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GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 1
EXPORT CONTROLTHE INFORMATION AND TECHNICAL DATA CONTAINED IN THIS DOCUMENT ARE CLASSIFIED UNDER CATEGORY 4E001.A ACCORDING
TO THE SWISS EXPORT CONTROL REGULATIONS. EACH RECIPIENT IS RESPONSIBLE TO ENSURE THAT USAGE AND/OR TRANSFER ORDELIVERY OF THIS INFORMATION COMPLIES WITH ALL RELEVANT EXPORT CONTROL REGULATIONS.
PROPRIETARY INFORMATIONTHE INFORMATION CONTAINED IN THIS DOCUMENT IS THE PROPERTY OF THE VIBRO-METER GROUP OF COMPANIES AND SHALL BE
USED ONLY BY THE RECIPIENTS FOR THE PURPOSE FOR WHICH IT HAS BEEN SUPPLIED AND SHALL NOT BE DISCLOSED TO ANY THIRDPARTY WITHOUT THE WRITTEN CONSENT OF VIBRO-METER
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 2
GEnx 1B Engine Monitoring UnitP0x Delta DDR – Section 2.3 Rev 1
Communications Processing Module (CPM)
Updated 19th November 2008
Indication of updated slide following DDR review 11-18-2008
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 3
GENx CPM DDR Review – 11/18/2008
IntroductionPDR Mini-Review Action ItemsCPM ArchitectureBoard Views / Photos Reasons for ChangesSummary of ChangesPCB Layout ChangesPCB Material ChangeThermalVibrationPowerWeightEMI Grounding and ProtectionSwitching FrequenciesComponent SelectionManufacturing and TestabilityFPGA ChangesScheduleVerification / Certification strategy
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 4
Introduction
The CPM changes identified herein are included with the P0X (increased size cast chassis).
Existing P06 CPM is compliant to specification.
Changes are driven by manufacturing testability, Industry Norm compliance (e.g IPC) and an initiative to improve Reliability.
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 5
CPM PDR Mini-Review Action Items
Action Item Required Action Owner Status Meggitt DDR Comments1 SRAM BGA Lead-free Solder Plan Evaluate impact of the lead-free plan relative to
the SRAM BGA. Determine if there may be need of an outside house for BGA pre-tinning.
Meggitt CLOSED This action is addressed in Slide 36
2 CPM Thermal Analysis Need to perform analysis. Include results at P0X Review.
Meggitt CLOSED This action is addressed in Slide 23
3 FR4 PWB Glass Plies Confirm single/double ply construction. Meggitt CLOSED PCB is Double ply Construction4 FR4 PWB Single Glass Ply If single ply is used, evaluate if extra PWB
dielectric test is needed to screen for void issues.Meggitt CLOSED Not Applicable - Double ply
5 VSM & VMU PWB Glass Plies Provide construction comparison relative to present / proposed P0X designs.
Meggitt CLOSED Data provided via Meggitt CM_436 and presented within DDR Section 2.4, VSM material
6 Stacked Power Rail Capacitors Evaluate transient power-up stress when voltage rails may be offset.
Meggitt CLOSED This action is addressed in Slide 21
7 Removal of Thermal Planes Provide more detail on premise as being removed due to being unnecessary.
Meggitt CLOSED This action is addressed in Slide 23
8 CPM Weight Re-evaluate the weight reduction calculations. Meggitt CLOSED This action is addressed in Slide 339 PSM Stability With reduction of ~1 amp, verify the stability
margin of the PSM with the reduced CPM load.Meggitt CLOSED This action is addressed in Slide 32
10 Ground Plane Conduct a separate meeting to discuss the from/to EMU grounding changes for P0X.
Meggitt CLOSED Completed on 8-4-08
11 Ground Plane Include the from/to details at the P0X Review. Meggitt CLOSED Completed on 8-4-0912 Ground Plane Within the CPM, provide explanation of each
board layer (ie circuit traces, grounding, shielding, etc).
