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GreatTeamBackendFoundry,Inc.
www.gtbf‐ltd.com
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Aleaderofsemiconductorpackagingandtes?ngservices,specializedinpowermanagement,smallsignal,discreteandcontrolICspackages.
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DateofFounded:May/21/2001
Paid‐inCapital:USD42.4Million
MajorShareholders:Etron,Pouchen,Hotung
Chairman:MaxWu
C.E.O.:CraigTzeng President:JohnsonTzu No.ofEmployee:1,000(Apr2011)
FactorySpace:11,000SquareMeter
CurrentMaximumCapacity:210KK/month
ManufacturingFacility:DongGuan,GuangDong,China
URL:www.gtbf‐ltd.com
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Increaseproduc?vityandcosteffec?venesstoachievehighprofitabilityandmaximizetotalreturn.
Increaseproduc?vityandcosteffec?venesstoachievehighprofitabilityandmaximizetotalreturn.
Establishlong‐termpartnershipwithcustomer,vendorsandemployeesformutualgains.
EnsurehighgrowthtoincreasemarketshareinPowermanagement
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Toprovidethetotalsolu?onofdevelopment,produc?on,logis?csanddropshipforpackagingandtes?ngservice.
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PassedDelphiManufacturingCapabilityAssessmentAudit
PassedPanasonicAutomo?veauditPassedAlpinesaudit
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PackageJun2001 IncorporatedinBVIDec2002 Massproduc?onTO‐252packageFeb2003 IntroducedSOT‐89packageMay2004 IntroducedSOT‐23packageNov2005 IntroducedSOP‐8packageMay2007 IntroducedTO‐220andTSSOP‐8packagesAug2007 IntroducedSOT‐223packageAug2008 IntroducedTO‐220FandPPAK(DFN5x6)packagesAug2010 IntroducedMicro3packageOct2010 IntroducedDirectFET(customizedPackage)May2011 IntroducedTO‐247packageAug2011 IntroducedQFNPackageTechnologyAug2006 NewtechnologyALribbonmassproduc?on.Aug2008 ABCCuwirebondingIPregisteredApr2009 Massproduc?onABCCuwirebondingAug2010 Massproduc?onFullCuWirebonding
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CurrentProducts TOseries:TO252,TO220/FP,TO263,TO2477 SOseries:P/SOP8L,TSSOP8L SOTseries:SOT223,SOT89,SOT2X(EIAJ/JEDEC),SC70
DFN:5x6PPAK8L QFN:2x2,3x3,4x4,5x5… DirectFET:Large(6.95x9.1),Medium(4.9x6.3),Small(3.8x4.8),
Tiny(2.9x4.0)
9 Pla?
ng(O
utsou
rce)
DieSaw DieBond WireBond Molding
T/F Tes?ng&Packing Rel.Lab.
CentralIsle
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DieAjach Epoxy Solder Eutec?c
WireBond Au ABC/Cu Alwire&Ribbon
MCM LFBase
LaminateBase
Packing Tape&Reel Tube Tray
Tes?ng AnalogueIC PowerDiscrete MixSignal
Dieajach:Epoxy+Solder
Wirebond:Au/Cu+Alwire/ribbon
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2011 2012 2013
Performance
SmallFormFactor
LowCost
Cycle?me
Reliability
Ready
Alwire,AlRibbon,Cuwire,
Auwire
Solder,Epoxy,Eute;cBond
Backsidemetalpla;ng
WaferThining
MSLL1
RibbonBond CuClip
ThinWafer
QFN+MCM FlipChip
WCLSP
RibbonBond ThinWafer
LGA+MCM
CP ThinWafer
Mul?chippackaging
FlipChip
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CurrentProducts TOseries:TO252,TO220/FP,TO263,TO2477 SOseries:P/SOP8L,TSSOP8L SOTseries:SOT223,SOT89,SOT2X(EIAJ/JEDEC),SC70
DFN:5x6PPAK8L QFN:2x2,3x3,4x4,5x5… DirectFET:Large(6.95x9.1),Medium(4.9x6.3),Small(3.8x4.8),
Tiny(2.9x4.0)
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SOTSeries TSSOP SOT‐223 SOT‐23/25/26 SC70 SOT‐89
SOPSeries SOP‐8 SOP‐14 SOP‐16 PSOP‐8 MSOP‐8 PPAK
TOSeries TO‐252 TO220/FP TO263
TO247
IPM
1sthalf2012
2ndhalf2012
2013~2ndhalf2011
1sthalf2011
TOSeries TO247
QFN
Forribbonbonding
QFN/LGAMCM
Forwirebonding
LowRdson Highdensity Highthermalperformance
IPM‐Auto
IGBTModule‐Rail
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Today 2ndhalf2011
1sthalf2012
2012~1sthalf2011
PowerModuleSiP IntegratewithIGBTs,Diodesanddrivers Transfermold Passivecomponents
TSSOP‐8 2to3DieMCM
PSOP8/SO8 2to3DieMCM
PSOP8 2to3DieMCM Ribbononchip
QFNRibbon+Ballbond 2to3DieMCM LowerResistance
D2PAK/DPAK 2to3DieMCM
IGBTModule MCMwithcas;ng Vacuumsoldering
QFN Buckconverter Copperbond Ribbonbond CLIPbond FlipChip
QFN Dr.MOS Copperbond Ribbonbond
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Tosupportthemarketrequirements Willheavyinvestintohighpowerpackages(IGBTs,IPMsetc,) ImprovethermalperformanceforhightemperatureMCMapplica?ons
Weofferourcustomersjointdevelopmentandmodifica?onfor Newpackagingtechnologydevelopment(MCM&powerpackagesetc.) Jointtestprogramdevelopmentforqualityimprovement Forimprovementofthermalperformanceandcharacteriza?on
Dedicatedcustomerlines(highIPprotec?on) SecureQualityduetopermanentcustomersurveyatthefacility Excellenttrainedworkforce
Logis?c:Drop‐shipmentandHUBmanagement
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GreatTeamBackendFoundry,Inc.
B,gbmPark,.YueYuenIndustrialEstate,HuangJiangZhen,
DongGuanCity,GuangDongProvince,China
Tel:+86‐769‐83635267,+86‐769‐86915999
Fax:+86‐769‐83661290
E‐mail:Grace_Wu@gtbf‐ltd.com
www.gtbf‐ltd.com
EuropeanRepresenta?veHTCErnst.Weissbache.K
T:+49‐8106‐351646
eaweissbach@htc‐weissbach.com
www.htc‐weissbach.com
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Ourmanagementphilosophyistobetrulycustomer‐oriented
byprovidinghighlyreliableproductqualityandcon?nuousimprovement
inordertoachievetotalcustomersa?sfac?onand
cost‐effec?veness
Serviceisourmojo