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From Technologies to Market LED Lighting Module Technology, Industry and Market Trends Sample Market & Technology Report
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From Technologies to Market

LED Lighting Module Technology, Industry and Market Trends

Sample

Market & Technology Report

2

o Authors of the Report P6

o Objectives of the Report P7

o Acronym P8

o Executive Summary P9

o Definitions and Uses of LED Modules P33

• Definitions

• LED Module in the Global LED Value Chain

• Luminaire Design Approach with a LED Module

• Benefits of LED Module for Integrator

• Overview

• Focus on Time and Cost Savings

o International Standards for LED Modules P41

• Introduction

• Overview of Main Standards

• International vs. Local Standards - Deviations & Trends

o LED Module Integration into Lighting Systems (1/2) P45

• System Integration

• Engineering

• Thermal Integration

• Electrical Insulation Rules

• Overview

• Details on Driver Classes

• Zhaga

• Guideline for Interchangeability of Light Sources

• Consortium Members

• The Dilemma

o LED Module Integration into Lighting Systems (2/2) P45

• The Different Types of LED Modules

• Taxonomy

• Middle Power vs. High Power vs. COB vs. AC vs. Custom

• Positioning

• Geometry and Size

• Electrical Interfaces

• LED Module vs. LEDi Module

• The Case of Flexible LED Strips

o Analysis of Main Functions in LED Modules (1/2) P62

• Introduction

• System Structure

• Parameter Interdependence

• Thermal Management

• Why Thermal Management is Required for LED Systems?

• Substrates/PCB

• Heatsink and Thermal Interface Materials

• Analysis of Different Thermal Interface Materials

• Heatsink technologies

• Heatsink Design vs. LED Module Technology

• Major Trends in Thermal Management

• Importance of Thermal Management for LED Module Reliability

• Optical Design

• A Large Panel of Optical Solutions

• Optical Generic Architecture in Lighting

• Collimators, Lenses and Refractors - Materials & Process

• Focus on Reflectors

• Focus on Diffusers

• Mixing Chamber

• Optical Architecture vs. LED Module Technology

• Overview

• Analysis per Application

TABLE OF CONTENT OF THE REPORT (1/4)

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

3

o Analysis of Main Functions in LED Modules (2/2) P62

• Power Supply and Drivers

• Overview of Drivers

• The Different Driver Topologies

• Driver Topology vs. LED Module Technology

• AC Drivers

• Low Voltage DC Minigrids

• Driver Reliability

• Trends

o Analysis of Middle Power LED Modules P94

• Drivers for Integration

• Why Middle Power LEDs for LED Modules?

• Overview of Standard Design

• Type of LEDs

• Performance Aspects

• Substrate/PCB

• Thermal Management and Reliability

• Power and Voltage

• Drivers

• Optics

• Focus on AC Middle Power LED Module

• Introduction

• Impact on Design

• Efficacy

• Cost Aspects

• Performance Standards for Luminaire

o Analysis of High Power LED Modules (1/2) P112

• Introduction

• High Power LEDs vs. Middle Power LEDs

• High Power LED Modules vs. Middle Power LED Modules

o Analysis of High Power LED Modules (2/2) P112

• The Different Type of High Power LED Modules

• High Brightness and Large (HBL) Module

• Overview

• Substrate/PCB

• Drivers and Electrical Connections

• Thermal Management

• Optics

• High Quality of Light (HQL) Module

• Overview

• Beating CDM Lamp Evolution

• Multichannel Technology

• Phosphor Technology

• High Brightness and Compact (HBC) Module

o Analysis of COB LED Modules (1/2) P126

• Introduction

• COB Technology - A Compromise Solution

• Main COB Design Choices

• Substrate/PCB

• Chip Layout

• Trends

• High Lumen Density in COB

• Positioning of High Density COB

• Market Segmentation and Uses

• New COB Devices

• COB Evolution and Roadmap

• Ecosystem

• Interconnection

• Options for COB

• Comparison of Technology

TABLE OF CONTENT OF THE REPORT (2/4)