Meggitt CLOSED This action is addressed in Slide 17
13 Obsolescence List Re-review. Speculation that this SRAM will be obsolete within 3 years.
Meggitt CLOSED Similar to action 1 - see slide 36
Open 0 0%Closed 13 100%
Total 13
Action Item 9 status changed to Closed
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 6
EMU Internal Architecture
SignalConditioning
Speed Inputs
Vibe ProcessorDigital Signal Processor
(TI TMS320VC33)
Level C OS
Accel Inputs
Strain Gauges
VRT Inputs
Buffers Interface
Dual PortRAM
Dual PortRAM
FLASH
RAM
CPU2 Processor(Freescale MPC5554)
Level E
FIFO
FLASH
RAM
CPU1 Processor(Freescale MPC5554)
Level C/E
Interface
Interface CAN Bus (2) Datalinks
Interface HSESB (2) Datalink
Interface RS232 Ground Datalink
Interface ARINC 429 Ground Datalink
Interface RS232 Debug Datalink
Interface CAN Bus Debug Datalink
Dual PortRAM
FLASH
RAM
AFDX Processor(Freescale MPC5554)
Level C
RS232 Debug DatalinkGSE Test Signals Power Supply 115V 400 Hz ac power
RS232 Debug Datalink
InterfaceARINC 664 AFDX Datalink
InterfaceRS232 Debug Datalink
Engine Position
Descrete I/O
External ConnectionsAircraftEngineGroundDevelopment
SignalConditioning
SPI
RAM
CPMVSM
PSU
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 7
CPM Functional Block Diagram
FPGA Control
VSM DSP
CAN SW Test
429 Bus
CPU 1 RS232
DiscretesDual AFDX
Dual Hi Speed RS 485
ARINC 429
HSESB
4/8 MB Burst
FLASH
8 MB Burst SRAM
384 MB Flash
32 MB SRAM
32K x 32 Dual-Port
SRAM
XCVRS
EEPROM 2KB
Engine ID
VSM Temp Sensors
VSM SensorsInput
SPI
3
Temp Sensors
PSM Control & power
FPGA Control
4/8 MB Burst
FLASH
8 MB Burst SRAM
4 IN 4 OUT 32K x 32
Dual-Port SRAM
8 MB Burst SRAM
32K x 32 Dual Port
SRAM
Dual 1K x 32 FIFO
128 MB Flash
Dual AFDX PHY
XCVRS XCVRS
I2C Controller
XC
VR
S
FPGA Control
&Dual AFDX
MAC 10Mbps
Dual CAN
CPU 2 MPC5554 132 MHz
CPU 2 RS232
BDM
CPU 1 MPC5554 132 MHz
BDMBDM
AFDX RS232
AFDX MPC5554 132 MHz
GSE RS232
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 8
P0x CPM Board Views
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 9
Reasons for Changes
Improve Module manufacturing Testability and test coverage to conform to Vibro-Meter DFM and DFT Unit Reliability and NADCAP/IPC compliance (PCB material and Via Ratio reduction)Correct existing, minor tracking errors 2 mod wires on bottom side of board
Implement EMI mod wires
No functional Changes
No changes affecting Software compatability
No changes affecting CPM performance
No changes to internal switching fequencies
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 10
Reasons for Changes – Board Size
Additional real estate is required to add JTAG buffer components and to improve Via ratio
½ inch increase on card depth
Increased EMU chassis size of 1 inch
Additional½ inch
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 11
Summary of Changes (1)
Existing board New board Reason
14 SRAM TQFP 7 SRAM BGA119 Power/thermal reduction
Component Placement
14 Standard buffer 14 JTAG Buffer (3 chain) Increased manufacturing test coverage
Short Stiffeners Extended Stiffeners Improved Vibration response
Weight: 494 gr Actual Weight: 420 gr -
Dimension 197.5 mm x 219 Increased dimensions
210 mm x 219 mm (1/2 inch increase)
Additional aea required to add test points, JTAG compatible buffers and improve via ratio
Board thickness 2.8mm Board thickness 2.12mm Reduced weight
Improved via ratio
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 12
Summary of Changes (2)
Existing board New board Reasons
Copper layer Copper layer removed Weight and via ratio improvements
FPGA v13 Updated FPGA firmware for new Buffer control logic
Buffer control logic is different between existing & new board
Heater circuits tracks and component placement
Removal of Heater circuit Legacy from P02/P03
Via Ratio 14:1 Via Ratio 10:1 Reliability
PCB material:
FR4 TG170 Epoxy-fiberglassIPC4101A/24 (IS410)
PCB Material:
FR4 TG170 Epoxy-fiberglassIPC4101A/98 (IS420)
Reliability
Implement Ground Plane mods as per Grounding mini-review (Slide 36)
Lessons learnt
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 13
PCB Layout Placement Changes
Old versus New comparison on following slides
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 14
Old / New CPM – Top View
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 15
Old / New CPM – Bottom View
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 16
