Harness Requirement Specification - EMITS Invitation To...

wilson_r

EadsAstrium

LISA Pathfinder

S2.ASU.RS.2022Issue 1

Page 2 of 44

EADS Astrium Ltd owns the copyright of this document which is supplied in confidence and which shall not be used for any purpose other than that for which it is supplied and shall not in whole or in part be reproduced, copied, or communicated to any person without written permission from the owner.

S2.ASU.RS.2022 ISS01 Harness Requirement Spec.doc

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CONTENTS

1. INTRODUCTION AND SCOPE.....................................................................................................................6 1.1 Note to User ...........................................................................................................................................6 1.2 Introduction.............................................................................................................................................6 1.3 Scope .....................................................................................................................................................7 1.4 Summary Description .............................................................................................................................7

2. DOCUMENTS................................................................................................................................................8 2.1 Applicable Documents............................................................................................................................8 2.2 Standards ...............................................................................................................................................8 2.3 Reference Documents............................................................................................................................8

3. HARNESS DESIGN REQUIREMENTS ........................................................................................................9 3.1 General Requirements ...........................................................................................................................9 3.2 Connector Requirements .....................................................................................................................10 3.3 Wire Requirements...............................................................................................................................10 3.4 Bundling Requirements ........................................................................................................................11 3.5 Identification Requirements..................................................................................................................12 3.6 Pyro Harness Requirements [STD 03] .................................................................................................13

4. INTERCONNECTION AND ROUTING REQUIREMENTS .........................................................................15 4.1 Interconnection Requirements .............................................................................................................15 4.2 Routing Requirements..........................................................................................................................15 4.3 Layout Requirements ...........................................................................................................................16

5. HARNESS CHARACTERISTICS REQUIREMENTS..................................................................................17 5.1 Mass .....................................................................................................................................................17 5.2 Voltage Drop Requirement...................................................................................................................17 5.3 Double Insulation..................................................................................................................................17

6. EMC / ESD REQUIREMENTS ....................................................................................................................19 6.1 Type Table............................................................................................................................................19 6.2 EMC Segregation Rules.......................................................................................................................19 6.3 Backshells / Overall Grounding ............................................................................................................20

6.3.1 Shield Grounding........................................................................................................................20 6.3.2 Shield Grounding Measurement ................................................................................................20

6.4 ESD Requirements Against Bulk Charging..........................................................................................21

7. MECHANICAL INTERFACE........................................................................................................................22 7.1 Mechanical Conditions .........................................................................................................................22

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8. THERMAL INTERFACE..............................................................................................................................23 8.1 Thermal Conditions ..............................................................................................................................23 8.2 Thermal Bakeout ..................................................................................................................................23

9. MANUFACTURING REQUIREMENTS.......................................................................................................24 9.1 Process & Techniques .........................................................................................................................24

10. VERIFICATION REQUIREMENTS ...........................................................................................................25 10.1 Manufacturing Tests...........................................................................................................................25 10.2 Subsystem level Verification ..............................................................................................................26

11. QUALITY ASSURANCE............................................................................................................................27 11.1 General Requiremnts .........................................................................................................................27 11.2 Responsibilty for Inspection ...............................................................................................................27 11.3 Reject, Retest and Failure Reporting .................................................................................................27 11.4 Package Inspection/shipping..............................................................................................................27 11.5 Facilities..............................................................................................................................................28

12. PRODUCT ASSURANCE .........................................................................................................................29 12.1 Software Product Assurance..............................................................................................................29 12.2 Design Software .................................................................................................................................29 12.3 Harness Supplier Database ...............................................................................................................29

13. GDIR APPLICABILITY MATRIX................................................................................................................31

TABLES Table 3.4-1: Signal Type Specific Requirements ............................................................................................12 Table 6.1-1: EMC Type Table .........................................................................................................................19 Table 8.1-1: On-Ground Thermal Environment for Pre-selected Launchers ..................................................23 Table 8.1-2: Thermal Qualification & Acceptance Levels................................................................................23 Table 10.2-1: Subsystem Level Verification ....................................................................................................26 Table 12.2-1: System Connectivity Report Example.......................................................................................29

FIGURES Figure 1.2-1: The LISA mission will use an ultra-precise interferometry through three satellites flying in

formation on an Earth-like orbit to measure ripples in space-time ............................................................6

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1. INTRODUCTION AND SCOPE

1.1 Note to User

This specification is applicable to the design, definition characteristics and verification requirements for the manufacturing of the LISA Pathfinder harness.

Lisa Pathfinder is the second of the Small Missions for Advanced Research and Technology (SMART), an element of the European Space Agency’s “Cosmic Vision” plan for scientific projects.

1.2 Introduction

LISA is a co-operative program between ESA and NASA to detect and measure `ripples' in the fabric of space-time to verify tenets of fundamental physics. The program includes two space missions; The LISA PATHFINDER mission and the LISA mission.

LISA will consist of three spacecraft flying in a quasi-equilateral triangular formation, in a trailing Earth orbit at some 20 deg behind the Earth (see Figure 1.2-1). Within each spacecraft, a measurement system consisting of two test masses, associated laser interferometer measurement systems, and electronics will detect and measure low frequency gravitational waves. The test masses are maintained in a drag-free environment, i.e. shielded from spurious external forces, by using low thrust propulsion. This mission is currently in its formulation stage.

LISA PATHFINDER is a precursor mission to LISA that aims to flight test most of the challenging technologies necessary for LISA.

Figure 1.2-1: The LISA mission will use an ultra-precise interferometry through three satellites flying in formation on an Earth-like orbit to measure ripples in space-time

Among these technologies, the demonstrations of the LISA Technology Package (LTP) and the µPropulsion Technologies have been identified as mandatory. Additionally the mission will enable the in-flight demonstration of the NASA provided DRS (Disturbance Reduction System).

The Lisa Pathfinder spacecraft, will demonstrate both electric and coloidal micro-thrusters during its 1 year mission at the Earth-Sun Langrange point.

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1.3 Scope

This document contains the contractually relevant requirements and constraints for the LISA Pathfinder project. This includes:

• The design and interface requirements of subject hardware

• The general testing and verification requirements

Requirements within this document are shown in an italic font. Each requirement is proceeded by a summary line that contains the following fields, delimited by "/".

• <Doors Requirement Number> HAR-xyz. This is a unique number, assigned consecutively

• <Created From> Shows parent requirement

• <Test Method> T= Test, A = Analysis, I = Inspection, R = Review of Design

If tables are considered as part of a requirement they are referenced clearly in the text and inserted after and separated from the requirement and are managed as free text attached to the identifier requirement.

The trace to the upper level requirements (Upper Links), shall be managed using the following format:

• AAA-NNNN where AAA is a label associated to the upper document and NNNN the requirement identifier of this upper level.

• Or CREATED key word if the requirement has no link with upper level

All document elements not presented in the format explained above are not requirements and will not be verified or tracked.

1.4 Summary Description

The harness shall provide all the electrical connections between the mounted equipments and skin connectors, to the interface connector brackets which connect to the payload equipments via Umbilical interface connectors.

The harness shall guarantee correct electrical functionality during launch and all other mission phases by ensuring correct electrical performance. This shall be achieved by the appropriate separation of power and command/monitoring signals and by the correct implementation of the harness.

