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GEM and Micromegas production Rui De Oliveira TE/MPE/EM

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GEM and Micromegas production Rui De Oliveira TE/MPE/EM. Summary. GEM Single mask process Micromegas Bulk Classical resistive. GEM process step by step. 2 suppliers : Sheldhal (US) Nippon steel ( Jp ). 5um Copper. 50um Polyimide. CR layer 10nm. 5um Copper. Base material - PowerPoint PPT Presentation
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GEM AND MICROMEGAS PRODUCTION RUI DE OLIVEIRA TE/MPE/EM 30/09/2010 Rui De Oliveira 1
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Page 1: GEM and  Micromegas  production Rui  De Oliveira TE/MPE/EM

Rui De Oliveira 1

GEM AND MICROMEGAS PRODUCTION

RUI DE OLIVEIRATE/MPE/EM

30/09/2010

Page 2: GEM and  Micromegas  production Rui  De Oliveira TE/MPE/EM

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Summary

GEM Single mask process Micromegas

Bulk Classical resistive

30/09/2010

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GEM process step by step

30/09/2010

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5um Copper

5um Copper

50um Polyimide

Base material50um adhesiveless copper clad PolyimideRolls of 100m x 600mmPolyimide : APICAL NP or AV

30/09/2010

2 suppliers :Sheldhal (US)Nippon steel (Jp)

CR layer 10nm

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Photoresist deposition15um dry resist (KL 1015 – Korea)

15um resist

15um resist

30/09/2010

Maximum size 100m x 600mmDupont manual laminators

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Photoresist holes patterning

15um resist

15um resist

30/09/2010

70um

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Top copper etching

30/09/2010

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Resist stripping

30/09/2010

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Polyimide anisotropic etching

30/09/2010

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Bottom resist protection deposition

30/09/2010

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Bottom copper etch by chemical reaction

Top copper protected by galvanic connection

etchant

30/09/2010

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Resist stripping

30/09/2010

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Soft Polyimide etching The hole become double conical

30/09/2010

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cross section pictures

1430/09/2010

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Comparison with std GEM from external supplier

1530/09/2010

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examples

30/09/2010

Large GEM already produced:

ILC Dhcal: 1m x 33cm (5 pieces)Kloe: 750mm x 40cm (30pieces)CMS: 1m x 45cm (40 pieces)

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GEM single mask process summary

30/09/2010

Chemical Polyimide etching

Second Polyimide etching

Copper electro etching

Stripping

Reality

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PCB

lamination

Mesh deposit

lamination

development

Bulk Micromegas

BULK Technology

DUPONT PC 1025 coverlayBOPP MeshesSERITEC stretching

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1919

• Pad read-out 1cm², thickness 8mm for ILC Hadronic calorimetry

• Tested in the RD51 1 kHz beam.• The BULK is made on a populated PCB

Bulk Micromegas ILC DHCAL first m2

LAPP Annecy

• Pad read-out large TPC

• Neutrino detector• 10 sqr meter in

service

T2K experimentJapan (CEA Saclay)

Page 20: GEM and  Micromegas  production Rui  De Oliveira TE/MPE/EM

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Resistive Bulk MicroMegas

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PCB

PCB

PCB

-Not compatible with pitchessmaller than 0.4mm-Thixotropic paste

Screen printing of for the resistive strips

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Double sided BoardResistive strip deposit

Bulking

Test before closingClosing

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Rohacell

Aluminum support plate

Stiffening panel

Drift electrode

Pillars (128 µm)

PCB1 PCB2

Classical MicroMegas resistive or not

1 x 1m2 not to scale detector opened

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24

Stiffening panel

Rohacell

Aluminum support plate

5.00

PCB1 PCB2

1 x 1m2 not to scale detector closed

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flat gluing < 10um error

Flat board < 30um error

Mesh on drift (10Ncm )


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