GBC Marketing Forum 2004 - Lead Free â€“ A European Perspective

10/11/2004Quentin Reynolds CMD Hanau

Lead Free – A European Perspective for Hybrid and Component Materials

Marketing Forum – IMAPS Long Beach, November 2004Quentin Reynolds


Outline

• Lead and Cadmium in glasses• A review of the European directives• Equipment covered by the directives• Allowed levels of considered substances• A review of the key exemptions and their meaning• The drivers for lead free materials• Summary and future


Role of Glass

Quote from Handbook of Thick Film TechnologyHolmes and LoasbyElectrochemical Publications 1976 Page 100“Many different glass systems are employed as frits in thick film inks,but the most commonly used are based on bismuth or cadmium oxides or on lead borosilicates”


Role of Glass

• CONDUCTORS– Adhesion– Protection of metal for leach or plating resistance

• DIELECTRICS– Glass ceramic matrix– Specialist electrical/mechanical properties– Flux for ceramic fillers

• RESISTORS– Non conductive phase– Chemical interaction with conductive phase

• LEAD & CADMIUM– Traditional and useful glass modifiers


Plated Capacitor

Plated Ni layer

Capacitor ceramic

Electrode

Glass

Ag metal


The Directives

• WEEE (Waste Electrical and Electronic Equipment)– Aims to increase the collection rates to 4-6kg of

waste electrical and electronic equipment per EU citizen per year.

– Obligations begin on 13 August 2005 – “The producer pays”

• RoHS (Restriction of Hazardous Substances)– Requires substitution of lead and various other heavy

metals and brominated flame retardants from 1 July 2006.

• ELV (End of Life Vehicles)– Restriction of waste from vehicles.– Recycling and re-use of components – Requires no use of lead and other heavy metals after

1 July 2003


Equipment Covered

• WEEE and RoHS– Large & small household appliances– IT & telecommunications equipment– Consumer equipment– Lighting equipment– Electrical & electronic tools

• Large stationary industrial tools exempted– Toys leisure and sports equipment– Medical devices

• Implanted and infected products exempted– Monitoring & control instruments– Automatic dispensers

• ELV– Cars & vans– Busses & trucks


Equipment not Covered

• WEEE & RoHS– National security or military use– Electricity is not the main power source– Electronic products not needed to fulfil the primary

function– Batteries

• ELV– Motorcycles and tricycles < I tonne unladen


Excluded Materials and Concentration Limits by Weight

• WEEE & RoHS– 0.1% Pb, Hg, Hex Cr– O.01% Cd– 0.1 % PBB & PBDE flame retardants– Concentration is per homogeneous material

• Homogenous Material – Homogenous material means a material that cannot

be mechanically disjointed into different materials


Homogenous Material

• THE PRINCIPAL OF THEORETICAL GRINDING

– Could grind a film off a substrate

– Could NOT separately grind within a ceramic

• WHOLE COMPONENT– Can NOT take the

Pb/Cd content as a % of the weight of the whole component


Key Exemptions as related to Thick film and Component Materials

• WEEE & RoHS– “Lead in electronic ceramic parts (e.g.

piezoelectronic devices)”– “Lead in glass of cathode ray tubes, electronic

components and fluorescent tubes”• ELV

– “Electrical components which contain lead in a glass or ceramics matrix compound”

– “Lead in solder in circuit boards and other applications”

• REVISION– The exemptions WILL be open to periodic revision


ELV - Car Production – World, Western Europe & Germany

0

10

20

30

40

50

60

70

1990 1995 2000 2005 2010

WorldW.EuropeGermany

CarsMillions

SourceFreedonia 2002Year


ELV - Electronic Value per Car – World, Western Europe & Germany

0

500

1000

1500

2000

2500

3000

1990 1995 2000 2005 2010

WorldW.EuropeGermany

Year

USD

SourceFreedonia 2002


Implications of ELV

• Interpretation (Courtesy of Tin Technology Ltd)– The exemption for lead in 'solders for electronic circuit

boards and other electric applications' for vehicles has been confirmed, permitting lead use for an unspecified time. This also implies that lead use in solders for non-electrical applications (e.g. radiators) is banned for products put on the market from July 2003.