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

4

o Analysis of COB LED Modules (2/2) P126

• Holder Reliability

• Diversity and Compatibility

• Standardization

• Zhaga Influence

• Optics

• Overview

• Integration

• Management of System Performance

• Drivers

• Thermal Behavior

• Performance Standards for Luminaires

o Analysis of Flexible LED Strips P152

• Flexible LED Strips at a Glance

• Flexible LED Strips vs. Rigid LED Strips

• Status of the Industry

• Differentiation Factors

• Overview

• Focus on “Large Variety of Flexible LED Strip Types”

• Focus on “Quality Criteria”

• Focus on “Specific Products and Innovative Solutions”

• Focus on “Price”

• Voltage

• Connectors

• Dust/Water Protection

• Adhesive

o LED Lighting Module Industry and Market Trends (1/2) P167

• Introduction - Packaged LED Industry and Market Trends

• Introduction to LEDs

• History of LED Industry

• Overview

• Recent Trends

• Market Trends

• LED Adoption Rate (Comparison 2014 vs. 2020)

• Focus on Display Applications

• Focus on General Lighting Applications

• LED Industry in 2015 - Main Challenges

• LED Lighting Module Market Trends

• Application vs. Module Technology

• Market Volume and Revenue

• Introduction

• Total Market (Excluding Flexible LED Strips)

• Split by Module Technology (Excluding Flexible LED Strips)

• The Case of Flexible LED Strips

• Market Volume and Revenue

• Trends in ASP

• Conclusion

• LED Lighting Module Industry Trends

• History of the LED Lighting Module Industry

• The SSL Chasm

• Main LED Module Suppliers (Excluding COB and Flexible LED Strips)

• Main COB LED Suppliers

• Main Flexible LED Strip Suppliers

• Non-COB LED Module Supplier vs. COB LED Module Supplier

• Origin of Players

• Overview

• Positioning of some LED Module Suppliers

• Example of Vossloh Schwabe

TABLE OF CONTENT OF THE REPORT (3/4)

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

5

o LED Lighting Module Industry and Market Trends (2/2) P167

• LED Lighting Module Industry Trends

• Focus on Packaged LED Manufacturers

• Focus on Driver Manufacturers

• Focus on Optic, Luminaire and Connector Manufacturers

o Conclusion P203

o Appendix - International Standards for LED Modules P209

o Appendix - Presentation of Yole Développement P216

o Appendix - Presentation of PISEO P231

TABLE OF CONTENT OF THE REPORT (4/4)

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

6

TO PROVIDE A COMPREHENSIVE OVERVIEW OF ALL ASPECTS OF LED LIGHTING MODULES!

- Technologies. - Markets and applications.

- Main functions. - Integration into lighting systems (…).

TO ANALYZE POSITIONING OF EACH LED LIGHTING MODULE TYPE!

- Middle power LED module. - High power LED module.

- COB LED module. - Flexible LED strips.

TO ANALYZE MAIN TECHNOLOGY IN USE FOR EACH LED LIGHTING MODULE TYPE!

- Thermal management (PCB/substrate,TIM, heatsink). - Optical design.

- Power supply and driver.

TO ANALYZE LED LIGHTING MODULE INDUSTRY STRUCTURE AND FUTURE TRENDS!

TO PROVIDE VOLUME AND MARKET SIZE FOR LED LIGHTING MODULE!

OBJECTIVES OF THE REPORT

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

7

• From LED chip to LED lighting system, several steps of value drive the lighting industry. LED modules represent a bridgebetween the packaged LED offer and the luminaire shaped product.

• A significantly integrated LED package reduces the level of know-how necessary for lighting manufacturers, thereby enablingconventional lighting system manufacturers to have easier access to the technology.

• Basically, we can consider an LED module as a unit containing one or more LEDs with mechanical and optical components.

• It may contain additional components (e.g., connectors, resistors, ESD protection devices, lenses…).

• Generally, LED module is considered a replaceable item for use in a luminaire.

• An LED module represents a component/sub-system optimized for a given application scope.

