GEM TN-93-440
GEM Muon Group Meeting - SSCL
July 12-13, 1993
Abstract;
Agenda, attendees, and presentations of the GEM Muon Group Meeting held at the SSC Laboratory on July 12-13, 1993.
-
-
-
-
Agenda July 12: Discussion of CSC chamber development
1. Chamber performance, prototype results and plans
Discussion ( 30 min) including: Large prototype status - Johnson, Golutvin Small prototypes plans - Mitselrnakher, Prokofiev Electronics for prototypes - Polychronakos, Whitaker, Marlow BNL prototype results Balagura, Polychronakos, ( 30 min)
2. Chamber design
,Johnson - 15 min Golutvin - 15 min Polychronakos - 15 min Lau - 15 min Horvath - 15 min Discussion - 30 min.
3. Pannel,strip boards and frames prototyping and production prospects
Johnson - 15 min. Pratuch - 10 min. Discussion - 20 min.
Agenda July 13: Discussion of alignment and FNAL test beam program
1. Guidelines for GEM R&D program: goals, $, schedule
G. Sanders
2. Progress on alignment: axial vs projective vs coverage
J. Paradiso, A. Korytov, Yu. Gerstein
3. Pros and cons: monolith vs sector - physics considerations
M. Marx - convenor
4. ATS plans
C. Wuest
5. Plans for FNAL test beam program
- scope and schedule C. Bromberg, et al.
- proposal writing discussion/task assignments Group
6. Slow control system
V. Glebov
7. Discussion and plans for next meeting
.-··:-::·
-
GEM
µ ,. e- L. Gt -'-' ( H a...- /(
s; t:.O if- w ~ ~-+ J.,._
fl'1 1/.
SSC.L
- ~'~v; p ------------------ - ----'crfv~L,t-~~ __________ -r1et/_S'S~L_
r-/ t- {3 i - F/o z. sl4<f'.: v>io.r
(J Ir:/ • '3 S' 3 - 04' I (p ~""Jc, : , .,..:::,iTf
f,r]-l..S-7-7-ZYj 'FET~/llf'lU-
::z r 1- 7o'l- c. z c.o OIJ.Jj <.Js-&.s~
~- - ;c-- 1- ::z ·- - - -1 • -
~ e w·~ "":e4 i...o&: $,S(.'..
--·- ~ fTf .::- -~ 1=; :::.-~a. 'k.~Ts~t[ ----~~= :fcDr~·E:3 ~!:_~~s-c:"~~-:!~J~~ 'r'urt bcnLt.ShKt"h S::SC C ---;:-r:..,--~2-::;c-.:f:6---ss:cv( . .,.. -
-· ·- ---·--- ---------- ------ . -------- -- - ---· .... -------
---------- -- - -- -·--- --- ---·- - - - - --- -SSCL
... ·- -··-· -S'SCVX/
----- ---- ---------------- ----- -----· -- -·. - -
--·--·. -- -- ----- la·-·----------------- - ~- --·· - - -·--· - - - - .. - -----------· --- . .:Van _/Ylar a w' ----·· __ f~-~ -- .., - -- _,0'7_~~0 '1_~85 ""~ -
··· . 7f' --· - -·. --·· - ·- . . -tQ'. Q~ .. k~- ------c.~ ----
s-revc: /f<-97Vc If
JoHAJ /.fot?...VA711-
11or qoluiv11v
tlo.~ ~ TCllEI/
Voiu-i" ICHER.f..flATtN. Q L &G f ltOl.(.o f: I ~ v
- --
. LI.. N/....
ll'<~l"A-
?IJP/./Cf'. °P2.1N~ "-'/11"~;,e;~. ·El>-
- .
_ (3o3) f/J?:J-771$"
<!! C.Ol.OP#Y.J.
""- f/lf IEl.~i.HeHH'.,,,.,.,
C5"to) f-ZZ· l'ffl- f/oR'[email protected]>L.tf·o~
(z•'t) TOl'-~06~ l~_t1~47!1_lP~_<:.r.CV~ <TL./fl'Clltl_8MCU
(St') 282-1/?/I' ~Wki
{5-t-6) ,l.J 2 - 'I'/ 'I eHE/<N/ AT~ 'r-1.1., l ~~ - y 't t6 P'l.Ot<oFOE(!.StCvtt;
c.~~ ~v.e.s.t
Kwoo- ~ CCL[ { 1$ ro ..... ~e.c'~ )#11.Y '?4J'~.</S'1.-;1
~~\~ -r4'-.·~~~
. ---~ /,.yq . . __ 77.,,;,.t(/ .. 4111tro1.y G ()ebii1.1
_}!;..,~"~-· -
U/IJL. f.510) 4J...'O -~qO'I
l1:>u.J.. -tCM (:1-13/h3-)~o o
H. s (.)._ (G"1 ?) :S:)J-J1o7
)11r ( M"l/ oVj -1Jfs,.,
M.l.T. ('il),~;-76"$.1
~Set {jt~-?,e't-~I
-·· .s' J' ~l. _ .. (,,A../f:) - ~~-~7..(
Ss ct... (zt'<)· r+f-lf&' -·---------·-·--. --- - - -- - --· -
WlA.EST~Wlk...G,c
la...._ 4)u H. ~.l
fi?;.f.;_lJ(fV ,,J .J1t 17"L
~lb--/ @ If IT L "'
/.4-.~{Ji'Sc.r..PC
ssevx1:.•ri-/ee:
ss.c11r1 ::i;,01Y&.--- ---·- -- - ------ -- .
-------------- ---- ------------ -- ..
___ ,'<~h-~""-~-e~v ··-· __ .!It:. P __ (~1<r) -:7-111-'U"" . ~ei .. ;~ l.)SSI::v~
---y~---~ -----·---·. --s5cL. -·- ··(i-1if;_7;·; .4-qr7 · iscllx1 ~-.; q t1t7
.. ·---·· ... -- ·. - ····- ---- -··--·--·.·. - . --·~, -) . . . -· __ _ )• ... t>c>&'S -~· O_!>_~_t!__':_':!_~-- ____ J!j ! _ _T_ .. ___ f,.J>f7 ·ZSJ-2'J'1C
.ClAi-r-·lSi~sER.....-- - ··· . -------- - . --· -- -··
LLNL . $10)47.3-2472-.
Bc.lt>jt.cro. • Vl.o..J. i "-- . ·SStL (!lji(;~-'t4 7-8 ..
\f ;11111 ··'I.. ~lyvhY0)1o_.~j ~L- r")2r;.,3, {). . Co.~ f11;! .. ev S~c
.J'I: ·-----o . r..;'IJo--e. r:;.Jl117/,U.
~ELSE"~i e.LWL.6C1
bo ta1v-c. c§)Ssi:v.({
futYC.~~NL!>f\L
11.\: !-... @) SSC 1tx
..
..
..
..
....
-..
..
...
...
-
-
-
s t °'-~ <,. 0 ~ :D'-' b Vt'\__
P~o t-v ~ p-<-~
_,_ -
C:: ()N T5N'r' ,'
- - 0.'!M 11 3.0M 4 LAVER Pll.O~OT'lPE
-• LA'(Cl.AT
• F'AC.\L\T'i
• SC\.tEl>t.lLE
- MASi~·PROt>'-'CTtON F"AC.•Lt1''{ J>&fafCN - Too~\ - AttEA -i CltA~ looM~
c::; OA L
X} ,.0 J>ES.1'-N THE 1'EC.kNOLO&V
-
1
- 2-CSC 3m x 0.3m -
REFERENCE POINTS
STRIPS READOUT
.,
STRIPS
.. 7.5 •I
·+"// .. CROSS SECTION .
ALONG THE WIRE
..
-
-..
HONEYCOMB PANE r, ANODE WIRES
--
WY'\Ct~W- rm ~·· --- ...
-~-
Precise sr~;:s
Data r-"'%$'%!'1'~¥~4W%f$:, connecto~ r•:~~~~~~~\W ~~-7, f;,:ffi:':/-0:%'/\ $':;,._. 0-/,;;;;;:y/;-;/,;,;;;-:<1 i ~est.ave· : ~~ ·, ,,,. ~~~""~~~~~~1 )f@»iM'?Jft@B>::::i:aj#0,: :~~#hi~i(,i;,;~;;,-~;,:-=>1 J Coolin~··-~. ' •· ~~~~~;-/ .~Jmlj;r,1(:0~,0: .~{(,W~/-:<0/::.:;;;0,,fj ~ waier /~:·I ~~~~~~1 -~~~~w&~ __ ~W~0/:0;0jf!~,?4;J
1/ , .. : . ~ -~~@iDf;;%%w.'~- W~.M-0'/:#(~~f#it IC'S~l . ~~j :~;Jili?'.;~;;;;~~< :%r~;.~;,,;f~;:1'iM»~ ~
• '.=. I ~~?]4, ~,;f'''~f:'''':fc'.'.;'.;'o/?;:(,;~/,';' ~;(,/,;;i'~:,.:;;;.;;::::';'.;;;:;:0Jt1 ':
PRECISE SiRIP READOUT
'~~~·~,~~~~'-:',~~~.~'"'::::~:;,~~:..~·.:;'.~;.:..·-~·-:: "'"~"'~~"~~'''•·.-0:--~-'"~:..,,~~i:'"'''" - .
-
-
STRIPS READOUT
REFERENCE POINTS
-s-
CSC 3m x 1.lm
/1110
> REFERENCE
--...:-...:7
3000
.074 .334-j
.1061
CROSS SECTION ALONG THE WIRE
(dimension• in mm)
9
(dimensions in in.)
2x4
182
REFERENCE POINTS
CSC PROTOTYPES PRODUCTION FACILITY
6m
24m _____ ...,
I 5.5 1 Clean room
!Om
...
...
..
/ .. Crate
chambers 9m area
/ 7.5m 8.5m 1 -1-......- -===+ - - -
5m ,, __ _,__--+-
lBm wires to the
chamber
D Test with I cosmic I
rays I I
D llm
-1-......-/-====,.a..--..---..... -+-----~-'-6m l c1ean l
Lr~ _J 6m
Winding machines
10.5m 10
..
..
-
-
Wall
-
-. '_.. CLEAN ROOM
Fans and filters
Wall
csc
Table for assembling CSC
Table
T = 20 C HUMIDITY = 603
Reference oints
AIR RATE CLEAN =10 000 dust part./cu.ft 11
..
CSC PROTOTYPE MILESTONES -* 1. Panels preprocessing June 1993
Materials from SSCL received June 1993 -* 2.
3. Panels processing, precise gauges mounting, stripped boards gluing 2 August 1993
4. Getting bars ready for gluing 13 August 1993
5. Glue bars to panels 15 August 1993
6. Drill holes 16 August 1993
17 August 1993 .. * 7. Test assembly of the panels
8. Assemble spacers and gas outlets 24 August 1993
9. Cover strips with resistive mater. 25 August 1993 .. 19. Install anode wires 1 September 1993
11. Mount capacitors, resistors, connectors 2 September 1993
*12. Assembled planes acceptance check 3 September 1993 ... 13. Get planes ready to assemble,
clean 4 September 1993
*14. Assemble chamber 5 September 1993 .. 15. Mount exterior parts 8 September 1993
*16. Final test 9-13 September 1993 *17. Packing 14 September 1993 ...
Steps 4-6, 8-9, 19-13 go Key operations are shoWn
In para I lel In bold.
tor al I planes.
...
-
-
-
-·~-
WkAT f~ ~"T,ll ~££J)E]) ro C:OM ~C.ETE ,.H& TA~~?
• PAttT~ ~\-4.\\)ME~T EX P&N S6'~
~SC. ~14-~A
• PROTO'TVP& ~f.CIPMfNT E'>tPfiN~&~
J) CA& tJA '> .S Sit"'~-
.. ';; J. tJ
' ' @ • • •
From se.jinr.dubna.su POP3 server Return-Path: <viz> Received: by SE.jinr.dubna.su (4.1/SMl-4.1)
Id AA18596; Tue, 15 Jun 93 17:42:55 MSK Date: Tue, 15 Jun 93 17:42:55 MSK From: viz (Victor Zhiltsov) Message-Id: <[email protected]> To: golutvin@se SUbject: reply to M.Harris from Yu.Kiryshln Status: RO
Dear Dr Harris, In reply to your request of Dubna Muon Chamber Prototype Specifications:
>> 1. Facilities description I. Bui I ding lt1
- Panels preprocessing area:
..
..
-199 sq.m - equipped with two metal tables 4.5 x 2.4 sq.m (9.1mm); 59 sq.m - equipped with crane, 9.5 tonns; •
- wire arrays winding area: 54 sq.m - equipped with two winding machines, and two tables;
- Clean room: 5.4 x 5.1 = 27.54 sq.m - chamber testing area:
54 sq.m - testing equipment for tests with cosmic rays; *no temperature control;
**no hllllidlty control;
11. Bui I ding lt2 - Gluing area (two rooms):
129 sq.m
...
47 sq.m - the two room s are equipped with three metal tables 3.4 x 1.7 sq.m (9.311111), and six wooden service tables; •
*no temperature control; **no humidity control;
In the new CSC fsctory building both temperature and humidity controls wi 11 be aval I able.
>> 2. Materials specif !cations List of Materials for Full-SCale SSCL-Dubna CSC Prototype:
1. honeycomb panel 7 pc (at Dubna) 2. strip cathodes 6 pc 3. cathode 3111 x 1.2m 8 pc 4. G19 frames 48 pc 5. conductive epoxy for strip cathode 9.5 kg 6. conductive epoxy for wires 2 kg 7. epoxy glue AW196 + AV953 15 kg 8. 5 minutes set epoxy glue (two 8.5 oz tUbes) 18 pc 9. 5 hours set epoxy glue (two 2 oz tubes) 18 pc
18. capacitors CERA-MITE 9.881 uF/6 kV· 258 pc 11. capacitors CERA-MITE 8.81 uF/6 kV 59 pc 12. resistors Allen-Bradley 1m0hn/8.5 w 258 pc 13. gold plated tungsteln wire 39 mkll with Rhe 15 km 14. air-powered dispenser 18880 with accesorles 2 pc 15. rUbber seal 188 m 16. flat cable 3M (part It 3517 serles/34) 58 m 17. flat cable connector 3M (part It 3514) 58 pc 18. printed board connector 3M (part It 3594) 58 pc 19. HV connector BNC - 5kV (male+fmiale) 58 pc 28. L.EMO connector (male+fmiale) 28 pc 21. HV cable RG-59 188 m 22. set of shrinking tUbes (1m long) 18 pc 23. wire for spacers, 8.8 mm diameter 5 m
14
...
..
-
--
24. red X corona dope (28 oz) 2 pc
>> 3. Fabrication Specifications and sequlence Fabrication specif !cation:
1. spacers 2. gas system prts 3. gauges 4. parts to mount amplifiers, HV supply, power supply 5. chamber assembly and fix parts 6. seal elements 7. screens 8. tranportatlon container 9. spacers Installation tools
18. panels and bars gluing tools 11. drill Ing tools 12. gauges installation tools 13. tools for chamber assebly using gauges
Fabrication sequence 1. printed cirqult boards 2. preparation of the panels 3. mechanical parts assembly
>> 4. Assembly procedures 1. glue stripped electrodes onto the planes 2. assemble precise positionning monitors onto the planes 3. glue chamber frames to the panels 4. glue pc-boards to the chamber planes 5. drill holes in the planes 6. assemble spacers onto the planes 7. assemble resistors onto the stripped electrodes 8. clean cathodes and the chamber frames 9. wind wire areas on the on transfer frames
(wire transition control, cleaning wires) 18. transfer wires from transfer frames to the chamber frames
(wire tensioncontrol, cleaning the electrodes) 11. electrodes acceptance test 12. final cleaning of the electrodes 13. assemble and close the chamber 14. assemble exterrior mechanical parts 15. assemble ground conductors, signal and HV connectors, etc. 16. flush chamber with gas 17. chamber HV training 18. complete test with cosmic rays 19. crate chambers 28. shipping to SSCL
>> Testing procedures A. test of single chambers of the llOdule
1. production quality test of each ch8111ber 1.1 cutting of anode wires 1.2 soldering of HV parts (R,C) 1.4 check of lnterstrlp shortclrqults 1.5 readout strips soldering, Including cables and connectors 1.6 wire tension check 1.7 check of anode boards junction (Mechanical, HV, gas) 1.8 seal surfaces quality check 1.9 anode-cathode gap check 1.18 spacers Installation
2. HV leaks check (flll chamber with N, apply HV=5kV, leakage current< 1 uA)
3. clean assembly check (no noise (discharges) in ch8111ber with Ar/CH4, HV=2.6kV.
15
....
chamber training, including disassembly and cleaning If needed)
s. Module check 1. gas leakage check of the module after assembly 2. strips misalignment measurement (with respect to outer gauge) 3. measurement of working voltage of the module
(Ar/CFn/C02 (38:28:58), measure space and time accuracy) 4. accumulation of statistics in working point (18e& events)
C. Passport (diskette) 1. gas leakage 2. strips misalignment
-
-3. working voltage/current -4. 2-dimensional map of uniform cosmic rays exposition/noise 5. readout electronics calibration data (pedestal, linearity, noise, e
>>Schedule and personell Schedule
1. Fabrication of technological equipment and csc parts at workshop - 1 .-2. chamber assembly - 1.5 months 3. chamber testing - 8.5 months 4. shipping to SSCL - 8.5 months
Personnel V.Rashevskl Yu. Vlctorov A.Vlshevski V.Perelygin S.Movchan V.Karjavln A. Ivanov s.selunln V.Khabarov A.Chvyrov + 12 technicians
With the best regards, Yu. Klryushln
16
-
---
...
-
-...
-Measurernent --+ A B C
Position -+I ~ :. l+-
J l i II ll I I I II I I II II I II ll I II I I I I I II I I I I I I I I I I I II i 1111111111111 ii 111111 i 1111111111111111
. - : ·.
18
I D
D I nl
11 LJ I
11 DI ,- I I I ! I . i I i !
: ; I ' i i. i i
'--'
D
D
0 '' 0 ·.
D D n
Measurement____,,. A 6 I~
Position --+! ~-:-----------------.i:. l+-
.J I
I n I I
i I ) I 4 ___.,_ LJ
: n. I I ! I
LJ l
6~ Q ..,_:O I . I
6-? D - '.;.·- .~ .- - . . - . - . '.
Q.-.... 0 .. 10 __.1 0 11~ 0
· ... : .·:. - · ...
11
I I I , I
I I LJ : I
! I n • i I . I ! t
I I
I I ;
i 1 1 u
: I
D t I I
D I n
I u I 0-I I I I
-· ..
I
D 0
20
-
-
...
...
..
...
...
-
-
I : Measurements for Readout Sheet ! ' 1 I I i
Trial 1 ' i 6/30/93 I I I I ' Note: Sheet was held flat horizontallv, with an Aluminum bar P..~r!?endicular to the strins.
Measurements are in inches. I 1
I . I ' .
Measurement i . iA i !B \ :c ! ~~·- --·---·-: --
!Value iDev !Value iDev :value !Dev Position I ~ ! . i . . I
Nominal ' 1.8000 ' 38.0600! 1.8000 1. l 1.79971 -0.0003 ! 38.06381 0.0038! 1.8001 0.0001 2 i 1. 7996 -0.0004 38.0637! 0.0037! 1. 7999i ·0.0001 3 i 1. 7997 -0.0003 38.0632! 0.0032! 1.7994! -0.0006 4 . 1.7995 -0.0005 i 38.06331 0.0033! 1 .8002i 0.0002 s . 1.7997 -0.0003 38.0632 ! 0.0032! 1.79931 -0.0007 Gl . 1.7995 ·0.00051 38.0631 i 0.0031 i 1. 7998 -0.0002 7! ' 1.79951 -0.00051 38.0633i 0.0033\ 1. 7997! -0.0003 . 8 ! 1.79981 -0.0003 38.06301 0.0030! 1. 7998 -0.0002 9 i 1.79921 -0.0008 38.0623! 0.0023! 1. 7994! -0.0006
1 Oi .
1.7995 -0.0005' 38.0611 i 0.0011 i 1.80001 0.0000 1 1 ' 1.79941 -0.0006 38.0625 i 0.0025! 1.80011 0.0001 '
i l .
! . Trial 2 i 7/1/93 i j
Note: This data is from measurements beina made with two reference wires as a check of the StriifCiiltness of the traces. l .
l
The sheet was held flat hv two steel bars runnina oarallel to the traces, in the o:naces between the contrast line and the first trace. . ; I
i· l . l Measurement \A B . iC l
!Value Deviation Value !Deviation !Value Deviation Position l I '
. . l Nominal i 1.8000 38.0600! ' 1.80001 j
l l 1.8000 0.0000 38.0626! 0.0026! 1.79951 -0.0005 2 i 1.7996 -0.0004 38.0628i 0.0028! 1.79961 -0.0004 3 I 1 .7998 -0.0002 38.06251 0.0025! 1.7993 -0.0007. 4 l 1.7999 -0.0001 38.0626! 0.0026! 1.7993 -0.0007 5 ! 1.7996 -0.0004 38.0623! 0.0023! 1.7991 -0.0009 6 ' 1.7995 -0.0005 38.0629! 0.0029i 1.7995.· ·-o.ooos·. 7 i 1.7995 -0.0005 38.0632! 0.0032! 1.7994 -0.000£ 8 ~ 1.7993 -0.0007 38.0618i 0.0018\ 1. 7995 -0.0005 9 ' 1.7992 -0.0008 38.0590! -0.0010! 1.7996 -0.0004 •
10 i 1.7997 -0.0003 36.05441 -0.0056! 1.7996 -0.0004 11 ' 1.7995 -0.0005 38.04951 -0.01 OS! 1.7993 -0.0007 '
i I i Notes: In the second triat the sheet had an a""rDX. 1 cm bulne in the ioint side. This would
cause an ""n2 rent shorteni""' in measurement B with minimum mannitude of 7 thousandths. Furthermore. a 500 mil lift of the e""" of the sheet from the table outside of the hold down bars is needed to cause the discre""""'' between trials of measurement C. It is likelv that there was such a lift. There is confidence in the measurements of Trial 1. while sources of error have been found for Trial 2.
