HAP device.

Secure Central Administration - HAP devices can be administered centrally through theirentire lifecycle, enabling the secure provisioning, audit, identification, authentication,management and decommissioning of the HAP devices in enterprise environments.

Source: www.nsa.gov/hap


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9

QorIQ ProcessorsObjective of the Assurance: Trust Architecture

Protection Against: Theft of Functionality - loss of control of the systems functionality

Theft of Data - where a data protection policy exists, loss of data to an unauthorized party

Theft of Uniqueness - loss of product differentiation through reverse engineering,duplication and unapproved inter-operability.

Relying on: Secure Boot start from Trusted code base or dont start at all

Strong Partitioning of the System isolation of cores from each other to provideredundancy and data corruption protection between critical functions

Threat detection internal and external security event detection

Secure Debug allows for protected on sight and remote debug


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Trusted Boot Process(Embedded Security Module, Software Measurement)

10

Private Key (d)

System Code(Plaintext)

Hash

Code SigningEntity Internal Secure

Boot Code

RSA SignPublic Modulus (N)

GenerateHash

Public Key (e)

Public Modulus (N)

Decrypted

Hash

If Decrypted Hash =Generated Hash, the SystCode has not been modif

Plaintext Hash = (ciphertext hash)(e) mod N

Ciphertext Hash = (plaintext hash) (d) mod N

E,d, and N are large integers, at least 2048b

E, d, and N are mathematically chosen so thatRSA works (N is the product of 2 large primes)

Sign and Verify are identical operations (modularexponentiation)

RSA VerifyPrivate Key (d)

System Code(Plaintext)

Hash

Code SigningEntity Internal Secure

Boot Code

RSA SignPublic Modulus (N)

GenerateHash

Public Key (e)

Public Modulus (N)

Decrypted

Hash

If Decrypted Hash =Generated Hash, the SysCode has not been modif

Plaintext Hash = (ciphertext hash)(e) mod N

Ciphertext Hash = (plaintext hash) (d) mod N

E,d, and N are large integers, at least 2048b

E, d, and N are mathematically chosen so thatRSA works (N is the product of 2 large primes)

Sign and Verify are identical operations (modularexponentiation)

RSA Verify


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11

CoreNet Coherency Fabric

2 MBFront side

L3 Cache

Peripheral AccessMgmt Units

FrameManagerParse, Classify,

Distribute

Buffer

PCIe1GE 1GE

1GE 1GE10GE

PAMUPAMUPAMUPAMU PAMU

FrameManagerParse, Classify,

Distribute

Buffer

1GE 1GE

1GE 1GE10GE PCIe PCIe sRIO sRIO

HV MMU

HV MMU

HV MMU

HV MMU

Partition 4Partition 3

Partition 2Partition 1

Partition 1Private Memory

Partition 2

Private Memory



HV

Private Memory

Qman Portal

Qman Portal

Qman Portal

Qman PortalQman Portal Qman Portal

Qman PortalQman Portal

SharedMain Memory

SEC4.0

Power Architecture

e500-mc Core

D-Cache I-Cache


Power Architecturee500-mc Core

D-Cache I-Cache



D-Cache I-Cache



D-Cache I-Cache


PME2.0

BManQMan

CommandControlStatusRegisters

Domain Separation


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TM

Power ArchitectureTechnology: QorIQ Platform

High Assurance Architecture User controlled line of trust

Threat Protection From Loss of Functionality From Loss of Data From Loss of Uniqueness

Strong Partitioning

Secure Boot

Drive Linux

enhancements Drive multicore support Drive open virtualization technologies Drive open firmware, x86 emulation, HAL

Tamper Detection

Size, Weight, Power and Performance Answering the demands of the market

QorIQ A balanced architecture for performance

and power High performance multicore processing Tri-level Memory subsystem High Speed IO PCI Express, Rapid IO Hardware Acceleration- Security and Networking CoreNet - Non-blocking Fabric Scalable Signal Processing

QorIQ Scalable Performance 600 MHz to 2.2 GHz/core 4 to 30 Watts Single ISA across family

Tools and OS

Broad OS support- Green Hills- ENEA- Mentor Embedded- QNX- Wind River

Single Board Computing- Emerson- Eurotech

Ecosystem

Control &Signal

Processing

TrustedArchitecture

12


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13



Roadmap



Embedded Pin-Out for COM Express PlatformEmerson, Adam Auer

Questions and Answers


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TM

Benefits of COM Express:Optimize Performance, Power and Size

Delivers full performance capabilities of the QorIQ platform Multicore capabilities PCI Express interconnects Gigabit Ethernet USB 2.0 SATA

