AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben
Tel +43 (0) 3842 200-0 | E-Mail [email protected]
www.ats.net
AT&Sfirst choice for advanced applications
Company Presentation
February 2015
1
Company Overview
Strategy & Market
Annex
Financials
Table of Contents
2
AT&S – a world leading high-tech PCB company
� Megatrend-driven
markets with attractive
growth potential
� Entering a new high-end
business segment by
2016
� Pure high-end segment play
� Technology & quality leader
� Largest European PCB
producer
� Partner of choice for blue
chip customer base
� Balanced industry portfolio
� Strong Asian production
footprint with focus on
high volume/low mix
� European footprint: high
mix/low volume
� Operational excellence:
Outstanding process
know-how, productivity
and efficiency
� One of the most profitable
players in the industry:
above industry EBITDA
margins
� Strong cash flow generation
� Proven long term successful
financial track record
3
AT&S – Key Facts
Strong track record1 Balanced portfolio/Global customer base2
488514
542590
489
96 103 102127 127
47 42 3154 71
2010/11 2011/12 2012/13 2013/14 Q1-3
2014/15
Revenue EBITDA EBIT
+5% +5% +9%
Revenue growth 7%
In E
UR
m
3
Distribution revenue: Business Unit
Distribution revenue: Customer Region
57%
43%
Mobile Devices &
Substrates
Industrial &
Automotive (inkl.
Medical)
25%
6%
17%
52%
Germany/Austria
Other European
countries
Asia
Americas
4
Global footprint ensures cost efficiency
� European production facilities: high mix/low volume
� Asian production facilities: high volume/low mix
� Sales network spanning three continents
� About ~7,600 employees
Plant Shanghai, China
Staff: ~4.500
Plant Ansan, Korea
Staff: ~250
Plant Nanjangud, India
Staff: ~1.100
Plant Chongqing, China
under construction
Staff: ~500
AT&S Sales OfficesAT&S Plants
Plant Leoben, Austria
Headquarters
Staff: ~ 900
Plant Fehring, Austria
Staff: ~350
►► volatility due to seasonal effects
5
Balanced high-end product portfolio
to level seasonalityCharacteristicCharacteristic Selected ApplicationsSelected ApplicationsSegmentSegment
1) Based on external revenue EUR m in Q3 2014/15
Mobile Devices &
Substrates
Advanced
Packaging
Selected Market
Leaders
Selected Market
Leaders
GoPro
Sony
LG
Canon
Qualcomm
Blackberry
Lenovo
Huawei
Samsung
Xiaomi
ZTE
Intel
Apple
►► stable business due to longer product life
time
� Includes the segment Advanced Packaging (still in the
process of being established) as well as group
management and financial activitiesOthers
(Revenue in EUR m)
(Revenue in EUR m)
Industrial & Auto-
motive & Medical
Revenue
Share1)
Revenue
Share1)
Communication
Computing
Automotive:
Lighting, thermal, sensors,
safety, infotainment,
powertrain
Medical:
Patient monitoring,
Therapy, diagnostic
Industrial:
Instrumentation &
Control, power
solutions, lighting
Consumer
Electronics
Osram
Hella
Siemens
General Electric
Continental
Harmann
EADS
Texas Instruments
ST Microelectronics
Freescale
Semiconductor
RFMD
TDK-Epcos
Qualcomm
74.5 90.1 87.7
69.0 68.0 88.7
120.9
Q1 13/14 Q2 13/14 Q3 13/14 Q4 13/14 Q1 14/15 Q2 14/15 Q3 14/15
57%
43%
66.4 66.3 62.9
69.7 72.6 71.7
65.9
Q1 13/14 Q2 13/14 Q3 13/14 Q4 13/14 Q1 14/15 Q2 14/15 Q3 14/15
6
Company Overview
Strategy & Market
Annex
Financials
Table of Contents
7
Convincing Business Model
Level of complexity
Strategic focus on high-end segments
� „Market intelligence“ – anticipate and industrialise future leading-edge trends
and technologies by defining high-end applications and technology niches
� Focus on profitable segments with sustainable growth perspectives
� Continuous technological process development
� Successfully leveraging technology between business segments
Sustainable profitability with strong cash flow out of core business
� Continuously improve product mix and capacity utilisation for on-going above
industry margins
� Strict working capital management / Operational Cash Flow driven decision
making
� EBITDA margin target FY: 23-24%
Accelerate growth by entering a new high-end business segment
� IC-substrates with start of production in 2016
� Joint-development with leading semiconductor company
� Cost advantage: one of the first companies operating a high-end IC Substrate