LED Module in the Global LED Value Chain

DEFINITIONS AND USES OF LED MODULES

LED MODULES

LED

Die/Chip

Packaged

LED

Light/LED

ModuleLight Source(Module + Driver)

Luminaire

Light

System/

Solution

Philips

Lighting

Lumileds

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

8

Modular approach enable an easier integration of LED modules.

System Integration

LED MODULE INTEGRATION INTO LIGHTING SYSTEMS

• System integration is based on standardized interfaces and building blocks: LED module, driver, optic, electronic (…).

• The design effort of the integrator is mainly focused on:

• The interfaces between these building blocks.

• The system performance qualification.

PCB /

Connector

Packaged

LED

Optic

Thermal

System

Driver

Mechanical

Assembly

• Please note that lower efforts can be done on theLED module qualification which is under theresponsibility of the LED module manufacturer /supplier.

• Modular architecture can be developed to easierupgrade of the building blocks (→ allowing forshort and efficient product development /evolution).

• With this strategy, companies benefit from:

• Improvement of LED performance (lm/W).

• LED cost decrease ($/lm).

• Work also for other components, such asdriver (…).

• Technology leverage → Same LED module fordifferent applications.

• Thermal redesign.

• Optics redesign (and improvements).©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

9

• The Zhaga Consortium is an organization enabling theinterchangeability of LED light sources made by differentmanufacturers.

• Zhaga establishes interface specifications for different form factors.For each form factor, Zhaga’s specifications enable interchange ofcomponents from different suppliers.

• Zhaga define following interfaces:

• Mechanical interface.

• Photometric interface.

• Thermal interface.

• Electrical interface.

Zhaga - Guideline for Interchangeability of Light Sources (1/2)

LED MODULE INTEGRATION INTO LIGHTING SYSTEMS

Example of compatible spot modules from Zhaga book 3

Source: Zhaga

Overview of Zhaga books

Source: Zhaga

* Books in

development as

of October

2015

10

System Structure (1/2)

MAIN FUNCTIONS IN LED MODULES

Power Supply & Driver

To realize AC to DC

conversion

Optical Design

To shape the light emitted

from LED

Thermal Management

To dissipate heat produced

by LEDs

• Substrate / PCB

• Thermal Interface Management / Material

• Heatsink

• External Driver

• Integrated Driver

• Collimator

• Reflector

• Lens Plates

• Diffusers

Function Associated Components / MaterialsLED Lighting Module

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

11

• Although the heatsink contributes tothe design of the luminaire, it remains apart dedicated to cooling the wholesystem. Shape, size, weight are directlythe consequence of the total embeddedthermal power and the thermal powerdensity.

• Middle Power modules have lowcooling needs due to their largesurfaces and low embedded power.Some lighting products like T5 tubesdon’t need a heatsink.

• COB modules concentrate the lightoutput on a small area, requiring gooddesign of the thermal cooling systemfor performance and reliabilitymanagement.

• High Power modules in general requirelarge and efficient heatsinks. Activecooling is an option to reduce the sizewhile getting the required thermalperformance.

Heatsink Design vs. LED Module Technology

THERMAL MANAGEMENT IN LED MODULES

High heatsink performance

Active cooling

Moderate heatsink performance

Passive cooling

No heatsink needed or

low heatsink performance

Maximum heatsink required performance

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

12

• In practice, creativity of solutions covers almost all configurations.

Optical Architecture vs. LED Module Technology - Analysis per Application

OPTICAL DESIGN FOR LED MODULES

Middle Power LED Module High Power LED Module COB Module

High Bay Can be used but not mainstream • Lens plate or collimators • Technology XX

Low Bay• Technology XX

• Technology XXCan be used but not mainstream • Technology XX

Spot Lighting • Lens plates and collimators • Technology XX • Technology XX

Troffer• Technology XX

• DiffusersCan be used but not mainstream Can be used but not mainstream

Downlight• Technology XX

• Technology XXCan be used but not mainstream • Technology XX

Linear

• Lens plates or collimators

• Technology XX

• Technology XX

Can be used but not mainstream Can be used but not mainstream

Outdoor Can be used but not mainstream • Technology XX • Reflectors

Task • Technology XX • Diffusers Can be used but not mainstream

Wall Pack• Technology XX

• Reflectors

• Technology XX

• Technology XXCan be used but not mainstream

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

13

Middle Power LED Module:

• The middle power LED is a solution offeringlow power consumption and high flux.