21
... Measurements for Terminatina Sheet .
• ;
Trial , 6/30/93 ; . ' ; i '
Nate: Sheet was held flat horizantallv, with an Aluminum bar rn.roendicular to the strios. Measurements are in inches. . . . ...
I \ ; , Measurement A i \B . c ' Value Deviation !Value !Deviation Value Deviation Position
. i .
Nominal 1.8000 i 38.0600i I 1.8000 -l 1.7992, -0.0008! 38.0642! 0.0042 1.8027 0.0027 2 1.7993 -0.0007! 38.0632! 0.0032 1.8028 0.0028 3 • 1. 7991 -0.0009[ 38.0633! 0.00331 1.8029 0.0029 4 1.7990 -0.0010: 38.063Si 0.0035 1.8025 0.0025 5 1.7994 -0.0006: 38.0635! 0.0035 1.8024 0.0024 6 1.79921 -0.0008! 38.0644l 0.0044 1.8025 0.0025
... 7 1. 79891 -0.0011 i 38.0653! 0.0053 1.8024 0.0024 8 1. 7991 -0.00091 38.0649! 0.0049 1.8019 0.0019 9 1.7989 -0.0011: 38.0643! 0.0043 1.8018 0.0018
10 1.7990 -0.001 Oi 38.0644! 0.0044 1.8015 0.001 s 11 i 1.79871 -0.0013\ 38.06661 0.0066 1.8018 0.0018 -I ~
. 1
Notes: These measurements were made with the orocedure of the Trial l measurements of the Readout sheet. and the same confidence in our measurements annlv.
-
...
...
-..
- 0. f 'Z:JU.Of1e V
7/12 /.IJ
P NP I p2.,./.:;./JP' o/ CS C
/, ~(on1lt~t.l;o.,. ol smc.ll C SC
(2 ()., l Q:_c1-r ~. O.~-!;, vc . ~ .~C:' ) . . . ·- -·. _. -- .
~:1-1, jt""'""' tt0
f.
ol .S ,,t " le: e {),, / 1'3--. a~ ./ ,•., "'.
s "" .··. :l' 'l .. . . . ,
£ / l'nm W ,,,m Sl l a_. Sl.f ~. 71
~L 2 I./. 0 I.I// ,
SL ~ s.o 10. ~ •
l - a O..p Q. h oJ~ - ea:/.J., 0 ,J t
Sp~c~ '-- / $: 2. S' nu11
w ... pi .fe.'1 ett:/.lr~Jt sl1i/7 · atAJo.-.. 4
- p'f%tl/(tf e;,,;.J ?<Arlitt( ~l-i•·fr Co1tf'°J"'tt1,f.-',;
- Q "otJ c. w: t' t-of c.. l-l tJ,,,
Lo z .. .,. +"i: fff1.e-+
f~1 COWtpt.., $-..f,·,,.,.,
~"' es( £ \" .t -C 4~ CD"' 4: '"''L'''o"'
25
•
1o'l... . rri ~ L< i IA J, -/ 'l ~ r-. ~ 'i.: .,
"_,. . ;
2. (;' ~ ,2_- 0 ,~-.,, ~ . CAc.J,· ,,,_ t.
'
-~ '' . --· ..
-
.. • ..!_ ' .... .. .
' ' ' ' \. :y ,,
.... \' '' ~-- ... - -- .... _ .. . -
·~ ~ ,,; / ~.-""" ......... ,,,.,. . ./:·""" ,,, ,,, ,,.
q-,...
• ' ' I I
- --,,,,,. // 1
I
I
I I
- --
• •
'
- Ca.-!-"'-~olt. s-1-i~f.l (F.._"(';..lt'-l} Btt ~'f ~ l COi.it ~ t
1
0,-V. tt'Jt, ~ ~ OVI
w = 5.",:,. t, .; g. l( 1; 10. ?2 M>-t
-
-...
...
..
-
-
- Ro..rJ.."1..R. St'!~p (£Viol eQ.;. f!oi-i·/,·1~t~./.·o._,1:.,.
- A ~ orl e. . /?ta..~,_ ·· pt~ P'- 'Vt ol1't'!:Bf a..,_ )
s' = 2 . ~ ,.., >"
?r;./.4ftol ::, J7. -
..
.(4 -t.A,-J. ' t \ :
t. 1,,41.;vis.·c l4ll~' e~1.,/ ... ./,·.,'4 /<>t rlc'fft..t.c.""~ Cht!.1MJt'f.. 3f.Qmc../'J
-2. I / m··"'J . !3t.~Mt cz.;111'"'/ -I~/
. ~{//c ,·~~tl. (' f~~~;} > j ! ~
11.-I 16 hJ .. ''"'":
.3. '10:3., .,.,,.,c. f-•'t lJ l f.,,.·,1~ c~-fo CO'- f1°~t. ttt. J,• ()I,. }
l/ ' 0 ,, ., .. ,.., .. 2 flt. 4 •· t)fttt c J, t:. .,,,.. t~"t
p~ ,~ m«/., '? s.
C 4 .f. It~,/.. .r/. a ~~ 2 e c J • IA~ ~ : l c/,
6 ~ ,, , r ~ .. e .! t,l I ...
-- S; s~,, ,·,,
f'fC.J tte ..f. -
/. t s:4
s -I °'- 4 ,· () "'
E .... J. Cc.r co'-' f,·~IA'IA.1 ... '"111
27
j
J COi.J.IMATO R.
' :'"~
{]j?_~ i· •I '/A ~
I
! .:-·--..
i ' -~! .: If ---~ -...:--
ii !i ·--:--~
Be/II) 1 w' . MAG ~ET....;,.;;.;.;.
-I ~l
COLl.IMATOR
Sc o
$CJ. SC~
/lt(Ovt~C
IA6l.€
SC 3 Sc:. Lf
P->EA M
~4.Cl'f p
--1 I i I ! ' t t
--
----
I : I : . '
f i
-
28 . -
p RoiOAI ; es; /. 7 be v/e
Quo..]) R t.1 po 1.. E :D 0t.l1:0 J..ET I
-) ov l;l..ET l!.
..
-..
-
..
-
-Test of CSC ... ..
E 11 8
csc •
30 ...... PRoiOJJ
8EA 11
~ ~ 0. I '1. / ,,., m
• 29
-
Status of CSC Readout Work
at Princeton
GEM Muon Meeting at the SSCL
July 12, 1993
Daniel R. Marlow
Princeton University
...
-
Muon CSC Electronics
• Work aimed toward production readout
• Pursuing SCA option, but work is directly rele-vant to T /H option.
• IC design by Bob Wixted
• Test fixture development by Stan Chidzik
• 2x2 mm2 IC prototype fabricated using ORBIT 1.2 µm double-poly, double-metal CMOS
• First prototype
3-channel x 24-sample 10 MHz SCA
CMOS comparator (building block for lowcost CF discriminator)
35
Test Setup
!----------------------------------------------------------------------------------------~
' ' ' ' ' ' ' ' ' ' ' ' ' '
, __
r-- 12-bit DAC SCA 12-bit ADC -AD DAC87v AD HAS1201
Write Addr Read Addr
' . ' ' Test board 100 ns 5µ s
' ---------------------------------- ------------ ~---------------------------------· --_.,
I HP Pattern Generator/
I
I Logic Analyzer - I
12 12
SCA Test Fixture '
- '486 PC
• Current tests use pattern generator to sequentially address the capacitors in the array. Readout follows same sequence and is not (yet) simulataneous with write.
• DAC settling time is 3 µs, so only "quasi-dynamic" tests are possible.
38
-..
-
..
--
...
-
--
-
-!
-
~
~ 4000 c 6 3500 u ~ 3000
(Jl
~ 2500 0 ~ 2000
25 1500 <t:
..... "' QJ
CD
1000
500
0
1.5
1
0.5
0
E -0.5 0 .... -c 0
:.:;
-1
0 -1.5 ·:; QJ
0
ADC VS DAC
0 500 1 000 1500 2000 2500 3000 3500 4000
In ut DAC Counts
0 500 1000 1500 2000 2500 3000 3500 4000
Input DAC (Counts)
37
..
... 38
-
-
g 5 I ::s 2.5
0 -2.5
-5
u 5 0 ::s 2.5
0 -2.5
-5
u 5 0 ::s 2.5
0 -2.5
-5
u 5 0 ::s 2.5
0 -2.5
-5
0
0
0
0
SCA Residuals by Cell
2000 DAC
2000 DAC
2000 DAC
2000 DAC
u 5 0 ::s 2.5
0 -2.5
-5
u 5 0 ::s 2.5
0 -2.5
-5
u 5 0 ::s 2.5
0 -2.5
-5
u 5 0 ::§ 2.5
0 -2.5
-5
0
0
0
0
2000 DAC
2000 DAC
2000 DAC
2000 DAC
u 5 0 ::§ 2.5
0 -2.5
-5
u 5 0 ::§ 2.5
0 -2.5
-5
u 5 0 ::§ 2.5
0 -2.5
-5
u 5 0 ::§ 2.5
0 -2.5
-5
0
0
0
0
39
/marlow/gem/sco/docsco.kumac
3-Params/Cell
2000 DAC
2000 DAC
2000 DAC
2000 DAC
u 5 0 ::s2.5
0 -2.5
-5
u 5 0 ::s 2.5
0 -2.5
-5
u 5 0 ::s 2.5
0 -2.5
-5
u 5 0 ::§ 2.5
0 -2.5
-5
0
0
0
0
2000 DAC
2000 DAC
2000 DAC
2000 DAC
u 5 0 :2j2.5
0 -2.5
-5
u 5 0 :2i 2 .5
0 -2.5
-5
u 5 0 :2i 2.5
0 -2.5
-5
SCA Residuals by Cell - 3-Params/Cell
0
0
2000 DAC
2000 DAC
u 5 0 :2i 2.5
0 -2.5
-5
u 5 0 :2i 2.5
0 -2.5
-5
g 5 ~2.5
i<»o~a:>¢.~ 0
0 2000 DAC
-2.5 -5
0
0
0
2000 DAC
2000 DAC
2000 DAC
u 5 0 :2i 2.5
0 -2.5
-5
u 5 0 ~2.5
0 -2.5
-5
(.) 5 0 :2j 2.5
0 -2.5
-5
40
0
0
0
2000 DAC
2000 DAC
2000 DAC
(.) 5 0 :2j 2.5
0 -2.5
-5
-2.5 -5
(.) 5 0 <( 2.5
0 -2.5
-5
0
0
0
2000 DAC
2000 DAC
2000 DAC
..
..
..
..
..
-
-
-
-..
-
Fit Parameters by Cell - 900 0 ~
rn <lJ 895 "D <lJ
0 Q_
890 0 0 0 0 0 0 0 0
0 0
885 0 0 0 0 0 0 0 0 0 0 ° 0
0 0 0 0 0
880 0 5 10 15 20 25 30
Cell Address
c0.99 0
(_')
0.985 0 ¢ 0 0 0 0 0 0 0 ¢ 0 0
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0
0.98
0.975 0 5 1 0 15 20 25 30
-5 x 10 Cell Address
~ 0.6 ~
0 u 0.5 _J
z 0.4 0 0 0 0
¢ 0 0 9 0
0 ° ¢ 0 ¢ 0 0 0 0 0 0 9 ¢ 0 0 0 0 0
0.3 0
0.2 0 5 10 15 20 25 30
Cell Address
41
..
.. /morlow/gem/sco/docsca2.kumoc
SCA Residuals by Cell - Single 3-Param. Set .. u 5 u 5 u 5 u 5 0 0 0 0 ~2.5
o9CO :?:i2.5 :?:i2.5 :?:i2.5
0 0 0 0 -2.5 -2.5 -2.5 -2.5 -
-5 -5 -5 -5 0 2000 0 2000 0 2000 0 2000
DAC DAC DAC DAC u 5 u 5 u 5 u 5 0 0 0 0 .. ~2.5 :?:i2.5 :?:i2.5 :?:i2.5
0 0 0 0 -2.5 -2.5 -2.5 -2.5
-5 -5 -5 -5 0 2000 0 2000 0 2000 0 2000 ..
DAC DAC DAC DAC u 5 u 5 u 5 u 5 0 0 0 0 :;s 2.5 :;s 2.5 :;s 2.5 :?:i 2.5
0 0 0 0 -2.5 -2.5 -2.5 -2.5 ..
-5 -5 -5 -5 0 2000 0 2000 0 2000 0 2000
DAC DAC DAC DAC u 5 u 5 u 5 u 5 0 0 0 0 :?:i 2.5 ~2.5 :?:i 2.5 :?:i 2.5 ..
0 0 0 0 -2.5 -2.5 -2.5 -2.5
-5 -5 -5 -5 0 2000 0 2000 0 2000 0 2000 ..
DAC DAC DAC DAC
-
-42
-I _,
SCA Residuals by Cell - Single 3-Param. Set
u 5 0 ::s 2.5
0 -2.5
-5 0 2000
DAC
u 5 0 ::!J2.5
0 -2.5
-5
- g 5 g 5 ::s 2.5 :s 2.5
I -2.~ -2.~
0
I - 5 01::-1---L--1--LI - 5 2000 0
- '
u 5 0 :s 2.5
0 -2.5
-5 0
DAC
2000 DAC
u 5 0 :s2.5
0 -2.5
-5 0
2000 DAC
u 5 0 :s 2.5
0 -2.5
-5
g 5 :s 2.5
0 -2.5
-5
0
2000 0 DAC
2000 DAC
u 5 0 :s 2.5
0 -2.5
-5 0
2000 DAC
u 5 0 :s 2.5
0 -2.5
-5
g 5 :s 2.5
0 -2.5
-5
0
2000 0 DAC
2000 DAC
u 5 0 <( 2.5
0 -2.5
-5 0
2000 DAC
2000 DAC
2000 DAC
Conclusions & Future Work on SCA Evaluation
• Ten-bit operation appears to be readily achievable.
• Random noise and cell-gain variations are already at the 10-11 bit level.
• Cell pedestals are uniform to only "' 8 bits.
• Future Work
- Use FPGA-based logic to measure noise under simultaneous read/write operation.
- Work to understand cell pedestal variations.
An improved test setup, using a 16-bit ADC, a faster DAC, and incorporating a number of "conveniences," is being developed.
SCA's from other labs (ORNL, LBL) will be tested.
Quantitative measurements of capacitor decay time will be made.
Layout of the first "production" device for FNAL test electronics will commence late summer.
44
-
-
-..
-
..
..
..
-Constant Fraction Discriminator Tests
• Goal is to develop low-cost fully integrated CF discriminator to correct for pulse-height walk.
• Design is based on Turko and Smith concept
vth
from Fast Shaper
Noninv. Input
--~---
A
B
c
A
CF Comparator 30 ns
Delay
Inv. Input
',,, / ... ...
_. 30nsE-
_jl_
• Key building block is CMOS comparator.
• Current version requires external R's and C's, but these can be integrated.
45
Constant Fraction Discriminator Test Setup
• Test setup is very simple.
Attenuator
p"""' ~6 6 9 6 9H~_c_F_D_is_c ____,
'scope
• Use simple RC differentiator to simulate pulse. (More realistic circuit needs to be developed. )
Pins 15,35 +5V 16,36 GND
v in
+SV
100
+5V
. 1 µ F
3 v out
• Measure delay of trailing edge with respect to trigger as a function of Vin.
46
...
-
...
-
-
..
-
-
...
-
~ 2 en
I c ...__, >-0 QJ
0 1 ~
:J 0.. ~
:J - 0 QJ
0 > :;::; 0 QJ 0::
-1
-2
-3
-4
-5
10
•
D
• C2 =20 pF
D C2= 1 0 pF
CMOS CFDISC -
• • •
D
D D
•
D
/morlow/gem/sco/cftest2.kumoc
C,=10pF
• •
D
• • •
104
Input Voltage (mV)
-
... 48
-Conclusions from Discriminator Tests
• The CMOS constant-fraction discriminator functions well and should easily meet GEJ\1's requirements.
• Further tests with more realistic pulse shapes and with actual chamber pulses are needed.
• In the current design, there is a slight tendency to fire early on smaller pulses. This could be problematic and should be corrected.
.-
49
-
In our case • lf- f /3 ~ ,.,20fm
53
0
-100
-200
-300
0
.. • : • ~~,.~---•-••-•.,•••••-;••-••••••••••••n•o•••-••••••••••••••••••• ••••••••••••n••n••••••oon•
• ·= ·:·.: • ~
,, ~-: -~ ri.... . .. -c-~: .. :~ .. ~ \;. . 91a.;-;-::)-s . : ...... JK_n:~· .... ~.
::-:.~~:£:~~=:: ~. ·: .. : • ... ~l::,, ... · ~·· .~ ·. • •
•• \T "'"' . • . .. • ................................ n••···:r::~--~ ~: ·:::;. "':". -· .. ·: ...................... r ............................. .. :·l::.::. ~. ~ . . . ... . . :
./ ·.. . . : ... ... ...
-~ ........................................... _____________ : ____ ~-~~----·-···:...·-·····-···-············
. . ········································r············································r···························
5000 10000
54
-
-
-
-
-
-
-
-
-
-
-
15
10
5
~0.04
......
' • I ' • I
••llDID•••
.. a~l3B• · · · · · .•• a ~~~ra a a • · · · • . . . •Bila fJ a • • . . . . •
.••.•. •Ill ae•• ... · · '10 Ell!• I'•' • 0
•.• flE]faEI fJ DI ••.•
··ar11aa•• · · · · •••1118•••
• • I I I I I 1
I I O • •
-0.02 0
55
-
-..
15 • I I 1 • 1
. . .
10
e I I 1 • • • -5
.. • • I I I • • •
• • • • • I •
.. 0 -0.02 0
..
56
-
Strip_26 0.02 0.02
0.01 f + 0.01
0 +-- t 0
+ -0.01 :i: + -- ...... -0.01 + .---0.02 ..,,.,.
+ •+
20 40 20 40
0.02 0.02
0.01 + 0.01 + + + -0 0 -......_.-....._...-
-0.01 - + -0.01 +
+ ------ --0.02 - -0.02 +
20 40 20 40
-
-
57
..
..
-
....
58 ...
-
750 150
- 100 500
50
250
-0
-10 0 -10 0
59
en C..v
) ) )
GEMUON Coleman Johnson 7.:12-93
CHAMBER DESIGN
• Edge spacer frame update • Summer workshop questions • Intra chamber alignment transfer test prototype
PANEL PRODUCTION • Cost summary
CVJlll 12:10 PM July 13, 1993 1
) ,
m ~
•
CHAMBER EDGE SPACER FRAME
FUNCTIONS:
• Cathode-cathode spacing • Cathode-anode spacing • Wire support · • Gas seal • Location for resistors, capacitors
ONLY 2 REQUIRE ACCURATE DIMENSIONS: • Cathode-cathode spacing • Cathode-anode spacing
DESIRED PROPERTIES:
C\')XlUCXX• I 5/llll'll
•
• Minimum material • Minimize fabrication costs • Minimize assembly costs
• • • • •
~
• • • •
-
cc <r CD <..,;)
z _J
<r w Vl
Vl w 0:: 3::
0:: <I: CD
•
\
x l.J...
u..J 0::
3::
0:: w u <I: Q_ (/)
\
/ _l ;' ;' ,· ',I . I I 'y ' / .!.
\j ,--,-. --/ .;:-.\ ',/ '
i
- ;
\
\/
\
\ \ \
\
/ 1,_
65
\ \ \
z _J
<t w VI
\
\ \
0:: 0 f-(/)
~·
--...-
>
\ \ \
\
\ \
\ > ~
co 2 0 u :r
I
:r x 0 Q_
LLJ
:r LW z .~ -I
< 0::: < co x u.. w 0:::
~ ;:::
-'-"' >----
< 0.. <
< w z 0 >--
~~' 0::: ;:::
>-x -· c ~· . '--' ~.
< -
" " ,, ,, " ,, " ,, ,, ,, ,, ,, " " ,, ,, ,, ,, ,, ,, " " " ,, " " " " "
GG
'i ' ii i
' ,L
' ,,
; i -',,. ' ·",
'~~"~"~1 'I
'·
I •I ,,
'·--J
'1;
...
,~
-
...
-
-
...
-
>
-
0
~·
-
'
. -----------.I i i I ) ! ! i 1:- -rr r - -- _, : I I ' '' 'i I
··~
-=
-~
' ''
~
I ' " ' j
11:-~ - ~-- - - - ~- ~ - - - -
i I
i' .,
'' I_
I I
'! I 'I ' I , -~L
i I '
t> v IJ)
L 0 +::i :9 L +(/)
>
----------: ---./-
Q)
v U5 +::i 0 v g, \.. !
~I 2
I ,,
! -.)1 i J..ij' •r' I
I i~ ~; ! ri! <t .