manufacturing facility in China
1
2
3
8
PCB Market Growth outperforms E-Systems Market
1) Market Size 2013 , in USD bn / Source: Prismark, April 2014 2) AT&S addressable Market Size 2013, in USD bn / Source: BPA, Prismark, AT&S, 2013-2014 3)excl. IC Substrates
Business Unit Industry/E-Systems Market Selected Applications E-Systems Market 1)
CAGR 2013-2018
PCB Market Size 2)
CAGR 2013-2018
Mobile Devices
& Substrates
Computing Notebooks, PCs, Server 490 bn 2.7% 17.0 bn 3.1%
Communications Smartphones, Tablets 482 bn 3.1% 15.3 bn 3.7%
Consumer Electronics Cameras 147 bn 3.5% 6.4bn 3%
SubstratesMicroprocessors, Graphic
Processors7.6 bn 4.9%
Industrial &
Automotive &
Medical
Industrial & MedicalInstrumentation & Control,
Therapy, Diagnostic253 bn 5.8%
3.2 bn 12.9%
Medical 1.3 bn 6.8%
AutomotiveLighting, sensors, safety,
infotainment, powertrain178 bn 6.5% 4.3 bn 7.1%
Total Market Size3)
CAGR 2013-20181,678 bn 3.8% 47.5 bn 4.4%
9
Market Player/Position HDI Technology
Source: Prismark, August 2014; NTI CY2013; AT&S Strategy
Market position HDI Technology
Revenue (in USD m)
Rank Country Supplier HDINon HDI
PCB´s
IC-
Substrates
Total
revenue
1 TWN Unimicron 682 671 795 2.148
2 TWN Compeq 538 509 - 1.047
3 AUT AT&S 530 248 - 778
4 KOR SEMCO 480 173 1.212 1.865
5 JPN Ibiden 426 - 1.080 1.506
6 USA TTM 406 962 - 1.368
7 TWN Zhen Ding 343 1.774 - 2.117
8 TWN Tripod 305 1.077 - 1.382
9 KOR DAP 279 21 - 300
10 TWN Unitech 236 304 - 540
(as of 31/12/2014)
Completion of
Infrastructure
Start Equipment
Characterisation
Certification
Start
Training
Start Equipment
Ordering
Plant Lay-out
Product-
Specification
Start of Production
�
10
�
�
�
�
Q4 Q1 Q2 Q3
FY 2013/14
Q4 Q1 Q2 Q3
FY 2014/15
Q3FY 2012/13
Q4 Q1 Q2 Q3
FY 2015/16
Q4 Q1 Q2 Q3
FY 2016/17
Q4
� Investment as at 31/12/2014: € 171.7 m1)
� Characterisations and certification for first line is ongoing
� Start of negotiations about the product mix and the ramp scenarios.
Management Board expects the negotiations to be concluded in the
coming months.
� Start of production is scheduled for 2016
Project Status IC Substrate plant Chongqing
1)Additions to tangible fixed assets as of 31/12/2014 since project start
Start Equipment Installation
11
Driving Future Trends: Internet of Things (IoT) and
Application Structures
� Healthcare
� Glasses
Wearable ElectronicsWearable Electronics
Smart Mobility Smart Mobility � Autonomous Driving
� Car2Car Communication
Smart CitySmart City � Smart Lighting
Smart BuildingsSmart Buildings � Home/Building Automatisation
� Energy Management
Smart Production/Industry 4.0Smart Production/Industry 4.0 � Automatisation/Robotics
� Production Control Systems
Smart HealthcareSmart Healthcare � Connectivity (e.g. online patient
monitoring)
Smart EnergySmart Energy � Smart Metering
� 30-50 Billion of „Things“ will be connected in 2020
� Wearables market forecast: USD 10 – 60 bn by 2018Source: IHS, 2013
12
Company Overview
Strategy & Market
Annex
Financials
Table of Contents
13
Sound top-line growth, above industry margins
and increasing cash conversion
2010/11 2011/12 2012/13 2013/14 � Continuous growth path up to full capacity
utilisation
� Revenue with products out of Asian production
increased from 69% in 2010/11 to 76% in 2013/14
� Next significant step-up in growth: start of
production of IC-substrate in Chongqing in 2016
EBITDA
AND
EBITDA-MARGIN
OPERATING CASH
FLOW / Y-O-Y
DEVELOPMENT
� EBITDA increase due to high capacity utilisation
� Continuous conversion to more high-end product
mix
� EBITDA margin guidance FY: 23-24%
� Operating cash flow generation driven by strong
EBITDA performance
488 514542 590 489
7187
72105 95
Selected Key Financials (EUR m)Selected Key Financials (EUR m)
REVENUE /
Y-O-Y GROWTH
96 103 102 127 127
19.7% 20.0% 18.8%21.5%
26.0%
Q1-3
2014/15
14
Efficient operational cost base
106
75 8296
106114
23,6%
20,1%
16,8%18,6% 19,5% 19,3%
Working Capital Working Capital % of Sales
Working Capital Development in EUR m
2008/09 2009/10 2010/11 2011/12 2012/13 2013/14
15
Staff and Capex
STAFF*The increased headcount is primarily based on
the Chongqing project. Decreased number of
staff in core business reflects improved
productivity.