LVDS

Reduces power usage for minimal consumption specs Compact form factor Six channels for data communication

Small footprint supports a broad range of applications Basic and compact form factor solutions Ideal for battery-operated or space-constrained devices
http://www.eurotech-inc.com/images/products/adbc7520a-large.jpghttp://www.eurotech-inc.com/images/products/adbc7519a-large.jpg


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TM

Low cost of total ownership Freescale 10-year product lifecycle for QorIQ platform Critical component EOL issues managed by module vendor Extends life of final solution

Reduce design and development costs Processor design complexities already addressed in module Enables OEMs to focus on core, application-specific designs Reduce time to market and revenue

Reduce manufacturing costs Fewer layers required on the carrier Reduced effort to manage component procurement Overall total cost reductions

Benefits of COM Express:Reduce Cost and Time to Market


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TM

Scalability Standard footprints and pin-outs offer migration paths

to newer technologies without carrier board redesign No need to redesign enclosures since carrier boards

can remain the same

Portability Design several carrier boards using one processor

platform Migrate across product line with minimal design work

required

Application-specific carrier boards Form, fit and function suited specifically for end

application Minimized development efforts

SBC

COM

Carrierboards

Benefits of COM Express:Flexibility and Customization


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TM

Overall Comparison:

COM Express Versus SBC

ProductDevelopment

PhaseCOM Express Module SBC Designs

Designing theproduct

Board supplier optimizesmodule for processorcapabilities

OEM focuses on application

design

OEM required to work withboard supplier onunderstanding features,pop/depop requirements

Introducing tothe factory

Opportunity to reuse existingresources

Low system assembly costs

Essentially introducing newproduct with every SBCdesign

Maintenanceandmanufacturing

Lower cost overall

Fewer components to

maintain

High inventory because ofinability to reuse existingdesigns and enclosures

End of lifecyclecosts

Scale to new technology toextend product lifecycle

Board EOLed, OEMnegotiates Last Time Buyconditions


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TM

Perfo

rmance

Power Consumption

Eurotechs QorIQ Solutions:

Target Markets and Applications

Adbc7517P4080

Up to 1.5 GHz,


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19



Roadmap






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TM

Corporate Sales of

$21B (2010)

Best cost design

and manufacturingfacilities

Widest range ofembedded computing products

Over 30 years legacy in Embedded Computing incorporating MotorolaComputer Group, Force Computers, Prolog, Blue Wave Systems, Paceline,Artesyn and others

Globally recognized for our quality, reliability and long life-cycle products

Excellent pre- and post-sales support plus comprehensive servicesportfolio for trouble-free deployment

Emerson Network Power
http://inside.phx.mcd.mot.com/webdev/graphics/images/6100-DS.jpghttp://inside.phx.mcd.mot.com/webdev/graphics/images/ATCA-7130_TN.jpg


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COM Express Pins and Headers

A B C D COM Express pin-outs definewhich signals are taken to the end

of a processing module via the 4COM Express connectors:A,B,C,D

Modules are built according to acertain type - in order tosuccessfully mate with a carrier

The types are defined by PICMG.http://www.picmg.org/

The QorIQ modules use new pin-outs that are PICMG compatible,not compliant.


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Goals of the Pin-Out

Processor-agnostic approach

Greater flexibility

Removal of x86 specific pins LPC, PEG, AC'97 Audio, Sleep states 3, and 4, etc.

Addition of embedded interfaces: IEEE1588 Precision Time Protocol

8 Bit local bus

UART interfaces

Configurable SerDes lanes - enabling 10G XAUI Ethernet, SGMII,Serial RapidIOor PCI Express interconnects