The design approach shall ensure that the optimum technical solution is produced which meets all of the applicable harness requirements.

Implementation and operational activities (e.g. procurement, repair and logistics) are also addressed. The output from the harness design shall be a formal set of engineering and operation documents (i.e. drawings, procedures, analyses) which will then allow formal tracking and control of the harness design implementation to assure conformance and achievement of the overall LPF mission objectives.

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2. DOCUMENTS

2.1 Applicable Documents

[AD 10] S2.ASU.RS.1005 PA Requirements for subcontractors

[AD 15] S2.SYS.RS.1001 Software Product Assurance Requirements for Sub-Contractors

[AD 17] S2.ASU.RS.2031 General Design and Interface Requirements Specification

2.2 Standards

[STD 01] ECSS-E-20A Space Engineering - Electrical and electronic

[STD 03] ESCC-E-30 ESCC Mechanical part 6 Pyrotechnics

[STD 35] ECSS-Q-70-26 Crimping of High Reliability Electrical Connections

[STD 36] ECSS-Q-70-08 The Manual Soldering of High Reliability Electrical Connections

[STD 37] ESCC 3901 / 001 Polymide Insulated Wires and Cables, low frequency, 600V, -100oC to +200oC



[STD 40] ESCC 3401 / 002 ESCC Detail Connector Specification Type D*MA

[STD 41] ESCC 3401 / 008 ESCC Detail Connector Specification Type Circular

[STD 42] ESCC-Q-70-01 ESCC Harness Qualification Specification

2.3 Reference Documents

[RD 146] S2.ASU.ICD.2002 LISA Pathfinder Science Module Mechanical Interface Control Document

[RD 147] S2.ASU.ICD.2003 LISA Pathfinder Science Module Electrical Interface Control Document

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3. HARNESS DESIGN REQUIREMENTS

3.1 General Requirements

HAR-49/CREATED/I,R

The design and routing of the SCM Harness shall be based on the MICD [RD 146], EICD [RD 147].

HAR-50/CREATED/A,R

The design shall not provide a nominal and redundant circuit on the same interface connector. If this is not feasible then connector pins carrying redundant functions shall be physically separated and isolated from each other.

HAR-51/CREATED/I

ONLY crimp terminations shall be used at harness connectors and internal harness interconnection splice points.

HAR-52/CREATED/I

The harness design shall ensure that the number of internal harness crimp interconnections shall be kept to minimum.

HAR-53/CREATED/I

No solder interconnection (splice) shall be allowed.

HAR-54/CREATED/I

Soldering (solder combs, shielding) shall be kept to minimum.

HAR-55/CREATED/I

The shields of the separate cables shall be individually connected at designated points to the structure (e.g. connector solder combs, back shells).

HAR-56/CREATED/I

The linking of cable shields by ‘Daisy chain’ is forbidden.

HAR-57/CREATED/I

The harness design shall ensure all cable shielding provides a minimum of 85 percent of optical coverage.

HAR-58/CREATED/R

Inclusion of components in the harness, such as resistors, diodes, capacitors, fuses, or other similar devices is not allowed except with prime contractor approval.

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HAR-59/CREATED/A,R

The harness design shall not introduce any single point failures into the SCM system.

3.2 Connector Requirements

HAR-61/CREATED/I

The harness design shall ensure that the harness connector type definition shall be as defined in EICD [RD 147].

HAR-62/CREATED/I

Each connector shall be locked on their destination during installation. (Except mobile connectors, for demate function).

HAR-63/CREATED/I

Connectors shall be selected such that they are not subject to demating when exposed to the maximum anticipated environment.

HAR-64/CREATED/I,R

The SCM harness design shall ensure that all spare connector contact cavities may be populated in agreement with ASU.

HAR-65/CREATED/I

The SCM harness design shall utilize minimum residual magnetism type connectors, as defined in relevant SCC specifications.

HAR-66/CREATED/R

The design of any interface connectors defined or modified to ease manufacture / integration by the supplier shall be submitted to ASU approval.

HAR-67/CREATED/I

The SCM harness design shall ensure that each connector is clearly marked with the unique identifier as defined in [RD 147].

3.3 Wire Requirements

HAR-69/CREATED/A,R

The harness supplier shall be responsible for the definition of actual harness wire gauges to be used, ensuring that all requirements pertaining to volt drop, mass, EMC etc. are met.

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HAR-70/CREATED/I

The wire used shall comply with ESA SCC 3901. The only ESA SCC references permitted are;

• 3901 001 & 002 Kapton Wire

• 3901 019 Kapton wire

Note: Exceptions shall only be by specific requirement or with agreement with ASU.

HAR-71/CREATED/I

The harness design shall ensure that there shall be no use of any wire gauge greater than 28AWG. (i.e. 30AWG)

3.4 Bundling Requirements

HAR-73/CREATED/T,A,R

The design of the SCM harness shall be such that it meets all voltage drop, twisting and bundling requirements as defined in Table 3.4-1 and detailed in [RD 147].TBC.

Note: Voltage drop is for signal line only. (i.e. excludes volt drop in return line).

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Interface Code Interface Designation Voltage Drop

Bundle EMC class

Twisting and Shielding

LCA (LCL) Regulated Latching Current Limiter Power Class A 100mV 1 TP LCB (LCL) Regulated Latching Current Limiter Power Class B 100mV 1 TP LCC (LCL) Regulated Latching Current Limiter Power Class C 100mV 1 TP LCD (LCL) Regulated Latching Current Limiter Power Class D 100mV 1 TP LCE (LCL) Regulated Latching Current Limiter Power Class E 200mV 1 TP LCF (LCL) Regulated Latching Current Limiter Power Class F 200mV 1 TP FCA (FCL) Regulated Foldback Current Limiter Power Class A 100mV 1 TP FCB (FCL) Regulated Foldback Current Limiter Power Class B 100mV 1 TP AN1 Analogue TM Acquisition -5V to +5V 10mV 4 TSP AN2 Analogue TM Acquisition 0V to +5V 10mV 4 TSP AN3 Analogue TM Acquisition -10V to +10V 10mV 4 TSP ANF Temperature Acquisition Type 3: Fenwall (TBC) 10mV 4 TSP ANP Temperature Acquisition Type 2: PT-1000 10mV 4 TSP ANT Temperature Acquisition Type 4: PT-200 10mV 4 TSP ANY Temperature Acquisition Type 1: YSI 44907/YSI-44908) (TBC) 10mV 4 TSP BLD Digital Bi-Level TM Acquisition (TBC) 10mV 2 TP EHP Extended High Power On/Off Command 100mV 1 TSP FCVC Flow Control Valve Command Interface 100mV 1 TSP LVC Latch Valve Command Interface 100mV 1 TSP LVS Latch Valve Status Interface 10mV 4 TP MEC Main Engine Flow Control Valve Command Interface 100mV 1 TSP MIL MIL-STD-1553B Interface As Mil-Std 2 As Mil-StdPBA Battery Power Interface 100mV 1 TPD PPS Pulse Per Second Interface 10mV 2 TSP PSA Solar Array Power Interface 200mV tbc 1 TSP PTA Pressure Transducer Acquisition Interface 10mV 4 TSP PTS Pressure Transducer Supply Interface 100mV 1 TP PYR Pyro Interface TBC 1 TSP RLS Receiver Lock Status IF 10mV 2 TSP RSA Relay Status Acquisition 10mV 2 TP SBDL Standard Balanced Digital Link 10mV 2 TSP SCS Solar Cell Sensor Interface (TBC) 100mV 1 TSP SHP Standard High Power On/Off Command 100mV 1 TSP SLP Standard Low Power On/Off Command (TBC) TBD 1 TSP SYNC Synchronization Clock Interface (TBC) 10mV 2 TSP USL UART Serial Link Interface 10mV 2 TSP XTC X-Band Digital TC Channel IF 10mV 2 TSP XTM X-Band Digital TM Channel IF 10mV 2 TSP

Table 3.4-1: Signal Type Specific Requirements

3.5 Identification Requirements

HAR-76/CREATED/I

The identification of cables, connectors and brackets, shall be designed to minimize the possibility of incorrect mating.