High Power LED Module:

• The high power LED is a solution offeringsmall lighting emitting surface and high flux.

COB LED Module:

• The COB module architecture is a solutionoffering good compromise between size ofthe light emitting surface, flux power andpower consumption.

The choice of the right LED module solution depends on requirements at

application level, cost level (…).

The Different Types of LED Modules - Positioning

LED MODULE INTEGRATION INTO LIGHTING SYSTEMS

High flux

Low consumption Small light

emitting surface

LOW POWER

LED / MODULE

COB

MODULE

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

14

• Photometric performances are similar between modules.

• Differences can be observed on the diversity (flux, CRI…), the choice of the LEDs, the pattern, the connections (…).

• The table below highlight key characteristics of middle power LED modules and associated general trends:

Performance Aspects

MIDDLE POWER LED MODULE

Characteristics General trend

Efficacy (lm/W)• In relation with LED performances.

• Efficacy stays in a range of XXlm/W to XXlm/W.

Flux Range (lm)• Driven by the application.

• Flux range is in average between XX lm to XX lm.

CCT (K) • 3000K, 3500K, 4000K or 5000K.

CRI• Mostly CRI 80.

• CRI 90 in specific cases.

Color Consistency

(SDCM)

• X SDCM at initial time.

• Can increase up to X–X SDCM after aging.

Lifetime (hours) • Not systematically specified.

Analysis “flux vs. efficacy” of different middle power LED modules

Source: Piseo

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

15

MCPCB is the solution of choice for middle power LEDs

Substrate/PCB

MIDDLE POWER LED MODULE

• MCPCB offers valuable thermal and mechanical properties compared to glass epoxy PCBs.

• Various thicknesses of substrates are available. Most common thicknesses are 1.1mm and 1.6mm.

• Dielectric thickness varies between 70µm to 200µm. This parameter has an influence on the thermal performances andthe breakdown voltage.

• Usual copper thickness is 35µm (1oz).

• The amount of power to dissipate requires a good enough thermal

dissipation/management through the PCB.

Technology

Thermal

Conductivity1

(W/m.K)

Voltage

Breakdown

(kV)

Cost

($/m²)Pros Cons

Standard

Glass Epoxy

0.25-0.65

(Rth: XX K/W)

XX–XXLow

(< $XX)

• Low cost.

• Multiple suppliers.• XX.

FR4 +

Thermal Vias

In between

Depend on

number of vias

Non Available Medium• XX.

• Multiple suppliers.• XX.

MCPCB

1-XX typically

Rth: XX K/W

XX–XXHigh

($XX–$XX)

• Better performance than

standard glass epoxy PCB.

• Cheaper than ceramic PCB.

• XX.

• XX.

MCPCB

architecture

Source: The

Bergquist Company

(now part of

Henkel)

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

16

• Strategy of middle powerLED module manufacturersis driven by cost aspect andbased on mass productionof middle power LEDs (i.e.,economy of scale), resultingin a standard offer withlimited diversity and fluxrange.

• High power modulesaddress applications havingdifferent needs (orcombinations of needs):

• Need XX.

• Need XX.

• Need XX.

• The market is characterizedby less volumes, but highervalue and selling price.

Introduction - High Power LED Modules vs. Middle Power LED Modules

HIGH POWER LED MODULES

Type of

ApplicationKey Requirements LED Module Used High Power Module Type

Application XX

• High flux

• XX

• XX

• XX

• XX

• XX

• XX

Spot Lighting

• XX

• XX

• Artistic touch

• XX

• XX

• XX

• XX

• XX

Troffer &

Linear Lighting

• High efficacy

For 300lux• Middle Power NA

Application XX • XX• Middle Power

• COBNA

Application XX

• XX

• XX

• Optical control

• XX• XX

• XX

Task Lighting• High brightness

• XX• High Power NA

Wall Lighting • Architectural light control • XX NA

17

High power LED modules integrate both primary and secondary optics (and can also integrate tertiary optics).