Via ratios
The ratio of the circuit board thickness to the smallest hole diameter is 14 for old board and 10 for new board
Existing board is IPC non-compliant
New board is IPC Class 3 compliant
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 17
PCB Stack up
Old and New PCB Stack-Up identified in the attached
Microsoft Word Document
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 18
PCB Material Change
Change of PCB material from IS410 to IS420 Both are FR-4 IS420 provides higher resistance to thermal stress High-Tg and temperature-resistant base material with improved expansion
behavior in the z-axis CTE is compatible to BGA material (die) IS420 Technical Datasheet attached
PCB supplier is NADCAP approved
Adobe Acrobat Document
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 19
Real Estate capacityEstimated 5% to 10% spare capacityZero Spare capacity on P06 CPM
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 20
Schematics
The current and new Schematics have been supplied to GEA seperately and will be re-submitted as part of eVSE for P0x
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 21
Stacked Power Rail – Transient Power-up Stress
PDR Mini-review Action item 6
CPM re-designed as per attached Report
Microsoft Word Document
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 22
Thermal Analysis
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 23
Temperature and Altitude Conditions Table III – M50TF4002-S3
Condition Temperature
High Operating Ambient Temperature – no cooling (Notes 1 and 2) 80ºC
Short Time High Operating Ambient Temperature – no cooling (Notes 1 and 2)
88ºC
Ground Survival High Ambient Temperature (Note 3) 88ºC
High Operating Altitude Ambient Temperature(Note 1)
60ºC at 50,000 ft.
Operating Low Temperature (Note 1) -55ºC
Ground Survival Low Temperature (Note 3) -55ºC
NOTES:1. A film coefficient of 7.2 Btu/(hour-square foot-ºC) applies.2. During operation at this condition, internal component temperatures shall remain below maximum rated operating temperatures.3. A film coefficient of 3.6 Btu/(hour-square foot-ºC) applies.
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 24
Environmental and Imposed Stresses Table II – M50TF4002-S3
Profile 1 – 22 Percent Occurrence Max Temp (Ambient) 24.8 ºC
Profile 2 – 28 Percent Occurrence Max Temp (Ambient) 36.2 ºC
Profile 3 – 28 Percent Occurrence Max Temp (Ambient) 45.2 ºC
Profile 4 – 17 Percent Occurrence Max Temp (Ambient) 54.2 ºC
Profile 5 – 5 Percent Occurrence Max Temp (Ambient) 63.4 ºC
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 25
Thermal Analysis
A « worst case » thermal analysis of the new CPM card was outsourced to Mentor Graphics, France.
Report available in French but will be translated
Top 10 components with least thermal margin on following slide
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 26
CPM Thermal Analysis –Top 10 Components with Least Thermal Margin
Component IDJunction
Temperature(Tj)
TjmaxSurvivability
Margin @ 80 Deg CSurvivability
Margin @ 88 Deg C
CAN#1 113 150 42 34 SRAM_gs832018t#2 112 125 18 10 MPC5554 BGA #3 112 150 43 35 SRAM_gs832018t#5 111.5 125 18.5 10.5 SRAM_gs832018t#7 111 125 19 11 SRAM_gs832018t#1 111 125 19 11 MPC5554 BGA #1 111 150 44 36 SRAM_gs832018t#4 111 125 19 11 MPC5554 BGA #2 111 150 44 36 PQFP_APA300 #2 110 150 45 37
Thermal Analysis performed at 85 Deg C Ambient
Table updated to show survivability margins at 80 and 88 Deg C
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 27
ConclusionsThe Thermal analysis was conducted at 85 Deg C ambient in “worst case” conditions
From the data available there is no issues with thermal margin, either from a survivability or operational standpoint
For the P0x design, the thermal analysis will be validated as follows: Instrument the top 10 least margin components (from Thermal Analysis) whilst running
the following test in a closed chassis environment
• Soak at 80 ºC , until all internal temperatures have stabilized, operate for a minimum 2 hours – verify thermal margin against manufacturers max junction temperatures
Instrumented test will be performed at 80 Deg C
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 28
Vibration
FEM Modal Analysis completed on new board with extended stiffeners and reduced PCB thickness
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 29
Board Modifications affecting Vibration