! i~I~ ;;~-,-· I , \ '11• I ' , ' __ _i._) --LJ-
"11 r ~:: • : I l~ ~ - ~ I ~I ,_, : . ;I ·n1 : I ,1 llU . . : ~u ·~ : ' l ~ ..__.:.\ '
''
I I : I · i 1 • . I u _ ... , . ' /--.'I ; -t------ .. i":;;·:-'-
., ' ;>I I
·_LJ' ' .,
(''--.1 ' '
;\ ' \
I
~ I I I I
--i-
T' I
I 'I 1 'i td! ,,,
,•.J.1
<
..
..
...
..
.. \
-\
/
. / /. i ./.I
1/ ;··. / / j . ,\
/ -,
/ I
/
/ -~/ ..
I /
.. /
/ ... /
I I
.. G8
/
I
I
I
~.}:l . _> 11
-
I
/
I
, I , /
I
I
I
I
I
I
I
I
G9
er:: <(
co :z: 0 !<(
x LL
!-
z I 0 I en ( e::: i
~ I > I
I
" " " n " " " " " " "
" " " " "
ii /~ ,/
I " " " " " "
)- " " x " " 0 " " Q_ " " w " " " ' " ' " "' •'"-. " '
" " " " " " " " " " " " ,, " " " " "
,, ·'
::---. ''
~~~~~~-·'
J , .. ·- ~\ ' ~
--/
_. /
J , ' <::"'"' I
" ' -!
' ' ~1 -·· ' i ~
' ......-)
__ _.:..__
70
s _/'-~
"'
z ,-., --v er: w >
" " " " '-~:: " " "
"
)
x 0 Q_ w
" '-" " " " " " " " " " " " " " " " " \, "
\,, It
' " " " " " " " " " " " " " " " " " " " " " "
•'
~-' '
n i' I I
I I
I
I· '
Oi .1 nJ '
-
-
-
-
--
--
-
-
-
) ) ,
SUMMER WORKSHOP QUESTIONS ~ CHAMBER DETAILS TO BE STUDIED, TESTED, RESOLVED:
• HONEYCOMB PANEL • EDGE FRAME • BOLTS • MID PLANE SPACERS
~ • ALIGNMENT DETAILS • ON CHAMBER ELECTRONICS • COOLING FOR ELECTRONICS • • •••••••
• ••••••••
CVJIII 2:21 PM July 9, 1993 1
0 \
\ \ ·o
\'O
\ \
...
...
...
-
-
...
-
...
-
-
-
-
1,:;t--J' './ / .
7 I
( \
"·
-
-
-\
-
-
...
...
---
-
-74
-
GEMUON SUMMER WORKSHOP QUESTIONS
11 HONEYCOMB PANEL: DRAFT a) unetched cathode side with anode readout connector; b) precision strip cathode side with cathode readout connector; • c) honeycomb plate with edgefill and details; d) gas inlet/outlet features
questions to be studied, tested, and resolved:
a) how to provide edge close outs, connector details, reinforcing for sealing, bolting, etc. b) how to minimize density and total mass of close-out features c) how to join layers of chambers together, bolts vrs adhesive bonding, effects on shear stiffness of final chamber, sag, etc., reinforcing for bolts, spacer tension wires, etc. d) how to provide holes for support spacer wires, location, reinforcing, etc. e) edge machining, raw honeycomb vrs edge filled, with or without face sheets
• bonded, etc. f) cleaning, all holes, gas passages, etc. g) soldering connectors to panel, reinforcing to withstand attachment forces, handling, etc.
21 EDGE FRAME:
a) provide wire position (both wire to wire and anode to cathode spacing) and fixation details; b) provide wire anode circuit connections, distribution to connectors, etc. c)provide location, isolation for resistors and capacitors d) provide cathode to cathode dimension control e) provide gas sealing details
questions to be studied, tested, and resolved:
a) detail component design to meet all functions and minimize mass and density of total system (compare three design concepts presented and others, evaluate, choose) b) how should the frame elements be attached to the honeycomb panels? adhesive bond with controlled bond thickness, adhesive bond with line to line contact to control dimensions, casting in place, etc. c) how should the anode wire connection copper pads be configured to allow staggering of wire groups from layer to layer in a given chamber? details of the required stagger? etc. d) how should anode wires be fixed, electrically connected to frames? what kind of structural epoxy, how much; solder vrs conductive epoxy, etc. e) what should the procedure, sequence be for attachment of resistors and capacitors? before wire attachment or after? above board or inside honeycomb/edgefill volume? f) how to protect the high voltage distribution track, corona, surface leakage (dark current?) proximity to grounded bolts, etc. under gas seal? g) how should we specify the cleaning processes and quality assurance testing, etc.
cvrrn 3:24 PM July 9. 1993
75
3! BOLTS DRAFT a) join honeycomb panels together to form chamber b) ensure ttlat elastic gas seal is intact c) provide shear strength to chambers for sag d) keep cathode planes in intimate contact with part of edge frame that determines cathode to cathode spacing. e) possibly provide attachment to chamber mounting hardware f) possibly provide attachment to chamber mounted electronics like mother boards g) resist gas pressure
questions to be studied, tested, and resolved:
a) should bolts be inside of or outside of sealing location? b)if bolts are inside of sealing location, how should the end be sealed, not compromise shear strength considerations, etc.
, c) how should we define the bolting procedure, sequence, torques, etc.?
4l Mio PLANE SPACERS
a) provide additional cathode to cathode spacing control, in compression b) provide location for tensile element to ensure contact and resist gas pressure
questions to be studied, tested, and resolved:
a)study original Dubna design, new SSCL design, others, evaluate, choose b) minimize lost readout area, volume c) simplify fabrication d) determine installation procedure constraints on design, when and how bonded into place, how to locate with respect to wires, etc. e) how to prevent surface current leakage (dark current?) from high voltage anode wires to ground potential tensile element f) how many do we need? how much performance degradation? etc.
Sl ALIGNMENT DETAILS
a) provide means to transfer knowledge of precision strip locations outside of the given plane for layer to layer alignment in a specific chamber and transfer to straightness monitor systems
questions to be studied, tested, and resolved:
a) study various ideas for transferring etched pattern to a mechanical (washer/) external feature, registration, phi and theta directions?, attachment schemes, etc. b) study possible external etched pattern concepts such as for the stretched wire concept (AK) identify limitations of photolithography process like minimum gaps achievable with accuracy, etc. c) study details of straightness monitor hardware attachment to the chambers, machined grooves to indent lines of sight into chamber volume, etc.
CVJIIl 3:2.+ P'vt July 9. 1993
78
..
-...
-
-
..
...
..
..
..
-
-
-
6l ON CHAMBER ELECTRONICS DRAFT a) provide pre amplifiers to get signals from cathode strips to mother board for processing b) marry information with adjacent pre amp boards for triggering information c) provide pre amplifiers to get signals from anode wire sets to the mother board for processing d) provide mother board to accept signals from both cathodes and anodes, process data, and send data and triggering information to control center e) provide regulated low voltage to electronics f) calibration functions g) possibly provide high voltage system fault detection, circuit interruption h) possibly provide calculations for straightness monitors i) possibly provide input to and receive output from functional transducers like pressure, temperature, flow, etc.
questions to be studied, tested, and resolved:
• a) study implications of the various locations for the first electronics, effects of cable lengths on signal to noise ratios, effects of access specific design features on the theta coverage, mounting, etc. b) determine best shielding concept, compare woven with solid shields, feed thrus, straightness monitors, access for maintenance or replacement problems, support problems, grounding isolation concerns, etc. c) study high voltage feed thru concerns d) study effect of captured gas, dead air space, etc. e) study overall temperature impact of closed shielding (see cooling, below)
7l COOLING FOB ELECTRONICS:
a) remove heat generated by the electronics b) prevent any heat from distorting the chamber elements
questions to be studied, tested, and resolved:
a) study ways to attach the electronics to the cooling system, make good thermal contact, etc. b) ensure that attachment is consistent with maintenance access c) study combinations of conductive and radiative cooling shields d) consider the impact of the EM shielding on static air around heated electronics e) study reliability impact of design features like soldered joints, feedthrus, etc. f) study impact of pressure and flow controls on overall system design
CVJIII 3:2~ PM July 9. 1993 3
'I O'.>
f
INTRA CHAMBER ALIGNMENT TRANSFER
TEST PROTOTYPE
• SSCL design concept • Design coordinated with/transferred to LLNL • Model to be constructed, tested at LLNL
CVJlll 12:10 PM July 13, 1993 2
f • • • • • • f • •
'\ \\
.. \
0
-
\o
\' \\
\ \ \~,
\
\\ ',\
\
'~\
~
\\\()[/'
79
.... _'
.; i -I
r
...
-
...
... 0
-..
-
-...
.. 80
-
irJ: \J I , ru ! I I
11:-----1
/ .1' ,.._ l ~ •\i.) \.. j
;~ ,.q, ).q, I /
i-' '11 • I l=-l I I - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -· !
81
//; I
-
COMMetJT~ o~
C HA~\?.EL. C..A\'Ot.t T
l. ~ 0 C.'-c T\I l IU
01/lfZ./93
~ -1
) )
Questions and Recommendations
-,-
1. Access to the muon system is claiined to require 3-4 1nonths. The subpanel v ic ws this as undesirable and encourage the proponents to explore shon-tun1-arounu emergency access, perhaps through a small section of the rnuon end cap.
2. The 48"'.'fold azimuthal segmentation may be unnecessarily fine. The subpancl requests that the proponents perform a cost-benefit analysis of the degree of segmentation. Reduced segmentation could lead to a lower overall cost and less material to produce multiple scattering and backgrounds.
3. The measurement and monitoring of the magnetic field requires more detailed study.
~ 4. The proponents are encouraged to consider methods to improve the geo1neuical efficiency of the system within the angular region covered.
5. The proponents should proceed expeditiously towards a full·scale pre-production chamber.
)
i. W l l)tk OF \H(; C.WAMaFP.~ \ N
\ke 1"\\S>J>l.E 5>"4.c>ell~AVeR..
Z. MA TE'R \ A<.. IN T \t e- C ~ (_
-
-
-
-
-
..
..
...
-
-
-
BAS\C l=OR.MULA:
• 6, - 4i.1NG-lC: Llt'f&R ta.esot.&.aTlc)IU tN S.uP&'llt.A'l&R. 1.
J\)i - NUf'\&e-. OF t.AYE. It~ IN SuPE•lAVi~ i ( .N;: 6) Ci - S.IN'-LE' lA'l&I. E."PICl&NC.'11
~ - P.A~. LIN~"TH o~ ca()PE'-'-A'i&a. 2. ~o
( 1) tl.E5>ot..uT10A> oi:- Suj3e.a.t.Ave-a.. '2. ~"au'-> 11e-
0PT•k1 ae:.]) I 6~ \ M\~ l IJ:r..E:.&..
(t.) ~Ul-TlPLE SCA"11E~\~' IN SIJPE£.<.A'/Ei 2 sttout.J) ae M1N1M\ce.])
MIN f ~! l 38
- M lNll'4tJM NUMBER OF CH AM Bea.~ IU lKE
M•»»LE supe~~AY62
- 1'1 l ~ l l'<t UM fJ Cl M &E: R. Of: A.Al). lR NG tH
IN TQe CHA~ ae &. ltlJb IN THE FA.Akes
- t-\AX\kUM. Po~s1ec.E Lc4'~llt OF ANO.Dr Wlltf'S (L.,)
- ,..,,(/(.Alt A.A-ll~li '"" n.e HIJ),1'1..w CkA"14eJt ~'P)
Lw = t\ 2. o c.l'-t
6\{)sz5°
90
...
-
-
-
--
-
-
-
-
...
-
!\ 1 ·
~ 0
' \ \
0
'
0
I
0
0
0
0 0
0
:L
91
IB) -c.05 -: -------~--,.._'.""", -,-i "':;·; 3 E)(i.€S• FflAH Iii+ CHAHOCR.
c.c: :- ·-ici GeV I~ - i-25GeV _,
o.04 :- ·-so GeV ._; ::----- ~-100GeV - "'n"::i::. ~ w • .,. __
-:::: : -0 .. 02 :-" - - - - - - -- ::Z:.~~ ..... -=~
Cl.Ci ;--~ I • I ' 0 -::.-·.;..;......;.------..;...;,...;....;.. ____________ __
(b) 0.2.5,, ., .... ,. ''l''''I''''
E P-' I
-sooGev 0.20t- 100GeV
-250GeV
r( 0.15 - 750 GeV ,... -1000GeV c.. ~ 0.10 t:-----_... ....... ,_,,
0 . 0
- - - -I ' • • .
0.5 1.0 1.5 Pseudcrapiclify
-2.5
TIP-o.1247
FIG. 4-19. Transverse momentum resolution for standalone three superiayer system: a) 10sPT100 GeV and b) 100 :S PT:S 1000 GeV.
© 0.063 Xo
@ 0. 2. 1 Xo
@ 0.66 Xo
(~)"'" = 1.~x
C1.>~~ = 2 % - - - -92
--
..
-
-..
..
-
...
-
IB)
-~. n=-w ..... - --
. ' t , I ' , . . . ' ' .
(b) 0..25, • • · · I • · · ' I ' ' ' ' I ' ' ' . 1 ' • • •
t: P-
0.20 t- iooGev -250GeV -sooGeV
~ 0.15 - 750GeV ~ -1000GeV 11.
-= 0.10 F------........ 0.05 •
0 .. 0 0.5 1.0 1.5
Pseudorapidity
2.0
'TIP.o.&2C
FIG. 4-19. Transverse momentum resolution for standalone three superlayer system: a) 10 s Pr 100 GeV and b) 100 s PrS 1000 GeV.
© 0.041> ~ Xo (~) p k~
@ 0.14 X.o c ?!-)k~ @ 0.! '=l ~Q (l!)M~
93
- 0.6%
- 1% -
- 1. ~,% -----
-93/07 /10 22.07
No. of X0 in Barrel middle layer Y.Fisyak
...
1.2
0.8
0.6
0.4
0.2
1.4
I . ·- ,:- i ••• - •=: i ,., ·- •=: • I •• ·=- I I' •• ,.. I I' •• ;I ····•• ······1···· .. :-1·!·· ................. -:--···1 .... ··:..-_ ......... , ........... :- .. ·•·; ...... :·•·=··· .... . I ·1,.. :I ·1,.. :1 •• : - ,. , I. ·• . . • ·• , .. . :• :- •-: - :- :- ••: .. :- ' .... i·;- ·· .. l·r ..... i ........ "t ...... ll~ .. -Ji· .... ··:-.......... , ...... liT .. Ij ...... '"il ........ t •• :• .... : •• :• .-I:' • : •• :• . .... ,.! ····1·1·····:·:·1· ........ , ........ 1·:., .... :··i· .. ···:·:·i ........ ;Lp.of =-; ... ,., .... ··•·:·i· ........ ~
I 11 :II : •• II [11 ' lj II [11 : ....... .. .... i .... :·1· ........ t... -~·1·j .. ·-I-=· . ·:1-......... t ........ ·j .. li· .... : .• -.• . .. ... c I•· . -· •· . 1. •· .
I I.: •11 : 1• L.: •11 : 1• L.: •11 : ........ , ........ , ...... ~:1 ·1· ........ ( ......... :-1 .... ;·•1· ..... ]. .. ................... r .. ·1.-1 ... : .. :·=1 ·I ......... :. I • • I· I •.. • ,, I : • .................... : ............. .:. ............ ; ..... , ................... .;. ............ ; ............ : .............. ,
I •1 : l'..U '1 : 1• -.J •1 :
1.2
...
0.8
0.6 ... 0.4
0.2 ...
10 20 30 40 50 0
60 70 80 90
1.2
0.8
0.6
0.4
0.2
•: ~ !I 2 •: I :!!I I! •: - :• .... _..., .... , ...... , ........... J .......... T .. tJ ...... ,.~ ....... , .......... , .... , ..... : ......... .. .... ;m!, .... ~ ...... ,~ ....... , ....... ill-;-................... j ....... ;l,.... ' .............. . Iii, :• ... Iii, ~ .. :• ... I', :• '
•• r.,••u 1n••···••1 or •i•• 1fn;;4;•···r.:~D= :n .. •• " ~· ...:: ·~ 1' r.• -n 'n -'- '! ti ';, ' .... !·:" .. ·•· ........ i1 ....... ·· ......... ,.; .... 11·· .. ·;:·;·· .. ···· "1"·· .. ·· t··r· · 1·i· .. ··~1········· .. .
····!·l·:·ll······t· ........ -... ·····l·!+JJ··· .... f ., ... = ....... 1.f .. 11 ........ 1·1··· .... ·~
... 0.7
0.6
0.5 -0.4
0.3
0.2 -0.1
10 20 30 40 50. 60 70 80 0
90
...
-94
-
2500
2000
1500
1000
500
0
2500
2000
1500
1000
500
- 0
93/07 /11 14.54
No. of X0 seen by muon in 2-nd barrel superlayer
Y.Fisyak
I: ! I Mean F- ....... , ............. :·············:············-r-···········.,· .2014
~ . : i : : . : ...... ..; .............. :-------------~------------··---··········•-------------·------··· .. ··•···-······---·----·······-·•·············• ' . . . . . . ' . . . ' . . . . . .
' ' ' . . . . . : : : : : . . . .
~ ······-············-····························------------.. ··-----------1-·· .. ················Epoxy ..... T ........... . - .. -- .. ·t····· ...... ·-t· .......... ··t··· .......... t··········· .. ~- ............ t··· ........ ··!-.. ---- .... -. t· ............ i" .......... ••i - . . . . . . . . . . . ' . - i.t' : : : : : - . • . ! : : . : . : - .... --~----····· .... :. ............. ;. ............. ;. ............. ;. ......... ·---~----- ........ .; ............. ~--- .. -... ----~----· .. ...... .: - ~ ~ ~ ~ 1 l ~. ~ l
I• : - - : i i . ,. 1· ' ,. :
1 t I ' 1 t r I
0.2 0.4 0.6 0.8 t 1.2 1.4 1.6 1.8 2 No. of X0
Medin . i 578 . . . . . . . ' . ······-············-············-·············-·····································································-············ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
······r············r·····-······ 1-··-----·r·-------··r···--·-··--·i·---·-·······r··-·········1········-····r············ : : : : : : : : ..... ·f ............ ·+· ........ ···f ........... ··[ ............ ··[ ........... ··[ ............ --~-............ j· ............ t ............ . ~ ~ ~ ! ! .P.cl~ vmer' c.oocr1 ete i ' ...... ..:. ............ ..:. ............ .:. ............. , ............. :...... •• ;J• • • .!. . . . .... .:. ............ : : : : : : : : : : :
: : : : : : : :
.... ··7····· ....... 7 ............ ~ ............. 1 ............. 1 ............. ; ............. i ............. ~ ............ ;. ........... . : : : : : : : : . ~ ~ ~ ~ ~ ~
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 No. of X0
95
C.OrJC.l.'-4 Cit\ oNC:.:
~. TkEtl& \~NO C.L!.tC..lAt.. EFP&C.I Or:.
l"\\.\C.."'ttPt..G- S.CATTE~l!V('.,. IW CSaC
FllAkE~ Au~ l:n"~ ON ~'-&ON
t'\Oke~TUI'-\ ~-=~oL"4.TIOl\J:
C.fiA~&e •~ o\li.Q'"'A~P1 ~'\ · ?>oa~ tvor
MAIC.E A VI T Ac. J>ETE~lO a.A'Tt o A.J
2. Tke.11.G I~ NO tJee:Z> To Ml&ll1'41J e
rliE' w I bTH 0 F Fa.AME~ AAI.) e.J>cr~
"5. lPC.&L6PrS.ING.- 1t1E Wlltc L•t.1c.'l''°' 1AJ
THt ~&Al)(..~ S.\.t.P£ Sl 1-AY&li. io TttCF
... A-)C•~UM Po$Sl8«.& (-12.oc ... ) Wfc.(..
~EC.I.SAS.~ Tk;. f')C11't&w~ 0 F' PllA'4t.S
96
-
-
-..
..
-
-..
...
-
-
Presentation by:
Vinnie Polychronakos
-
~--- ~ .LJ7--
.063 PC BOARD
.068
,,:::~,,,,::::,:~i'.'~:':'t'·::<''''''''''''''·:::':~,,:;,_;:::\:;,,,,,,,(80Q;,~,,,,;~,,o;:,:/::,:\:;\\iq, -. . . ~
. ;--- ._ . .. _.: '.·.< - -
.020J .··. . . .
·. . . ' .. -
0.281 THRU
i--- 1 437-----.-
.2501t
. I
--1.125---
t I
.. 100 .068 .. ·----;-·. -
l ]·
.250-j :---
·-···· ;:- .. - . ·--99
. .·.-.. ··- -.. ··-
- .-·-
,- .063 PC BC-"'RC'
/ ,,,........- -- v-"--/
/ /
/
I ... I
I
I \ \
I -I
I \
... I I
\ .. ' '
'\_ ' ' "'- .... .... -...... _/ -
-..
100
-
c AMAC Bus
- -
CSC Readout and Calibration Block Diagram
(Cathode Strips) INPUTS
-... - ..- ~ ..- -... -~ -Channels • I
CAMAC NIM pulsed
4n+1 Wide 4n+2
Router Band 4n+3 96 Channels per :ontrol Router 4n+4 board
,, 0, 1,2,3 ....
• IVnplitude •
control Precisior • DAC Pulser
»~~~ ' -- - T •
_./.
One of 96 Channels
Output Trigger Register
10 - bit Multiplexed Data Out (512 or 1024 Channels) FADC
I Start Conversion
Readout Control Module
•
External Trigger
\
TRACK/HOLD
CLOCK
RESET
101
i.- 16 channels per chip •
,...._
-
Gravity Sag of Sandwich Panel Assemblies
As Applied To Precision Cathode Strip Chamber Structural Design
John Horvath
July 12, 1993 ...
