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EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse 1 4782 St. Florian am Inn Austria +43 7712 5311 0 Contact [email protected] www.EVGroup.com Printed on paper from sustainable sources. Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names are registered trademarks and/or the property of EV Group or their respective owners. © EV Group (EVG). All rights reserved. V20/01 ■ New SmartView® NT3 face-to- face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy ■ Up to six pre-processing modules like: - Clean module - LowTemp™ plasma activation module - Alignment verification module - Debond module ■ XT Frame concept for highest throughput with EFEM (Equipment Frontend Module) ■ Optional features: - Debond module - Thermocompression bond module Features Integrated platform for high precision alignment and fusion bonding Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG’s GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm. Introduction GEMINI® FB XT Automated Production Wafer Bonding System Technical Data Wafer diameter (substrate size) 200, 300 mm Max. number of process modules 6 + SmartView® NT Optional features Debond module Thermocompression bond module
