Forenprogramm Forum programs 21/5/2015 · highly reliable semiconductor ... 10:00 Aavid Thermalloy...

ForenprogrammForum programs

Ausstellerforum, Halle 7, Stand 260 Exhibitor Forum, hall 7, booth 260

Fachforum, Halle 6, Stand 345 Industry Forum, hall 6, booth 345

Ausstellerforum und Fachforum 2015Exhibitor Forum and Industry Forum 2015

Mittwoch, 20.05.2015 Seite 5 - 6 Wednesday, 20 May 2015 Page 5 - 6

Dienstag, 19.05.2015 Seite 3 - 4 Tuesday, 19 May 2015 Page 3 - 4

Mittwoch, 20.05.2015 Seite 10 Wednesday, 20 May 2015 Page 10

Dienstag, 19.05.2015 Seite 9 Tuesday, 19 May 2015 Page 9

Donnerstag, 21.05.2015 Seite 7 - 8 Thursday, 21 May 2015 Page 7 - 8

Donnerstag, 21.05.2015 Seite 11 Thursday, 21 May 2015 Page 11

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Ausstellerforum Halle 7, Stand 260 Exhibitor Forum hall 7, booth 260

Dienstag, 19.05.2015 Tuesday, 19 May 2015

Uhrzeit Time Firma Company Referent Speaker Thema Topic

10:00 - 10:20 ICAR S.p.A. - INDUSTRIA CONDENSATORI

Matteo Colautti Tailor made solutions in capacitors market

10:20 - 10:40 Advanced Cooling Technologies

Pete Ritt Thermal management technologies for power electronics

10:40 - 11:00 Keysight Technologies GmbH

Carlo Canziani Simplify and improve measurement of power and efficiency of power converters with new Keysight IntegraVision power analyzer that can visualize power waveforms in real time

11:00 - 11:20 AgileSwitch LLC Rob Weber Learn how the AgileStack, the first, patented, fully software configurable power stack can provide data from advanced monitoring and predictive analytics to helps pre-empt inverter system failureand adjusts overall system performance accordingly

11:20 - 11:40 Mentor Graphics Deutschland GmbH

Mathew Clark Andreas Simon-Kajda

Real world IGBT module measurement and optimization of thermal design in simulation

11:40 - 12:00 The Bergquist Company GmbH

Holger Schuh Thermally conductive “cure in place” gap filler as an optimal thermal materials solution for highly effective cooling of electronics

12:00 - 12:20 Lehrstuhl FAPS, FAU Erlangen-Nürnberg, PFARR STANZTECHNIK GmbH, POWERSEM GmbH

Aarief Syed Khaja

Haneen M. Daoud

Ashok Chadda

Preform based diffusion soldering technology for highly reliable semiconductor power modules (SiC/GaN/Si) for usage at high temperatures

12:20 - 12:40 Vicor Corporation Robert Russell Vicor's VIA package technology: Electrical & thermally adept power components for high current power delivery applications

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Ausstellerforum Halle 7, Stand 260Exhibitor Forum hall 7, booth 260



12:40 - 13:00 Exagan S.A.S. Frederic Dupont Exagan: 200 mm Power GaN to accelerate market adoption

13:00 - 13:20 Mitsubishi Electric Thomas Radke A new IGBT module with insulated metal baseplate (IMB) and 7th generation chips

13:20 - 13:40 OPAL-RT TECHNOLOGIES

Yahia Bouzid Real-time simulation of power electronics for drive and grid applications on FPGA

13:40 - 14:00 Cree Marcelo Schupbach Cree power technology and the impact on PV Inverter designs

14:00 - 14:20 Infineon Technologies AG Germany

Brian LaValle StrongIRFETT power MOSFETs - an optimized solution for industrial low frequency applications

14:20 - 14:40 SBE Inc. Edward Sawyer Greatly improved AC filter caps for wind, solar, and network power

14:40 - 15:00 MAGNETEC GmbH Tobias Trupp Next generation nanocrystalline cores and chokes NANOPERM(+) and MB new generation

15:00 - 15:20 Panasonic Automotive & Industrial Systems Europe GmbH

Tetsuzo Ueda State-of-the-art GaN and SiC power devices and applications

15:20 - 15:40 Vishay BCcomponents Austria GmbH

Gerald Tatschl Energy storage capacitors

15:40 - 16:00 Vincotech Michael Frisch Efficiency prediction of 630kW bidirectional power conversion with 3 level power modules

16:00 - 16:20 Analog Devices Nicola O`Byrne Applying digital isolation in motor control

16:20 - 16:40 ABB Switzerland Ltd. Christian Winter ABB high-quality modules expand to medium power