– Lead in electrical components is also exempt for specific glasses and ceramics. Solders and components that continue to contain lead must be identified through specific labelling. They must also be dismantled and treated according to relevant regulations if the total per vehicle amounts to 60g Pb per vehicle or more.

– The Decision also specifies a limit for lead; maximum concentration up to 0.1wt% per homogeneous material, if not intentionally introduced.


Extract from ELV


ELV - Other Considerations in Vehicles – Change Drivers and Limiters

• PRODUCT CYCLE– Development – 3 years– Production – 7 to 8 years– Spares Continuity – 10 to 15 years– Requalification costs mean Pb free is only being

introduced on new components and applications– “Last Pb containing car – 2015, first~2009”

• RELIABILITY– Operating temperatures up to 150C– Introduction of Pb free solder joints for cycling

behaviour >130C– Ceramics technology proves itself at T>120C

• Pb CONTENT– Weight above 60g Pb must be removed before the

recycling process– Labelling


RoHS - Labelling

• STANDARDS – There is no direct marking requirement from the RoHS Directive

– JEDEC Standard JESD97 (May 2004)– IPC-1066 June 2004 (Now an IEC proposal for world

wide standardisation)– JEITA ETR 7021 (June 2004) (Japan)

• BASIC PROPOSAL– Level 1 – Contains Pb but Pb free processable– Level 2 – Lead free solder systems and terminations– Level 3 – No Pb in any system apart from RoHS

exemptions– Level 4 – Completely Pb free


Labelling ExamplesJEITA So ldertec IPC /NEMI / JEDECPhase 1 Phase 2Phase 3APhase 3

Phase 1Phase 2Phase 3 --> Phase 3APhase 4 --> Phase 3

2nd level interconnectSolder symbol (e0,) e1, e2....

Material SnAgCu --> A30C5SnZnBi --> Z80B30It displays at the main unit and the wrapping material.

Board none none halofen-free/solder reflow-wave-hand/coating

Component Phase 1 -->

Phase 2 -->

Phase 3A -->

Phase 3 -->

Solder symbol (e0,) e1, e2....2nd level interconnect label or barcode

Assembled board

Solder symbol e0, e1, e2....(totally) Pb-freeidentification label

Pb-free symbol

Clas

sific

atio

n of

the

labe

lling

for o

bjec

tsLead-free phases

Phase 2

Phase 3A

Phase 3

Solder Symbol: A3C.5, Z8B3


Pressures

• AUTOMOTIVE– ELV exemptions can be revised– Labelling– 60g Pb Content per Vehicle– Reliability

• ELECTRICAL & ELECTRONIC EQUIPMENT– RoHS exemptions can be revised– Labelling– The market– Reliability


Progressive Lead free gives Higher Reliability

Pt/Ag Conductors Aged Adhesion @150 C with Sn62 and Sn96.5 Solders

0

1

2

3

4

5

6

7

Initial 48 Hrs 144Hrs 250 Hrs 500 Hrs 1000 Hrs

Aged at 150 C

Adh

esio

n in

Lbs

Pt/Ag Pt/Ag Pt/Ag Pt/Ag

Storage at 1500C

C4727Sn62

C4729Sn96.5

C4727Sn96.5

C4729Sn62

Pt/Ag Lead free Conductors


Summary & Future

• Pb/Cd free thick film and component materials allow full labelling (market) or non-labelling (ELV)

• Pb/Cd free thick film and component materials future proof process against revision of the exemptions

• Pb free thick film and component materials take away one of the adders to the 60g limit/vehicle

• Pb free thick film combined with Pb free solders can increase product reliability, especially at operating temperatures > 130C

• Pb Free thick film and component materials are a key future direction of the European requirement


With Thanks

• KAY NIMMO– Manager Environmental Affairs, Tin Technology Ltd,

UK• PETER BOKALO

– R&D Manager, Heraeus Inc, Circuit Materials Division, USA

• DR PETRIK LANGE– Hella KG, Advanced Development Technologies,

Germany


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GBC Marketing Forum 2004 - Lead Free â€“ A European Perspective

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