-
-
-
. ~· ., "':'.; ~ . . .
"""" rFIJE..~S c F- o..i e.. .SOLID SL A-& ~Ii~ ~=-~ TAIJ'f-Ul.A-(.. c::.i: •S S-:>£.C. IJO>J
,, ., Tt1-f. t>£f'JIJJ'r)l).J oF I is,
r =- 't> 1.cr11 >J (..{ r-R.11 M. me t-> It u ne..A-c.. P LA ;J a _.,.-n E-<-EMJOJT J. .. .fir
l"toMIVJT" o !"'- I~ 1tie.11A oF- o,.ie '-£.c.rAvt;.ut.AK.
10()
-
...
...
-..
...
--
...
...
. ~· . ' "7 .:: ~. ..
,, ,, ~IJffOSE.. \~IC.RE. P.,'f._E.. ,....,() -..LA-P->S 6[-L\JSD "TU6-e .. :rf+£f2. (A-SSUML ~OTH- A-~E MA-1)£. OF- n+-£ ':5.¥1E MAre:t-1.4'-)
..
h[ ___ st.Ae."~' IJ&uTR.brk Pt..A/JE.. i-+-....,._.-?-""'4~:;...;.--'-..4-""I --- - - As~f.J-'I e,i.. v 1J£urM1..... PLA;JE...
-- ~1...M!> ''e," /IJ£vT"R.AL !'L.AIJE:'. .... .., ... ' ' ' \.
I..A" b h"
(A-'E>ovl " " µi;<UT~L- P<-A-iuE.) - I 'Z.- -o~A-0 A
T ~ ,, 1 h :!. LA-~ovr . "
Nf..,UTT(AL !'l...AiVE..) - - ~LAB lb -lb It.
,l.v~t<.T IA oF A-~E.M&Ly ;
Slf.Jc.£.. ~E- !Wt> ~L.J\.'E>S M..E ~lft-IDL.I ·~ui;;..D11
"TOG-€..Tflf.R.. .J
Tit-E.. ?A-(A.LLE:.L AXIS T~E..oltEM .tv.f>,.'1' BE. hPfLI E.D.
w~ I 0 1~ Tl4-E.... ,,._,~T1A or A '-"Mfo~ A-~u\ I TS NE.uTieAL- f't..>,..VE
b j./ -+ 1'1-
107
A- I'=> Tli-E- ~rtE.A OF: It t..ol"\Po..i~I
v. p I:> -rt+e... D I=-r A>\lC.E. r/(()M /Jr•
A-~SEM~L'f fJ!!tJT/ZA-'- P/.../rA2- To C..01-\ PoAJff..NT AJe.upeAt.... PL-A~E.
I I -..
I A S$£M f'.>L...'1' - 2-I.,
IA~fE.MP.>l.'7' lo I, 3 b h;
- - +-JZ I "I.- .. I A $.SI<>'\ s L '( - -z..._ lo h:;
I '!...
.. •• h
For(. \I-Jo "=>1....1\BS or wt r:>TH b A-ND it-e1t+l-T ,, 11
h '::>T~KE.1) To ~~n+E./<.. j
-1 r ffW-;o...,IE'..t> TO . "BL..1f : "l Lil. . . s\.\-0-lt. is ~<-owui)
·- ) ·,
-"T't) s L 1 P (lJC.. ·~~· ,e~t.o-S~ (<.v£-) -
~ L. h3 J '1.-
...
11 ,If -
Ttl-E- GrL-uE e>C1klU Jl-M.I 1 s A)EC..ES!Aft'r' TO f'~VE'-'T ~1....f'Dl N~ e.E..Ti.iEE.iU ::.1...Aeis i ~ Tf!-E ... :' "~ftf' f',e,4M£ I~ -t.T .. · &01.11:)5, Toq.E..'itHUt. T*-E... -s,A-klb'1!1c..H- f>J\-IJE.L.S..
.,..1\-E '511ZU(....TultAL. Pu~Pos£ oF- Tfl-E .. qJ\I"' FtqrMC 1:>; -~ P~'li:...llEAll "::>L-1 n '"'f- eE.TwE.EtJ "=>l4NPw1c..J/ .. PAt-.i ELS.
.. Ttt-E-- fA'f' ftlA-Me.. MA-TU.JAL /tAJD · ~oMEne1c... T>eS~
. M\1.IT !tE.SI ST :>ttE.A-R., . DE-FoJe.MP.."iJl)IJ,
-108
-
-
5 ~ g. --~· ., "":.: ~ . ••
fo~ A cc.~ or 1DEA->r1c..M- SL-.\!!>~ DF- "ffiE .·"=>AME MA.Tf:.~l~L. Tth\r f..f4:... Flt~TENE.D Tt> f'~E.\fEtJT ":::>t..l\)IAJ~,
--L,.J ti-€ rt£. I~1*.K. ~ -5~ '5TtFFJJ£5f
J.. ~L.lr6 ,::::. S'-A-6 '?Tlf'FJJESr
""- :::: tJ \JM f!,EJ<. 0 ,:;- '?<-A-BS
":>t.ABS F-fe./l.£ Tb ~t..•'De oJJ €.Jk.t-+ oTlt'EK_,
1.,T1KX.. --
When a bending load is applied, the stack will deform as indicated in Fig. 10-13(b). Since the slabs were free to slide on one another, the ends do not remain even but become staggered. Each or the slabs behaves as an independent beam, and the total resistance to bending or n
,__._:_-s~_':65_c.li....., \ ii (;.~ ~E.P t>,JJ 0 (..C. u J(. "'"f' bDPI> J.HJIOS
!
lol
'i> 1-A&S rt.E:E. TD
ro
I I-> :;~£~ft SL-1 P£ olJ eAcH- on/£/!:.
, '"
slabs is approximately n times the resistance or one slab alone. Ir the experiment is repeated artcr the slabs have been fastened together so as to prevent their sliding on one another, the entire assembly would behave as a single beam having a thickness equal to n times the thickness or one slab. 1 n the case or elastic action, the bending resistance or the assembly would be approximately n' times the bending resistance or one slab. From this simple experiment you can sec the importance or a beam being able to resist longitudinal .shear forc_es so that this .. slipping" will not_o.ccur. ·
108
OF />rN :r.- 8-EA-M. f
The facings of a sandwich panel used as a beam act similarly to the flanges of an I-beam by taking the bending loads - one facing in compression and the other in tension. Expanding this comparison further, the honeycomb core corresponds to the web of the I-beam. This core resists the shear loads,
Figure 1
Sandwich Construction
,ti
I I
increases the stiffness of the structure by spreading the facings apart, but unlike the I-beam's web, gives continuous support to the flanges or facings. The core-to-skin adhesive rigidly joins the sandwich components and allows them to act as one unit with a high torsional and bending rigidity.
Face Sheet
Honeycomb
3E •
ftic.L ~££1's c.Mt'! ltJ·Pl.J.tJf. TEi.>'!>t o PJ of.
c.o ""PltE5srol\l
110
Fabricated Sandwich
Panel
-...
-
...
-
---...
-
....
t f't~ii.iiJ ~ FAr-E..
tsA~""* f _j_ \ I \ \ \ '<-;0 ,l',~ ,M,,.._(~~ 1~~ \ \ \ \ I I f t t::::=:::=====::::::::==::::::::::=:±:::::::::=:==l.;""""2._ FA-c-E.
t'<;1(11J ll""i•r----- b -------+-+
s11.1c..e. 11+EMA "r-C:R1ttL,
co,tr_ MA-TIE!l.iltL /S 1'<:,oF-T" c..1>,._.l'A-/e.~O Tl> 'Tit£.. F-4e...
11 is 1G-lloft(1) p.; i1t£ J:.;vEfi.:r//I, c..f>r-c..ui....1<-T 1o>J.
- - -j I
I i ' j ·'
: I
! I
k ! -, -,- --
~ I I -~:::
- ---
t\ •I
't>~rl rJE... h .4-5 TH-IZ... qiEJJTl<.01')) 'P /S~Alc..tc:. f:>f_T1JE£.AJ TH-£ FA-c..ES (b15T1't1..1t.E.. e,~n.iE.EA> NE-UT"/Ur<-. ~uf'l..~E.S)
I :c
L_ To +·I. A-a-"" -. 'GANOwr_c..f.{
~
b *;:,.,· lo t-~,., +- b.t" ,) ::. +-I "l- \"t- SfCJ
l!>
"''I.. 'L Jo ';t;loC I N + <- b :t."''"' - \"I-
J~"'l)wr <J./ ~ b *"~,,., .
+ lo *"~)<Ii.I ------··(p -z...
S1tlc..i'- TH-£- ::,i<:.1 .J ~1(.j(J.)Ef.S l rs.._,..,'\ 15
Tt\-E.- 'f 1 Its r T E.lO'\ .c o N Ttl I f> v T:e.S \J E.1t y 'P~N~~ ST"I FF ,.J E:S5, .. _ .. , , T\'\-Et.£.ft. ~E... . I tJc..ftEAS I N Ct- -*;!(.I i.J Erfe::c..r D/.J 'STt fFN£sr
1 _
ll ,,
ir h ...
~)~+- bt~,Jt-k:)
AND _ ,..,c.ie.£:As11Jct- h . '$f¥iCJt...D . lt-~vt: A- ~ E..Fr-ec...r: Al-sQ/ c.t.{{.E... MA-TEJ()~L $+}£4/{_ ·~iltff>-JE.SS JS Ni:£.f>E..f) TD
____ J....llJ"- S/(JAJJ,,, &ILT' .. jT'S' ~o~ 1.JE./~r . lS I>f:Ab L..oAb.
111
0 o• -. N• •• ;; i ••
s1t-~1>w1c:.I{ Tll-l'-lUo i;;s S
..L m· ~:::!>::I:::c::::l.::::i;:::cL::J::i:~ T
,, ti
11:>1tM-c..Y p~vf£wT&:.D F/to~ -<>L1 f'f'Jlllf- P.:>Y 'f'£~Fcc:t
MP.SSL.IE.~..' ~l uE..,
fT. = A
-'!; ;. bl'$~£ FJ'{of'\, tJ~UTIU.'- ~\J~FA-c.E. OF A-0::.S!<-M&L'r' -;u NE.\Jl"ieA-'- Sll~FA-<.E. Df'- n+E.. ).-#..· .:S.~1u
~' -'TIH5. A~TH-1"1£.'rlC.. i-+-lt!:i. 2>££~ P.Rot:;U.MME.D IN70 /\ ~P.R E.A-t>':>l+E.E.T Mil DE_t.. -'--
ii-IE. ?PREAD~\tE..E.T 0rt.c.ui.AIES_ I,_~l"l&c..Y Us 1>-.)f-. ~ 'l'AltA-l.t... f.L.. Ale.IS -n+EOIC.EM _,- T~ ~~£. -~ A-'OOV£~ e;;.,.;; .. : -
1\\E. ~f>f:.EAI> sift£T. ~o'D~. ?Ro VI D£S- T:..A.PID - :
_ c.1+~c.1JL-1tr101J_ oF -""".::>~E>'\eLY __ "OT1FF..i.>e.5s· ·· f>,'$ A F olVC 'rlON Of", \/Altl ous PAft'-f+f"lE.:rE.f<.;. \/Ac...vE.S.
-
-
--
--
--
-
-
-
-
-
-
- C.::.TW<- oF- 7 "::.A-Nl> ""' <:..r\- ?A-NE.LS - ".:>f\ND\V1<:.tt !'A-/..JE.-L Til-lci:::N£SJ =- Z.O ............... (_c_aNJl1\~1J _
VA-~A.-ME:t~S ~ - ~l\"11>'->IC..\4- 'i'A-NE-1...... SKl>.l 1H-1c.1<-NES.T (_ 0,)-.<!o.i't-:.fo.-.,:
- ~ r::>f ... TwE.&J :>A"'!>J.JI c..1+ f.4,.Je..1..5 ( o,o ~ ~M' ;. zo-) - '5qf oft NO-S"-lf (t;:_LvED) E>E...r\.lEEIV PAl.JE...1-$
\l+E... ~E:::,uLr.S o F- n+E.. A-E>o\/£ ANA-L'l'S£..S A-RE... f'-cirE.D C N Tt+E... f-oL.1-0 "-Ii l,J~ PA-q'.-E-.
(~If '}'Q11,1T O.J II+-£ ~+\ K~f'f?E_S£.JJTJ 01\)E srterMJl.1£&-T ft-NAC...v f (J' ~.iJJ)
Tl.\-E.R-E.. \'!:> A 'FA-C...T~lt.. or '3"/ )1'.lC...KE.AS~ lt.J A':>SEM!3L...\" ~TIFF/JESS P.:>E...n..vut.J Ac "SL.If' •• AN'!) A- "N0-":.L-1f'" :>TA-c.K o~ 7 PA~$ win+- lb ............. 6;-AfS f)£.r1JE.£'.N PANC.LS <.;{.s"'"'=- o.r--)
TH£ "llUL£. ~T~e,'' ~A-Pit o"" I"No-&-i~ =- M "L t_,.v-~i... .. c1>
IS Stf)..I T\:) FA/...'- Ac.t-oss i;:~Afl{.S folt. vAl!.1ov~ ~AP ':>16-ES or- ~c·Sl..IP A-SSEJ"\P->'-•E.S. Ti+£. "~11l.-E... oF ~uMe:." 1~ fOlt. A ~()LID fA-r..Jf.l-. '$,\A..IDWl'-f+ fft/JU..S e:.£tl-~VE...
1:> I F FEJ{.ENn. 'f.
11\e,. ~f~M.... c.A-&E. oF- A- STA-<l'-. OF 7 "U>l""""\-TI+I'-"-. SANPIVlc..t+ f'~/\J£1-S IV t lft 10"""""'- ~Kll'.JS A-Nl) ~P.::.O.o 'KE.tt.opuc.ES TH-£- J:..,
0 .._ .., =~"- l=- . V,4L..vE.. E><At..n..'f.
•• •.,L\r · ,.\.lf'-Al-1.twQI
0..,c. \()""""" SK1tJS o~ A "-.ll ~ ?~""1CJf 1s A 'SCH .. 1]) f>At11£L. ~AY' ::..o,o l.S ~ e.01..rD A':>SE.l-\0C.Y.)
,.., ~E.NEAA1..., T»~E is I\ P£.c.t.EA511.J'r ·f'AYor-F F-~ 1~EA-S1Mf Sl:'Jt.l Tlil<:.µ.IESS Fo/f?._ A f'I )(E.1) -SANJ> wrc..i+- r/1-t(.¥-NC.c;.s. (NUT£:: STlf'f'iJ~S.S A->CIS IS L..o~A~1rHM1i:..-.)
al 'E _, Q)
-· .5 .. 0
'E Q)
E 0 E u Q) N ·;;; E 0 c
•
1
0.1
0.01
0.001 -
0.0001 . 0
•
Normalized Moment of Inertia Vs. Skin Thickness, Gap Thickness, & Gap "Sllp"
Seven 20.0mm-thick Sandwich Panels
("ideal" zero-shear glue assumed) •n-squared" Rule-of· Thumb
is exact for a "solid slab" v (skin=10mm, sandwich=20mm, gap=Omm) •h
- ---· >!.> __ _.c;
~ I'""' _... • ' .,.- ··-----"' _,, ~
.. .t:..---"
~ ' :... y
"'
),
,r
I.Ir'
. ,.
v...,....i r
~ v v ."r --~ y--v factor of 39 INCREASE IN MOMENT OF
INERTIA going from slip-allowed to no-slip J stack of seven 20mm-thick sandwiches
wfth 0.5mm skins and 10mm gaps
............. ~
I/
v v skin thickness = 0.5mm (baseline)
.. .... . . . . . . . . . . . . . I I I I
1 2 3 4 5 6 7 skin thickness (mm)
8
• • • •
•
. 9 10
solid
slab
•
-4- gap= 20.0mm ("IDEAL" glue)
-a- gap= 15.0mm ("IDEAL" glue)
.... ~r·- gap= 10.0mm ("IDEAL" glue)
-e- gap = 5.0mm ("IDEAL" glue)
-tr- gap= O.Omm ("IDEAL" glue)
-Jtr- "n-squared" Rule-of-Thumb
--e- ANY gap size (SLIP ALLOWED)
•
file: skinvgap.moi
jah 7/12/93
• • •
-
-
-
. N> ., "":'.; N • ••
TH-E... o~
To
C..AL-e...uLAilOkJ OF ~TlrFNES.S 'OKI!..) nt1c..J<JVE..5S IS Nor C-1-!AM b E.R.._ t> ES I q..t-.>.
/'rS A F-~c.. T It.kl DI ~B:-TL '( A-f'f'L.. f 0\-BlC:
"=>TIFF-t-.l~..$S Wt.\Jl-..7) OE. 'DIR.C..C...TL.. 'r' APfL-..lc.AP.JLE. IF- c...AA-MUI(. W E.1&1-\-r WAS A-IUJIJ5Jt;.NI F-tc.AJ.JT Ff{A.{_T JON OF T#E.. T<> TA-L L._Q A-'D 0 A) TifE... c..l+AM'OE..1<-.
Fo!Z c.A-TltoDIZ- ~Tte.IP c..HAMBE.tS, Tt+E..- WE-ltH/T oF- 71-1-E. STf(\IC..TUAAL.. a:iM?oJ-jJC:.NT! 15 A-'f>ouT "JO?., cF- T'r\-£. TUTAL '-.()At>. (NON-S.rt..vc.:rv,,.~1_ rf ... !-£..LT/loAllc_;,J uTll.-ITIEf
AN';) /+t.1~/JMf./JT +tA-..eDIV~'E.. c_onf'1?.Js£ -rTJ£. £.E'S•.)
"SI /'lC..E.. INC.~E.A.SJA.lf 'PA-tJE.L- -s~;.) THI CJ'.\.li£5S /\lCI OAl'-Y )Nc..~SE.i' frSSE,J'\6LY "5Tlf-FNESS lOUT lt-<..Jo /IJC.~Sf.S ,, C..f-1.Al"\P.>I!~ hJIE.-/~ T, Tl+-£.. Jl"\Po~TAi'Vr JtJDJ~j't)R. F<>f<.... C:tl-AM0C£.. '5l~11c...r\.lfZA.C...... ~~'?14-11.l FoR. 5Ti F'-F/Jf.S.J
1-::. ~R.A"1T'( ?A-4.
Tl+E. f'oLLC)\,JltJ'" 'YM-E.. C..t1i-.!TA-11JS ~ l)f:F<-C.c...TJOAJ ~f({~S.SION.S Fol<.. VAf{l{)O.S ~\)ff'O~T i...oc..A-r101"S.
Tl.\-L Mi:.ST u.~E.fl.vA-11\/E. (J.t.usr ~£,IWl_T'( SM-) ~Ote.1JltS f-C)f<.. '$1t'lPl..E... t;vffol2..T5 fi;f Tt+E- t..')(r~~ £1-JI:> 'POINTS.
(-ri+e.. Df'TIMUI"\ 1-oc.ATJt>.J.S F1>1<.. ";;>Uf/'OJ(.Ti"'4- Pr u.r.JrFoitM 'iO t:.A Y\I\ A~ I+ r ro 1.ur s o. "2..'2.. ~ L. ff.o I'-\. Tl+E.. EIJll.L Ttt-1 S I S c.AS L. 't; o"' Tl+E... -c...it-111-R. T)
11\L sL!\SS~ srcruvJ "DJEiC-nllt- t...J ~S /!t- FoAJc..r1QJJ OF ~oSS"-':1~\ION 'Plll"\~IOµS Of\JL.'(,
Ttl-£ ~ ~'llT'( ~§ \'S A fuJJLl/OiJ o F- rl+E.. c.~o~~-•EC.T\ol'l kaMEJ.Ji o;.. 1NE:.Jt..r1A- ~e.v1ou.s<..r c.At...t."'-"'"'1'1C.'I))) MA-~1A-L.. f'lltlPUL.VS MA-TE.J{\AL t>lCJJS 1 'i'J' .BEAM 1-E.JJ4n\, ltt-->1> -Suff'()~T~. J
115
I-' 1-• ~
•
0.GAM C .... 1.C:.ULATION~ - !>Pl::CIAL CA<;ES. oi= un 'T'\.-4 UN,'J='OR.M 1-o"'D
-$PEG,,.,_ CA'l.I! -u=~=a cAo;.'-.io
E'QUAL -.....-c ....... Q)
.+- ~c:.~8~1. ~:J. SUPl'OR:T$ C.l!.rrBl't
© ~e1tO 6&-0PE "T 'E!Jl>S =c:.5'17 L -=t.2.11 i:L
@ NO ""IJ1> t>EFIZCTION L .511 L :J.2141..L
e""1> .. eGNTISR. ® l>• FIEC.TIOr.I S l!OQllAL • ,,....- L .5~4L J .2'2;i l\'lllJIM~M CWERllll.lo 1'5Fl.ECl'IOIJ
® .
i!:GIU:> $Of'f! · AT SUPPORT:; - C .ss1 L :J.zz:l @
~ C.&,.,Tlll"- 'l>s;FU:C.TION ..,,,-.2?.S'"j. .523L
IU~'t"I~ 'POnJT' AT CQ.lre~ Mii~. 'l>5'Fc..£:Cl'ION kr Ge'IJ~
~.sooLJ~ i!:ISRo ~ ·~T' ccr..mo"°
• f f f
'5Y111""1°1l ICAL Jf.J o V1Jli-
0VIGl1!1-1AtJGti-JG S!!<"M S. Lo ... D («.l!· lb.,/1"')
:-11'TA""• llN..1 MOIW\C,,T •T ... ~ ..... ..,, 'DCFl-C.LT"10 .... Jl5. s::'LEl...,.f°"' WA1 Ftulrl C~fJ• C•JJ'T9• PoR.'1',.(M,AJl. A..T Ct.JPS. ..,. a; t..tTeA. T•.R TO tu'lK- '1"-f) """""'"') ~10.,. Pol"IT'
"1<." F. ""'--Re'(.c•21)-.I!) Wl"I. (:t~ j.J/ 2
(rou ..... u zsec - ~ •T 24E "ME:I c, Mf),...,,.)