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Mittwoch, 20.05.2015 Wednesday, 20 May 2015


09:40 - 10:00 Aavid Thermalloy SRL Gianfranco Lanzo TMHydrosink is an intelligent, innovative, high perfor-

mance liquid cooling system which aims to replace TMexisting air cooled systems. Hydrosink is most

efficient for high power electronics

10:00 - 10:20 ATHERM Jean-François Savard Atherm the european manufacturer of grooved and

sintered heatpipes

10:20 - 10:40 Fairchild Semiconductor Jonathan Harper Achieving higher reliability and power density with new extended temperature specified MOSFETs

10:40 - 11:00 Hoffmann & Co Elektrokohle AG

Klaus Höll High reliability applications of Aluminium Graphite

11:00 - 11:20 Hengdian Group DMEGC Magnetics Co., Ltd.

Mauricio Esguerra Software-assisted magnetics design for power applications

11:20 - 11:40 dataTec GmbH Thomas Großmann Zweiquadranten-Lösungen für Last- und Versorgungsprüfungen

11:40 - 12:00 Analog Devices Dara O`Sullivan Isolated gate drivers for industrial motor control

12:00 - 12:20 Jianghai Europe Electronic Components GmbH

Arne Albertsen Reliability of electrolytic capacitors

12:20 - 12:40 MAGNETEC GmbH Tobias Trupp MR-typeline: Advanced and easy-to-use toroidal cores for upgrades of ferrite-based EMI-Filter

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12:40 - 13:00 Typhoon Hil Nikola Celanovic Unveiling the new revolutionary HIL 4 series notebook sized Hardware-in-the-Loop system

13:00 - 13:20 Wolverine Tube Inc. MicroCool Division

Matt Reeves Building a low cost, high performance coldplate using MicroCool MDT and friction stir welding

13:20 - 13:40 SEMIKRON International GmbH

Stefan Häuser SEMiX 3 Shunt + SKYPER: Pushing for integration

13:40 - 14:00 Magnetics Inc. Donna Kepcia Achieve energy-efficient, compact, high-current inductor designs

14:00 - 14:20 Keysight Technologies GmbH

Ryo Takeda Challenges and solutions for power testing in automotive applications

14:20 - 14:40 Diotec Semiconductor AG Udo Steinebrunner State-of-the-art design of the input rectifier stage of power supplies, LED drivers and frequency inverters

14:40 - 15:00 Power Electronic Measurements Ltd.

Jo Aberdeen The practicalities of measuring fast switching/transient currents in power electronic applications using rogowski transducers


Felix Grawert or Neil Massey & Jan-Willem Reynaerts or Hubert Baierl

Full system solution for 130kHz PFC stage with latest innovations from Infineon

15:20 - 15:40 Schweizer Electronic AG Christian Rössle Power PCBs for reduction of fuel consumption and CO² emissions

15:40 - 16:00 Proton-Electrotex JSC Alexander Pisarev Housing-less welding diodes with improved high load-cycling capability

16:00 - 16:20 ABB Switzerland Ltd. Raffael Schnell LinPak: The solution for low-inductive and compact converter designs

16:20 - 16:40 YOKOGAWA Deutschland GmbH

Ugur Gürsoy Oszillografische Messung und Analyse transienter Leistungen in der Praxis

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Donnerstag, 21.05.2015 Thursday, 21 May 2015



Stefan Schmies MIPAQ™ Pro – A new approach for protecting intelligent power modules

10:20 - 10:40 DANA Meinrad Machler Recent advances in cooling of Li-Ion batteries and of IGBT arrays

10:40 - 11:00 ETH Zürich Power Electronic Systems Laboratory

Andreas Müsing The "Gecko" design platform - GeckoCIRCUITS and GeckoMAGNETICS

11:00 - 11:20 MAGNETEC GmbH Tobias Trupp Reduction of motor bearing currents/common mode currents with CoolBLUE (R) and NaLA(R) in inverter motor systems

11:20 - 11:40 Vincotech Evangolos Theodossiu Power module solutions for innovative 3 phase PFC applications

11:40 - 12:00 THALES MICROELECTRONICS S.A.S.

Sebastien Oge Performances and ageing of SiC MOSFETs in very high temperature environment ( > 250°C)

12:00 - 12:20 DODUCO GmbH Joachim Ganz AI/CU Hybridwerkstoffe - eine neuartige Werkstoffkombination

12:20 - 12:40 Vishay Semiconductor Italiana S.p.A.

