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Future Trends in Nanocarbon Materials Nanohiilet ja painettava elektroniikka Prof. Dr. Esko I. Kauppinen NanoMaterials Group Department of Applied Physics Aalto University School of Science [email protected] New Carbon Materials Research Initiative October 26, 2012 @TEKES, Helsinki, Finland
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Page 1: Future Trends in Nanocarbon Materials Nanohiilet ja ... · PDF fileFuture Trends in Nanocarbon Materials Nanohiilet ja painettava elektroniikka ... Allotropes of carbon ... based on

Future Trends in Nanocarbon Materials Nanohiilet ja painettava elektroniikka

Prof. Dr. Esko I. Kauppinen NanoMaterials Group

Department of Applied Physics

Aalto University School of Science

[email protected]

New Carbon Materials Research Initiative

October 26, 2012 @TEKES, Helsinki, Finland

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Allotropes of carbon

diamond graphite

C — C

fullerene

Nanobud (CNB) Graphene – NO band gap

carbon nanotube –

YES has band gap

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Nanocarbon FUTURE in Finland: develop PRINTING-based manufacturing & engineer novel flexible electronics applications of nanocarbon thin films

Proposal for Large Strategic Research Opening 2013-2020

Already developed for SWCNT

To be developed for graphene

Future technology to be developed

1atm,

continuous, fast

formation

Room temp. process

Onto any substrate

High

Performance

Touch Sensors,

Flexible ICs &

Other

Applications

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Finland

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Conference chairs

Prof. Esko I. Kauppinen (chair) Prof. Risto Nieminen (co-chair)

Prof. Pertti Hakonen (co-chair)

Co-organizer Prof. David Tomanek

National committee Albert G. Nasibulin (Aalto, chair), Hua Jiang (Aalto), Markus Ahlskog (U. Jyväskylä),

Arkady Krasheninnikov (U. Helsinki), Harri Lipsanen (Aalto), Kai Nordlund (U.

Helsinki), Yutaka Ohno (Aalto & Nagoya U. Japan), Mika Pettersson (U. Jyväskylä), Yuri Svirko (U. Eastern Finland)

Local organizing committee Toma Susi (chair), Marita Halme, Alexander Savin, Antti-Pekka Eskelinen

Supported by NT Steering Committee and International Advisory Board

NT 13 Organizers

• Metrology, biomedical

• Modeling

• Graphene

• Thin films

• Composites

Satellite Meetings June 29-30, 2012 In Tallin, Estonia (80 km from Helsinki)

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WORLD LEADING EXPERTS contacted • Prof. Morinobu Endo, Shinshu University/Showa Denko, Nagano, Japan

• Prof. Sumio Iijima, Meijo University, Nagoya U., AIST, NEC, Japan

• Prof. Daniel E. Resasco, Oklahoma University/SWeNT, Norman, OH, USA

• Dr. Tapani Ryhänen, Nokia Research Center, Cambridge, UK

• Dr. Jong Min Kim, Samsung Electronics Co, Korea

• Dr. Patrice Gaillard, Arkema, France

• Dr. Y. Awano, Fujitsu/Selete, Japan (now Keio Univ.)

• Prof. Young-Hee Lee, Sungkyunkwang University/Samsung, Korea

• Prof. Richard Martel, Montreal University, Canada (earlier IBM, USA)

• Dr. Yoon Soo Park, Rensselear Polytechnic Institute, USA

• Dr. Christoph J. Brabec, Konarka, USA

• Prof. Yueh-Lin Loo, Princeton University, NJ, USA

• Prof. Iain McCulloch, Imperial Collage, London, UK

• Dr. Vladimir Serikov, Nippon Sheet Glass America, USA

• Dr. Martin Schmidt, Bayer Baytubes, Germany

• Pasi Keinänen, Amroy Oy, Lahti, Finland

• Paul Glatkowski, Eikos, MA, USA

• Sean Olson, Unidym, CA, USA

• Prof. Ray Baughman, UTD, TX, USA

• Prof. Dr. Janos B. Naby, NanoCyl/NANOPART, Belgium

• Prof. Liming Dai, U. Dayton, OH, USA

• Dr. Michael J. Bronikowski, Atomate, CA, USA

• Dr. Marcelo Motta, Thomas Swan Co., UK, England

BLUE = has answered the questionaire GREEN = has been discussed

KYSYMYKSET:

Mitkä ovat

nanoputkien

tärkeimmät

sovellukset

2020 ja 2030 -

Mikä

on niiden

sovelluksiin

tuoma

arvonlisä

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CNT application areas 2020 and 2030 – additional business value from CNTs