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HAR-77/CREATED/I

Cables shall be identified with a unique identifier at both ends of the cable. Multi-core cables shall be labeled on a “per cable” basis if the internal wires are individually identifiable (by colour, for example), i.a.w. [RD 147].

HAR-78/CREATED/I

Connectors shall be identified with a unique identifier on both sides of connector, i.a.w. [RD 147].

HAR-79/CREATED/I

Interface brackets shall be identified with a unique identifier on both sides of interface bracket, i.a.w. [RD 147].

HAR-80/CREATED/I

Connectors which are fixed onto a bracket or a unit shall be labelled xxxxJ secured with a female lockscrew.

Mobile harness connectors shall be labelled xxxxP supplied with a male lockscrew and will go in front of fixed connector xxxxJ for demate function.

3.6 Pyro Harness Requirements [STD 03]

HAR-82/CREATED/I

There shall be no gaps or discontinuities in the shielding, including the termination at the back faces of the connectors, nor aperture in any container which houses elements of the firing circuit.

HAR-83/CREATED/I

Shielding caps: All electroexplosive devices and safe and arm devices shall have shielding caps attached during storage, handling, transporting, and installation.

HAR-84/CREATED/I

The shielding cap shall have a solid metal outer shell which makes electrical contact with the EED case in the same manner as the mating connector for EED.

HAR-85/CREATED/I

There shall be no splices used to join elements of pyro cable.

HAR-86/CREATED/I

A connector shall be provided wherever mating or demating of a circuit is required. The interceptions on the Pyro line shall be minimised.

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HAR-87/CREATED/T

All current-carrying components and conductors shall be electrically insulated from each other and system ground.

HAR-88/CREATED/I

Structural ground shall not be used as return for pyro circuitry.

HAR-89/CREATED/I

For EED lines, there shall be only one wire per pin and in no case shall a connector pin be used as a terminal or tie-point for multiple connections.

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4. INTERCONNECTION AND ROUTING REQUIREMENTS

4.1 Interconnection Requirements

HAR-92/CREATED/T,I

The SCM harness shall be designed in accordance with connectivity details contained in the SCM EICD [RD 147].

HAR-93/CREATED/R

If required to ease harness integration onto the SCM structure the harness supplier shall propose necessary interface connectors for this purpose in agreement with ASU.

4.2 Routing Requirements

HAR-95/CREATED/R

The SCM harness routing shall be designed in accordance with defined stayout zones in MICD [RD 146].

HAR-96/CREATED/R

The SCM power harness shall be routed along the top of the panels (+ Z), starting from the PCDU towards the battery and all other units.

Small bundles shall spur off from the main loom to their respective unit location.

HAR-97/CREATED/R

The SCM signal harness shall be routed along the bottom of the panels (- Z), starting from the OBC towards the skin connectors and all other units.

Small bundles shall spur off from the main loom to their respective unit location.

HAR-98/CREATED/R

The routing shall be developed to allow easy integration / de-integration of the harness or parts of it and to ensure easy access to the connectors for mating /demating of connections at satellite level.

HAR-99/CREATED/I

The redundant bundles shall be separated as far as possible from the nominal bundles.

HAR-100/CREATED/I,R

The design of harness routing shall not prevent unit installation / removal.

HAR-101/CREATED/I

Wire length shall provide sufficient slack for harness relief and rework.

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HAR-102/CREATED/I

The bend radius of harness bundles shall minimize wire stress.

HAR-103/CREATED/I

The bend radii of the bundles shall not be less than 5 times the cable / diameter.

HAR-104/CREATED/I,R

The routing of the SCM cable bundles shall be done on a supplier furnished full 3D mock-up which shall reflect the Harness subsystem interface, the structure of the Harness subsystem, and all associated equipment including brackets, standoffs and fixations.

HAR-105/CREATED/I

The cable bundles shall be fixed to the structure by cable ties and tie bases.

HAR-106/CREATED/I

The harness supplier shall install the tie bases, which shall be glued to the structure.

HAR-107/CREATED/I

The tie bases shall be spaced 120mm to 180mm according to bundle size.

HAR-108/CREATED/I

In order to avoid damage to the cables by fixation to the tie bases, the cables shall be protected by several layers of Kapton tape or by suitable shrink sleeve under the cable tie.

HAR-109/CREATED/R

Special care shall be taken to optimize the routing to ensure maximum mass savings.

HAR-110/CREATED/I

Dynamic envelope clearance of at least 5mm shall be ensured for harness bundles at corners and sharp edges, including all protective wrapping.

4.3 Layout Requirements

HAR-112/CREATED/R

The layout of the RTB power and signal harnesses shall be performed on flat boards which shall have representative shearwalls and units in accordance with the MICD [RD146].

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5. HARNESS CHARACTERISTICS REQUIREMENTS

5.1 Mass

HAR-115/CREATED/I

On completion of the SCM harness the harness shall be weighed and reported to ASU.

HAR-116/CREATED/I

The tie bases, cable ties, shall be weighed separately, and reported to ASU.

HAR-117/CREATED/A,I

The SCM harness design shall utilize qualified light weight materials where appropriate and a mass estimate shall be provided.

HAR-118/CREATED/I

The weighed mass of the SCM harness shall be less than 20kg, including all connectors, contacts, solder combs, male/female lockscrews, tie bases, cable ties and wrapping.

5.2 Voltage Drop Requirement

HAR-120/CREATED/A,R

The harness supplier shall determine the voltage drop for signal cables as defined in Table 3.4-1 using the load current defined in EICD [RD 147].

HAR-121/CREATED/A,R

The harness supplier shall compute the cable voltage drop with the following assumptions;

• Maximum resistance (tolerance)

• Including all connector pins on the link (end to end).

• 60°C ambient temperature (worst case qualification operational temperatures).

The maximum voltage drop allowable is specified in Table 3.4-1.

5.3 Double Insulation

HAR-123/CREATED/I

This insulation shall be made with kapton adhesive (kapton thickness < 50µ to avoid kapton bulk charging), and wrapped around the cable bundles.

HAR-124/CREATED/I

The following elements require double insulation;

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• Power conductors

- PCDU to Solar Array

- PCDU to Battery

- PCDU to SAPS I/F

- Battery to Battery AIV I/F

• Plus any signals identified by ASU in accordance with the EICD

HAR-125/CREATED/I

Crimp interconnections shall be individually double insulated using kynar sleeving.