CAPEX (€ in million)
CAPEX increase reflects technology investments in
existing locations and investments in Chongqing
project (whereof € 74m).
Regular Business Employees Project ChongqingCAPEX end of reporting period FY
CAPEX end of reporting period Q1-Q3
* incl. temporary employees , average for the period
115 113
40
90
69.7
130.4
2010/11 2011/12 2012/13 2013/14 Q1-Q3
2013/14
Q1-Q3
2014/15
6,9877,417 7,321
7,0277,526
2010/11 2011/12 2012/13 2013/14 Q1-Q3
2014/15
123539
54
Financials Q1-Q3 2014/15
16
€ in thousands (unless otherwise
indicated)
01.04.2014- 31.12.2014 01.04.2013 – 31.12.2013
STATEMENT OF PROFIT OR LOSS
Revenue 489,416 450,947
produced in Asia 79% 76%
produced in Europe 21% 24%
EBITDA 127,284 100,138
EBITDA margin 26.0% 22.2%
EBIT 70,811 43,458
EBIT margin 14.5% 9.6%
Finance income/(costs) - net (4,376) (9,088)
Income Taxes (16,097) (3,933)
Profit for the period 50,338 30,437
Cash Earnings 106,751 87,084
EPS in € (average number of shares
outstanding)1.29 1.08
Strong sales, improved product mix combined with cost savings translate into strong EBITDA/EBIT
Financials Q1-Q3 2014/15
17
€ in thousands (unless otherwise
indicated)31.12.2014 31.03.2014
STATEMENT OF FINANCIAL POSITION
Non-current assets 624,052 483,858
Current assets 473,496 432,201
Equity 502,803 390,680
Non-current liabilities 403,312 370,336
Current liabilities 191,433 155,043
Total assets 1,097,548 916,059
Net debt 153,716 110,874
Net gearing 30.6% 28.4%
Net working capital 111,432 91,722
Net working capital per revenues 17.1% 15.6%
Equity ratio 45.8% 42.7%
Based on the strong operating performance increase of debt could be limited
Financials Q1-Q3 2014/15
18
€ in thousands 01.04.2014 – 31.12.2014 01.04.2013 – 31.12.20131)
STATEMENT OF CASH FLOWS
Profit for the period 50,338 30,437
Non cash bearing of profit or loss 65,442 54,090
Changes in Working Capital (20,406) (2,457)
Net cash generated from operating
activities95,374 82,070
Net cash used in investing activities (130,433) (69,866)
Net cash generated from financing
activities16,838 13,182
Net increase/decrease in cash and cash
equivalents
(18,221) 25,386
19
€ in millions < 1 Year 1-5 Years > 5 Years Total
Corporate Bond 0.6 99.6 - 100.2
Export Loans 32.0 - - 32.0
Public funds and other - 2.6 1.4 4.0
Bank Borrowings 14.4 204.2 49.5 268.1
Total 31/12/2014 47.0 306.4 50.9 404.3
Total 31/03/2014 46.0 282.9 43.0 371.9
Maturity
Overview Debt Portfolio Duration
AT&S - Stock Profile
Listing Vienna Stock Exchange, Prime Standard
Indices ATX Prime, WBI
ThomsonReuters (A) ATSV.VI
Bloomberg (A) ATS AV
# of shares outstanding 38.85m
Avg. daily volume 65,000
2014 abs performance 24.51%
Dividend 2013/14: EUR 0.20/per share
Dividend yield: 2.3%
Calendar
Annual Results 2014/15 7 May 2015
21st Annual General Meeting 9 July 2015
1st Quarter Results 2015/15 28 July 2015
Ex-dividend day &
dividend payment day 30 July 2015
20
YTD price development/liquidity & Shareholder structure
*including direct and indirect holdings
*
*
ATX Prime AT&S
21
Outlook FY 2014/15
Based on the positive business development of the first nine months and
taking into account the seasonality in the mobile devices & substrates
segment in the fourth quarter – and provided that the macroeconomic
environment and the current exchange rates remain stable – we will enhance
the outlook for the financial year 2014/15: we expect revenue amounting to
€ 623-633 million (previous year: € 589.9 million) and an EBITDA margin
between 23 and 24% (previous year: 21.6%).