Copper Layer removed
Extended Stiffener implementation
Board dimension increased : 210 x 219 [mm]
PCB Thickness reduced : 2.12 [mm]
Total CPM Weight Reduced by : 74g (Weight = 420 [g])
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 30
Vibration Analysis
Current Board New BoardExtended StiffenersShort Stiffeners
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 31
FEM Modal Analysis
Current design New design
430 Hz 425 HzConclusion
New board is expected to have equivalent vibration behaviour
Extended Stiffeners
Current Board New BoardShort Stiffeners
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 32
CPM Power Consumption / Impacts on Existing PSU Design
CPM Power Consumption Old board: 14 SRAM @ 230 mA: 3220mA New board: 7 SRAM @ 310 mA: 2170 mA
------------- 1050 mA reduction
PDR Mini-Review Action Item 9: Power Supply Stability with reduced Load PSM (3.3V to CPM) was designed and tested for range Zero to 3A. By the design topology of switching DC/DC converters, we know that a
converter designed for max 3A, will work for any current up to 3A. We can expect with reduced consumption is reduced output ripple
Second Bullet added to cover PDR Mini-Review action 9 (PSM stability)
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 33
Weight
Existing Board Weight : 494 gr
New Board Weight : 420gr
Weight Reduction : 74 gr (2.6oz)
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 34
Component Selection (New Components)
New components introduced in this CPM Design JTAG Buffers
• Existing buffers replaced with JTAG equivalent devices (14 off)• These are upscreened parts
SRAM • 7 BGA devices replacing 14 TQFP devices• 7 x 17 ball Bump BGA-14 x 22 mm2 Body-1.27 mm Bump Pitch• Military Temperature range parts• Extract of Data sheet attached
Adobe Acrobat Document
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 35
Component Obsolescence Status
P0x Component Obsolescence Status updated on 11/14/2008 – No issues raised
Microsoft Excel Worksheet
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 36
Component Obsolescence – BGA SRAMThe (new) BGA SRAM was raised as a specific obsolescence risk by GEA –> PDR Mini review actions 1 & 13
Meggitt Response as follows: See attached letter from manufacturer (GSI) regarding continued production of this part
BGA SRAM pre-tinning: • The BGA cannot be pre-tinned. They can be reballed but this process is not
recommended by Vibro-Meter
All military customers are using this version (SnPb balls)
Obsolescence Mitigation -> We will have 12 months to take a decision: 1. Place a last buy order, 2. Demonstrate reliability of a Pbfree BGA inside a SnPb process3. Reball the component
Adobe Acrobat Document
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 37
EMI Grounding and Lightning Protection
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 38
EMI Grounding Scheme (CPM)
The Overall EMU Grounding scheme has been subject to an earlier mini-review with GEA (Feb 15, 2008)
The CPM Grounding scheme fits into the overall Grounding scheme and is identified on following slide
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 39
EMI Grounding Scheme - CPM
0 Ohms1nf/2kv
CALMARK / WEDGELOCK
0 Ohms1nf/2kv 0 Ohms1nf/2kv0 Ohms1nf/2kv
CALMARK / WEDGELOCK
CPM BOARDGROUND PLANES (0V DIGITAL)
CHASSISGROUND
CHASSISGROUND
0 Ohms1nf/2kv0 Ohms1nf/2kv0 Ohms1nf/2kv0 Ohms1nf/2kv
COUPLE OF CAPACITY & RESISTOR, NUMBER OF COUPLE DEPENDING THE PLACE ALLOWED ON THE BOARD
COUPLE OF CAPACITY & RESISTOR, NUMBER OF COUPLE DEPENDING THE PLACE ALLOWED ON THE BOARD
3x STIFFENER
ON EACHSCREW
ALL GROUND /
SHIELDCONNECTED
TO 0V DIGITAL
BO
AR
D C
ON
NE
CT
OR
S
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 40
Lighting protection
1.6KV isolation between Case_gnd and on board components
ESDA19SC6 and SLVU2.8 protection are used
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 41
Internal Switching Frequencies - CPM
Frequency: Used For:
25MHz Master oscillator for AFDX & FPGA timing & other time bases
56MHz Master oscillator for CPUs & FPGA timing, local CPU buses
112MHz (132MHz)
2X PLL in CPUs for internal operating rate
40MHz PLL derived from 25MHz in FPGA for HSSB & various timing
300kHz 1.5V & 2.5V switching regulators (on-board CPU)
2.5MHz HSSB external I/F {derived from 40MHz}
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 42
Internal Switching Frequencies – CPM cont.