HBL Module - Optics

HIGH POWER LED MODULES

• High power LEDs already integrate a Silicone dome shape (encapsulant/primaryoptic) which is used to extract the light of the (individual) LEDs and increasethe light efficacy.

• In general, a secondary optic is added on the module. This optic consists of aplate supporting a lens array with each lens being located in front of an LED andproviding an individual light beam.

• Key features for a lens plate:

• Feature XX.

• Feature XX.

• Feature XX.

• Lens design, shape and material choices are managed by optical manufacturers,but the lens plate geometry is generally made under the supervision of the LEDmodule manufacturer.

• LED module manufacturers’ offer also integrates modules combining the LEDboard with the optical plate.

• Zhaga participates in the standardization of interfaces between LED modulesand optics.

Lens plate for LED array

Integrate module white optic

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

18

• Chips are spread into series and parallel chains. The rulesare similar to mid-power modules (minimum of 3 pcs for astring).

• There is a wide variety of LED quantity and arrangement.The smallest COB has 12 chips, the biggest can have 650chips or more.

• There is no real limitation in terms of number of chips.However, the chip to chip placement lowers the re-absorption of light, leading to a flux penalty.

Main COB Design Choices - Chip Layout

COB LED MODULE

CLU-56 (Citizen) CXA1304 (CREE)

Chip number 648 12

Targeted flux 20,000 lm 400 lm

LES diameter 32.8 mm 6 mm

Power 170 W 0.4 W

COB size 38 x 38 x 1.4mm 13.35 x 13.35 x 1.7mm

Analysis of COB products

available on the market (data from

CREE, LG Innotek and Lumileds)

Source: Piseo©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

19

• Offering specific products might be a strong differentiation factor however products have to respond to a customer demandand might represent only niche markets.

Differentiation Factors - Focus on “Specific Products and Innovative Solutions” (1/3)

FLEXIBLE LED STRIPS

Parameter Typical Value (s) Differentiating Value(s)Example of Product /

Manufacturer

Light Output • 100–900 lm/m (depends on color)• XX lm/m for white light

• XX lm/W for white light• XX

XX • XX • XX • XX

XX NA • XX• XX

• XX

LED Density• XX / XX / 60 / XX / 120 / XX (unit

per meter)NA • Most manufacturers

Voltage • 12 VDC or 24 VDC • XX V DC • Most Chinese manufacturers

White Color Type• 2—3 types of white (cold white, warm

white, natural white)NA • Most manufacturers

XX • Blue, Red, Green, Yellow (…) • XX NA

White Color Choice NA • XX • XX

XX • XX • XX • XX

CRI • No specification or superior to 80 • > XX• XX

• XX

High Medium LowDIFFERENTIATION STRENGTH: ©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

20

Most of the LED module manufacturers are coming from the XX field.

Origin of Players - Overview (2/2)

LED LIGHTING MODULE INDUSTRY TRENDS

• As detailed previously, LED module manufacturers are coming fromdifferent horizons in terms of activities.

• However the majority of them is coming from the XX industry and theXX industry (see analysis on the right).

• Detailed explanations about drivers for such players to manufacture LEDmodules are given in the next slides.

• It is also important to understand that the LED module industry isstrongly disparate, with:

• Small companies and large companies.

• Companies having a unique offer and companies developing largeproduct portfolio.

• (…).

As a very young industry, the LED module industry is not reallystructured at the moment!