HAR-126/CREATED/I

Wired contacts in connectors shall be individually insulated using kynar sleeving

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6. EMC / ESD REQUIREMENTS

6.1 Type Table

According to the signal characteristics and the circuit parameters, electrical circuits within the spacecraft are classified in standard groups for EMC purposes, see Table 6.1-1 below.

EMC Class EMC Type Class 1 Power (Primary / Secondary) Class 2 Digital Signals Class 3 Pyrotechnics Class 4 Analog Signals Class 5 Radio Frequency Signals

Table 6.1-1: EMC Type Table

6.2 EMC Segregation Rules

HAR-132/CREATED/I

Routing segregation is required for EMC types. Wires of different groups shall be separated by a minimum distance of 50mm. (This does not apply where bundles are separated by a grounded metallic barrier).

HAR-133/CREATED/I

To ensure a low magnetic moment within the harness, each equipment interface shall be implemented using point to point twisted pairs carrying signal and return. Any exceptions shall be approved by prime contractor.

HAR-134/CREATED/I

If multiple wires have the same return line, they shall be twisted with the common return line.

HAR-136/CREATED/I

If the distance between 2 EMC groups cannot be achieved, the supplier shall notify ASU immediately who shall review the distances and decide whether one of the groups shall be overshielded.

HAR-137/CREATED/I,R

Power lines to internally redundant modules shall be routed via separate connectors. If a separate connector cannot be used due to other considerations, then connector pins shall be allocated to obtain maximum separation between the different wire groups.

HAR-138/CREATED/I

Bundles can cross one another with separate EMC type at an angle of 90° +/- 10% to avoid capacitance and inductive coupling.

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HAR-139/CREATED/I

Looms shall be routed as close as possible to the structure to avoid coupling on the signals and minimise magnetic momentum.

HAR-140/CREATED/I

The effective height of the base of the looms shall be H< 1cm above the panel surface.

6.3 Backshells / Overall Grounding

HAR-142/CREATED/R

For LISA Pathfinder it is not required to fit dedicated individual connector backshells, however it shall be possible to retrofit such conductive backshells and apply overall shields if necessary should the EMC performance of the spacecraft prove that this is necessary.

6.3.1 Shield Grounding

HAR-144/CREATED/I

Shields shall not be used as an intentional return conductor.

HAR-145/CREATED/I

To ensure a better immunity of the harness with regard to a coupling with an electromagnetic field or a coupling with another harness, the shield shall be grounded at both ends.

HAR-146/CREATED/I

The shields of screened wires shall not use an internal contact of a connector.

HAR-147/CREATED/I

The harness shielding shall be grounded outside the equipment to the connector chassis (eg. solder combs). With a wire length of ≤50mm

HAR-148/CREATED/I

At any connector interface, the harness design shall ensure the harness length which is unshielded shall be ≤30mm .

6.3.2 Shield Grounding Measurement

HAR-150/CREATED/T,I

Resistance between shielding and spacecraft structure shall be < 20mΩ.

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HAR-151/CREATED/T,I

To ensure the 20mΩ grounding value, the resistance between shielding and connector chassis shall be < 10mΩ.

HAR-152/CREATED/T,R

The measurement of resistance between shielding and connector chassis shall be performed using a 4 point milliohmeter.

6.4 ESD Requirements Against Bulk Charging

HAR-154/CREATED/T,I

All metallic parts whatever the size, location and surface shall be grounded to the structure by DC resistance less than 100KΩ.

HAR-155/CREATED/I

The SCM harness design shall ensure no floating conductor cable.

HAR-156/CREATED/I

The SCM harness design shall ensure no floating pins on the I/F connectors. Except additional pins to guarantee good mechanical characteristics.

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7. MECHANICAL INTERFACE

7.1 Mechanical Conditions

HAR-159/CREATED/A

To ensure the harness operates under all mechanical environmental conditions, the harness and all fixings shall demonstrate a positive margin of safety under a load acceleration of 20g in any direction.

No qualification / acceptance tests are required. The harness will be qualified at satellite level.

HAR-161/CREATED/A

Due to tight requirements in determining the forces acting on the payload instruments the harness design shall meet the following;

• CoG estimate have a predicted accuracy of 50mm radius sphere

• MOI predicted with uncertainty of better than 10% in each axis.

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8. THERMAL INTERFACE

8.1 Thermal Conditions

The environmental conditions on-ground for transportation, storage, AIT, and inside the launcher fairing are described for the different pre-selected launchers in Table 8.1-1.

Ground Transportation In Preparation Areas Encapsulated (in fairing)

Launcher Min Temp (oC)

Max Temp (oC)

Min Temp (oC)

Max Temp (oC)

Min Temp (oC)

Max Temp (oC)

Dnepr -40 (1) +45 (1) +5 +35 +10 +25

Rockot -38 (2) +33 (2) +18 +25 +10 (3) +25 (3)

Table 8.1-1: On-Ground Thermal Environment for Pre-selected Launchers

Notes: the temperature ranges presented are the worse cases that the equipment units could experience during the launch campaign

1) ambient temperature at Baikonour

2) ambient temperature at cosmodrome

3) temperature range during active temperature control

HAR-170/CREATED/T,A,R

During the In Orbit phase, the spacecraft harness shall be kept within its acceptance temperature limits. Unless otherwise specified in an EID or equipment specification, the levels of Table 8.1-2 shall apply.

Min Op Max Op Min Non Op Max Non Op

Min Start Up

Acceptance Temperature Limits -10 +50 -30 +50 -30

Qualification Temperature -20 +60 -40 +60 -30

Table 8.1-2: Thermal Qualification & Acceptance Levels

The harness design shall ensure under all conditions specified in Table 8.1-2 the harness shall perform nominally.

HAR-173/CREATED/A,R

Any self heating effects of harness bundles which may increase the bundle temperature above the maximum allowable shall be analysed and compensated for in the harness design.

8.2 Thermal Bakeout

HAR-175/CREATED/I

To ensure that the majority of volatile compounds are removed from the SCM harness, it shall experience a bake out period of 72hours at a temperature of +65degC in vacuum (TBC). This will be confirmed following a review of materials used in the harness manufacture.

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9. MANUFACTURING REQUIREMENTS

9.1 Process & Techniques

HAR-178/CREATED/I

Only standard manufacturing processes/techniques shall be used.

HAR-179/CREATED/I

Crimping shall be in accordance with [STD 35], ‘Crimping of High Reliability Electrical Connections’

HAR-180/CREATED/I

Soldering shall be in accordance with [STD 36], ‘The Manual Soldering of High Reliability Electrical Connections’.

HAR-181/CREATED/I

All manufacturing personnel shall be certified to the above mentioned specifications.

Note: Utilizing these standards, well-known processes and techniques minimize the risk of failure occurrence during manufacturing.

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10. VERIFICATION REQUIREMENTS

10.1 Manufacturing Tests

HAR-185/CREATED/R

Requirements for the acceptance of test limits shall be agreed between supplier and ASU.

HAR-186/CREATED/T

A high potential test at 500V shall be performed on the harness between each conductor and every other conductor; between each conductor and all shields and between each conductor and all connector shells.

HAR-187/CREATED/T

The insulation value shall be > 100MΩ.

HAR-188/CREATED/T

A circuit continuity test shall be performed on each conductor and on each shield and the results given in the test report.

