Freescale Semiconductor Technical Data RF Power Field ...

MRF5S21045NR1 MRF5S21045NBR1

1RF Device DataFreescale Semiconductor

RF Power Field Effect TransistorsN--Channel Enhancement--Mode Lateral MOSFETsDesigned for W--CDMA base station applications with frequencies from 2110

to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applications.To be used in Class AB for PCN--PCS/cellular radio and WLL applications.

• Typical 2--Carrier W--CDMA Performance: VDD = 28 Volts, IDQ = 500 mA,Pout = 10 Watts Avg., f = 2112.5 MHz, Channel Bandwidth = 3.84 MHz,PAR = 8.5 dB @ 0.01% Probability on CCDF.Power Gain 14.5 dBDrain Efficiency 25.5%IM3 @ 10 MHz Offset --37 dBc in 3.84 MHz Channel BandwidthACPR @ 5 MHz Offset --39 dBc in 3.84 MHz Channel Bandwidth

• Capable of Handling 5:1 VSWR, @ 28 Vdc, 2140 MHz, 45 Watts CWOutput Power

Features• Characterized with Series Equivalent Large--Signal Impedance Parameters

• Internally Matched for Ease of Use• Qualified Up to a Maximum of 32 VDD Operation• Integrated ESD Protection• 200°C Capable Plastic Package• N Suffix Indicates Lead--Free Terminations. RoHS Compliant.• In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel.

Table 1. Maximum Ratings

Rating Symbol Value Unit

Drain--Source Voltage VDSS --0.5, +68 Vdc

Gate--Source Voltage VGS --0.5, +15 Vdc

Total Device Dissipation @ TC = 25°CDerate above 25°C

PD 1300.74

WW/°C

Storage Temperature Range Tstg -- 65 to +150 °C

Operating Junction Temperature TJ 200 °C

Table 2. Thermal Characteristics

Characteristic Symbol Value (1,2) Unit

Thermal Resistance, Junction to CaseCase Temperature 80°C, 45 W CWCase Temperature 79°C, 10 W CW

RθJC1.351.48

°C/W

1. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTFcalculators by product.

2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.Select Documentation/Application Notes -- AN1955.

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Document Number: MRF5S21045NRev. 4.1, 12/2009

Freescale SemiconductorTechnical Data

MRF5S21045NR1MRF5S21045NBR1

2110--2170 MHz, 10 W AVG., 28 V2 x W--CDMA

LATERAL N--CHANNELRF POWER MOSFETs

CASE 1484--04, STYLE 1TO--272 WB--4PLASTIC

MRF5S21045NBR1

CASE 1486--03, STYLE 1TO--270 WB--4PLASTIC

MRF5S21045NR1

© Freescale Semiconductor, Inc., 2008--2009. All rights reserved.

https://www.application-datasheet.com/






2RF Device Data

Freescale Semiconductor


Table 3. ESD Protection Characteristics

Test Methodology Class

Human Body Model (per JESD22--A114) 1C (Minimum)

Machine Model (per EIA/JESD22--A115) A (Minimum)

Charge Device Model (per JESD22--C101) IV (Minimum)

Table 4. Moisture Sensitivity Level

Test Methodology Rating Package Peak Temperature Unit

Per JESD 22--A113, IPC/JEDEC J--STD--020 3 260 °C

Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

Off Characteristics

Zero Gate Voltage Drain Leakage Current(VDS = 68 Vdc, VGS = 0 Vdc)

IDSS 10 μAdc

Zero Gate Voltage Drain Leakage Current(VDS = 28 Vdc, VGS = 0 Vdc)

IDSS 1 μAdc

Gate--Source Leakage Current(VGS = 5 Vdc, VDS = 0 Vdc)

IGSS 1 μAdc

On Characteristics

Gate Threshold Voltage(VDS = 10 Vdc, ID = 120 μAdc)

VGS(th) 2 3.5 Vdc

Gate Quiescent Voltage(VDS = 28 Vdc, ID = 500 mAdc)

VGS(Q) 2 3.8 5 Vdc

Drain--Source On--Voltage(VGS = 10 Vdc, ID = 1.2 Adc)