Analysis of origin of LED module manufacturers per

activity

The analysis is based on the identification of main players

involved in LED module manufacturing and sale (sample

of more than 40 LED lighting module manufacturers

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

21

Main LED Module Suppliers (Excluding COB and Flexible LED Strips)

LED LIGHTING MODULE INDUSTRY TRENDS

US:

Cree, Bridgelux, XX, XX,

XX, XX, XX, XX, XX,

Lumileds

England:

XX, XX, CarcloFinland:

XX, XXRussia:

XX

South Korea:

Seoul Semi., XX,

XX

Taiwan:

XX, Lextar

China:

XX

Italy:

TCI

Slovakia:

XX

Germany:

Osram, BJB,

XX, XX, XX,

XX

The Netherlands:

Philips

Austria:

Vossloh-Schwabe

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

22

In 2014, total LED lighting module market represented a size of ~$XXB. It should grow to a size of ~$XX by 2020.

LED LIGHTING MODULE MARKET TRENDS

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

© 2015

Yole Développement

FromTechnologies to Market

24

MEMS &

Sensors

LED/OLED

Compound

Semi.

Imaging Photonics

MedTech

Manufacturing

Advanced

PackagingPV

Power

Electronics

FIELDS OF EXPERTISE

Yole Développement’s 30 analysts operate in the following areas

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

25

4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research, marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

www.yole.fr

o Reports

• Market & Technology reports

• Patent Investigation and patent infringement risk analysis

• Teardowns & Reverse Costing Analysis

• Cost Simulation Tool

www.i-Micronews.com/reports

o Financial services

• M&A (buying and selling)

• Due diligence

• Fundraising

• Maturation of companies

• IP portfolio management & optimization

www.yolefinance.com

Blu Morpho

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Technology magazines

• Communication & webcast services

• Events

www.i-Micronews.com

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

26

A GROUP OF COMPANIES

Market,

technology and

strategy

consulting

www.yole.fr

M&A operations

Due diligences

www.yolefinance.com

Fundraising

Maturation of companies

IP portfolio management & optimization

TBA

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr

Blu Morpho

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

27

OUR GLOBAL ACTIVITY

Yole JapanYole Inc.

Yole

Korea

40% of our business is in

EU countries30% of our business is in

North America

30% of our business is in

Asia

Blu Morpho

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

28

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis, technology evaluation, and business plan along the entire supply chain

Integrators and

end-users

Device

makers

Suppliers: material,

equipment, OSAT,

foundries…

Financial investors,

R&D centers

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

29

REPORTS COLLECTION

• Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:

• MEMS & Sensors

• Imaging

• Medical technologies (MedTech)

• Advanced packaging

• Power electronics

• Compound semiconductors

• OLED, LED & Laser diode

• Semiconductor Manufacturing

• Photovoltaics

• Batteries

• Our reports are unmatched in quality and technology depth and typically include:• Technology trends and evolution: costs, barriers, roadmaps, etc.

• Supply & value chain analysis: business models, relationships, value flows, etc.

• In-depth analysis of applications and market drivers: challenges, inflection points, etc.

• Market data ($, units, wafer starts, etc.)

• Every year, Yole Développement, System Plus Consulting and KnowMade publish +60 reports.

• Take the full benefit from our Bundle and Annual Subscription offers.

www.i-Micronews.com

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

30

OUR 2015 PUBLISHED REPORTS LIST

o MEMS & SENSORS

− Sensors and Data Management for Autonomous Vehicles

− Sensors for Wearable Electronics And Mobile Healthcare

− Status of the MEMS Industry

− Uncooled Infrared Imaging Technology & Market Trends

− IR Detector and Small Size Imagers

− High End Gyro, Accelerometers and IMU

− Non Volatile Memory Markets and Technology Trends

o IMAGING & OPTOELECTRONICS

− Camera Module Packaging (Vol 1: Market & Technology Trends / Vol 2 Teardowns &

Reverse Engineering)

− Uncooled Infrared Imaging Technology & Market Trends

− Status of the CMOS Image Sensors

o MEDTECH

− Microfluidic for Sample Preparation

− Microfluidic Applications

− Sensors for Wearable Electronics And Mobile Healthcare

o COMPOUND SEMICONDUCTORS

− Sapphire Applications & Market 2015: from LED to Consumer Electronics

− Status of Wide Band Gap Material: GaN, SiC (and also AlN, Ga2O3, Diamond as a trend)