HAR-189/CREATED/T

The voltage drop test for the power and pyro lines shall be performed by the ‘4 wires’ method and the value shall appear in the test report.

HAR-190/CREATED/T

The voltage drop test for the TC lines shall be performed during the continuity test of the harness.

HAR-191/CREATED/T

A contact retention test shall be performed on all connector contacts.

HAR-192/CREATED/T

The acceptance tests shall be performed by an automated test facility with the following test parameters;

• Continuity test

• Maximum test current: 100mA

• Resistance: TBD

• Insulation test

• Test voltage: 500V DC

• Resistance min. 100MΩ

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• Resistance measurement on all power lines.

HAR-193/CREATED/R

If the automated test facility is not used the supplier shall demonstrate the suitability of other means used.

10.2 Subsystem level Verification

HAR-195/CREATED/T

Functional and end-to-end testing of the Harness subsystem shall be completed prior to delivery.

Functionality consists of specific cable characteristics, voltage drop and mass.

End to end consists of connectivity, resistance and insulation resistance.

Sub System Real Time-Test Bed Flight Harness

E2E Func Perf E2E Func Perf Env

Harness √ (1)(3) √ (1)(3) √ (3) √ (2)(3) √ (4)

Table 10.2-1: Subsystem Level Verification

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11. QUALITY ASSURANCE

11.1 General Requiremnts

HAR-199/CREATED/T,I

All items shall be manufactured, inspected and tested i.a.w. this specification and all PA requirements. Detailed within [AD 10]

11.2 Responsibilty for Inspection

HAR-201/CREATED/I

The supplier is responsible for the performance of all inspection and tests.

HAR-202/CREATED/R

The supplier may use his own facilities or any outside facility with the agreement of ASU.

11.3 Reject, Retest and Failure Reporting

HAR-204/CREATED/A,I

The supplier is responsible for reporting all failures using an in house system and subsequent rectification, and retest.

11.4 Package Inspection/shipping

HAR-206/CREATED/I

After de-integration of the cable bundles from the assembly jig the bundles will be packed in bags made of PUMA foil or similar and made available for vacuum cleaning.

HAR-207/CREATED/I

After vacuum cleaning the bundles shall be sealed in bags made of kapton.

HAR-208/CREATED/I

These bags shall be already labeled for easy identification.

HAR-209/CREATED/I

The harness shall be prepared for delivery, packaged and stored in a manner which will provide protection against corrosion, deteriation and damage until its requirement for use.

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11.5 Facilities

HAR-211/CREATED/I

The manufacturing and testing of the harnesses shall be performed in a class 100 000 clean room.

HAR-212/CREATED/I

Unless otherwise specified, all measurements and tests shall be made within the following ambient conditions;

• Temperature: 23°C ± 5°C

• Relative Humidity: 60% maximum

• Pressure: 760 ± 25mm mercury

HAR-213/CREATED/I

All measurements shall be performed with an accuracy better than ± 5%.

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12. PRODUCT ASSURANCE

12.1 Software Product Assurance

HAR-216/CREATED/A

Any software used in the design, and manufacture shall be in accordance with the relevant requirements contained in [AD 15].

HAR-217/CREATED/R

Verification of this shall be achieved by a detailed statement of compliance against [AD 15].

12.2 Design Software

To ensure the successful transfer of data between ASU and the harness supplier, it is necessary to define a standard method of producing system level data and how this is to be transferred to the harness supplier.

ASU will be responsible for the collection of unit level EICDs, formatted as defined in [AD 17].

These will be collated into a system level database, detailing;

• Connectivity,

• Termination connector details,

• Signal characteristics (current, voltage etc).

HAR-222/CREATED/A

Due to the relatively small size of the LISA Pathfinder SCM harness, it is intended that a simple database be constructed to hold the separate tables for individual unit level EICDs.

Using these ASU will define the system connectivity in terms of ‘Nodes’, by modifying the original tables such that individual connections will be identified by a unique Node identity.

Table 12.2-1 below shows the proposed format for system connectivity data to be passed to the harness supplier. It will be generated from the ASU system database.

ELECTRICAL DATA SHEET 2/2 SATELLITE : LISA Pathfinder

MODEL : PFM SCM Harness

ISSUE SHEET : 01 ISSUE DATE : Harness Supplier Provided Information

NEW From RETURN PIN

SIGNAL SIGNAL LINK

SIGNAL LINK EMC IF L/dt Volt Current Resist Capa Freq. SPECIFIC TOWARD Wire Wire Route Wire Wire Volt

UNIT Connector Pin PIN NAME Type NAME TYPE Type DW S (V) (mA) (Ohm) (pF) (Hz) REQ's Unit Conn Pin Code Type Code Length Resist Drop

Table 12.2-1: System Connectivity Report Example

12.3 Harness Supplier Database

HAR-227/CREATED/R

The harness supplier shall be responsible for modifying the system connectivity data from ASU so it may be used for the harness design / manufacture.

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HAR-228/CREATED/A

It shall be the harness supplier who defines the specific wire details for the following;

• Unique wire code,

• Wire Type (after volt drop analysis),

• Route Code,

• Wire Length,

• Wire Resistance,

• Volt drop.

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13. GDIR APPLICABILITY MATRIX

The following table lists the applicable requirements of the GDIR.

It contains, in the first column, the Local ID for each applicable GDIR requirement number.

The second column contains the GDIR Requirement number and the opening text of the requirement.

The third column defines the Applicability Y/N

The final column shows the intended verification method

Req No. Reference Applicability Verif. Method

3 General Design and interface Requirements 3.1 General Design Requirements 3.1.1 Lifetime

HAR-234 GDI-31: The on-ground lifetime of flight hardware is defin ...

Y R

HAR-235 GDI-32: The Unit shall meet the requirements of this speci ...

Y A,R

HAR-236 GDI-33: The in-orbit lifetime of the satellite is defined ...

Y R

HAR-237 GDI-34: The unit shall be designed with positive margins o ...

Y A,R

HAR-238 GDI-35: Maintenance during storage shall be as limited as ...

Y R

3.1.2 Design Safety

HAR-240 GDI-37: The unit shall be designed and fabricated with com ...

Y A

3.1.5 Identification & Marking

HAR-242 GDI-50: For the particular case of connector identificatio ...

Y I

3.1.6 Accessibility/Maintainability

HAR-244 GDI-53: The equipment shall be designed to require a minim ...

Y R

HAR-245 GDI-54: No field maintenance, servicing or adjustment shal ...

Y R

3.1.7.4 Lubricants and Sealants

HAR-247 GDI-78: No lubricants shall be used without the prior writ ...

Y R

3.1.7.5 Screw Locking

HAR-249 GDI-80: All fasteners used on the unit shall be locked by ...

Y I,R

3.2 Mechanical Design and Interface Requirements

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HAR-251 GDI-82: All drawings, specifications and engineering data ...

Y R

3.2.1 Structural Design 3.2.1.1 General Requirements

HAR-254 GDI-92: The unit shall be designed to withstand the enviro ...

Y A,R

HAR-255 GDI-93: For sine and random vibrations, the mechanical siz ...

Y A

3.2.1.2 Mass properties

HAR-257 GDI-98: All mass estimations shall be accompanied by the d ...