Frequency: Used For:
10MHz AFDX external I/F {PLL derived from 25MHz}
1MHz ARINC 429 controller clock {derived from 40MHz}
100kHz ARINC 429 external I/F {derived from 1MHz}
88-330kHz I2C serial bus for on-board and inter-board peripherals [SW configured at 88kHz]
1MHz SPI serial I/F for inter-board peripheral
1MHz CAN external I/F [SW configured]
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 43
BGA Devices
BGA SRAM 7 x 17 Bump BGA-14 x 22 mm2 Body-1.27 mm Bump Pitch
Smaller BGA devices than those already implemented (3 off 5554 Power-PC BGA 416)
SRAM BGA ball size / spacing is larger than the MPC5554
Five CPM boards manufactured and all BGA joints have undergone X-Ray. No issues raised from a manufacturing perspectice
BGA Solder Joint Life Analysis
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 45
Solder Joint Life Analysis
Analysis Scope: • Thermal Cycle Fatigue Life Analysis
• Plastic Ball Grid Array (PBGA) With 416 Solder Balls
• 5 Different Temperature Profiles With Percent Occurrences
Analysis Results:
• Published in Meggitt CM GEnx EMU CM-VM-GEAE-020 R1 ‘Solder Joint Thermal Fatigue Analysis for New Temperature Profiles’
• A thermal cycle equilibrium equation was used to obtain the forces, stresses and thermal cycle fatigue life of the solder joints (63/37 sn/pb) for the Type 5554 PBGA. The most critical solder joints were in the corners of the square PBGA because these solder balls are the greatest distance from the neutral axis of the component. The approximate solder joint fatigue life was based upon the airplane flying 3 long flights a day, 6 days a week, 48 weeks a year for a total of 864 flights a year. This resulted in a solder joint fatigue life of about 31.2 years, when each flight was equal to one thermal cycle.
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 46
Electrical Components Derating
M50TF4002-S3 Paragraph 3.6.12 Electrical Components Derating In lieu of the requirements of M50TF72, internal components of the EMU shall be
derated using TE000-AB-GTP-010 as a guide, or an alternate procedure subject to Purchaser approval, under the following conditions:
(a) The highest mission profile temperature defined in Table II - [M50TF4002] for the hottest mission mix day, excluding mission profiles with less than 10 percent occurrence.
(b) All input and output interfaces utilized during normal system operation connected with nominal loading and mid-range input signals as applicable.
The existing CPM is shown to be fully compliant via Meggitt ECM GEnx EMU CM-VM-GEAE-262
Derating analysis to be updated for EMU P0XNew CPM components (BGA SRAM and JTAG buffers) will be compliant
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 47
Manufacturing Testability
Due to dense population of existing board the DFM/DFT standards for testability were never achievedDetailed DFM/DFT reviews have been held with manufacturing departmentBoard test strategy includes JTAG testing and « Bed of Nails » functional testing (using MTS TM Test Equipment) JTAG test coverage
• Existing Board: Calculated test coverage of 25%• New Board: Calculated test coverage of 75%
Bed of Nails• Additional test points have been added on new board
Test coverage at board level will be > 95% and fully Automated
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 48
FPGA Changes
Reasons for FPGA Changes
Change Description
Change Impacts?
DO-254
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 49
Reason for FPGA Changes
Implement new buffer control for JTAG devices
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 50
FPGA Change Description
Old buffer New Buffer
OEn and DIR pin Direction are managed only with two OEn pins
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 51
Impacts?
There are NO impacts on CPM Bootloader or on CPM Operational Software (AFDX/OS/AS)
FPGA firmware change will be configuration controlled via CPM and EMU Hardware part number change controlled via GEA DCID and DPD (PNR 2122M32P08)
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 52
DO-254 Certification
A delta DO-254 certification is in progress for the CPM FPGA devices on CPU 1 and CPU 3
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 53
P0x CPM Key Milestones & Validation Status
Five Boards Manufactured
Bench Testing Verification Completed at Module level
Production JTAG testing completed
DAT (Thermal) testing in P0x chassis is pending availability of Flex prints and is scheduled Jan 2009
GEnx EMU DDR 18 November 2008 © Vibro-Meter Confidential and subject to Export Control as per Front Page Section 2.3 CPM Slide 54
25 Point Matrix
Certification Strategy
New CPM will be certified at Component level as part of GEnx -2B component certification tests (currently scheduled Feb to May 2009)
25 point Component Certification matrix
Microsoft Excel Worksheet