Main advantages
Deposition rates > 1 nm/s; 100 times faster compared to conventional ALD Large range of applications with variety of precursors Enable multi-material stack with multiple precursors Process at atmospheric pressure (no vacuum process) Thickness control at atomic scale Straightforward adjustment of layer thickness Excellent conformity No pinholes No contact on deposition side of foil No parasitic deposition Compact equipment footprint
FLEx R2R sALDSpatial ALD coating technologyAbsolute thickness control, extreme layer homogeneity, superb conformity without cost of vacuum tooling.Atomic layer deposition (ALD) technology uses cyclic exposure of a substrate to different precursors where in each cycle a layer is formed of a single atom thickness. This ensures superior thickness control, extreme layer homogeneity and superb conformity without cost of vacuum tooling. Spatial ALD (sALD) is the enhanced form of traditional ALD improving the deposition rate by several orders of magnitude. The FLEx R2R sALD is a Roll to Roll Spatial ALD production solution for many applications that require these benefits of sALD. Next to high throughput the FLEx platform approach enables integration of various additional coatings and pre-treatment technologies.
Schematic representation sALD
Key features
Accurate controlled exposure time and process temperature High precision rotating spatial ALD drum and WEB tension control High precision WEB unwinding and rewinding modules High uptime Flexibility in foil type and layer thickness Scalable platform 24/7 volume production Customizable configuration Various optional modules available
R2R sALD principle
General specifications
Deposition technology Proprietary spatial ALD technology
Configuration Roll to roll line, used for development and (pilot) production
WEB speed 0,1 - 20 m/min, depending on layer thickness
WEB materials PET, PEN; 25-125 micron, other materials on request
WEB width 300 – 600 mm, ready for up-scaling to 1600mm
Control Graphic User Interface
ALD coating
Materials Al2O3, TiO2, Zn(O,S), ZnO, ZnO:Al; SiO2, HfO2, In2O3, ZnO:In, IZO, IGZO, ZnSnOx, Silver, Alucone (R&D level)
Layer thickness 2 nm - 300 nm
Process temperature 80 – 150 C
Additional process modules
- Slot die coating
- UV or Thermal curing
- Surface activation (Corona or Plasma pre-treatment)
- Protective interleaf wind or unwinding
Optional modules
- Down flow enclosure
- Particle pre-cleaning
- Integrated measurement technology
- Manufactring Execution Software (MES)
Meyer Burger (Netherlands) B.V. | [email protected] | www.meyerburger.com
We
rese
rve
the
right
to m
ake
chan
ges
refle
ctin
g te
chni
cal p
rogr
ess
| FLE
x_R
2R s
ALD
v17
0203
Optical transparent barrier films Optical stack development Zn(O, S) buffer layers for CIGS cells
Optically transparent barriers with water vapour transmission rates in low 10-5 range with only 20 nm layer coating on organic films.
Manufacturing of perfect optical stacks. Example: Al2O3 and TiO2 stack with reflectance max. at 550nm on PET foil
Replace CdS by ALD Zn(O,S) avoiding use of cadmium and improving efficiency (>0.4% abs) by lowering optical absorption.
Technical data of FLEx R2R sALD platform