USA – CANADA – UK – CHINA – INDIA

Global Semiconductor Packaging and Assembly Equipment Market

2016-2020

USA – CANADA – UK – CHINA – INDIA

Scope of The Report

• Market landscape of global semiconductor packaging and assembly equipment

market

• Market size and forecast of global semiconductor packaging and assembly

equipment market

• Key market highlights of global semiconductor packaging and assembly

equipment market

• Understanding the challenges faced by the market

• Enabling technologies and the roadmap

• Key focus areas for the vendors

• Major trends that will shape the future of this market

• Vendor landscape and trajectory of the market

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Key Segments

• Global semiconductor packaging and assembly equipment market

segmentation by type

• Global semiconductor packaging and assembly equipment market by

business

• Global semiconductor packaging and assembly equipment market

segmentation by vendor

• Geographical segmentation of the global semiconductor packaging

and assembly equipment market

Global Semiconductor Packaging and Assembly

Equipment Market 2016-2020

USA – CANADA – UK – CHINA – INDIA

Growth Rate

Technavio’s market research analyst predicts the global semiconductor packaging and assembly equipment market to grow steadily at a CAGR of around 5% during the forecast period.

CAGR:

Key Vendors and Regions

Vendors Regions• Applied Materials

• ASMPT

• DISCO

• EVG

• Kulicke and Soffa

Industries

• TEL

• Tokyo Seimitsu

• APAC

• Europe

• North America

View Our Report: Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

USA – CANADA – UK – CHINA – INDIA

USA – CANADA – UK – CHINA – INDIA

Key Questions Answered in Our Report

• What will the market size be in 2020 and what will the growth rate be?

• What are the key market trends?

• What is driving this market?

• What are the challenges to market growth?

• Who are the key vendors in this market space?

• What are the market opportunities and threats faced by the key vendors?

• What are the strengths and weaknesses of the key vendors?

Have a question of your own about this report?

please drop us a mail atenquiry@technavio.com

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Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

USA – CANADA – UK – CHINA – INDIA

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