Y T

HAR-258 GDI-100: The mass of an item must be measured with the foll ...

Y T

3.2.1.3 Centre of Gravity and Moment of Inertia

HAR-260 GDI-102: All COG and MOI estimates shall be accompanied by ...

Y A

HAR-261 GDI-104: The unit centre of gravity shall be determined wit ...

Y T,A

HAR-262 GDI-105: The unit moment of inertia shall be determined wit ...

Y A

3.2.3 Mechanical / Optical Interface Control Documents

HAR-264 GDI-184: Interfaces will be subjected to a formal inspectio ...

Y T,I

HAR-265 GDI-185: The issues of ICDs have to be released as defined ...

Y A

HAR-266 GDI-191: Interface Control Drawings shall be provided to th ...

Y R

3.2.4.1 Software/Electronic Files Delivery

HAR-268 GDI-200: The model shall be prepared using NASTRAN Software ...

Y R

HAR-269 GDI-201: Finite elements models shall be provided for all u ...

Y R

HAR-270 GDI-202: For the FEM delivery, the following list of inform ...

Y R

3.2.4.2 Units

HAR-272 GDI-204: S.I. units are to be used: · Newton (N) for force ...

Y R

3.2.4.3 Coordinate system

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HAR-274 GDI-206: The FEM shall use the Units/assembly Reference Fra ...

Y R

3.2.4.4 Model Identity/Comment

HAR-276 GDI-209: The model description shall refer to a configured ...

Y R

HAR-277 GDI-210: The following comment cards must be included in th ...

Y R

3.2.4.6 FEM Checks 3.2.4.6.1 Mass Distribution Check

HAR-280 GDI-221: The outputs of the NASTRAN “Grid Point Weight Gene ...

Y A

3.2.4.7 FEM correlation.

HAR-282 GDI-235: Full finite element models shall be updated as nec ...

Y T,A

HAR-283 GDI-2102: For modes with effective masses > 10% of the total ...

Y T,A

HAR-284 GDI-2100: The cross-orthogonality checks shall comply with; ...

Y T,A

HAR-285 GDI-2097: For fundamental modes, (lowest frequency mode with ...

Y T,A

HAR-286 GDI-2098: For modes with effective masses >10%of the total m ...

Y T,A

HAR-287 GDI-2096: The difference between the Centre of Gravity posit ...

Y T,A

HAR-288 GDI-2095: The mass difference between the measured and FEM f ...

Y T,A

3.2.4.8.1 Reduced Distortion Analysis Models

HAR-290 GDI-2067: The mass difference between the measured and FEM f ...

Y T,A

HAR-291 GDI-2068: The difference between the Centre of Gravity posit ...

Y A,I

3.2.5 Unit Mass Distribution Requirements (for Gravitational modelling)

HAR-293 GDI-2043: For gravitational modelling purposes carried out b ...

Y A,R

3.5 Electrical Design and Interface Requirements 3.5.1 General Requirements

HAR-297 GDI-308: All electrical performances are specified under Wo ...

Y R

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HAR-298 GDI-309: Beginning-Of-Life criteria shall be derived by the ...

Y R

3.5.3 Standard Signals 3.5.3.2 Harness Capacitance

HAR-302 GDI-391: Interface signal drivers shall consider the capaci ...

Y A

3.5.4 Connectors General Design Requirements 3.5.4.1 Harness

HAR-305 GDI-395: Cables falling into different EMC classifications ...

Y I,R

HAR-306 GDI-396: All cable bundles shall be routed as close as poss ...

Y I,R

HAR-307 GDI-397: In wiring through connectors all leads shall be ke ...

Y I,R

HAR-308 GDI-398: The DC resistance between the single cable shield ...

Y T

HAR-309 GDI-399: The structure termination of shields shall be made ...

Y I,R

3.5.4.2 Connector Types

HAR-311 GDI-401: All connectors mounted on units shall be D*MA** co ...

Y R

HAR-312 GDI-402: All flight connectors shall be designed to withsta ...

Y I,R

HAR-313 GDI-2158: Individual mate/demates shall be recorded in a mat ...

Y R

HAR-314 GDI-2157: The number of times flight connectors are mated / ...

Y R

HAR-315 GDI-2156: If by prior agreement with ASU the number of mates ...

Y I,R

HAR-316 GDI-403: Different connector classes shall be implemented i ...

Y R

3.5.4.3 Connector Characteristics

HAR-318 GDI-405: Connectors at interfaces shall be clearly identifi ...

Y R

HAR-319 GDI-406: Connectors shall not be a source of single point f ...

Y R

HAR-320 GDI-407: Equipment or structure-mounted connectors shall be ...

Y R

HAR-321 GDI-408: Male and female connectors shall be mechanically l ...

Y R

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HAR-322 GDI-409: Active lines together with their return shall be o ...

Y I

HAR-323 GDI-410: Connectors shall be made of Non magnetic material ...

Y R

HAR-324 GDI-412: Nominal and redundant lines shall have separated c ...

Y R

3.5.4.4 Connector Mounting

HAR-326 GDI-416: Mechanical methods in conjunction with identificat ...

Y I,R

3.5.5 Standard Interfaces 3.5.5.2 Standard Balanced Digital link (SBDL)

HAR-329 GDI-438: The SBDL link interface is dedicated to serial dig ...

Y T,R

HAR-330 GDI-1201: The contractor shall design his side of the Standa ...

Y T,R

3.5.5.3 UART Serial Link (USL)

HAR-332 GDI-451: The UART RS-422 Serial Link Interface shall be imp ...

Y R

3.5.5.4 Timing Pulses 3.5.5.4.1 Synchronisation or Datation Pulses (PPS)

HAR-335 GDI-460: The Pulse Per Second (PPS) Interface shall be impl ...

Y R

3.5.5.4.2 Synchronization Clock Interface 3.5.5.5 Housekeeping Analog Acquisitions

HAR-338 GDI-471: The interface shall consist of a differential link ...

Y R

3.5.5.5.1 Analogue Telemetry Aquisition (AN1)

HAR-340 GDI-1205: Analogue Telemetry Acquisition -5V to +5V Interfac ...

Y T,R


HAR-342 GDI-1210: Analogue Telemetry Acquisition 0V to +5V Interface ...

Y T,R


HAR-344 GDI-1211: Analogue Telemetry Acquisition -10V to +10V Interf ...

Y T,R

3.5.5.6 Temperature Acquisitions (ANY, ANP, ANF, ANT)

HAR-346 GDI-482: The signal shall be transmitted via twisted shield ...

Y R

HAR-347 GDI-483: The temperature aquisition interface circuitry, as ...

Y R

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3.5.5.6.1 Thermistor Type1: YSI-44907/-44908 (ANY)

HAR-349 GDI-1215: Temperature Acquisition Type 1: YSI 44907/YSI-4490 ...

Y T,R

3.5.5.6.2 Thermistor Type2: PT-1000 (ANP)

HAR-351 GDI-487: Temperature Acquisition Type 2: PT-1000 (ANP) Inte ...

Y T,R

3.5.5.6.3 Thermistor Type3: Fenwell (ANF)

HAR-353 GDI-1216: Temperature Acquisition Type 3: Fenwall (ANF) Inte ...