Committee for Future / House of Parliament study published March 24, 2010

Sovellus Hiilinanoputkien

tuottama arvonlisä

miljardia $

Yksiseinäisiin hiilinanoputkiin perustuvien

sovellusten osuus arvonlisästä

2020 2030 2020 2030

1. Akut ja paristot * 4 10-20 20% 50%

2. Taipuisien ja läpinäkyvien johtavien/puolijohtavien

kalvojen sekä transistoreiden sovellukset mm. näytöt

3 8-20 75% lähes 100%

3. Aurinkopaneelit ym. valosähkölaitteet* 2 10 20% 50%

4. Valaisulaitteet (mm. kenttäemissio)* 2 5 50% lähes 100%

5. Autojen ja lentokoneiden materiaalit* 2 15 Hyvin vähän 25%

6.Muut komposiitit (mm. urheilu, tuulienergia)* 2 5 Hyvin vähän 50%

7. Aistimet tms. sensorisovellukset 1,5 5 lähes 100% lähes 100%

8. Johtimet integroiduissa piireissä 0,5 3 20% 25%

9. Elektrostaattinen suojaus* 0,5 2-4 20% 25%

10. Superkapasitaattorit* 0,3 5 20% 50%

11. Lääkkeiden kuljetus kehossa tms. lääketieteen

sovellukset

0,3 3 50% lähes 100%

12. Polttokennojen elektrodit* 0,2 1-8 Hyvin vähän 50%

13. Suodattimet 0,2 0,2- 3

14. Elektromekaaniset muistit 0,2 2 lähes 100% lähes 100%

15. Laser 0,1 2

16. Muut sovellukset 0,4 3

Yhteensä 19,2 90-110

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FNTG Research Society Japan –chair: prof. S. Maruyama,

Tokyo U.

Fullerene

Single-Walled Carbon Nanotubes

(SWNTs)

Peapod

Multi-Walled Carbon Nanotubes Graphene

Nano-Diamond

Bundle of SWNTs

Double-Walled Carbon Nanotubes

Metallofullerene

http://fullerene-jp.org/

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The Fullerenes, Nanotubes and Graphene Research Society

1990 2000 20100

100

200

100

102

104

Year

Num

ber

of

Pre

senta

tions

Sapporo

Nagano

Earth Quake

Tokyo40th

Shinohara

Maruyama

Num

ber

of

Web o

f S

cie

nce P

apers

fullerene

nanotubes

graphene

Osawa

FullereneNobelPrize

GrapheneNobelPrize

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MWCT real applications in China developed by Tsinghua University

Yang Wei Yang Wu

Peng Liu

Qunqing Li

Qiang Zhang Rong Xiang

S. Maruyama

Fei Wei Shoushan Fan

Kaili Jiang

Yan Li

Kaili Jiang Rong Xiang

Shoushan Fan

S. Maruyama

Yan Li

Fei Wei

Qiang Zhang

Jin Zhang

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Recent Developments in USA (IBM)

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Nokia phone with

CNTs ?

Samsung phone

with Graphene or

CNTs

?

Products based on flexible electronics ?

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CNTs and graphene for flexible electronics

Swiss, Empa

E-paper Smart phone Flexible solar cell

Flexible electronics:

Carbon nanotube: Electrical properties, Mechanical properties, Optical properties, Thermal properties, …

(www.photon.t.u-tokyo.ac.jp)

Carbon nanotube thin-film: High carrier mobility, Flexibility and stiffness, Simple and fast process.

RFID tag

Sunchon Nat. Univ.

& Rice Univ.

(Radio Frequency Identification)

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Requirements to material and devices for flexible electronics

Fabrication on plastic substrate Low temperature process Low-cost fabrication Atmospheric pressure process High-speed printing method Roll-to-roll manufacturization

Silicon and ITO:Hard, Fragile Plastic: Flexible, Elastic

Hewlett-Packard

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Comparison of various traditional thin-film transistors for display applications

Material Mobility (cm2/Vs)

Method (Process temp.)

Flexibility Large area

Cost Stability

Poly-Si 30~300 Vac. CVD (500C)

Bad Fair High Very good

Amorphous-Si 0.5~1 Vac. CVD (> 200C)

Bad Fair High Very good

Oxide (InGaZnO)

1~10 Vac. Sputter (R.T.~200C)

Good Fair Moderate Very good

Organic 0.01~10 Solution,

Sublimation (R.T.)

Good Very good

Low Bad

Additional important parameter: on/off ratio – must be larger than 1 000 000 = 106

(ratio of transistor on-current to off-current)

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Comparison of SWCNT and graphene for for flexible electronics applications

Material Mobility (cm2/Vs)

On/off ratio

Manuf. method (Process temp.)