VDS(on) 0.2 0.35 Vdc

Forward Transconductance(VDS = 10 Vdc, ID = 1.2 Adc)

gfs 3.2 S

Dynamic Characteristics (1)

Reverse Transfer Capacitance(VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)

Crss 0.9 pF

Functional Tests (In Freescale Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ = 500 mA, Pout = 10 W Avg., f1 = 2112.5 MHz, f2 =2122.5 MHz, 2--carrier W--CDMA, 3.84 MHz Channel Bandwidth Carriers. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5 MHzOffset. IM3 measured in 3.84 MHz Bandwidth @ ±10 MHz Offset. PAR = 8.5 dB @ 0.01% Probability on CCDF.

Power Gain Gps 13.5 14.5 16.5 dB

Drain Efficiency ηD 24 25.5 %

Intermodulation Distortion IM3 --37 --35 dBc

Adjacent Channel Power Ratio ACPR --39 --37 dBc

Input Return Loss IRL --12 --9 dB

1. Part is internally matched both on input and output.

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Figure 1. MRF5S21045NR1(NBR1) Test Circuit Schematic

Z7 0.500″ x 1.000″ MicrostripZ8, Z13 0.270″ x 0.080″ MicrostripZ10 0.789″ x 0.080″ MicrostripZ11 0.527″ x 0.080″ MicrostripZ12 0.179″ x 0.080″ MicrostripPCB Taconic TLX8--0300, 0.030″, εr = 2.55

Z1, Z9 0.250″ x 0.080″ MicrostripZ2 0.987″ x 0.080″ MicrostripZ3 0.157″ x 0.080″ MicrostripZ4 0.375″ x 0.080″ MicrostripZ5 0.480″ x 1.000″ MicrostripZ6 0.510″ x 0.080″ Microstrip

C2C1R2

VBIASVSUPPLY

C6C5C4

C8 C9 C10

C3

C13

C7

RFOUTPUT

RFINPUT

R1

Z1 Z2 Z3 Z4 Z5

Z6

Z13

Z8

Z7 Z12 Z11 Z9

+

DUT

R3

C11

Z10

C12

C15C14

Table 6. MRF5S21045NR1(NBR1) Test Circuit Component Designations and ValuesPart Description Part Number Manufacturer

C1 220 nF Chip Capacitor (1812) 1812Y224KAT AVX

C2, C3, C7, C12, C13 6.8 pF 100B Chip Capacitors ATC100B6R8CT500XT ATC

C4, C5, C14, C15 6.8 μF Chip Capacitors (1812) C4532X5R1H685MT TDK

C6 220 μF, 63 V Electrolytic Capacitor, Radial 2222--136--68221 Vishay

C8, C10 1 pF 100B Chip Capacitors ATC100B1R0BT500XT ATC

C9 1.5 pF 100B Chip Capacitor ATC100B1R5BT500XT ATC

C11 0.5 pF 100B Chip Capacitor ATC100B0R5BT500XT ATC

R1, R2 10 kΩ, 1/4 W Chip Resistors CRCW12061002FKEA Vishay

R3 10 Ω, 1/4 W Chip Resistor CRCW120610R0FKEA Vishay

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4RF Device Data



Figure 2. MRF5S21045NR1(NBR1) Test Circuit Component Layout

CUTOUTAREA

MRF5S21045NRev. 0

R1

R2

C1 C2 C4 C5

C3

R3C8C7

C9

C6

C12C11C10

C13

C14 C15

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TYPICAL CHARACTERISTICS

Gps,POWER

GAIN(dB)

Gps,POWER

GAIN(dB)

IRL,INPUTRETURNLOSS

(dB)

IM3(dBc),ACPR

(dBc)

--20

--8

--11

--14

--17

IRL,INPUTRETURNLOSS

(dB)

IM3(dBc),ACPR

(dBc)

--22

--10

--13

--16

--19

22202060

IRL

Gps

ACPR

IM3

f, FREQUENCY (MHz)

Figure 3. 2--Carrier W--CDMA Broadband Performance @ Pout = 10 Watts

2200218021602140212021002080

13.4

15.2

15

--44

32

28

24

20

16

--32

--36

--40

f, FREQUENCY (MHz)