Y T,R

3.5.5.6.4 Thermistor Type4: PT-200 (ANT)

HAR-355 GDI-2136: Temperature Acquisition Type 4: PT-200 (ANT) Inter ...

Y T,R

3.5.5.7 Relay Commands (SHP, EHP, SLP) 3.5.5.7.1 Standard High Power On/Off Command (SHP)

HAR-358 GDI-497: Standard High Power On/Off Command: The contractor ...

Y T,R

3.5.5.7.2 Extended High Power On/Off Command (EHP)

HAR-360 GDI-502: Extended High Power On/Off Command: The contractor ...

Y T,R

3.5.5.7.3 Standard Low Power On/Off Commands (SLP)

HAR-362 GDI-1252: Standard Low Power On/Off Command: The contractor ...

Y T,R

3.5.5.8 Relay Status Acquisitions (RSA)

HAR-364 GDI-516: Relay Status Acquisition The contractor shall desi ...

Y T,R

3.5.5.9 COMMS Interfaces (TT&C) 3.5.5.9.1 X-Band Digital TC Channel Interface (XTC)

HAR-367 GDI-527: The X-Band Digital TC Channel shall consist of 3 s ...

Y R

HAR-368 GDI-1283: The X-Band Digital TC Channel shall be transmitted ...

Y R

3.5.5.9.2 X-Band Receiver Lock Status Interface (RLS)

HAR-370 GDI-535: The X-Band Receiver Lock Status signal shall be tr ...

Y T,R

3.5.5.9.3 X-Band Digital TM Channel Interface (XTM)

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HAR-372 GDI-538: The X-Band Digital TM Channel shall consist of 2 s ...

Y R

HAR-373 GDI-539: The X-Band Digital TM channel shall be transmitted ...

Y R

3.5.5.10 Pyrotechnics (PYR) 3.5.5.10.1 General Concept

HAR-376 GDI-1255: Items which require pyrotechnic release shall inco ...

Y R

HAR-377 GDI-1256: All EED's shall be initiated via the spacecraft de ...

Y T,R

HAR-378 GDI-1257: Only qualified initiators shall be accepted for us ...

Y R

HAR-379 GDI-1258: Only one firing command to a single filament shall ...

Y T,R

HAR-380 GDI-1259: Redundancy shall be provided for each function by ...

Y R

HAR-381 GDI-1260: The Pyro electronic interface, as well as the inte ...

Y R

3.5.5.10.2 EED Interface Characteristics

HAR-383 GDI-1264: Pyro Firing Characteristics The contractor shall d ...

Y T,R

3.5.5.11 Digital Bi-Level TM Acquisitions (BLD)

HAR-385 GDI-524: Bi-level Digital Interface The contractor shall de ...

Y T,R

3.5.5.13 Propulsion Interfaces

HAR-389 GDI-1775: The driver function shall implement an arming and ...

Y T,R

HAR-390 GDI-1776: The arming and firing commands shall be implemente ...

Y T,R

HAR-391 GDI-1777: There shall be no failure propogation from the dri ...

Y A

3.5.5.13.1 Latch Valve Interfaces (LVC, LVS)

HAR-393 GDI-1288: Each Latch Valve Command interface, main and redun ...

Y A

3.5.5.13.1.1 Latch Valve Commands (LVC)

HAR-395 GDI-1289: The contractor shall design his part of the Latch ...

Y T,R

3.5.5.13.1.2 Latch Valve Status Interface (LVS)

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3.5.5.13.2 Flow Control Valve Interfaces (FCV)

HAR-398 GDI-1437: The contractor shall design his part of the Flow C ...

Y T,R

3.5.5.13.3 Pressure Transducer Interface's (PTS, PTA) 3.5.5.13.3.1 Pressure Transducer Acquisition Interface

(PTA)

HAR-401 GDI-1591: Pressure Transducer Acquisition Interface (PTA): T ...

Y T

3.5.5.13.3.2 Pressure Transducer Supply Interface (PTS)

HAR-403 GDI-1790: The contractor shall design his part of the Pressu ...

Y T,R

3.5.5.13.4 Main Engine Interface

HAR-405 GDI-1774: Main Engine Flow Control Valve Interface (MEC): Th ...

Y T,R

3.5.5.14 Battery Power Interface (PBA)

HAR-407 GDI-2150: Battery Power Interface (PBA): The contractor shal ...

Y T,R

3.5.5.15 Solar Array Power Interface (PSA)

HAR-409 GDI-2152: Solar Array Power Interface (PSA): The contractor ...

Y T,R

3.5.6 Electrical Interface Control Document

HAR-411 GDI-558: Interfaces will be formally controlled within the ...

Y R

3.5.7.1 Bonding

HAR-413 GDI-563: Metallic parts of each electrical equipment chassi ...

Y T

HAR-414 GDI-564: Joint faces shall be flat and clean before assembl ...

Y I,R

HAR-415 GDI-565: All non-electrical equipment shall be bonded to th ...

Y T

HAR-416 GDI-566: Each electrical equipment chassis (case) shall be ...

Y T,R

HAR-417 GDI-567: Metallic receptacles of connectors shall be electr ...

Y T

3.5.7.1.2 Cable and Harness Shields

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HAR-419 GDI-573: Where shielded wires are used, the shield shall be ...

Y R

HAR-420 GDI-574: The maximum unshielded length of any shielded wire ...

Y R

HAR-421 GDI-575: Daisy chaining of shield terminations shall be avo ...

Y R

HAR-422 GDI-576: Shields shall not be used as an intentional curren ...

Y R

3.5.7.2 Grounding and Isolation 3.5.7.2.3 Insulating materials

HAR-425 GDI-593: Space exposed insulating material having a bulk re ...

Y R

3.5.7.3.2 Secondary Power Lines

HAR-427 GDI-614: Grounding diagram including zero volts interconnec ...

Y I

HAR-428 GDI-615: The symbols in Figure GDI-2107 below shall be used ...

Y R

3.5.7.3.3 Signal Interfaces

HAR-430 GDI-617: Signal circuits interfacing between Satellite equi ...

Y R

HAR-431 GDI-618: Where single-ended signal transmitters are used, i ...

Y R

HAR-432 GDI-619: The use of common signal return paths is only perm ...

Y R

3.5.7.4 Magnetic Moment

HAR-434 GDI-1997: Each equipment shall be designed and fabricated to ...

Y T,R

4 Environment Design Requirements 4.1 Atmospheric Conditions 4.1.1 Humidity

HAR-438 GDI-771: The unit shall be designed to withstand a relative ...

Y R

4.1.2 Cleanliness

HAR-440 GDI-773: The cleanliness design requirements on the unit H/ ...

Y R

4.1.3 Storage time

HAR-442 GDI-775: The S/C units flight H/W shall be designed to with ...

Y R

4.1.5 Contamination

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HAR-445 GDI-782: Cleanliness requirements are as defined in the Sec ...

Y T,R

4.2 Mechanical Environment 4.2.1 Ground Operations Loads

HAR-448 GDI-790: The equipment/assembly and associated transport co ...

Y T,A

HAR-449 GDI-793: During ground transportation the equipments shall ...

Y T,A

HAR-450 GDI-795: The design of transport containers shall be such t ...

Y T,A

4.2.3 In Orbit Phase 4.2.3.1 Quasi-static & Thermo-elastic Loads

HAR-454 GDI-823: During orbit and attitude correction manoeuvres, u ...