− GaN and SiC Devices for Power Electronics Applications

o LED

− LED Module Technologies

− UV LED - Technology, Manufacturing and Application Trends

− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays

− Sapphire Applications & Market 2015: from LED to Consumer Electronics

o POWER ELECTRONICS

− Power Packaging Technology Trends and Market Expectations

− Thermal Managment for LED and Power

− Power Electronics for Renewable Energy

− Energy Management for Smart Grid, Cities and Buildings: Opportunities for battery

electricity storage solutions

− Status of Chinese Power Electronics Industry

− New Technologies and Architectures for Efficient Data Center

− IGBT Market and Technology Trends

− Status of Power Electronics Industry

− Status of Wide Band Gap Material: GaN, SiC (and also AlN, Ga2O3, Diamond as a trend)

− GaN and SiC Devices for Power Electronics Applications

o ADVANCED PACKAGING

− Advanced Packaging in Emerging Markets in China*

− Status of the Advanced Packaging Industry

− Supply Chain Readiness for Panel Manufacturing in Packaging

− Fan-in Wafer Level Packaging: Market and Technology Trends

− Flip Chip Business Update

− 2.5D & 3DIC Business Update*

− Fan-Out and Embedded Die: Technologies & Market Trends

o MANUFACTURING

− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED

Applications

− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS

Image Sensors

− Non Volatile Memory Markets and Technology Trends

• Reports to be decided within 2015

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

31

CONTACT INFORMATION

o Consulting and Specific Analysis

• North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.

Email: [email protected]

• Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.

Email: [email protected]

• RoW: Jean-Christophe Eloy, President & CEO, Yole Développement

Email: [email protected]

o Report business

• North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.

Email: [email protected]

• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service

Email: [email protected]

• Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.

Email: [email protected]

• Korea: Hailey Yang, Business Development Manager, Korean Office

Email: [email protected]

o Financial services

• Jean-Christophe Eloy, CEO & President

Email: [email protected]

o General

• Email: [email protected]

Follow us on

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

© 2015

Appendix - Presentation of PISEO

©2015 | www.yole.fr | LED Lighting Module Technology, Industry and Market Trends

33

• Initiated in spring 2010 by CEA-LETI & Cluster Lumière members

• Selected as National Technological Platform and granted for public funding by the French Ministry of Industry on September 23rd, 2011

• Created as an independant private company on November, 30th 2011, € 1 169 827 capital, owned by 30 shareholders

• € 4 millions investment over 2012 – 2013 – 2014

• € 1,6 millions support from French State and local Authorities

• Located in Lyon, France

MISSION We help our clients to Create and Deploy Innovative and Performing Lighting Systems

National Lighting Innovation Platform and Testing Lab

HISTORIC & MISSION

34

Manufacturers

Materials

LED packages

LED Modules

Luminaires (LED & conv.)

Lamps (LED & conv.)

Displays

Other LED Systems (automotive, medical, …)

Specifiers & Users

Property developpers : buildings, shops, roads, …

Specifiers : architects, lighting designers,

engineering offices,…

Retailers

Installers, contractors

Tenants

OUR CLIENTS

35

OUR SERVICE OFFER

TESTINGPhotometrical

ElectriqalThermalReliability

Safety

TRAININGLED TechnologySystem design

ReliabilityRegulationsStandards

Applications

CONSULTINGR&D

ReliabibilitySafety

RegulationsStandards

Applications

36

Photometric & electrical characterizations

Luminous flux

Spectral analysis & colorimetry (colour point, CCT, CRI)

Light distribution

Consummed power

Luminous efficacy

Power factor

Harmonic distorsion

2D Luminance Mapping

Thermal measurments

Hot point with thermal camera

LED junction temperature in operating conditions

Thermal interface analysis

Tests on demand (half, full lab day)

TESTING

37

Performance & Reliability

Critical analysis of the design and manufacturing of electronics parts

Endurance and sturdiness tests

X-rays

Microscopy

Regulation and standards compliancy

CE Compliancy of lamps, modules and LED luminaires (244/2009/CE, 874/2012/CE, 1194/2012/CE)