==·l.£2.- ,_.,_ ... PllAl. ___ , pL\tS • "'DowN plu~ • 'tlow..J fll.UJUS::: UP M1tJIJS. • Uf'
L4 4 .201 L .01.IA. W~ .. 02.14 -u> L2. -.00021 :!!!.- .0001>15 ,., L.
E:Z: E:X:
4 .00051'2. -:; Jr. 4
.1% L. .0192 ..., ....... .0223 .,., L" -.000078 ~ i;. :r..
4 .1e3L .011111.11.?' .o2?>0 ...iL._ 0 00044b :!!!b_ • e::z:
4 .oao2"8 ...,L4 .11.4 L .01?>S....,L .. • 0248..., L.'"° ,00o2.b6{~
!>. :r..
,0252.-WL .. 4
.0002?>7 10 L4 • 1~9 L .0121>-wl .... .OOO!W1 ~ 1:_ "' :z:
• 101> L • oos7 wL ... ,OZ84-u>L ... • 0007.59 .,., L 4 i;;.:i:.
0
0 0 .031'-""L .. • 001131A.JL4 ...
-.OOOll.'l.1')t..: s;;.z. Ii.I
* • ' • f 4 •
)
Cl I-' al .... rn
-- -~ ~ .... Cl
"C Ql N
"iii E .... 0 c
)
Normalized Gravity Sag Vs. Skin Thickness, Gap Thickness, & Gap "Sllp"
Seven 20.0mm-thlck Sandwich Panels ("IDEAL" massless zero-shear gap frame and glue assumed)
1
~
~ ~ Factor of 39 Increase In gravMy sag for a
0.1 1 stack of 7 sandwich panels with 0.5mm
j skins and 10mm gaps (wHh "IDEAL" glue)
·~ I .._,
0.01 ·: i._ ' . ·- .
-
'""' ' ' ' ... i_:· .. - .
.... ~
'°'- skin thickness - 0.5mm (baseline)
0.001 I I
0 1 2 3 4 5 6 7 8 9 skin thickness (mm)
?'-
--
'
' )
' I
10 solid
slab
Factor of 49 Increase In gravity sag
(n-squared Rule-of-Thumb Is exact) for
stack of 7 solid slabs with gap = o. Omm
-+- ANY gap size (SLIP ALLOWED)
~ gap= O.Omm ("IDEAL" glue)
-tr- gap= 5.0mm ("IDEAL" glue)
-e- gap= 10.0mm ("IDEAL" glue)
-·"'1:1'-·- gap= 15.0mm ("IDEAL" glue)
-e- gap= 20.0mm ("IDEAL" glue)
file: sklnvgap.nogl
)ah 7/12/93
)
< . "' . ' '"':.: ". ..
-i(i •
I "" Tiff.. ?~E:..Vlov.S A-kl,4..1... 'r'? Is -nJ-.E. -:;TA-c..K. OF ~A-1-..lD \.JI C...I{ '\l.4JJ£.L.s (\Al I 11-1- Gr-MS ~ic..r..i E.S..A.J ?A-.VELS) ""'~ A-:>S VM£?> e,oJ\.lllEJ'.) Ac.R~SS. TlfE. ~A-l"S IN 1 l+t '' :LOf.A.L.• MA-~.S:i.£SS ~L....UEO.
IN T~1S P.>fNDIAI~ A-tJA-L-TSIS A-ssun PT10,J .. M~C#A~1c:s, \\C.~CISS: ... ~E.r....T1<>1'l!:. 15 -=-TA-T~ · A-S. R£.MA-1>J R..A-r Dv,_,"'~ f3EJJD1Nt.. •
fOF... Pt..ltPJE. B 8-J I) I J\l~' 1'J le.. IP
Al
\"'~or :, ~v..e.s JI It. I o
A I /A D\
~.::: , e. c..1
~ "') ~ 't c::::: ~ ,~ \ $4 ~ J D
Ai...L... c..Ro~s-s£.C.\l!)tJ 'PL.A-tJES (;..-A, e-.e,, ... ) REMA-1U 'F~T 't>l.l~IN~ 2>E,.,DI~~
-;,r~1'- oF :, '51...A-BS
'" Pl.AUE. l!>ENb1~
To A4f-llE-VE. T1+1S 1-.P..l KIN<t- '!2>rrw€..£1J ~L.-A-e.s Tt+E. t;Af'S Mu.n- ~re.. ~PA,.,~E..I> AT 5uFF1c.1ENT L..oc.A-r-10,.,s ~ ,,.,
_ __. f.t- MAtJ"-leJ{ T~AT . ~E..~I ST S_ T~E.. ~EA~ L.oA-0_ 11-Jlhlc....E-D P.:>E....T._, f.E-U ->i.A-'2>S.
J'";l-L. <::>A-/\11) w I t. H ~il\-N EL S A-f:..E. £.: t IJ i<.£.,'I) 't'T) <rE Tfl-C.(Z
jl\lTtl A 1 '~A-JJl)"VtC..tt .. OF- ~~b""I vt£J" ~.,.. Ti-I-£ G;F>r'P Fl<'.fl>l-\E: • I..l)E:lk..Wf Tffe_ ""6-A-f" ~£ 'E:>ftouLD t'fl.~VEJ.JT "!:lt+E.AK- 'Dfi-Fo!CJ-11\ilo"' (S''-IPf'Jl-Jf) ...
Tl\-E.. E-FFEc..T"' oF- ~A-P F~Ah e.. w11>ntS .:;,A,JJD ~~S.E..Mfl>L...1' l;-~\/Jfl( t;.#i-4- 15 L.4--LC..VWl-T.Cf) ~oniE.ie.. 5f'i(.£A.1)~fot.f.E-T A-s f'oLLOW5 ~
118
----...
...
-
-
-
Ttl-E.. Movuc...uJ or- ELAJT1c.. 1rr cF- n+E:' ~f' F't?.1+1-1£ MA-TE-"-1A<- .1.r A 1-1A-~1A-<- Pf4iPii..K..rY,
If ~
TH-f.. l->ltlMEllll 0 F 11J£:/l!.TIA- OF- 71+£ tfltf f'/eA-1'1£:,
15 /+ Fu.V<....TIOI\/ OP 71+1£ /'rMt:;,yA.J'r fJ.-t.Jb rn£ i.-. o '-A-n o "' o r n+,;.. tr-It P P ~f'rM s:. ( 6- eo ,.., e:TJ'J c_ t>1.r ne.1 ,;vn~w),
Tiff_ W{; IJ-11-T / v,_, 1T 1,..fl.N&..TIJ Dt= 'T'l+E. ?A-f P-/!-A-11& KA-rE.~tA-~ tS A ~uAJc..r10,J OF-- i3or# me M/t-~f21A-L !'t-"'O TI+e tf/:oJ-1E-rf!1c_ T>1srte1evr10,;,
II II Tift!,, ~lt/7 F/Z./1-~e. "'->!£..<-. e-A-/!.f. 't .,,~ r or nf£ ~/JNDw1c_fl- Pl9-N£<- w&1~1f'r Ir ~th4-P ftZ~Me... £. s. IS H-IC..#&/t. IH-11-N "TttE- ~lk.>1' '-"' ul fM £.l- E, S.
t-l-o v Ii'.-\IE rt 1
Tft£-. As .r \) M f Tl o l\l ~E..HA-11\J F"'-AT" #>-)I L.L J.>C)I. 1QEf!,/'r~ f~f>rMJ: 11-t..<-owJ ":>~Ii.A-"-.
II 'TftfrT C$.ti.S .f - 5" ~c.. T771 tJI'
-rfl'J £ I,.. Tlt.E.. 't>f:.FOK.MA-TIOl\I 'T1) oc.c.. uie:,
TtT-E- (l,.f?.lo1Je. J.JA-t<fZ-oi-J Mi:>
AN!+1..'t'.11J M.f\I M~ TH*T e-vffe'J n+i;: H•IT SOFT ~Rrf' FJl;4-M£. w/1..1..- A.JOT '1'/-£.Af?..
fl)!(. '5~l>w1q.J, AsJtJ1e>4e~, 11f&- 'l.f'Fec:1 o~ ~f.l.e.A-f- -o,:,FDie-,.,A:,-tOIJ 11J · 1ltt:- /4-oNTE'l'cti~e '-'l~P 1-1u11 BE- c_e.l\J-s1 o~'I>~ {lr-J wt.I..<- ftJ i7fli.- G€6Ht--T/(.Y l's-ND 'f/R-01'£/tnl!J oF T1I£. ~JR ff.A-MES,
119
~· [ :i Cl
•
Normalized Gravity Sag Vs. Gap Frame Width & Gap Frame Material
Seven 20.0mm-thick Sandwich Panels, No Core Edge Filler, Skin Thickness = 0.5mm, Gap Height = 1 Omm, NO SLIP ALLOWED
1 -I I I I I I ~ Materials "less stiff' than the sandwich v _,, - panels are partially •carried' by the panels. 0.95
v ,/"
. ~
. v _,.,.
0.9
0.85 v -,/
i=== • :"' .
""' Materials 'stiffer' than the sandwich
C> Ill UI
£; 0.8 fa .... ~0.75 Ql . !::! ...
...... panels 'carry' part of the panel weight. -,........_
""': ..............
Ill 0.7 E .... 0
c 0.65
.............. ~ -........ ' -
0.6
0.55 -,
0.5 . . . . . . .. 0 5 10 15 20 25 30 35 40 45 50
gap frame width (mm)
• • • • • •
The 'IDEAL• gap frame material
adds no weight to the assembly and
ALLOWS NO SLIP (no shear deflection)
between panels.
-·E- epoxy gap frame
-V- "Vinny's" gap frame
-6- G 1 O gap frame
-+- "IDEAL" glue gap frame
-A- aluminum gap frame
---------------·-----·
• •
file: gfvmat.base
jah 7/12/93
• •
f-• (\)
t-··
1
0.95
0.9
i 0.85
f D> 0.8
i "iii § 0.75 0 c
0.7
0.65
0.6
·--.
Normalized Gravity Sag Vs. Skin Thickness & Gap Frame Material
Seven 20mm Sandwich Panels, 10mm Gaps, 25mm Gap Frame, No HC Core Edge Filler, ("IDEAL" zero-shear glue assumed)
t
0
'\
""' '
""' Although Hs modulus of elastlcffy Is
" 25 times that of epoxy, aluminum
I gap frame reduces gravity sag by
only30%.
~ '~ :-.........
I - ........ --......... -
""-..._
skin thickness = 0.5mm (baseline)
I I I I .... ' I ' ..
' I
1 2 3 4 5 6 skin thickness (mm)
-E- 25mm-wide epoxy
-V- 25mm wide "Vinny's"
-6- 25mm wide G 10
-/It- 25mm-wide aluminum
. 7 8
. 9 10
file: sklnvmat.gf25mm
jah 7/12/93
,
e..D~C.. F-1 '-'-!CL. IS ~IMP L.. 'I' A'O ,4-1\J'D W I <-If Ul /It£. MA-T /i:../-IA-L ,
I-Ts rz.,Fl"ft..c...r oAJ 7>E-Ft£.-C-T10AJ 1::. p/?.ot'or<..r101\)M... -re , r:s ~rt-1--~ltVE 1 FC-FF-&c-r111/i:- :>TIFFJ.J£.S'.f • (A-s D1sc..v1J£1) '"' ~E.'-A-TION TO ~ F/t.-lrMC fL,.pec .. :r-1J.
II+{.. o~L. 'r' ""'1 t.Jo~ i>I PF£1(.e.>.J'-'£ I J n+-14-1 c...o/ZE... E:..D ~E-- 'Fl L.L.tr./t- t>IJ fLA-<-ES H-<!~£'t' LJ>M.5 /'-1.4-~IAL. ~IN~
i+o1V£..t'c...oMe AAr ~ Mb{)u1....vJ '"" nf£_ 'Pt..A.JE. o,C T1+£._ 'PIW~'--~ L....1~f..l..T f+>.JD <;;.T1FF' s~ -F-!Lo...e/!J ~uc..t+ Al 6-lb 'f't4111oe! so~ ?JE-Nt!-Ftf) P->uT A-DD MA-SS.#
122
..
-
-
..
..
...
...
...
1-• (\) ...
. ·-
Normalized Gravity Sag Vs. Sandwich Core Edge Fiiier Width & Core Edge Fiiier Material
Seven 20.0mm-thick Sandwich Panels, 25mm-wide Epoxy Gap Frame, Skin Thickness= 0.5mm, Gap Height= 10mm, NO SLIP ALLOWED
1,.-~~-.~~~.-~~-.-~~~r-~-::::"'l: Materials "less stHI" than the
sandwich panels "load" the panels.
···1:a=r t t J 0>08..J' ~--== I Ill . -, \ I I I
.. ~ 1-~~~~~~+-~~-t--.~~:t::::--~ I!! 0>01-1 ~·
·~ ~-+-~~~-r--~~l Materials "stHler" than the sandwich
panels "carry" part of the panel weight.
g 0.6-t
0.5-1 I
0.4 I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' I ' ' I I ' I ' I 0 5 10 15 20 25
core edge filler width (mm)
The "IDEAL" core edge flller material
adds no weight to the assembly but
removes core mass (replaces H wHh
massless zero-shear glue).
-E- epoxy core frame
-l,J- "Vinny's" core frame
-f- "IDEAL" glue core frame
--&- G 1 O core frame
-fir- aluminum core frame
file: cfvmatbase
jah 7/12/93
•
..... l\J .. ~'.)
•
CoNcLus10NS ~ W\A6N1Tu.DE OF C...tA~8E'R. SAcf is Mtt;MlY DE: P6N DENT ON: • C"Arf\BEJt SUPPORT lOC.AilCN
• J)E'Sl 4fJ OJ: 6AP FllCAIV\E
Qii.'f' FR1'tt\E DES.\4;11J WI\..\. PE'TERl"tHE HOW
C\.OSE w C Co"4\E IN 08TAtNIH't -rHE '' PE:RFECT '' S ... E~R. 801'0 BE'TWE£~ SAND.w.•cH PANELS.,
Tl-\ \1 S ~' ~ t I"\ & 1 N '1 CM A~ B S-R S A~ : • Ei~O~ETRY (Tti)ca( ,JESS, Wl'OTH, fl<T~N,T AR.oVJ..10
f'ER.• f'l\E"TER OF PP.>11 E &..)
• rt>~TE'R1AL f'l\E~M AIJtCAC.. 'PRof>ERTIES
• f'~NEC.-To- PA>JEI- AT"T~tM 1'\EN r TECMA/J ~ V( ( •ot-TS, AP ~E'S>VE' _. eTC.)
GEM Muon Meeting, 12July1993 F. C. Belser l\\:
4 f f f f f f f • - 4
- ~o~LQµ.. ':lr/t -z.. I q ~
5c\'V\e thtiw:s-r,\ts DY\ Opef\ u;;~ csc...
' I .
\we
..
+ ....
.. ,
L.owo~t-oYd.l!Y- Le. e ~'lr\~e.
+. •
• - ~- _ ... "" .,,,, ..
• .. . . - -
+
elb.h(,,~c.. ~. · :. ··- ... ·
• .... -
t ~ \A. l~,p e : C.E:Q.tJ 6'\-te(l1l' & ..,;\ r-
•• - •• ·-eo ., -· --. • --' ..•. _, ..
""' - -+- .;. -
f e - ~ l {.l. u ~ ,~ ~ -·· · ~ '2. "\\ E:o s s. ~ ;> ~
127
. . .
. . =
\-uy- 5 :. R_ :. '2.· ~ '111\M
\ """' :. o · 4. s tJ tw" '2.. o Y-""" -t ~ ~ \ ~ w I~
, L c.. " - \· ''+ ""' .
D-¥1.t e..... e..~ e..tA-s
~-j. CP..~ck ·~
·it-'~~ . -••
. -
..
128
+.
•
..
... •
·~ .
• •
•. .
• . 1'
-
...
...
-...
...
-
...
-
~. '>hl it i 1 \IA. \)(., tl.e.s~\1" CpM. ~ \'~1bve..A_
.•. ~A..r.I ~ ~1~ -tlt \ c.k.er ~·t. ld w it-e..<.
(., .
d .\ t' M \ y ~ DC. Jtt,\~'111 t<, ~· P~""'°'f 11 w~
\.u_-t S~lc\ ~ o.J.~~
··--·-··- .. - .. · ...
Q... ~~ Q.. u,t\cl~ (. \·'S' wt ')( ~ ) p "D ~~ ~ ~ -...e.sal.w'h·tM l ~~\l~-~)
b. ~T~ ~ ~~ l ) ~~
~~ L :t .. ~ ~ 0 TW\i __ =a-~ ~ - .
-'c{M\ 'f\.\ • 12~j
-
-
.-
H. Ohgaki ~I al. /Position .r~nsing in thL SQS lransition r~ion 523
·c, 30
Q; Ar· CH•(7:3) ~··
c c Va:2375V .~ .. 20 .t: Proportional mode u
(~ -"' c
" 10 0 110µm
",'!; u
' r •.
712 Channel
~-.: fig. 2. Typical position spcc:trum obtained in the proportional / mode. .-,. ~·
tbe figure, the position resolution of· the proportional <: mode reaches a value which is determin~ by the instru-
mattal limitation due to the beam collimation and the dectron noise. On the other hand, the position resolu· lion ol the SQS mode begins with a value higher than the instrumental limitation and goes to a serious value of about 1 mm. As for the avalanche size, the transition
·-. (diJplayed in lig. 3 as an arrow) from the proportional ,. ID the SQS mode as a !unction ol high voltage can be ... observed in the position resolution data. The position ~-. resolution of the SQS mode is worse than that or the
!, proportional mode. The fluctuation of the localization ol the SQS discharge, however, can be considered to be less than I mm. Since the width of the SQS avalanche is considered lo be less than 1 mm [2,5], the large nuctuation or the localization of the SQS discharge cannot depend on the avalanche width. Then, the fluctuation may be due mainly to that of the path ol the SQS walanche.
In addition to the standard quenching gas. so called second quenching gas, !or example ethanol, methylal and so on. is considered to stabilize the SQS operation [8,9). We measured the position resolution ol the SQS
c ,g ;; 0
Q.
sos.-
Proportional
0.1 ·-- • -- • :....:.:..
0-•~. ~·:_t;Afn"Width-Ar+CH.(7:3)
SIN limit
0-01 L-..LJ...J..;UULL-...L...U..LJ.IJW....-'-......_.....,_.,.. 0.1 10 100
Avalanch" Slz" (pC)
Fig. 3. Results or the measurement of the position rc~lution =i~ a function of avalanche !>i7.c.
(a) 'thanol ··i e 0 ·1. .. .s c 0.1 0
"5 1 (b) .
0 2-6·1. .. .. i "' "' <r c 0.1 0
1 "iii (c) 0 8 .,. .. a. . "~1
Oll--L...1....U.il.ll~-L..LLU.U~ 1 10 100
Avalanche Size(pC)
Fig. 4. Results of the measurement or the posilion resolution in lhe SQS mode..The counter gas was Ar+ CH, (7:3) adding
:eth;.,,.,I vapour or (a) Oli. (b) 2.6!1> and (c} 8!1>. Arrows in the figures show the 50$ transition points.
mode in different concentrations or ethanol. In this measurement. the beam collimation was nearly 0.25 mm. Fig. 4 shows the results or the position resolution or the SQS mode. Arrows in fig. 4 show the 50$ transition points. In this figure. the position resolution improves with higher concentrations or ethanol. From this result, the second quenching gas. ethanol, can be considered to suppress the fluctuation of the localization ol the SQS discharge. In the practical use ol the SQS discharge for position sensing. the second quenching gas promises stable counter operation and good resolution in an Ar+ CH 4 gas mixture. Furthermore, ethanol can absorb the UV photons which play an i1npo1 taut role in the transition- mechanism of the SQS.
[R our previous data [6], the double SQS mode was observed clearly and the position sensing was tried 'vith this mode. In the present work. we could collect no tneaningrul events that arose £rom this mode. This may be due to the dif(erent cathode surface conditions in the two experiments. The double SQS mode is considered to be sensitive to the:· material and the· condi-ti:on. of the cathode (SJ.
4. Condusion
Position sensing has been investigated around the transition region from the proportional ·mode to the SQS mode. The position resolution ol the proportional mode reaches to about 0.13 mm (FWHM) which is limited by the beam collimation. On the other hand. the position resolution of the SQS mode is \Vorse than that of the proportional mode. The nuctuation of the localization of the SQS discharge. ho,vever, is less than I mm.