Flexibility Cost Stability

Individual SWCNT on the subtrate

50 000 – 200 000

108 CVD (600-900C)

Very good High Very good

SWCNT thin film on the subtrate

100 - 2000 105 - 107

Depositon from solution or gas phase (ambient)

Very good Low Very good

Free-standing graphene single

crystal

100 000 - 1 000 000

2-100

Exfoliation (not an industrial

manufacturing process)

Very good Very high Very good

Graphene thin film on the subtrate

1 000 – 5 000

2-100

CVD (900-1050C)

Very good High Very good

On/off ratio for digital electronics and display backplane must be larger than

1 000 000 = 106 – graphene is not suitable for these applications

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Solid process - also for graphene:

Liquid process: Aalto/Canatu dry

gas-phase process :

DGU: Hersam group

Gel: Kataura group

Spin coating/ liquid printing

Direct Dry Printing (DPP)

e.g. Rogers group

Fabrication methods for flexible CNT device

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Large-area synthesis of graphene by

CVD Set-up for the CVD growth 5 x 5 cm2 transferred graphene on Si

Raman and optical spectroscopy

Dept. of Micro- and

Nanosciences,

Aalto University

Prof. Harri Lipsanen

Micronova Research Center,

in collaboration with

VTT Nanoelectronics

1 µm

W. Kim, P. Pasanen, J. Riikonen, H.

Lipsanen Nanotechnology 23 (2012)

115201

Graphene rectifier

Transparent graphene on rigid or

flexible substrate Graphene transfer

to new substrate

Polymer

support film on

graphene

Graphene

on copper

Copper foil or

Cu/SiO2/Si wafer

Mobility ~ 2000

cm2/Vs

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RF Field-effect transistor (on CVD graphene)

On/off ratio ≈ 2 Cut off frequency ≈ 80 MHz

(Measured by J. Anteroinen, Circuit design group)

7 x 5 graphene FETs array 1 µm x 50 µm channel dual gate FET

Inverter (on CVD graphene)

Implemented configuration

1 µm x 50 µm channel FETs

Graphene transistors on wafers & on flexible substrates

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SWCNTs in the

reactor gas

Synthesis

Control of SWCNT

properties Patterned/non-

patterned

Deposition Thin Films

Aalto University Novel dry, direct CNT film deposition method: DPP – Direct Dry Printing

Industrial manufacturing – Canatu Oy

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High Crystalliny as observed with 80 kV Cs-TEM: 2 individual tubes with (17,6) chirality –

diameter 1.60 nm, chiral angle 17.2 degrees - and with UHV-LT STM

Collaboration with

Prof. A. Kirkland

Oxford Univ. UK

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25.1.2010

The Finnish nanotechnology based electronic component company Canatu Oy

was announced as one of the winners of the Red Herring Global 100 award at

the award ceremony in Laguna Niguel, California.

Canatu Oy's business is the production and sales of a new class of versatile carbon

based components based on carbon nanotubes and our novel NanoBud™

nanomaterial. These components improve the performance and reduce the cost of

optical, energy generation and storage and electrical devices while, simultaneously

reducing their environmental footprint.

© Canatu Ltd. | Tekniikantie 21 02150 Espoo Finland | info: www.canatu.com

Touch the Future

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Canatu Thin Film manufacturing process

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Canatu Production Facility, Helsinki

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1 10 100 1000 100000

20

40

60

80

100

This work: NO2-doped SWNTs (Nasibulin et al.)

This work: pristine SWNTs (Nasibulin et al.)

Aerosol synthesised (Kaskela et al.)

Sorted DWCNTs + SOCl2 (Green & Hersam)

Sorted SWCNTs + SOCl2 (Green & Hersam)

Pristine SWCNTs (Green & Hersam)

Arc tubes (Geng & Lee)

Laser tubes (Geng & Lee)

HiPco tubes (Geng & Lee)

Tra

nsm

itta

nce

(%

)

Sheet resistance (/ )

ITO on flexible substrate

Record performance level of SWCNT-based transparent electrodes (1.7 nm tubes)

Nasibulin, Kaskela, Mustonen, Anisimov, Kauppinen, et al. (2011)

ACS Nano, 5(4), p.3214

84 / at Tr=90% ->

40 / at Tr=90%

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World's first carbon nanotube based integrated circuits on plastic substrate

Inverters

Ring oscillators (3, 11, 21 stages)

NOR and NAND logic gates

RS- and D- flip-flops Sun et al,Nature Nanotechnology (2011) 6, 156–161

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Long, straight CNTs

Clean network

Y-junction

Unique morphology of CNT network

Sun, Timmermans, Tian, Nasibulin, Kauppinen, Kishimoto, Mizutani and Ohno,

Nature Nanotechnology (2011) 6, 156–161.

World’s highest performance carbon nanotube TFTs - High mobility and high on/off achieved concurrently-

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Let us together develop novel nanocarbon applications in Finland !

Fullerene

Single-Walled Carbon Nanotubes

(SWNTs)

Peapod

Multi-Walled Carbon Nanotubes Graphene

Nano-Diamond

Bundle of SWNTs

Double-Walled Carbon Nanotubes

Metallofullerene


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