Figure 4. 2--Carrier W--CDMA Broadband Performance @ Pout = 20 Watts

Figure 5. Two--Tone Power Gain versusOutput Power

Figure 6. Third Order Intermodulation Distortionversus Output Power

10011

17

1

IDQ = 800 mA

650 mA

Pout, OUTPUT POWER (WATTS) PEP

VDD = 28 Vdcf1 = 2135 MHz, f2 = 2145 MHzTwo--Tone Measurements

15

13

12

10

--40

--10

1

Pout, OUTPUT POWER (WATTS) PEP

10

--20

--30

100

--60

--50

ηD,DRAIN

EFFICIENCY(%)

ηD

ηD,DRAIN

EFFICIENCY(%)

Gps,POWER

GAIN(dB)

INTERMODULATIONDISTORTION(dBc)

IMD,THIRDORDER

14.8

14.6

14.4

14.2

14

13.8

13.6

--28

VDD = 28 Vdc, Pout = 10 W (Avg.), IDQ = 500 mA2--Carrier W--CDMA, 10 MHz Carrier Spacing,3.84 MHz Channel BandwidthPAR = 8.5 dB @ 0.01%Probability (CCDF)

22202060 220021802160214021202100208013

14.8

--34

46

42

38

34

30

--22

--26

--30

14.4

14.2

14

13.8

13.6

13.4

13.2

--18

14.6

IRL

Gps

ACPR

IM3

ηD

VDD = 28 Vdc, Pout = 20 W (Avg.), IDQ = 500 mA2--Carrier W--CDMA, 10 MHz Carrier Spacing,3.84 MHz Channel Bandwidth, PAR = 8.5 dB@ 0.01% Probability (CCDF)

16

14

500 mA

350 mA

200 mA

IDQ = 200 mA

650 mA

800 mA

500 mA350 mA

VDD = 28 Vdcf1 = 2135 MHz, f2 = 2145 MHzTwo--Tone Measurements

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6RF Device Data




Figure 7. Intermodulation Distortion Productsversus Tone Spacing

10--60

--25

0.1

7th Order

TWO--TONE SPACING (MHz)

VDD = 28 Vdc, Pout = 45 W (PEP), IDQ = 500 mATwo--Tone Measurements(f1 + f2)/2 = Center Frequency of 2140 MHz

5th Order

3rd Order--30

--35

--40

--45

--50

--55

1 100

IMD,INTERMODULATIONDISTORTION(dBc)

Figure 8. Pulse CW Output Power versusInput Power

40

54

P3dB = 48.17 dBm (65.6 W)

Pin, INPUT POWER (dBm)

VDD = 28 Vdc, IDQ = 500 mAPulsed CW, 8 μsec(on), 1 msec(off)f = 2140 MHz

52

46

4230 3432 36

Actual

Ideal

P1dB = 47.60 dBm (57.5 W)50

44

48

3828

P out,OUTPUTPOWER

(dBm

)

IM3(dBc),ACPR

(dBc)

Figure 9. 2--Carrier W--CDMA ACPR, IM3,Power Gain and Drain Efficiency

versus Output Power

0

Pout, OUTPUT POWER (WATTS) AVG.

40

--10

--20

30

--30

--40

10

--50

1 10 100

20

VDD = 28 Vdc, IDQ = 500 mAf1 = 2135 MHz, f2 = 2145 MHz2 x W--CDMA, 10 MHz@ 3.84 MHz BandwidthPAR = 8.5 dB @ 0.01%Probability (CCDF)

ηD,DRAINEFFICIENCY(%),Gps,POWER

GAIN(dB)

10011

17

0.10

60

Pout, OUTPUT POWER (WATTS) CW

Figure 10. Power Gain and Drain Efficiencyversus CW Output Power

VDD = 28 VdcIDQ = 500 mAf = 2140 MHz

101

16

15

14

13

12

50

40

30

20

10

ηD,DRAINEFFICIENCY(%)

Gps,POWER

GAIN(dB)

Figure 11. Power Gain versus Output PowerPout, OUTPUT POWER (WATTS) CW

Gps,POWER

GAIN(dB)