11. GASEOUS DETECTORS
' p
11 i! !3
!J ... •• •• ;l
~- ~
u v' -""" ~
'3) uo ~ .c u
• •
(o,AtlJjJ~J,,"f Charge Distribution of G~s 1-a 1 00% Source Fess, SQS mode significant by 3.20 kV
30 micron wire chamber
No pfJ.~ fo 1 fr~"''V lltoJt 11;.U' ~Ill
105 1 1xr--tl~-t-l~-t-I ~:1:---1~-t~-t-~-+~~~u~I ~ I I I I I I -;1~11~+---+~+-~~+---+~4- I I I I I I ; ' , , I
---------------!---------------···l~ •••••• : ••••••• i i • • • • i ----- ---- ----------- 'f-------- . ! • • ' )iJ . -----·+··-
-----..~~:_L I -.. ! - ------• ' ------------- ---- ' '"!I,, ""' ' • • I -r-------,-: __ _'._ ____ !- -- -
I ' 1' ! ' . .
-----1----------f-- --------t------"-l---- --l i I 1 . i ! 1 I ! I 1 ;
;
1000
100
104
10 I I I I I I I I I I I I I I I I. I I I, I I 2 2.4 2.8 3.2 :3.6 4
Voltage (kV)
• • • f • • • • •
1-•
"' C."l
~
~ ~
~
Rate Curve of Ga~ CF4 87%, 1-1:3 13% Threshold -3omv, Source Fess, lntarval 100 s
SQS mode significant at 2.6 kV
)
~ u .H. ,:.1,~1;,/"1. /
0. 7 -l----+---+--l---+--~-+---+---l--!--+-+--4---<>--+--+--+--+---+-----+-
0.6
0.5
0.4
0.3
0.2
0.1
. i I • ·-·················-··-··- I i 1 ; ........... ,................................................ • • • • i I~ ~ • ! ........ ·················j····,.·~··············· ·-···-···········i··· 1 .•.•.••.••••••••••.•••••••.••.•.•
. • i . ! l ic'rJ5· -··············-···-·-- I ! I) VJ..
-' ---·.-~=i--~-~==~-+~~~-~==~==J-~- --=~-----t • I ! I i
0 I . I I I I l I ! 1 8
I I I I I : • I I I I. i I ) I f 2 2.2 2,4 • 2.6 2.8
Voltage (l<.V)
)
) )
HONEYCOMB PANELS ~ G-10
• GE: 60 x 144 in; 0.021 in; 0.5 oz Cu; $184.40 • min order 150
t; Bare honeycomb c.D
• 48 x 96 x 0.75 in; $230 • 60 x 144 x 0.75 in; $678
Fabricate panels, including honeycomb material
• Hexcell 48 x 138 x 0.8 in ATF quality $1419.66 • 48 x 108 x 0.8 in Flat $2100 • Both plus tooling, setup charges
CVJIII 1:04 PM July 12, 1993 1
relephone: (800) 284-3923 ~ax. (817) 274-1121
2UOTED TO: 82280-01
QUOTATION HEXCEL CORPORATION 201 E. ABRAM STE 300 ARLINGTON TX 76010
TERMS: FOB:
NET 30
Page:
~ote Nbr: ote Date: /CSR Nbr:
Cust. Ph: (214) Fax: ( 214)
Casa Grande AZ
1'"' A3C0406 05/21/93 105/1R4 708-1188 708-6088
.. SUPER COLLIDER LABORATORY ATTN: COLEMl\N .JOHNSON 9050 AUTOBAHN DR BLDG 2 DALLAS TX 75237-3946
RFO· coV'T CONTRACT:
FAX FROM NORRIS DATED 4/22 -I T MATERIAL UNIT OF -E DESCRIPTION MEASURE gr'{ UNIT PRICE TOTAL M
01 HRH-10-1/8-8.1 Piece 10 $1,419.66 $14,196.60
SHIPMENT: 10 Weeks After Receipt Of Order
SPECIFICATIONS: ~s ~~o ~~ D/S 4000 ~ \ . QUANTITY TOLERANCE: + 0\ - 0% 0'1- f~ .1 I'\
TQ: 1 ----- \ 02 HRH-10-1/8-8.1 Piece 10 $1,397.82 $13,978.20 ..
SHIPMENT: 10 Weeks After Receipt Of Order
SPECIFICATIONS: D/S 4000
QUANTITY TOLERANCE: + 0\ - 0%
TQ: 1 .. I 03 HRH-10-1/8-8.1 Lot 1 $2,446.23 $2,446.23
TOOLING FOR ITEM 01
SHIPMENT: 10 Weeks After Receipt Of Order
! SPECIFICATIONS: i DIS 4000
QUANTITY TOLERANCE: + 0% - 0% ' I
-TQ: l I
04 HRH-10-1/8-8.1 Lot TOOLING FOR ITEM 2
l $2,446.23 $2,446.23
-SHIPMENT: 10 Weeks After Receipt Of Order
SPECIFICATIONS:
I DIS 4000
QUANTITY TOLERANCE: + 0\ - 0% I TQ: l I
I -I
QUOTE TOTAL s~' 06"" "'6 I ........ , I ..... I I
!otes & Conditions: ..
•• ..... !lotes & Conditions• (Continued)
QUOTATION Page:
~otc Nbr: ote Date: /CSR Nbr:
Cust. Ph: (214! Fax: (214
- 1 48 L +l-.125 X 138 W +l-.125 X 0.80 T +/-.045 DIMENSIONS fiND TOLERANCE OF ITEM 02 28 L +/-.125 X 138 +/-.125 x 9.80 T +/- .045 SKINS: Fl85-7781 2 PLYS ADHESIVE: MA 562 S POTTING COMPO: EPOLITE 2402 THE PARTS ARE QUOTED PER REQUEST WITH THE FOLLOWING
- EXCEPTIONS:
-
-
-
lJJHE L AND W DIMENSIONS ARE REVERSE OF THE RFQ DIMENSIONS. 2 RATHER THAN EPOXY FILLING THE OUTSIDE PERIMETER OF THE P EL, HEXCEL WILL USE A GLASS REINFORCED POLYESTER TUBE.
-, ··-
THANK YOU FOR THE OPPORTUNITY TO QUOTE.
05/21/93 09127
DATE TIME Marla Dowdle customer Service Rep.
NOTE: This quote is valid for 60 days. Please read NOTES & CONDITIONS on reverse side.
141
2 A3C0406 05/21/93 105/1R4 708-1188 708-6088
TO 12147006J8E P.Jl
QUOTATION l:IEXCEL COl\?ORATION 201 E. ABRAM STE 570 1'RL!NGTON TX 76010
Page, 1 ._ Quote Nbr: A2C0622 Quote Date: 10/29/92 AE/CSR Nbr: 105/lRS
'1dephone: (800) 284-3923 Fax: (817) 274-1121
QUOTED 'l'O: 82280-01
Cust. Ph: (214) 708-1188
SUPER COl.LIOER LJ\SORATORY TERMS: NET 30 ll.T'l'N: COu:?l!IN JOHNSON FOa: Casa Grande, AZ 9050 AUTOBAHN DR BBJLDG~.,32;_..--=:::::::::::---uo~---___;------'-----~ DALT.AS TX 75237-39~ GOV;T CONTRACT: UNKNOWN -,
I T MA'l'ER!AL E DESCRIPTION M
IJN!T OF ME:ASURE QTY
~M of )
UN1'l' PRICE
-/ 0 ,_,/
---TOTAL
01 BONDED PANEL l!RH-10-1/8-1.8 WITH .5 OZ./SF COPPER
Panel 2,100 $2,616.37 $5,494,377.00
w ~:125 ~~{i5 T ~;~30 ~~~30 48.000 1.000 10a7000 ~~f25 ~~f25 SPECil'lCATIOllS:
HEXCEL BONDING CAPABILITIES
QUANTITY TOLEAAHCE, ... 0% - 0\
'l'Q• 3
This iten has !Jeen prepared u a ROl1GH ORDER or MAGNITUDE. HEXCEL reserves the ri¢it to submit a tlrm quotation be~ore placement of an order.
~ !t.1 ,.. '
02 BONDED PllNEL Panel 2,000 $3,751.59 $7,503,180.00 HRH-10-1/8-1.8 WITH 1 OZ,/SF COPPER
L 108.0e<ll
SPECIFICATIOMS 1 HEXCEL BONDING CAPABILITIES
QUANTITY TOLERANCE: + 0\ - 0\
'l'Q: 3
w 48.000
, .. ) 0.125
(-1 0.125
T 1.000
This item !las been f::epared as a ~UGH OllDER OF MAGNITUDE. HEXCEL reserves the ri;llt to submit a f.rm quoution before placement ot an orl2er.
03 80JIDEO PANEL Panel 2,100 $4,394.36 $9,228,156.00 HF'l'~3/16-2.0 WITH .S OZ.IS? COPPER
L l0S.0e0
C+ I 0.125
Sl'ECll'ICATIONS:
(-) 0.125
HE%CEL BONDING CAPABIUTIES QUANTIT'! TOU:lWICE1 • 0\ • 0\
'l'Q1 3
w 48.000
(-) 0.125
T 1.000
(-} 0.630
This item has .been prepared as a ROUGH ORDER or MAGNITUDE:. HliXCEL reserves the ~iOh~ 'tO stiClilit a tlrm quotation be:oi:e pl~cement of an order.
-..
-
-
..
-
-...
-
- I T E M
04
05
LU
QUOTATION
MATERIAL UNlT OF Dl:SCRllTION MEASURE
BOlfllED PMEL Panel ~-3/16-2.0 WITH l OZ.IS?
p~
"
QTY
2,000
T
P.Q~
Pag:e:
~ote Nbr: oee Date: /CSR Nbr:
cust. Ph: (214)
2 A2C0622 1012!1/!12 105/lRS 708-1188
UNIT PRICE TOTAI.
$4,954. 70 $9,909,400.00
108~000 ~:bs ~~bs 48.000 ~:bs ~~bs 1.000 ~:~30 t~30 SPECmCATIONS:
HEXCEL BONDING CAPABILITIES
QU]\N'l'ITY TOLERANCE : + 0t. - 0\
'l'Q' 3
This item has beenlrepued as a ROUGH ORDER OF Ml\GNJ:TUOE. KEXCEI. reserves the right. to submit. a im quotation before placement of sn order. NON-RECURRING ENGINEERING Lot l $100,000.00 $100,000.00
SPECIFICATIONS a NIA
QUANTI'fi TOLERANCE: ... 0% - 0\
'l'Qt 3
This itelll has beend'.repared as a ROUGH ORDER or MAGH!TUDE. !!EXCEL reserves the right to submit a rm quotation before placement. o! an order .
. QUO'l.'!l 'ro'.l'AL $32,23!5,113.00
Bott• & Cqnditjmw1 l QUOTE IS BASED ON THE ASSUMPTION THAT PULTRUSIONS WILL BE
FLUSH WITH THE EDGE OF THE SXIN.
NON-RECURRING ENGINEERING SUBJECT TO F!RAL DESIGN. NOT TO EXCEED PRICE QUOTED.
2 FREIGHT COLLECT
THANK YOU FOR THE OPPORTu1'ITr TO QUOT!l.
10/2!U92 15:39 I Barbara Rust
Customer Service Rep.
NOTEc This quQt.e is valid for 60 days. Please :i:ead NOTES & CONDITIONS on reverse side.
5-Mar-93 Barrel CSCs Malerlals Cosl Estlmale r·;; •. ,z, "6-6·6"
Tolals ch•mber type lnn1r·1 lnner-2 Mlddlo·t Mlddlo·2 Oulor·t Outer-~ 8ASEl..INE wldlh (mm) 854 854 938 938 1200 1200 lenglh (mm) 3249 3471 2387 2587 3297 3500 panel area (111"2) 2.123 2.270 2.220 2.408 3.958 4.200
gaps/chamber • • • • 8 11J
8 chamberl/aeclor 4 4 • 8 8 8 seclorslbarrel hall 12 12 12 12 12 12 lolal chambers t8 t8 192 192 192 192 980
lolal arH (111"2) 1223 1308 2558 2774 4558 4838 17258
wire (m/gap) c;.o) 881.9 850.8 925.8 1534.8 1832.0 2.5 mm pllch, lull chamber wldlh wlro (m/GEM) 59~555 834935 1224833 1332890 2209788 2350080 8345080 (25" ...... ,.,
\ i ) ' '. i ,,
unll co111: wires Sim 0.21 0.29 0.29 0.29 0.29 0.29 OUokt from Luma -~
I-' ckcull boards Shn'2 ol penal 20 20 20 20 20 20 End cap oollmale
~ ~· calhodeo. ploln S/m•2 5 5 5 5 5 5 End cap quole
calhodeo, aklpo Slm'2 258 258 258 258 258 258 t/2 Actual Buckbee Meara cost
manulactured panels 0.12725 0.12725 0.12725 0.12725 0.12725 0.12725 M. C. GHl "b" laclor 450.71 450.71 450.71 450.71 450.71 450.71 M. C. GHI •a· leclor
$/panel 889.42 891.44 888.82 925.83 1231.08 1279.11 M. C.Glll (Cos1-a • b • aroa(ln • "2)) number req'd. 872 872 1344 1344 1344 1344 8720
'Li I . I ·1 • \00·6/'h Y6l\ ,41) 311. 19 "JO '-1. 5.; s I AfA2
Total Co111: :i• wires $171,841 St84, 131 $355,202 $388,538 $840,832 S88t,52~ $2,420,087 f40.23
clrcuh boards $48,911 $52,302 St02,309 Stt0,954 $182,311 $193,538 $890,322 40.00
JINR- $24,458 $28, 151 $51,154 $55,477 $91, 155 $98,788 $345, 181 asllmalod •• aamo as cir bids 20.00
calhodeo, plain '8, 114 $8,538 $12,789 $13,889 122,789 $24, 192 $88,290 5.00
calhodes, 1klp1 S315,478 $337,345 $859,893 $715,850 St,175,905 $1,248,307 $4,452,578 2511.00 1111~
manufactured panels $514,251 '803,755 St,194,312 SI ,244,042 St,854,543 $1,719,118 S7,000,022 rsr.1s 405.81
MATEllM.S $1,151,051 St ,210,221 $2,375,858 $2,528,530 $3,787,538 $3,983,445 $14,994,441 1166.114
315113 page 1 R.E.Gusllt"9atl
• • ( • • t • f • j •
-
-.
-
CSC panel Fabrication Specs
Panel Definition: A 19 mm (nominal) honeycomb NOMEX core (l .8 lb/ cu. ft.; 0.25 in. cell) sandwiched between two .5 mm fiberglass (G-10 or FR-4; NEMA specs.) face sheets. The fiberglass face sheets are copper claded (17 µm thick; 1/2 oz. per sq. ft.) on the outward facing sides. The copper on one of the face sheets is etched to provide a precision cathode plane.
Specifications (prioritized) l. Flatness
700 µm over 7.2 m
2. Parallelism 700 µmover 1.2 m
3. Net thickness (incl. face sheets) 20mm±250µm
4. Squareness Diagonal measurements± 250 µm of each other
5. Length and width dimensions Nof set at this time.
Cathode strip
i------1.2 meters------'o.j
147
Gap Spacer
Fiber Glass Face Sheet (Copper Clad)
Prototype Manufactured Precison
Panel Flatness Parallelism Thickness Cost
f-' Manufacturer (over 1.2 m) (over 1.2 m) <Nom.20mm) (2 pCllels)
~ co LLNL/M.C. Giii lOOµm• lOOµm ±250µm 150 KS
Composite Optics 75 µm (side 1) 7 5 µm (side 1) ±250µm 25 KS
150 µm (side 2) 150 µm (side 2)
• Cu"ent Physics requirement: Anode to cathode spacing within± 100 µm.
' f f ' f ' f f f f '
I-' ..: .. ~
) . )
Material Thickness Tolerances
Fiber Glass Face Sheets • 10% or 20 mil± 2 mil
NOMEXCore • 19mm(748mil)±l0mil
Resulting Precision
Flatness (coarse Cathode) and Parallelism
Thickness
)
Panel Prototype Fabrication process
Step 1: Fiber glass face sheet sucked down flat onto granite table and NOMEX core bonded to it via a room temperature curing epoxy.
Step 2: NOMEX core machined down ( using Toshiba cutting tool) to a flatness of 2 mil over 1.2 m.
Step 3: Top fiber glass sheet bonded to NOMEX core.
6 mil over 1.2 m
20mm ± 14 mil
Improve Fiber glass thickness tolerance and/or machine tolerance Improve NOMEX thickness tolerance
19.65 mm Overall Thickness 19.8 mm
Low Point
Machine down 24 ± l mil -4 756.5 ± 1 mil
-4 757 .5 mil (high)
High Point
)
I-' c,, 0
•
Concern:
Solutions:
• •
A seven-panel (6-gap) chamber sags 67 µm under its own weight leaving only 33 µm of manufacturing tolerance for the panel Qild. gap frame assemblies.
l. Review the physics requirement (and possibly loosen-up tolerances).
2. Stiffen-up the individual panels • Rib stiffeners across the panel width • Alternative face sheet materials which
Increase stiffness relative to mass.
• • • ' • • • '
-
CJ) ...
(iu. 5~p h4M~ Sevwvp/rl W\fkcl.L ~y
I PEA 1. , kii ik-'.
. . .
lnterstrip Capacitance for PRC board 40
~ 30 a.
rms 34.4 pF
a: 0.66 pF a. ·;:: -• -0 .... • .a E ::s z
._> .• ; -
20
10
0 30 32 34 36 38 40
tnterstrip capacitance [pFJ . - --·:----
.. f I
I PRC (Bottom) i : board
I I I 0.05
"' I -., r ; 11 .r:
tJ 0.04
/ ;§. I I ! ,, l l e 0.03 iii '
"' ~ ~ <I)
'( "'"' ~ ::; 0.02 ' -f c;; ' c: 0.01 r .E F 0
j ::: VJ-1.S" - '/ ""! f/4w~reJ. z 0 •
0 20 40 60 80 100 120 -Readout Strip ('It)
PRC board (Middle) '\ r
l 0 i1 \ 0.05 \
"' ' ., .r:
) 111
.. " 0.04 ~ ,, e 0.03 :::>
!"'- ' D "' i "' ., I ::; 0.02
\ -1i
eecro~ c: 0.01 e 0 z
0 0 20 .. o 60 80 1·00 120
Readout Strip -
PRC board (Top) -0.05 -;;;
"' .r:
" 0.04 ~ .., e 0.03 :::> ., .. ., ::E 0.02
1i c 0.01 e 0 z -
0 0 20 40 60 80 100 . 120
Readout Strip ··,-:·.
.. 154
-
M.l.T. June 29, 1993
Most Recent Results on Axial Alignment
(Stretched Wire + mini-Strip Readout).
1 1".'.'•-i iJ I
Reminder:
PROJECITVE + AXIAL ALIGNMENT
as was shown by J.Paradiso and A.Ostapchuk in detail, the axial alignment with a detector accuracy-10 µm is adequate to the GEM alignment goals.
158
..
...
-
-
-
-
-
-
..
-
-
GlOboard
~stretched wire
mini-strips
calibration pad
A pulse is fed to a stretched wire, as large as wanted.
Induced charges are picked up from mini-strips.
The induced charge shape is determined by pure electrostatics, peak of the distribution indicating the "horizontal" wire position and its width giving "vertical" displacement.
Narrow strips (-1 mm) allow to get a high accuracy (<10 µm) over large range (-10 mm) without special concerns about calibration, which is the main issue of a high accuracy + large range aligi:unent.
Monte Carlo simulation showed that the scheme should work and not effected by many systematic errors, such as electronics calibration, wire tilts in both directions, crosstalks and so on (stochastic noise is not a concern at all).
159
wire fixture is NOT attached to strip boards
axial stretched wire
______ _:::::~.._Number of mini-strip bands aloi
1GO
chamber adge may be as freque1 as needed
-
-
-
-
-
-
...
-
-
-
Experimental Set-Up:
A G 10 board with 11 strips equipped with electronics. Pitch= 1.016 mm (40 mil). Etching was made at a standard firm (standard electronic board tolerances, nothing special).
100 µm stretched wire (1 m long) over the board.
The board was fixed on a stage which could be moved by precise micrometers (2 µm min division).
Signal from - 2 V up to -13 V was used for the wire.
Maximum pick-up charge on a strip was around 700 fC. Electronics noise was - 5 fC (30,000 e, really lousy!)
Calibration was done by feeding a test pulse onto the underneath pad (trivial).
161
RMS ~ 1.5 ~Ltn (includes 1rteasure1nertt errors)
8
7
6 -
~ 5 .,...... ~ ..... § 4 0 u 3
2
1
0 -10 -8 -6 -4 -2 0 2 4 6 8 10
Strip Center Deviations, µm
Fig.4. Pitch accuracy of strips etched on GlO board as measured with an optical microscope.
1G2
-
-
-
-
-
---
-
-
f-' C';) c,.J
) ) )
Line - theoretical distribution Dots - experimental data
rn ..... ...... §
•
~
1500
P. 1000 'E Cl)
~
i:: 0 0
~ 500 a "d 0 u .g ~
0 -10 -5 0 5
~ (Xstrip - Xwire), mm
H = 2.0 mm
10
-
-
-June 24, 1993
wire position
H= l.Omm -2000
"' .... 1600 ..... ... = ::s ..ci a . 1200 a>
~ -..c: u 800 "O a> (.) ::s
"O
= 400 ....... ...
0 1 2 3 4 5 6 7 8 9 10 11 ...
STRIPS
...
-164
-
-
June 24, 1993 wire position
H= 3.0 mm 2000
"' 1600 ... ..... i:: ::s
~ «> 1200
~ ..c:: u 800 "O Q) 0 ::s
"O 400 i:: ......