Claudio Damilano ® Trench field stop IGBTs and Fred Pt Gen 4: The perfect match

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12:40 - 13:00 Traftor Europe Guillaume Pasquet Toroidal inductors from 20kVA to 500kVA: How to achieve higher performance and cost reduction combining optimized design and manufacturing capability

13:00 - 13:20 EpiGaN nv Markus Behet EpiGaN’s epiwafer technology: Enabler for best-in-class GaN devices

13:20 - 13:40 Alpha Julien Joguet Latest advances in sinter technology manufacturing from Alpha

13:40 - 14:00 Fairchild Semiconductor Jonathan Harper Reducing EMI and improving power density of24V - 80V motor drives

14:00 - 14:20 ON Semiconductor Chris Rexer Jason McDonald

Advanced silicon and GaN power technologies from ON Semiconductor for next generation applications in the medium to high voltage range

14:20 - 14:40 DEWETRON Elektronische Messgeräte GmbH

Knut Gottwals Experiences in measurements on hybrid and electrical vehicle test benches using DEWETRON’s power analyzer DEWE-2600

14:40 - 15:00 HEIDEN power GmbH Andreas Schmelter Kurt Reitberger

Emulation von Netzbetriebszuständen um deren Auswirkungen zu testen. Die Anwendungsbereiche durch steigende Dezentralisierung der Energieversorgung wachsen stetig. Mit unserem HGE14 können Sie bereits in Ihrer Automatisierung testen und emulieren

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Fachforum Halle 6, Stand 345Industry Forum hall 6, booth 345



10:00 - 10:15 WEKA Fachmedien Andrea GillhuberEngelbert Hopf Ralf Higgelke

Presentation of the electronic-study „DIN-rail power supplies“

10:15 - 11:00 WEKA Fachmedien - Bernhard Erdl, Puls- Hermann Püthe, inpotron Schaltnetzteile- Daniel Scharfen, Infineon

Panel discussion: „Power electronics and its applications”

moderated by Andrea Gillhuber, Engelbert Hopf, Ralf Higgelke

11:00 - 12:00 ECPE European Center for Power Electronics e.V. Germany

Thomas Harder The ECPE Network and its joint research programme

12:00 - 13:00 Energie Campus Nürnberg Jens Hauch Innovative technologies for a renewable energy supply

14:00 - 15:00 Infineon Technologies Germany

Thomas SchützeWilhelm Rusche

Innovation of power semiconductor development

15:15 - 16:15 KIT - Karlsruher Institut für Technologie

Karsten HähreFabian Denk

SiC power transistors at 2 MHzReliability evaluation of SiC switches

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10:00 - 11:00 Yole Développement - Paul Kierstead, Cree- Eckart Geinitz, Robert Bosch Automotive Electronics- Pierric Gueguen, Yole Développement

How are hybrids and electronics going to reshape the overall power electronics industry?

11:00 - 12:00 Bodo's Power Systems, A Media Germany

- Jim Witham, GaN Systems- Jeffrey Casady, Cree- Carl Blake, Transphorm- Alex Lidow, EPC- Rinbar Singh, Gen Sic- Kazuhide Ino, Rohm- Anup Balah, USCi- Peter Friedrich, Infineon- Steffen Metzger, Infineon- Gourab Majumdar, Mitsubishi Electric- Eckhard Thal, Mitsubishi Electric- Tetsuzo Ueda, Panasonic- Marianne Germain, EpiGaN- Phil Burnside, Raytheon

Panel discussion:“Reliable volume production of wide wand gap semiconductors“

moderated by Bodo Arlt

13:00 - 13:30 Infineon Technologies Germany

Thomas Geinzer Value creation developing new Infineon HybridPACK with micro pattern trench IGBT (750V EDT2) for automotive applications

14:00 - 15:00 Power Electronics Europe Germany

- Alex Lidow, EPC- Girvan Patterson, GaN Systems- Tim McDonald, Infineon/IR- Steffen Metzger, Infineon - Steve Tom, Texas Instruments - Umesh Mishra, Transphorm

Panel discussion:“Quo Vadis Power GaN”

moderated by Achim Scharf

15:00 - 16:00 Christian - Albrechts - Universität zu Kiel

Marco Liserre The smart transformer and its impact on the electric grid

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10:00 - 11:00 Analog DevicesPowerlink

Sari GermanosStefan Hacker

An open source approach to synchronizing mechatronic systems using real-time ethernet

11:00 - 12:00 Mentor Graphics Deutschland GmbH

Andreas Simon-Kajda Managing temperature differences between IGBT modules

12:00 - 13:00 Fairchild Semiconductor Kevin LeeYongtaek LeeJames Victory

4th generation Field Stop (FS) IGBT with high performance and enhanced latch up immunity

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Forenprogramm Forum programs 21/5/2015 · highly reliable semiconductor ... 10:00 Aavid Thermalloy...

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