22
Company Overview
Strategy & Market
Annex
Financials
Table of Contents
23
HDI microvia printed
circuit boards
HDI any-layer printed
circuit boards
IMS printed
circuit boards
Multilayer
printed circuit boards
AT&S Product Portfolio
Double-sided printed
circuit boards
Flexible printed circuit
boards
Semiflexible printed
circuit boards
Rigid-flexible printed
circuit boards
Flexible printed circuit
boards on aluminium
HDI rigid-flex
printed circuit boards
Management
24
Andreas Gerstenmayer, CEO
� Joined AT&S as CEO in 2010
� Previous positions include:
− 18 years of work experience at Siemens, including Managing Director with Siemens Transportation Systems
GmbH Austria and CEO of the Drive Technology business unit in Graz from 2003 to 2008
− Partner at FOCUSON Business Consulting GmbH after leaving Siemens
� Education and other positions:
− Member of the Research Council of Styria
− Degree in Production Engineering from Rosenheim University of Applied Sciences
Heinz Moitzi, COO
� COO since 2005; with AT&S since 19811)
� Previous positions include:
− Various management positions within AT&S
− Measurement engineer with Leoben University of Mining and Metallurgy
� Education:
− Degree from Higher Technical College of Electrical Engineering
− Studied electrical installation with Stadtwerke Judenburg (Judenburg municipal utility company)
Karl M. Asamer, CFO
� Joined AT&S as CFO in 2014
� Previous positions include:
− Managing Director of GEKA Group in Germany
− Managing Director of Sell GmbH in Germany
� Education:
− Degree: doctorate in business administration in Linz, Austria
1)He was already with the founding company of AT&S
1) High Density Interconnect (laser-drilled printed circuit boards)
25
History
2013 � Collaboration agreement with leading semiconductor
manufacturer to enter IC substrate market
2011 � Acquisition of land and start of construction of a high-end
plant in Chongqing, China
2010 � Relocation of Group Headquarters from Vienna to Leoben
� Ramp-Up plant II in Nanjangud
2009 � Restructuring and reorientation of Leoben plant towards high-
value industrial business
� Focusing Shanghai on high-end mobile devices segment
2008 � Relisting on the Vienna Stock Exchange (Prime Market)
2006 � AT&S buys flexible plant in Korea
2002 � Start of production in new AT&S plant in Shanghai – one of the
world’s leading HDI1) facilities
1999 � AT&S listed on the Neuer Markt at the Frankfurt Stock
Exchange
� AT&S buys PCB plant in India
1994 � Privatisation and acquisition by Hannes Androsch, Willibald
Dörflinger and Helmut Zoidl
1987 � Foundation of AT&S
Five core dimensions of sustainability within AT&S
Energy and
carbon footprintWater
AT&S – a learning
organisationResourcesThinking ahead –
shaping the future
CSR gains importance in long term success
� Improving efficiency
� Motivated and qualified staff
CSR as a key to sustainable business success
26
The importance of sustainability is rising within:
� Authorities
(basis for securing operation licences)
� Customers
(relevant for placing orders)
AT&S saves CO2 and Water…
27
Sustainability – Figures and Fields of Action
AT&S aims to minimise its
environmental footprint by
reducing the CO2 emissions
per m2 PCB attributable to
production processes by 5%
a year.
AT&S aims to reduce
the Group‘s annual
fresh water
consumption per m2
PCB by 3%.
Visit: www.ats.net; Twitter @AT&S IR_PR; YouTube AtundS
28
AT&S – first choice for advanced applications
IR Contact:
Elke Koch
Fabriksgasse 13,
8700 Leoben/Austria
Tel: +43 3842 200 5925
Mobile: +43 676 8955 5925
Fax: +43 3842 200 15909
www.ats.net
Disclaimer
29
This presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria(“AT&S”), and the contents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein,and no reliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You areexpressly cautioned not to place undue reliance on this information.
This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘sexpectations and assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actualdevelopments, results, performance or events may vary significantly from the statements contained explicitly or implicitly herein.
Neither AT&S, nor any affiliated company, or any of their directors, officers, employees, advisors or agents accept any responsibility or liability (for negligence orotherwise) for any loss whatsoever out of the use of or otherwise in connection with this presentation. AT&S undertakes no obligation to update or revise any forward-looking statements, whether as a result of changed assumptions or expectations, new information or future events.
This presentation does not constitute a recommendation, an offer or invitation, or solicitation of an offer, to subscribe for or purchase any securities, and neither thispresentation nor anything contained herein shall form the basis of any contract or commitment whatsoever. This presentation does not constitute any financial analysisor financial research and may not be construed to be or form part of a prospectus. This presentation is not directed at, or intended for distribution to or use by, anyperson or entity that is a citizen or resident or located in any locality, state, country or other jurisdiction where such distribution, publication, availability or use would becontrary to law or regulation or which would require any registration or licensing within such jurisdiction.