0 1 2 3 4 5 6 7 8 9 10 11
STRIPS
-
165
-
-
June 24, 1993 wire position -H = 7.0 mm
2000
"' - 1600 -..... c: ::l
.ci a . 1200 ~
~ -..c: u 800 -0 ~ u ::l
-0 c: 400 -......
0 1 2 3 4 5 6 7 8 9 10 11 ..
STRIPS
-
-
166
-
-
Straight Line Fit June 24, 1993
with a Slope Constrained to be 1.0000 H- 2.0 mm 11 Strips
8 ::t
11000
i 9000 Cl)
8 Cl)
~ ...... 7000 ~ .... 0
Cl) ·= 5000 ~ 'tj
~ ~ 3000
~
I . . . . : . ! . ··-·····--·t•····•-·--·••C·--••• ••••·•·4-·••·•·••····-·+··--.. --··t·--····--001°-···--••• ....... --·-·• .. ··--···- ·-··--
---·-l··--···-·-l···--·--·· l. ....... -.... i ................ 1 ............... -1----... l.---·-! ·---!-···--· i = ! ! ! = j I l I = i i I ! I I
--·--···!···--···-···1··-··--·-···t- ····--··t·-·-···--!---·--·-~···- i --·t-----LI. ----1 i ! i ! I I I
i ! l ! l i I j · ·--·-··t·-·-·-···-r----·-··t···-·- ···i·-----r-·-······· : ·----·t····--·1·--1····-··-i i i I i 1' I i l ' i I . i I I ---·1------t-···-.. --t---·-·1 ·--- i---r·---·-r---·t·--·--r·---· I : : I ! ! i I I i i ! i I i I I . '-----'---, --: ---· - -:----! -,
' : I • f
j I ! I i --~-----i--: ·---~---L-L----+-' _ _,l_--i---1
! i i i !
I ! I I I I . . . . , I --1-·--·-, · .. ------r----i----!1--·i---·--41--+---1,-.....-1 I I ! :
--!· .. ·- ~4 m~ R~ge _Use~ for Ana_lysis_ : ! · 1 I
1000 1000 3000 5000 7000 9000 11000
Wire Displacement as Measured by Micrometer, µm
---
Note: slope is constrained to be 1.00000 June 24, 1993
H = 1.0 mm
20 ' '
-10
-15
15
10
0
-5
5
-····-··-f--····-·-··t··········--i-·····-···-·+·-·--······~---·---!------t----·-+-·-·---·-f--i ! l I I I l I I
-···-· .. ·-1--·········+·····-·-··+··-·-·····1--··-·····-f-·-··-· .. -+-·-····+-·---··t-·---··t--· • • I • • • I I l
·-·---1-··-···-···l·-·····-·····-r--······-·····t--···--+-·---+·---·-1--·--·-t-····----+··-·-~- l l I i ~. ···r···.! i --·-····-· .... ·~·········f.······-·---'t'···-····•·--:-···~-·-·!·--·-·---·t--·-··--·~··-····-4·-····--·· I i • i. ••• .: •• •i9 • •i i ! • • i
_____ .L ....... -. ..1. .... ____ J .............. [ ___ J ___ l ________ l ____ l. ____ ~t .. i ; ' I ' I I ! I t-j~s = ;1.3 ~ :±4n:n1) t-j·---'
i 1--
-
-,
-20 1 2 3 4 5 6 7 8 9 10 11
Wire Displacement as Measured by Micrometer, mm -
-
-1G8
-
-
-
s ::l -~ § 0 u
15
10
5
0
June 24, 1993
H = 1.0 mm
RMS= 1.3 µm
-20 -15 -10 -5 0 5 10 15 20
Residuals, µm
169
-
-
-Note: slope is constrained to be 1.00000 June 24, 1993
H = 3.0 mm .. 20
,..... ..0 + 15 -(<j
~ 10 II s "' (<j ::1. 5 ~ ~
0 __,ca ... ::s ...... "O ~ ...... II) ~ -5 :3 ~ ... -10 ..c:: bO ·a -15 b
ti)
· , , , · I ! i i i I I I
··········-1---····--···t .. ·············+···············t····-·········1··-···-·--·1·········--··r·-·-·········t·-----··-·i·-·--·· I ! i i i . I l I f i i ! I j I ····-·······-i····· .. ·········:. ............... :. ............... ! ..... - .. - .. -·········-·-·············-···~----·--· -----.:---·· i l l i I I 1· I I ! , , ' . · I 1
·-·-········~·:····:···t-·········· .. ·t-············1···-····-··+-·-··-·····1·········-··-t-···-···-··[· ----·1· _ ........ _ ! • •1 1 ! I L ••• ,. ••
----4-------···rJP .. «-----t----·-·1t·······!·11········1· .. .!--·r--··· --. I · • : • • 'f't r• I
- ....... ...1 ... - ......... .L ......... :.t.._~_...l ......... _J __ ·-l·----- ---- --•• i_ I I I i I ' I ! I =t--J ~s = :1.6 F \±4~m) )-:,.._ __ __, I l ' I ' I • ' 1
'
...
..
.. -20
1 2 3 4 5 6 7 8 9 IO 11
Wire Displacement as Measured by Micrometer, mm -..
..
i70
-
Note: slope is constrained to be 1.00000 June 24, 1993
H = 6.0 mm
20 ' i
-10
-15
15
10
-5
5
: : : l l I l ! I ···-····-·-i················t·-······-····t····--·-··-t··-·-····-·1··-·-··-·f····--··-··-t···-·-·--·t·--·---1··--
i i i i i I l i I • I I ' ' ' ' l '
·-·-·---l------···l· .. ···----t-----~------~-----~---·---~---·-4-----4-1 i : : i • I I • . : : i l I i I i '1 j ! t' ! I j I
! I . . I ! I I --·l'l·-·-··--·i·-----t--··-·--f··-----1 +---·---;.-......... ;.----·-··--t--1 j I l I I je •• , I I I ' I I • ' I. ' l • i i ! •• •! ; • • •1 !9 ! ---·r·-··• ... •t--··---t"--·-··-.. ~·---1---·•··---1---1·---•---J. ____ _ ' . I • I . • I . • I : I • : • • I .,. ••• , I I • •' i ~ • i I I ! i I ;a
---.!------·i·-······..!~------.i.----1---i---·1---4-----1--l l l i j l j · I j i ! : i . !
-·---- ·--1--......j I RMS = 2.5 µm (+4mm) I ~--1.~.l::==:::::;:========:;:::===::::::===i====t..~~i·----i
-20 1 2 3 4 5 6 7 8 9 10 11
Wire Displacement as Measured by Micrometer, mm
·-
171
10
[ 9
8
5
4
3
2
1
0
--
-RESULTS OBTAINED WITH 11 (1 mm wide) STRIPS
10 µm goal June 24, 1993 ..
I
~fEl==~~ : ! i : I I j ! I
-·-····f·--···--i--·····---t-·-···----.:..·--··----t-----·l-·------i-------1--···-······1'-·--···· I. ! ! ' i ; 1· ; i
i i ! ! i : I i ----t---~----r.----~-----+---i ... ---i------1------·-i--···---
'1 I i II j i I I ! i I ! ! I l
--!----i--r-~----r---i---!- 1··-·-i i i I I I i i
1----i';.......-' ' ! ! I • ! r i : .i f . .·,; : i _; __ j_ . ;. '
I •' • T I i I • · i : I I i ... ·--t--·--·-··i··---... ---+--~---... --•---+---1 I I ! l I I I i-
-
-
-0 1 2 3 4 5 6 7 8 9 10 -Distance between Wire and Strip Board (Heiglit), mm
-
e ::t . ... ·-ll. >.. ,.c
= u > ·-0 "' "' ... ..c:: bO ·-u
::c:
M.V. = 999.7 µm RMS= 2.7 µm
June 24, 1993
H- 1.0 mm
1050
1040 1030
1020
1010
1000
990
980
970
960
l ' j . i i i i i i i l _J
-:~:~J::=:=:J::::~~~=r::~~~=1~~~1=:=r=~r--·1=---l-i l i I l ! i i I i i ! ! l ! i I ! -·-·-:-----·-1-····---+---1---?· I •1·--·t---:-·---1 ! ! I ! I . t I i i : ! ' ; i 1' '
-·-i··-··--··~ .. ·--···i----·--~---i------+·----'1'-·-----~--i i l f i i l i j __ ... t..::.::J •. ~ .. ! ...... l .. --···'"·•l..!~l._?.!.!..L._ ...... L _______ J ______ 1. __ t ; •:.. ! i :•. ;. ••• ! •• : l : : : . : i •I • :• i = f i ! i 1 i.. I -·-·r---l-·--:----,·- -,·----·-r--·,....--+---t ! I I I I I : I . ' . I ! I I I ! ' I I . I --i-------~----4----t i----;..1 __ _..,_ _ _, __ __, l l I ! ' I I
··-.. ·-t··--· .. ·-~---i---1- :- :---+---+---! i l i i i i I
--~·---·r-----+-----r--1--i-·----·------;----1
I ! i 1 i 1 I 950
1 2 3 4 5 6 7 8 9 10 11
Horizontal Wire Displacement. mm
173
e ::1..
...: ·-~ >. .0 c:: Cl)
> ·-0 "' «I ....
.c:: bl) ·-Cl)
::r:
M.V. = 3015 µm
RMS = 3.7 µm
June 24, 1993
H-3.0 mm
3050
3040
3030
3020
3010
3000
2990
2980
2970
2960
£ffi1-Fr-Fi-~ ·r .... L •••• i.····r····~· ... J ~-·· J -i----·-i---+·----+·· . --·=··-----~--~ ...... •.,-----!--! l ! ! ! l i i I i I i 1· ! . i ! ; ' ' ' ' I ' --1 ----1 I -I ---~--! ! i i i I ; f l l f I l i j
~--·._-: ... 1 ____ J f H 1 f r--·r-·-j l ! i i t
~--;!----l--··! I . -i---->---+·---t·---1 ! i .1 •• i i
2950 1 2 3 4 5 6 7 8 9 10 11
Horizontal Wire Displacement, mm
174
..
..
-..
..
..
..
-
..
-
100
El ::1. ,-... 80 . "' ....... 0.
>-·E s...,, 60. 4:::E -ti),.::. t.> c
.... 0 40 ~ .. El B Q) 0 .... c "' ._, ;... 20
ti)
0 0
June 24, 1993
Error Bars indicate RMS errors
I I 1
i i i j • ! ! ! I I I i I I I
--1-·-----L----1 ---··t------r--i-1 I I I ;
I . ! I 11 I 1 1
1 2 3 4 5 6 7 8
Distance between Wire and Strip Board (Y), mm
175
SUMMARY:
Regular Etching gives -1 µm (or better) pitch accuracy.
Strip width has - 1 µm uniformity (over 3 cm range).
Using just 11 strips allowed to achieve 1-3 µm resolution over ±4 mm range (goal is -10 µm).
Vertical accuracy is worse (-50 µm and should improve considerably with increasing the number of strips), but much better than 200-400 µm requirement.
PLANS:
1. Multiplex Readout. Say, using an AMPLEX would allow to readout 16 strips with essentially one chip (cost estimations!).
2. Try a silicon carbide wire (it will sag by 300 µm only at 15 m length; 1-2% tension control is simple• and will allow to correct a sagita with a few µm accuracy).
3. Make a full scale prototype (15 m long wire and all accessories).
• As proposed by J .Paradiso, one of the possible options could use the same mini-strips: the wire can be vibrated with a peso-element at varying frequency while the resonance is detected by the mini-strips. However, even a simple weight may tum out to be adequate enough.
17b
...
-
--
-
-
...
-
...
-
-
-
A\i~111 ..... e1o.~ 1 BAS.Cb Ot\ ihe
He•fb'At..&MeWT• o~ P."'t&e(e
No"'· ~e'-'el Coo~cl~~~~e
( A.. Occ.-tQ.p~"'\4"")
• I'A~V'C~v.e.~~0'-'.
• T"'e ~e.~otl
e Rec.t:eo.t\c"' ~c~e\4.t~~ l, too'"I. -a- - ~eu-ev.t f.. \O"/. 'l- - V'•c.fl.o'"'t
e ~'d~~ewi.c..~~c. e.¥rte..*tt.
4 '-\o"'-u."'-'-4-cv "-' 1M0,"1.e..,t\c. ~ ." e. le(
4 c. ~o. ""~. " al. «. 4 c" ""' .. {.~ 0 ... ~
~ ...
179
'
G.J.tr\·~·J "'°'! l\, •• & A. Osi,,,l .. 1c:
F '°'9l(- -) - ... ~e)..:.. A(e)_..:.. ~9) • .;.. A(e) __ ..:.. A(e)_! · A(e)_!_ ~.. -, - - -uo ' .... 10 - . --i..il - ... !! -- ' ""''!?O - -:- -:1 - -
''to\ -iW • IJi - 2.02
Different te:ms a.re different linear combinations of F S; (measured values of false sagitta.) and therefore they depend on difi'e:e:it mov=ents. So,
a00 is determined by shift along the x-a.:cis;
ao1 is deter.nined by rotation a.round the y-a."cis;
a10 is determined by rotation a.round the x-a.:cis;
a20 is determined by rotation around the z-a.:cis;
We can apply the same interpolation procedure to the function NS(x,z) and get similar polynomials:
NSC4l(:, z) = ~> + b~!'= + b~~>z + z4~l:z
NS(9l(:, z) = b~ +bl~=+ bf:1z + z4~1:z + b':}:2 + b~~1:2z
The coefficients of these polynomials depend on shifts and rotations of muon modules in different ways, but the shifts and rotations are the same in both cases! So, there must be correlations between coefficients a;; and b;;:
bio is fully correlated with ao1 (see Fig.18),
b,,1 is slightly correlated with a11 (see Fig.19);
and most interesting, iI there are no torque de!o=ations of muon modules,
b11 is fully correlated with a20 (Fig.20, but see Fig. 21).
The last correlation means we are able to correct rotation a.round z-a.xis using only four straightness monitors. This is the second application of monitor measurements of non-bending de1iections.
9. Alignment requirements
We would like to st;ess the sharp distinction between placement and measurement acc:uncy requirements. The only requirement for monitor measurement accuracy is tha.t it mus: be better th;l!I 25µm.
There are two types of placement or p:ope: posi:ion :equirements: l) relative :;: o-
180
-
-
-
-
-
-
-
-
-...
-
• .
, -; ;
· ... , ',,
- ~
-
-
. ; ;
~= 4 -
t
'·" ........ · ..
Q a........:: a.:ca
Fig.18 biov.sao1
i'~~~~~~~~~~~~~~~~~~~~~~...., •
'
.. -E ;.
Q O.•
Fig.20 buv.s4Q2 ; No Torsion
... .1a-s
: . .s .•
J.! -
: ....
0.: ~ .• ~ ;. , ~ ·· ..
-u ~ E " .. ··
-l.4 :_ -• :_c
-J.J ~ ~ ...,_, :.
...:..::.l -J • .::..: -.l.~:z -:.::1 a .i:c: J.::: J • .::.: :.:: ...
Fig.21 b11v.s4Q2; Torsion: ii'_,. S :3mrcie
181
• c~Q ~ b~v ~ ·~ v ~ca\ cJ. 'boc\~:
l>x / 1) y J D a. - c\ ,' '- p \Ct t! e """' e '-'-~-. -Rx, R. d~ 'R. ~ - 'l"O ~c..~ o '-' ~
.. • l=°'\e:.e ~Q.~~;~~ \=<&, ~)
L. \ 4 fl;,{._. ... ~et"'c.\ • ~ Cl#'~ 'Mc..\\ 4!.~~c.l,"' -F ('!19): Q 00 + °''• · t\i ~ Qo, · ~\g + ..
+ ~". -t~ 'f -t ca e + Q.20 • {~" 'f ..
..
-
-...
.,
182 -
• ~ O V' "O'-'-b e\A cl cc c v-cl. \ '°' Q. ~ e : N ( 6 ' "9)
4 ~0.M41 fA~t~OO.e.~ 1- ~o.tMe. 1> ~ 'R: !
~l0,~)~ b00 -t- b,0 t~~ + bo,~~6 +
4- b,, t\'f -lcie ~ b o~ ~\e
- 'N' ~l.. b • • - ~ - "lo.\.._\~~
be,, - 1 - ~"'' !r~ b - ~ ... ~ .!,. "'J.. : .- t \\ ~ ~ , ..... ...
.... -v ,. -1. ... .I..:. • t:':,. .... ro; .. _w, , .........
-
-
b ~ C,) - lj .. V" €: -':-~ ~~ c: ... ,
Q,o: bot ~'°' ~- b,o Q '' ; bot. Q~o :t b"
I. o\\ co-.4".:c.t:e.'-'~~ &.xc.,~ Q.~0 - V'•~~·"'~-~\c. ~o~ V-!:."'-\~t-
183
• T~ev• \~ '-'.O ~-\\;4-. be""el el.\~ .. e,,\\ ''--
~ 0'4 \ ~ QN ~ C':. C. .; V'O\M ~
• \.'-\
- c.."'- 0 ~ h~ "' ~' ~ o. l ,· ~ ~ """ t. ""':~ - Hwl'i:-~ple ~coc.~te.v~\il\.d .:.""' ~
~~clcl\e ~L
- ~0\A. - tA ~,· ~O VIM ~a,,~ &.-~\1
C ~· ~ .( o(
• C. "'-°"""" b e .,. o\ e..,\-o v ~~: '9 ""'~
t. ~ E C '-' Oi:>: t. O\:.~Q.~"' a 4!t&~ o\ ~~,6~1 ).J"~C'f.·.,9,·) .t. ):~~ ~- fl~Q. \;.~ t>O\~"'-O\M.\~
l I \~t( "'•~ lt:l_"._) ~ l +•t ~ b\..'t-\: -·~..., l ~-\: -t- 9"" t.S. + N 1 I 17 -i>o~ to ict t>IU 0
~~-l:a~"'°'t\{ o••~ LS,.i.t .L...t.9'-'.,'-+ " <> l ~,.,. ~ o~~ . "'a
~. U~e. Vt.~~\O'A.~ fA.:i~ f>;i
4'. Ob~Clt ~ w-.~49~~ ~~ O.oo c.o~\~~~4:
~~\~ O\Ae. ~-\:"o.~"=~•s; ""'o~~ov
184
--
....
-
-
-
-
-....
-
-. e,uT: ~"Qeo\ ~ - ve~ol~t~c\A.
I. RE9'-1.\"·~~ vE~cl-...{\.;... ~c.f.e...,cl~ 0\.\. .. *d-\ ~-l·\ C. ~ Q.\.;0. \ \ O. b \ E.
e P~o po tb e i wo ~~ \ \ • Q..lc: \ ~ ~ '-: - 100.,. .re~ct ou.-\::. - ~\\ 0- V'Q.u.C\c. - \0 •t • .re~c:l0'-\.1: - ~ \AO.VVOUI 9 ~"'-~-t.VVCc.(~
-100'/. RE ~bo~,.:
~ WiP.e "-eo-c.: ... , - 2 .S' .... ""' •') (J"'~: "';~: 'fDO,. ...
L. ~two \tA'6e."' ". ~~: soo r~ l~·c.~·"·~ *' If a..
~ ~. ~- W.~ \o.~· \ O'-',
e N~-\;c..~ : 4 coo
-
• ?-~"' ~ \~ Gr-e."
• WIA \-l-\ ~\d ~e.cc.-tt-~v\~~ • \(1M\~e~ c:.\ ~c. ~ \~~V'Q.c:k~o~
e CDocrd.~ ""°'"*~ ve~o\"4.+: ~
• V''2°'- '=' Ou.ol> \ e. cL. o."'"' ~ e v ck\ co -l-ov c::, \ o \A~
185
i l
1 ~
20
15
10
5
0 0
. fils+ = ~ 0 0 0
( ev !_ ~ ""'r) L ~~ =LO ~~~-I
100 200 300 400
FaJSog(microns) vs Z-resolu~ion(microns) 15GeV
1GG
-
-
' ; .. I
' ) .. I ' I I j ' / .. I
r I
i
500
-
-
-
\~ ~- v~~~l.u.{\o'-' o~ c..'-'.o.~~~v·~
o;,.., \OO·l.CO r"--1. 10000 ~-"'*'a.l•• ~ '> \'i ~etJ -. E\JOU.Gt~
( 2.. ~·'4~ W"\A.tJ • l 0 ~ l. )
.. 5'000 pQv-~c.\,, p,. '!; G>a\/-. FtJOu.~1-1 ( S' '-'. o~.,. "''-'"" @ l 0'"' )
• • • • ? •
.. ('I....,
.lo '
45 ....
<iC ~ c: 35 ~
.3C ~
25
20 1 -'::l
10
5
0 -so ' '
ll~i::s. .
. 40
35
JO
25
20
15
10
5
0 -50
I ' - ! i "
- ------ ----------------------- N::,t:. Z o OD
-----------------------------
, I , , I r r I •
0 50 100 150 200 250 300 350 400
FclScg (microns) vs Z-resolution (microns) i 5GeV
-- ------------ --
--------------------------------
' ' ' ' I , ' I , I
0 50 100 150 200 250 300
FalSag (microns) vs Z-resolution (micrcns) 25GeV
188
-
·-I I I ii ' I
I -
-
I-
--
-
- • IMM '"'\ol\A.\-lscv'M ~a.B "'e.4~ t .S.~ e ld GcM ~o'4:t. TW- '9 ~- ~84\ , ~. ,..,·~0 ,.. c.v
L, ~A~lEL: O.'L1>'l. ~ o'k.