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TM

QorIQ P1022 Processor Compared to a Type 6

P1022

A B C D

GIGE 0 1588 CK GIGE 1

i2C

SATA SATA DDI x 1

USB USB

USB USB

PCIE 1 PCIE 4

PCIE 2

PCIE 3 UART 0 MDIO

LVDS A UART 1 IRQ

SPI SPI SPI SPI

VGA I2S Audio

SDIO SDIO

Type 6A B C D

GIGE 0 LPC USB 3.0 USB 3.0

SMB PCIE 7 PCIE 8i2C DDI x 3

SATA SATA

SATA SATA

AC97 Audio AC97 Audio

USB USB PEG

USB USBUSB USB

USB USB

PCIE 1 PCIE 4

PCIE 2 PCIE 5

PCIE 3 PCIE 6

LVDS A LVDS B

SPI SPILPC VGA

GPIO/SDIO GPIO/SDIO
http://ecintranet.emrsn.org/marketing/Product%20Images/COMX-P1022_Angle.gif


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TM


P2020

A B C DGIGE 0 1588 CK GIGE 1 GIGE 2

i2C

USB USB

USB USB

PCIE 1

PCIE 2

PCIE 3 UART 0 MDIO

LVDS A UART 1 IRQSPI SPI SPI SPI

VGA

SDIO SDIO

Type 2

A B C DGIGE 0 LPC IDE

SMBi2C

SATA SATA PCI

SATA SATA

AC97 Audio AC97 Audio

USB USB PEG

USB USB

USB USB

USB USB

PCIE 1 PCIE 4

PCIE 2 PCIE 5

PCIE 3 PCIE 6

LVDS A LVDS B

SPI SPI

LPC VGA

GPIO/SDIO GPIO/SDIO

ExpressCard ExpressCard
http://ecintranet.emrsn.org/marketing/Product%20Images/COMX-P2020_Angle.gif


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Type 5

A B C D

GIGE 0 LPC GIGE 1 GIGE 2SMB

i2C

SATA SATA PCIE 7 PCIE 8

SATA SATA PCIE 9 PCIE 10

AC97 Audio AC97 Audio PCIE 11 PCIE 12

USB USB PCIE 13 PCIE 14




PCIE 1 PCIE 4 PCIE 21 PCIE 22



LVDS A LVDS B PCIE 27 PCIE 28SPI SPI PCIE 29 PCIE 30

LPC VGA PCIE 31 PCIE 32

GPIO/SDIO GPIO/SDIO

P4080A B C D

GIGE 0 1588 CK GIGE 1 GIGE 2

i2C

SERDES 6 SERDES 7

USB USB

USB USB

USB USB SERDES 17 SERDES 17

USB USB SERDES 18 SERDES 19

SERDES 0 SERDES 3

SERDES 1 SERDES 4

SERDES 2 SERDES 5 UART 0 MDIO

UART 1 IRQ

SPI SPI SPI SPI

UART 2

SDIO SDIO Local Bus Tamper
http://ecintranet.emrsn.org/marketing/Product%20Images/COMX-P4080-A1.gif


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TM

Results

Dramatically increased flexibility Configurable SerDes lanes allow interfaces to be configured during

boot-up

Pin-out Compatible modules 100% compatible power and ground pins

100% compatible common interfaces (SATA, USB)

Interchangeable with limited functionality Mechanically Identical - mounting and thermal designs can be re-used

QorIQ Architecture is now available on modules!

For more information: COM Express please visit PICMG.org: http://www.picmg.org/

QorIQ implementation: contact Emerson Network Power, Eurotech orFreescale Semiconductor for more information.


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QorIQ Modules from Emerson Network Power

COMX-P4080 8 Core 1.5 GHz CPU Up to 4 GB DDR3

12 configurable SerDes lanes

COMX-P2020 2 Core 1.0 GHz CPU

Up to 2 GB DDR3

COMX-P1022

2 Core 800 MHz CPU Up 2 GB DDR3
http://ecintranet.emrsn.org/marketing/Product%20Images/COMX-P1022_Angle.gifhttp://ecintranet.emrsn.org/marketing/Product%20Images/COMX-P2020_Angle.gifhttp://ecintranet.emrsn.org/marketing/Product%20Images/COMX-P4080-A1.gif


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28



Roadmap






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Glenn Beck - Segment Marketing Manager - Single Board Computing andAerospace & Defense Markets- Freescale Semiconductor

Haritha Treadway- Product Manager at Eurotech Inc.

Adam Auer- Marketing Manager with the Embedded Computing business ofEmerson Network Power

TM


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Thanks for joining us

Event archive available at:

http://ecast.opensystemsmedia.com/

E-mail us at: [email protected]

TM
http://ecast.opensystemsmedia.com/mailto:[email protected]:[email protected]://ecast.opensystemsmedia.com/

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