VDD = 12 V

16 V

806

16

0 5020

10

8

30 40

12

14

IDQ = 500 mAf = 2140 MHz

TC = --30_C

25_C

IM3ηD

--30_C 85_C

85_C25_C--30_C

85_C

ACPR25_C--30_C

25_C

Gps

85_C

TC = --30_C

--30_C

25_C85_C

25_C

706010

20 V

24 V

28 V

32 V

85_C

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210

109

90

TJ, JUNCTION TEMPERATURE (°C)

Figure 12. MTTF Factor versus Junction Temperature

This above graph displays calculated MTTF in hours x ampere2

drain current. Life tests at elevated temperatures have correlated tobetter than ±10% of the theoretical prediction for metal failure. DivideMTTF factor by ID2 for MTTF in a particular application.

108

107

106

110 130 160 180 200

MTTFFACTOR(HOURSxAM

PS2 )

100 120 140 150 170 190

W--CDMA TEST SIGNAL

100.0001

100

0

PEAK--TO--AVERAGE (dB)

Figure 13. CCDF W--CDMA 3GPP, Test Model 1,64 DPCH, 67% Clipping, Single--Carrier Test Signal

10

1

0.1

0.01

0.001

2 4 6 8

Figure 14. 2-Carrier W-CDMA Spectrum

f, FREQUENCY (MHz)

3.84 MHzChannel BW

--IM3 in3.84 MHz BW

+IM3 in3.84 MHz BW

--ACPR in3.84 MHz BW

+ACPR in3.84 MHz BW

PROBABILITY

(%)

(dB)

+20

+30

0

--10

--40

--50

--60

--70

--80

--20

205 15100--5--10--15--20--25 25

--30W--CDMA. ACPR Measured in 3.84 MHz ChannelBandwidth @±5 MHz Offset. IM3 Measured in3.84 MHz Bandwidth @±10 MHz Offset. PAR =8.5 dB @ 0.01% Probability on CCDF

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8RF Device Data



Figure 15. Series Equivalent Source and Load Impedance

fMHz

ZsourceΩ

ZloadΩ

2000

2110

2140

4.78 -- j5.19

3.81 -- j3.69

4.04 -- j4.14

8.15 -- j5.91

7.07 -- j7.32

6.28 -- j7.71

VDD = 28 Vdc, IDQ = 500 mA, Pout = 10 W Avg.

Zo = 10Ω

Zload

f = 2000 MHz

f = 2200 MHz

Zsource

2170

2200 3.57 -- j3.11

3.69 -- j3.395.61 -- j7.85

4.92 -- j7.85

Zsource = Test circuit impedance as measured fromgate to ground.

Zload = Test circuit impedance as measuredfrom drain to ground.

Zsource Z load

InputMatchingNetwork

DeviceUnderTest

OutputMatchingNetwork

f = 2000 MHz

f = 2200 MHz

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PACKAGE DIMENSIONS



10RF Device Data









12RF Device Data









14RF Device Data







PRODUCT DOCUMENTATION

Refer to the following documents to aid your design process.

Application Notes• AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages

Engineering Bulletins• EB212: Using Data Sheet Impedances for RF LDMOS Devices

REVISION HISTORY

The following table summarizes revisions to this document.

Revision Date Description

4 Oct. 2008 • Modified data sheet to reflect RF Test Reduction described in Product and Process Change Notificationnumber, PCN12779, p. 1, 2

• Updated Part Numbers in Table 6, Component Designations and Values, to latest RoHS compliant partnumbers, p. 3

• Replaced Case Outline 1486--03, Issue C, with 1486--03, Issue D, p. 9--11. Added pin numbers 1 through 4on Sheet 1.

• Replaced Case Outline 1484--04, Issue D, with 1484--04, Issue E, p. 12--14. Added pin numbers 1 through4 on Sheet 1, replacing Gate and Drain notations with Pin 1 and Pin 2 designations.

• Added Product Documentation and Revision History, p. 15

4.1 Dec. 2009 • Corrected data sheet to reflect RF Test Reduction frequency described in Product and Process ChangeNotification number, PCN12779, p. 2

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16RF Device Data



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