~ E\fl)CA-1> ~ 10 .~t. ._ ~.V .. '"°'-'cl~ 4 ol1.t~ ~ ~t:. ~
_ e T"-e "'\M°" \ e xto.v.c,~o~ I C.O'A.~"'a.e..~~ o ""
L. Mt~ A.le• to•c .,, o' v.. - e Tov-r.~o'-'- O.t"°"MJ.\O~~~
L. ~clol. ~ ~ ~ ~ 9 .\: W\M ~ ~ ( 6 1 ~) J Qa, a. b,a,.
bQ.4:%~ ~le ~QV~ i-o N'°(9,'f)
I.Mc:~~ ~~ .... tl ~o'\t • "'10\A ~u..~1so"'~ o.~ocla vi\"•~ ~
L.~v-e ~1!
- • A"''A~\A.~~\~e. ~
189
• ~ ~ OM o.R_{e.v \Aak~\IQ
l. eli~•~~e gCl~~
l. v-e•v.ee ~be"' o~
e A":!# c.ou.... ~ \q ~e""~Q.v ~ p'i'O f..e cl.u.\I'._ :
4 ine.Y-ea~& 1'e\\ A•\ l •+ ~ l
-
--
-
.~~~ -~ V"ef\IA.;V'Q'!> sevc..ro.l lr-o"'"' ~Yi ~~C.!. I+ t'A~·~~~-l-~"~ ~"' .;C&'D~ ~~,e o+
e'-'.Q. w.. be..,- po~\~ o'-'~
.. hQ~dWQ.V'tt. \\Mp\.e'M.e.C4~~o""-t
190
-
-...
-
-
I-• CD C.v
~
·-
) ) ) . ) ' ) )
Alignment System R&D Program rl? Alignment Test Stand,(ATS) Objectives
. -
• Provide a ''Test Bed" for proposed projective alignment hardware.
• Provide variabletemperature cond· itions as would be seen' in GEM.
• Measure the effects of air disturbances on the actual structure.
• Test actual hardware designs:for · chamber/structure· interface.
• Develop alignment procedures, test
t1111 our
./liiiJl•.11 ~-
_,... ,~
,-,-,-,-,-,.,-,-,-,-,-,-,-,-,-,-,-,,-,-,,,, ,, ~i', ... , ... ,'; ... , ... , ... , ... ,', ... , ... -·' .·',', ... ,', ... , ... , ',', ... J ... • • ... ··'. _._,,.,.,..,-.,
)
ing and certification. • Demonstr~te the .Physical constraints t L&.~~!"'"''-l*'H . ~ : . " . . . m . ii
of the vanous ahgnment schemes. , " " , , , , , , , , , , " , , " , ; , , , , " , , , . , , , , , , T . . . d k' .. ' ... ',' ... ',',',',',',','··/,",',',' ,',' .. :' ,' ,' ,' ,' ,' ,' ," ,',',' ,' ,' ,' , .... ,' ,' ,' ,' ,' ,' ' 1
• est pos1t1onmg actuators an 1n- ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ·· ·· ' ' ·· ' ' ·. ' , ' ' · ' , ·· , ' ' ' ·· ' ematic mounting ·schemes. · ~.--..... dSllfll
• Test bed for using X rays for. global alignment.
GEM PAC Review, May 26, 1993 C.R. Wuest
U. ~
I-' CD ~
•
Alignment System R&D Program ~e_1)
ATS· Experimental· Plan
• Measure stability of alignment hardware for 3-point projective alignment scheme. ·
• Measure sensitivity of alignment hardware to temperature and atmospheric variations.
• Study procedures for installation of CSC mock chambers and chamber/structure interface hardware concepts.
• Study quadratic interpolation method by intentionally distorting chambers in controlled ways.
• Evaluation of remote actuator system, operation of remote position actuators and C(ncoders, and development of alignment procedures.
• Vibration sensitivity measurement.
• Hardware optimization, including chamber interface hardware.
• Repeat tests for all straightness monitor technologies.
GEM PAC Review, May 26, 1993 C.R. Wuest
"--c • • • v • ' ' f
~
• •
-
195
0 u..J 1-- 1-<C :Z: __,_ :=>0 ~a_
U?:Z: 0
1--:z: 1-u..J u ~<(
:z:= ~ u..J -!----' :z: <(-
)
) /
...
-
--..
-
-...
...
-lSL
-
-
- )
-
-
- 197
-
---
-
-
-
-
-
-198
-
-
-
-199
-
-
-
Muon Beam
Cathode-Strip Chamber Tests GEM Muon Detector
MWEST Magnet
Beam
2A. Cu Radiator
Six-Plane Chamber
Lorentz Angle and Resolution Studies
Strips 11 Rotation by ± 10°
to Field
Wires .L to Strips
Resolution Studies from 0 to 50° Polar Angle
0B Beam
Strips II to Field
/ /
/
/
Wires .L to Strips
203
"" Rotate Upward 150.,,. .... ""
.,,.""""\"" -"" --"" --.,,, ---"" --"" --"" - - B -< - earn --- ------ --- - ----
Six Operational Chambers Shown Shaded
-240cm
-1\1WES_T_.Eloor.. _ l __ 30° _ B"'.:"'J Sector 1!;1 ~--------=900cm - - - - - - - - - - - - -
R~~te by_ 30° ~ ..... ------ - - -
.... -- Beam -------.... 350cm --
-.... -.... -
204
..
...
-
-
-
...
•
...
...
..
-
-
-
VLADIMIR G-LEBDV SSC L ~ -:J4 13. IJJ~
G E M Slow Cott/~
~ M 111,011. S~~ ~~Vu-m.e.w~
207
GE M Sliw Co/,1/tul ...
-~GEM TDR: .. ~·scMs ~ ~ ~~~ ol tk GCS
-tA &, ~kwt.UVtul ~ tk E P.Ics 11"
p. 8-lt, ..
EPICS - Ex~~td
P , fv~ I ~t;.ud -
-
208 -
-
w 'l =I ©
I
D~ ~
(fJ
~ ~ @
Q
= ~
~ l, _'5 @ = ~
-
Ch .. © s Fl § =1J
w
!--i 2 GI
8
~ .2:
! I .~
·~-di ~ <l
U) g u -
D
c: E O> GI ·- " i.IJ E en GI <D Ct a "' c
"' '- :::i: ~ E -5 ...
I : ~
"' .. ID 0
15 0
~· r:J < D • ~
.. .. 5
.. -"
"' ! ~
.. ID .. i:;
0 ·: u "'
l i 't: ID .s;
.£
... g
"' -ID c. 0
-
-
-209
[- ---
I '
( "' c Y-. 6 9 g __ ii ~ g ___ u ~
~!-n ll Y-.gillE y_ii q_jj '° -___ _:=T--"' g_n c
'---- g_u ~ •- H--n
t ;; f. "'
D 0 D D D D
~~ g--~ 5--5 g __ g a o D 0
8 g D=J g 0
! B 0--ll s D
~ g 0 0 6 g D
l-----11=1
5--S Q D
6--n 0 0 0 b
L----118=::B 0 0
210
I u
~ "'
-
-
-
l
-
-
N f-J. f-:,
) ) ) ) ) ) ,, '1 ) )
l / , Loo A~aillilioo .J
Channel Access
Operator Interface
Cllent
Channel Access
Cllent I Server
Client:
' '
PrOV1C1as 1eadlwrile camections lo any IUllsyslem
on Iha nerwork witt1 1 chamal access server,
Server. Provides 1eac21wme connections to information in
lhis node trom anywhela on the netwollc lhlough
Iha channel access client calls.
Platfonns: VxWOfl<s - ·c· interface
VMS - ·c· ana FORTRAN Interface
Ul'«X - • c· and FORTRAN Interface
Alarm Management
Client
Services Provided: Oynarmc Chamel Location
Gel (Corretalad.Asyncnronous)
Put
Archive
Cllent
Monitor (Correlaled.A5yncnronous1
Connection Mondonng
Automatic Reconnec1
Data CorrvetsiOns 10 Client Types
Nerwork Transparency
Operahng System lndeoenaence
!L<c:3 A~@IJiiilOS
)
N 1-~
f'J
• '
'nput·Cu:cut Control c;~::.e.=:;1;;;i1~:o;o;oo1;
I , i ; ~ ; • i: : I I . : I; . ! I 1 I! I
CiDl::a1=1c1a ICl:ltC!C
! S19n11 Cona1tiontnQ I
Input/Output Controller
Haroware C::rnoonems: 06020 Processor iloara ::nernet Conr.ect1on 5oarc ·nout. Ou1cu1 ~.~oc:i1es
· 0 ':ommun1cauon Mccu1es
~cau1rec Software: '/'CWOrKS Q:)era11ng Syster:-:
Oeve1ooeo Software: tnteracuve Oataoase ·.:.::nngur aucn i co1 Oaiaoase Access Dataoase Scan Tas•s lnouvOutout Drivers
Record Tyoes Suooorted: Ana1og Input : Outout Waveforms. Data Comoress1on Dlscre1e Input / Outout Mo1ors nmang Ca1cu1auons. PIO. Signal Select Suoroullne
110 Bus Suooort VME VXI Allen-Bradley Senal Bus GPIB Bit-Bus CAMAC
los A~@l!JUil<Os
( , • Operator Interface-~ \ • • • • t • I •
N I-"' C·J
) ) ) J J I I )
m ___ -Operator Interlace
.. '
D ........ ........
Operator Interface
Hardware Comoonents: SPARC Processor Boara Elhemet Connectton Board Gtaonic Generator Boara 19" High Resoluuon Monitor Keyboara Mouse
Acauired Software: UNIX Ooeranng System X Server X Client X Window manager
Develooed Software: lnteractNe Oisolay Editor Run-Tima Olsplay Generator Chamel Access
Graohical Elements: Line. Arc. Oval. Rectangle Monitors: Text lnaicator. Meter. Bar Controuers: Text. Button. Slider
lcs [email protected]!Mlos
Plots: Striochart. Value vs. Value. Wavetorm Relaled 01$play Callup
los A~~!Mlos
)
N 1-• .t-~
•
'"·
•
Haroware C.:imoonents: Scare Processor Boara E!herne1 Connecbon Boara SCSI Disk 1n1ertace Htgn SDHCl/l"!tgn OenSllY Disk
Acouired Software: UNIX Ocera1111g Sys1em SCSI Dnver NeiworK Frie Sys1em
Develooea Software: Arcnive ConhgUra11on Tool Arcnive User iniertace Run- l1111e Data Arenivar
Data Collection On Change On Oemanll Penoclle ltmed Triggered by Event Pre-<1e1ermnea Disk Allocalicln No Per enamel Ouoatas
Data Anat.vsis: Da1a Correlaocn Viewmg HiSIDnC Data through Time PlolS (Time.yy) (x.yy) : (llne)(mark)(pointl Fast Data Access Spread Sheet Repon Fonnat Encacsulatea PoslSCnPt Plot Format
Archiver
. 7j Archiver
los A~©JITiiilOs
r- ·- ·----··· Alarm Manager .. -· -- .. - -,
I • • • • • • • • I •
l\:) ..... C:.'"l
,
,
, )
I IV~ \ lnltU,JJI \A•JJI • llillQJllllGl"'l\~VIUlf
Fast Data Access Spread Sheet Repart Fonnar Encapsulated Postscnpt Plot Format
)
Alarm Manager
1-FJ Alarm Manager
Hardware Comoonents: Spare Ethernet Connecllon Board SCSI DISk lntertace High SP88d/Hlgh Density Disk
Acauired Software: UNIX Coeradng System SCSI Driver
Develooed Software: Alarm Configuration T col Alarm Access Routines Run-nme Alarm Manager
Alarm Monitorina Faull Tree Dellntion Faull Tree Descent Fault Tree Status Alarm Annunciation Alarm Acknowtedgement Alarm Log Fde Alarm Logger (Scron Wlnaow 1 Disable Sub-tr1111s Acdons Conflgurao111 Dy Sub-tree
0 ,
!Los A~@l!iiiilOS
los A~@l!iiiile»s
E PI C S s ~t~ d tk, s s CL
:z. M . Bo Ur; ~""f ( L E B)
3. S"vt-'1,,d rurJc- ~ t S D C
4. G E M w;Jl, h,fNlJt, E p I cs sys te/M., S o c> lit. ( "" 2 wuks ? ? ? )
EPICS J TTR v. Gtdr;v
A. Mo~s
G. Wo't,rL ••• • • •
21{)
--
-
-
-
-
--
-
-
...
-G E M H \A,Oli\. s y 5 t e- V1A.,
SJ~t~#l'A;S :
• H I,\.,/;~.. c-0~1/fNfe,,y~
• MwoK- 4~.,,t ~~
• L~v~ i M~~ T~~
• H~rl Vol~ ~t~
- • L'O w Vr;l t""~
' H~~ ~ ~~ -
• Sf!/t,vo - c,oll(, t ~ /."' 3 - fJO;,J ~UM,,td c-k.~~ r~¥.
-
-
-217
- '--I
' I - -==-=»I
I~ ::: J~-
::: ' - I~ ... ... , . ...;. ' ' mr .. -I' I~ I
~-~·. H:O-~
I. I --c:::....: •
I -! ' ~I: - ·-
~Trel'!a ... t.>"'!'--··
Ga Fig>..ire .!.lb: :'iluon Svs-..em End View
I L' ...! S.ic:ion) View from :'i"r.:!:t E!ld of 'CG H:iJI
ISIOO
-
218
• I ... =
Figo.ire .!.le: Emic:p }luon Cb:unbe LlTout (114 Secionl View from ll'
...
-
--
-
-
...
-
-
-
- Nvvo~ c~~
BQ/Vr.d E~c.t/;fS Totd 5 G fJ r ,,... r .... .::, .... 4 8 f) c.sc !4'10CSC
--M IMK. M o~t,,'t, Bo~ ~ cit, .. ""'" o~
-
-
-218
LV cable
;· Mother board
Signal fiber optic to trigger I DAQ
I /
Cooiing water inlet
220
Anode wire readout
Gas inlet
Cooling water iet
Cathode electr0nics
-
--
..
..
...
-
-
-
-
-
-
-
-
-
-
MM.-o~ A~,,,~~wt S~
R~~ 'U..-~wt : 2 5 ~Hi.-
D r~~~e-4 ll(A.,,O ~toy_ t;,,,, """" ... twe.. alit~""'t ~'t' ..st . /lfA,,fl~IJ,t:..
Oi.<..c.. f''tA~ / ~t;,,l°~xvc, ~
A'/=3U" s~ 9 :24 !>AO. s~
2n· i::; l
(a)
Coded mask
Light source (i.e. LED/field lens) Lens Projected
mask image
(b)
Composite LED illumination video
• • •
Frame Grabber ...
I
LAN
Power (12 V}
• RS-170 Chip or SS camera card ·
RS-170 Video Detector sites (per sector}
µ--computer Detector Site
:----------9µm , 4'. J-I I ' I I I i 3~ I
(c)
i I Straight-line residual ! ! ! - 2:- - I E , , · :.1:... '! _. I 1 i
~ o~ / j=iµm ~ ~~\ ~ ! ~~ . l __ , -4 _ __:::;.._ ________ ;.._;.._ ___ _
0 2000 4000 6000 8000 Displacement (µm)
TlP-03900
-
-...
-
-
--
-
-
-
-
-
-
-
(a)
Precision bearing
\ _ Wire
Precision X/Y Distance measurements bearing
/' /\ ~ \ _> 1 !'\, ~Wire _,
/C'L_ .... __ __J ..... r __ -'1 ..... r~ __ __;1 ..... ,.., ___ ....... ~ xf
mg Detector I ,'' ~ Jr i 316 / o-o
@ ~-,_.,,---.;-'1 '--r ___ _. ..... 1 .... ___ --~ ...... ~/,/-:v0'0
3 Proj. : Lens ,/' ,J,~,,_, p~sl /
(0 = 90°) ' ~ ~ ;; ;;~ ,,,,, 3 Projective paths
· ~.I ___ -----1J ._I ----lo<~~,~~.sc.0 <e = 30°>
(b)
Source .., z
Source Lens Detector
~i~ 12~==~·~!~~~~==::::U}::::::==~ ~ A 2 Axial paths on each 2 Axial paths on each Cl side of superlayer side of superlayer
3 Proj. paths 6 Proj. paths Q) (9 = 90°) (9 = 40°) ~ cfJ 3 Projective paths 0 i :§- (0 = 30°) en --------' i__ ___ _. c.;,o ~------------~Z
2nn Gu
TIP-03890
L e. v e. l 1 M IA,CK, T ~~ ...
Oic.. - r.,l....,....,,/q(, t..&.e,tu~ =;> M ~i<. M'l~i;,-r,. BD~ -
01{-cl.J'-lt- ~~* GEM R.~ t1o"""fo"
L~vd I M ~Mo T ~ --. ""'" g ~ -GEM fltM:,k Mo~~ -
I) Powvc- SfJ.1Jpt, v,,t~ f,.,, ~ ~
I.} P1woc.. ""'..,.1'f'lt ~Moo-~ /,or,, cae4 tYU.ti. •
.3) rc. .. p~~ '1- 4k't ....,J, w~ ...
4) w'cJtuc.. LM.,.r,a ...,,,/, ordrJ <f-1,.w ~tt-
-L t-ve.-l 1 M ~.-.... T ~ :
I>ow~a--olW..t- ~ -
-
-224
-
-
-
-
-
-
G- EM Hi~ Vol¥ s~ s~~ H. V. ~ /..,, _,a o1 tk. &.EM
ktu:'b,~ • Coi.v...IM.A'K.. H~w~
• s~ CotNt~ s~~
• SQAM..C, Cowl~ S,,/fw~
~ ¢ J..t '~~,/, ~ puo/,u,eul 4-«e/.. H. V. ~UK
8 ~~: LA-i. Cd.) N. C ... V./J.1TRD ....
C~/Vot~ ~:
~100 v ~ 7«-V C +1-J
"'- 10 KA ~ I ""A
:3GSO 1-1 V e4~
v M E G bl cx.,,'tc, I "8 H. v. e1c •• , ./~
g 8 020 /." P-uc.. J !=Jl e11e'f'J~ o/ ~ tu..2 u.~ ~t,;,°'":
Vs.t I Ioe > Vo ... i J r.,,,t > V~v
225
1440 c~~ zy
144~ HVc~
'°' 30 HV c~
N_ CA,OM.. HV s • SL I •
O~tiAct vol.t.,: 2. tk.'I
M1J1... ~ : ""ID~ A
22G
•
8,&32 Pt~ -{}
s, s32 1-1 v c~-~
I Slr fl V c-u.-~ -
-SL.2 SL3 -3.4 "" 4. D 1i.:v
~ 10 /CA •
-l~A
-
-
-
-
-
-
-
-
GEM low Volt~ S~
Si;""tb, L.v.1 Volt'-?- ~ ,h tk, t;EH
o S f)./·r/'_,i, ~ "" t -.u-t S;r/~ . s~ ... ..t. Cr,~~t 'V).e, So{ t W~...L s~~IVC,, ~ GEM R_«.c,lc_ r1 ,~by,
1 ) Po W"vt- s"-'rr4 volt~ i) P.wvi. ~rN~ ~K--~
.3) T~t~
4) \A/ ~t&.'t- /!Aw ~
H ~o~ S~vtA.,... :
L V P S ~'1.- M~~ ~t~~
L V P s ~~ M~1t. A.t~~
227
{'vENT
STQ"ll-"
8- ...... I .... ~I 1 ....... '?.:
1 I ~~mi J (.;::.~~ ~ • n1co-, ...... , I - 1 GASMDC~~- '-<D __J II-.;~~ ______ i__
I~~ :·--1 ·--·--·--·--·--~ I I'\
lfi___ -. I """"""" I """""'
I c. c CQl8PAl1SS )A .r--.. VM..VE
TIMPeAA'l'URE!i~ !f"~--&"' 'NC&R ~-L . ~f~1~~ \~'- _-_- _-_-_- -----'.
, .I - - : ;I'
---~~-·-'i,: ;-1· 1·,·, --- -- i!1I --, iill1
!NOC# •1 --1.:~-----· I ~=-----...ll·,. --·---~l~ ENOCN' - --.-----....!:' ------ . 'I I' I AlilUllN ---------~~~-:... : l ~'' ----' , ; ------ 1 !IJ'"---1
- • GIM HAU. !-- ':.o <:... ; : i J. ,-, "'"'.' - - , _____ Qi._Q_ .. ; ' 7~l; "1'. 1'018~ ·-'!'----==r.::- l I l "!!;;' GI .-,., ,...._;'. SECnJAS -,..--.....:1 ~~ .. -;=:\ - ~ -'-'-i .. ~ -;- 'i I - : ;:.
; . . i-.. f ':::: 1·~-.-UI!~ I r;...- - 1 ~,~~~ · 1 · 1 ;)111 1 · , ~ !:"'!:"' uul•l '" imi•mii liiiiilli•! ::-Ori"- c: :..S:Z ' I I '"'
J-)!-)!-)!-) ~ll,,'i'sNG 'ljlljjLl:!:;- . : • ~ 3~~ ~ I I P ~ ! ~ ' ~a Qt'.":";_";!~-~N ~ I!...=°" - "' ffi!~ "'
~---===--~· ' I '"-!:!--~~ : VI~·~ ~!J·~~~ ~ . -·-~ ""'""
"'°'°'- ~~ ""'""
228
-
--
-
.. ' E-o
-...
..
-
-
-
··.·-· .... --.·.··.;-" ---.-.·-. ·-·· 0 ' .
0
Q
- "'"" = ..... 0 u = "'"" .....
v..l (!,) u ·~ ~ - . . Q
, . ... ---- -;..., C)
..0 ---~ - --u
229 -