Andy Blue
Glasgow Update
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Update
• ABCn130– Dicing and FIB work– Wire bond trials– Bonding program v3
• X-ray imaging of Glue Coverage• Spending
– Cabinets
• ATLAS12 measurements– Analysis software
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ABNc 130
• First ABCn chips are now with FIB group– Remainder of chips to be diced
• 30 for FIB
• Remainder for wire bond trials
– Plan is to hand out to groups at AUW• As well as Glass ASICs
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130nm Bonding Parameters
• 2nd Wire bonding trials began– Using back to back abcn130 chips
• Separated by 1.5mm to allow 30o angle with 500um bond loop height– used chips from periphery of wafer
• Bonds to go down next few days– Will look at the lower bond forces suggested at last meeting
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QA - Wire bonding Programs
• Now have a range of programs for wire bonding QA– 250nm Barrel
• Hybrid work
– V1 : Records bond number and fault
– V1.2: Records bond number and tells user info
on bond
• Module Work– 130nm Barrel
• Hybrid Work V3 finished last week•Able to cope with
Different hybrids and modules for both endcap and barrelDifferent bond programs for different institutions
•User chooses appropriate .h file for usage
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QA – SVN repository
• As of last have SVN account at CERN• Means anyone can download the version they want• Can play with/optimise code• Will let others know when ready to download from
• Can use same area for other code (eg vac monitoring)
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• Had this idea for a while – Use the Medipix chip to X-ray the ASIC gluing– Images taken of Module via Bart over various areas
• 60Kev (Vp) X-rays with 1s acquisitions
Medipix Hybrid Pixel Detector
• 65k single-photon counting pixel array;
• Square pixel size of 55 µm;
• 14x14 mm area;
• Electron or hole collection;
• Threshold equalisation;
• Count rate of ~100 kHz;
• Readout in 300 µs;
• High dynamic range;
Medipix/Timepix
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X-ray Imaging – ASIC Gluing
• Scanned glued hybrid on Module (from Bart)
• Very clear Imaging of glue spots
• Rough analysis shows glue coverage of 39%
• Good for• Sanity check• Initial 130nm glues?
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BCC on Module
• Imaging of BCC on the module
• Tuning “should” allow me to see the module to hybrid glue as well
• We also have an automated stage that can be used to raster scan a full module
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Spending
• Dry storage cabinets – Delivery dates of Tue 25th and Wed 26th March– FAO Cambridge & RAL to successfully receive these as a
Glasgow order I need a scan of the delivery confirmation from your sites
• Almit ran out of component for model ordered– “The original HSD-1106-51 had a basic control unit and display but it has been replaced with
a SIEMENS display and controller (that has been used on more expensive Totech cabinets for about 5 years) that makes the dry unit operate more efficiently …..and operates in a SMARTER way…”
– “it dries faster (recovers quicker) after door openings and holds the RH set point more accurately…so the performance is better…”
– “They should be sold at a higher price…but yours prices won’t change.”
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ATLAS12 measurements
• Fixed Analysis code– Returns correct (bad) CCE from irradiated sample under test– Writing additional code that plots measurements from multiple
files for given sample • E.g. CCE measurements for varying voltage and automatically
plots in ROOT
Example of code in testbeam reconstruction
Plots cluster size from various input files