Photobiological risk (EN 62471, IEC/TR 62778, EN 60598, EN 60031)

Emergency lighting (EN 60598-2-22)

Product Certification

ENEC+ testing

TESTING

38

R&D

CONSULTING

Financing Research & Innovation

- Opportunity study

- Idea generation

- Demonstrators

- Proof of concept

- Technology maturity

grids

Concept

Creation

- Functional

requirements

- Modelization &

dimensionning

- Optical design

- Product and system

designPrototyping

- Sourcing strategy

- Risk management

- Testing and

qualification

Function / Product

Development

• Marketing of

technology

• Strategic Roadmapping

• State of the art analysis

• Application research

• Market research

• Technology scouting

• IP scouting

• LED, modules &

electronics analysis

Prospective & Research

- Offer valorization

- Certification

- Labellization

Market introduction

39

Specific Programs

Benchmarking of LED packages, lamps and luminaires

Failure analysis

Reliability improvement

FMEA

Supplier assesment

Quality control

Support for regional homologation (CE, UL, …)

Lighting design & DIALUX simulations

CONSULTING

Ts (°C) =

Set

Anode

I (mA) =

SetTp Vf (V)

Flux

Lumineux

(lm)

Flux

Radiométrique

(W)

IRC CCT (K) x y

1,7 100 -7,2 24,19 210,1 0,78 97,5 2985,4 0,4392 0,4070

25 100 14,7 23,81 204,0 0,76 97,7 2958,7 0,4397 0,4046

35 100 30,6 23,59 199,5 0,74 97,8 2942,5 0,4399 0,4030

55 100 50,1 23,32 193,1 0,72 97,8 2925,5 0,4399 0,4010

65 100 61,4 23,25 189,8 0,71 97,7 2918,7 0,4398 0,4001

75 100 71,4 23,10 186,2 0,70 97,6 2912,4 0,4398 0,3991

85 100 79,5 22,99 182,0 0,69 97,4 2906,7 0,4396 0,3982

RESULTATS DES MESURES – 100 mA

40

Regulation & standards

Implementation of LED technology for SSL lighting

Reliability of LED lighting systems

Basics of photometry

Basics of optics

Understanding LED package datasheets

IP for LED Systems

Lighting simulation with DIALUX

« A la carte » programs

TRAINING

41

Unique concentration of photometrical, electrical & thermal imaging equipment

EQUIPMENT

Photo-Goniometer LMT GO DS

2000 type C equipped with CAS 140

spectrometer

Gonio-photometer MAJANTYS

for retrofit lamps

2 m Integrating sphere

INSTRUMENT SYSTEMS

equipped with CAS 120

spectrometer

Thermal camera INFRATEC 50 cm integrating sphere

MAJANTYS (or 5cm for LED

sources) equipped B&WTEK

spectrometer

Photobiological test bench

OST-300 EVERFINE

(200nm-3000nm)

Video-luminancemeter

LUMETRIX

Non exhaustive pictures

42

• High precision equipments calibrated in accredited labs

• Quality management system according to ISO 17025 – accreditation pending

• Photometrical and electrical tests according to international standards (EN 13032-1, EN 13032-4, LM-79)

• Regular Participation in inter-laboratory comparaison programs (eg: participation in IEA SSL inter-comparison program)

Quality as our foundation

QUALITY

43

• Highly specialized team with large experience in the lighting industry (technology, system design and integration, metrology, applications)

• Independant Testing Lab with cutting edge equipment

• Comprehensive offer (from Research to full System Qualification)

• Strong Partnerships :• LCIE BureauVERITAS, electrical test lab and certification body• SERMA Technologie, reliability of electronic systems test and consulting• YOLE Développement, strategic analysis of semi-conductor markets and consulting• Institut d’optique Graduate School, optical engineering graduate school

• Strong involvment in the development of the lighting sector• Participation in light sources and luminaires standardization committees of AFNOR, CENELEC and IEC• 3 professional lighting associations as shareholders (Cluster Lumière, GIL, Syndicat de l’éclairage)

KEY ELEMENTS


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