Y T,A,R

4.3 Thermal Environment 4.3.3 In-orbit phase

HAR-458 GDI-841: During the In Orbit phase, the spacecraft units wi ...

Y A,R

4.5 EMC Environment 4.5.11 DC Magnetic Requirements

HAR-471 GDI-954: The use of ferro-magnetics shall be avoided for pa ...

Y I,R

HAR-472 GDI-956: Steel or other magnetic materials shall be avoided ...

Y I,R

5 Unit Level Environment Test Requirements 5.1 General 5.1.1 Test Definition 5.1.1.2 Acceptance Tests

HAR-477 GDI-969: Environmental acceptance testing shall be performe ...

Y T,A,R

5.1.1.3 Functional Performance Tests

HAR-479 GDI-971: The objective of the test item functional performa ...

Y T,A

5.1.2 Test Facilities Requirements

HAR-481 GDI-973: Any test facility to be used within the instrument ...

Y A,R

5.1.2.1 Accuracy of Test Instrumentation

HAR-483 GDI-975: The accuracy of instrument and test equipment used ...

Y A,R

5.1.2.3 Facility Ambient Condition

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HAR-485 GDI-981: Unless otherwise specified herein, all measurement ...

Y A,I,R

5.1.3 Test Execution

HAR-487 GDI-983: Test execution shall be started only if all starti ...

Y A,I,R

5.1.4 Success Criteria

HAR-489 GDI-985: The test is successfully performed if all measurem ...

Y T,A

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14. REQUIREMENT/SECTION CROSS REFERENCE

HAR-49............ 3.1.......................9 HAR-50............ 3.1.......................9 HAR-51............ 3.1.......................9 HAR-52............ 3.1.......................9 HAR-53............ 3.1.......................9 HAR-54............ 3.1.......................9 HAR-55............ 3.1.......................9 HAR-56............ 3.1.......................9 HAR-57............ 3.1.......................9 HAR-58............ 3.1.......................9 HAR-59............ 3.1-1.................... HAR-61............ 3.2.......................10 HAR-62............ 3.2.......................10 HAR-63............ 3.2.......................10 HAR-64............ 3.2.......................10 HAR-65............ 3.2.......................10 HAR-66............ 3.2.......................10 HAR-67............ 3.2.......................10 HAR-69............ 3.3.......................10 HAR-70............ 3.3.......................10 HAR-71............ 3.3.......................10 HAR-73............ 3.4.......................11 HAR-76............ 3.5.......................12 HAR-77............ 3.5.......................12 HAR-78............ 3.5.......................12 HAR-79............ 3.5.......................12 HAR-80............ 3.5.......................12 HAR-82............ 3.6.......................13 HAR-83............ 3.6.......................13 HAR-84............ 3.6.......................13 HAR-85............ 3.6.......................13 HAR-86............ 3.6.......................13 HAR-87............ 3.6.......................13 HAR-88............ 3.6.......................13 HAR-89............ 3.6.......................13 HAR-92............ 4.1.......................15 HAR-93............ 4.1.......................15 HAR-95............ 4.2.......................15 HAR-96............ 4.2.......................15 HAR-97............ 4.2.......................15 HAR-98............ 4.2.......................15 HAR-99............ 4.2.......................15 HAR-100.......... 4.2.......................15 HAR-101.......... 4.2.......................15 HAR-102.......... 4.2.......................15 HAR-103.......... 4.2.......................15 HAR-104.......... 4.2.......................15 HAR-105.......... 4.2.......................15 HAR-106.......... 4.2.......................15 HAR-107.......... 4.2.......................15 HAR-108.......... 4.2.......................15 HAR-109.......... 4.2.......................15 HAR-110.......... 4.2.......................15 HAR-112.......... 4.3.......................16 HAR-115.......... 5.1.......................17 HAR-116.......... 5.1.......................17 HAR-117.......... 5.1.......................17

HAR-118 ......... 5.1....................... 17 HAR-120 ......... 5.2....................... 17 HAR-121 ......... 5.2....................... 17 HAR-123 ......... 5.3....................... 17 HAR-124 ......... 5.3....................... 17 HAR-125 ......... 5.3....................... 17 HAR-126 ......... 5.3....................... 17 HAR-132 ......... 6.2....................... 19 HAR-133 ......... 6.2....................... 19 HAR-134 ......... 6.2....................... 19 HAR-135 ......... 6.2....................... 19 HAR-136 ......... 6.2....................... 19 HAR-137 ......... 6.2....................... 19 HAR-138 ......... 6.2....................... 19 HAR-139 ......... 6.2....................... 19 HAR-140 ......... 6.2....................... 19 HAR-142 ......... 6.3....................... 20 HAR-144 ......... 6.3.1.................... 20 HAR-145 ......... 6.3.1.................... 20 HAR-146 ......... 6.3.1.................... 20 HAR-147 ......... 6.3.1.................... 20 HAR-148 ......... 6.3.1.................... 20 HAR-150 ......... 6.3.2.................... 20 HAR-151 ......... 6.3.2.................... 20 HAR-152 ......... 6.3.2.................... 20 HAR-154 ......... 6.4....................... 21 HAR-155 ......... 6.4....................... 21 HAR-156 ......... 6.4....................... 21 HAR-159 ......... 7.1....................... 22 HAR-161 ......... 7.1....................... 22 HAR-170 ......... 8.1....................... 23 HAR-173 ......... 8.1....................... 23 HAR-175 ......... 8.2....................... 23 HAR-178 ......... 9.1....................... 24 HAR-179 ......... 9.1....................... 24 HAR-180 ......... 9.1....................... 24 HAR-181 ......... 9.1....................... 24 HAR-185 ......... 10.1..................... 25 HAR-186 ......... 10.1..................... 25 HAR-187 ......... 10.1..................... 25 HAR-188 ......... 10.1..................... 25 HAR-189 ......... 10.1..................... 25 HAR-190 ......... 10.1..................... 25 HAR-191 ......... 10.1..................... 25 HAR-192 ......... 10.1..................... 25 HAR-193 ......... 10.1..................... 25 HAR-195 ......... 10.2..................... 26 HAR-199 ......... 11.1..................... 27 HAR-201 ......... 11.2..................... 27 HAR-202 ......... 11.2..................... 27 HAR-204 ......... 11.3..................... 27 HAR-206 ......... 11.4..................... 27 HAR-207 ......... 11.4..................... 27 HAR-208 ......... 11.4..................... 27 HAR-209 ......... 11.4..................... 27 HAR-211 ......... 11.5..................... 28 HAR-212 ......... 11.5..................... 28

HAR-213..........11.5 .....................28 HAR-216..........12.1 .....................29 HAR-217..........12.1 .....................29 HAR-222..........12.2 .....................29 HAR-227..........12.3 .....................29 HAR-228..........12.3 .....................29

LISA Pathfinder


Page 43 of 44



INTENTIONALLY BLANK

LISA Pathfinder


Page 44 of 44



DOCUMENT CHANGE DETAILS

ISSUE CHANGE AUTHORITY CLASS RELEVANT INFORMATION/INSTRUCTIONS

1 - - Initial Issue

DISTRIBUTION LIST

INTERNAL

EXTERNAL

Astrium Ltd ESA CADM

Configuration Management

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