Heat-PipesHeat-Pipe Heat Sinks

Heat-pipes

heat-pipe techHeat pipe (HP) is celebrated as an excellent heat transfer component, consisting of threeparts called evaporating section, adiabatic section and condensation section. The main partis a sealed metal tube in which the air and other impurities must have been excluded out tomaintain a micro-negative pressure and certain working fluid was filled in. When inoperation, the liquid near heat source section evaporates after absorbing heat and becomesvapor, which carries latent heat and flows to the condensation section. After releasing heatthrough HP shell and outer cooling medium, the vapor then rechanges into liquid, whichflows back into evaporating section at the pressure of capillary structure, and starts anotherworking cycle. For the super heat transfer capability endued from its critically designedcapillary structure, HP can carry large quantities of heat from heat source instantly and it isacclaimed super heat conductor.

product exhibition

(1)Product Exhibition

WTL Sintered wick heatpipe WTL Axial grooved wickstraight heatpipe

WTL Axial grooved wickelbow heatpipe

(2)Product ParameterItem Parameter

Heat Pipe Length(mm) 230~900

Container Materials Cu

Capillary Structure Axial grooved wick / Sintered wick / Screen wick

Working Fluid WTL Cooled Medium

Designed OperatingTemperature(℃)

20~200

Designed OperatingInclination Angle(°)

α> 5

Heat Transfer Capacity (Qmax) 50~1000w (depends on the product specs)

Isothermal TestWhen heating in 50℃ water bath, the temperature differencebetween Evaporator section and adiabatic section is less than2℃

Heat Resistance (℃/W) < 0.08 (as reference)

Principle of Heat TransferCapacity Test

Testing Requirements

1)Heating input-power is supplied by the special delicatepower adjustment;2)heat pipe is placed with a α inclination angle; 3)when the fluctuate of the supervisory temperature on theouter shell is within 0.5℃ in 5min, the heat transfer processreaches its balance and the maximum heat transfer capacity(Qmax) is also defined simultaneously.

(3)Sample Charts of Heat Transfer Characteristics Test

Fig.1 Heat Transfer Capacity Test of HP with 700mm Length

Fig.2 Isotherm Test of HP with 700mm Length

Heatpipe Product exhibition

Heat Pipe Working Principle

Heat Pipe Exhibition

Heat-pipe heat sink

heat-pipe heat sink brief

Heat pipe heat sink (HP heat sink) was generated by combination of HP technology andexpansion fin heat dissipating technology. Compared with the traditional pure aluminumheat sink, HP heat sink is superior in its heat transfer capacity and efficiency per unit volume,which makes it an appreciated heat dissipating product.By exclusively introducing most advanced HP technology and process, WTL has beenresearching, developing and manufacturing numerous of new products for various of users.The products, such as HP heat sink for power devices and HP heat sink for explosion-proofcircumstance and etc, have been widely applied in such fields as high speed locomotive,railway, oil, chemical, coal, medium-voltage and high-voltage inverter and etc., and widelyaccepted both in domestic and abroad.

Some products of our heat pipe heat sink are in the picture.

Heatpipe Heat Sink For Silicon Controlled

1、Heatpipe Heat Sink For Silicon ControlledWith the fast development of the power and electronic industry, it is obvious that the largescale integration, assembly modularization and volume minimization are becoming a trendin integrated circuits, resulting in the increasingly larger dissipating heat of the powerdevices (such as silicon controlled rectifier SCR, silicon transistor, IGBT and etc.) Accordingly,higher requirements are put forward for the heat sink. To satisfy the requirements of thelarge heat dissipation, the HP heat sink with compact design is found to have higherefficiency, smaller volume and lighter weight, when compared with the traditional purealuminum heat sink.WTL produces the HP heat sink (following the national standard) for the power devices, suchas the SCR (Refer to the Fig.1 and Fig 2).

Fig.1 Series Parallel Connection CompositeSystem

Fig.2 Six-phase Semiwave RectificationCircuit Composite System

Heatpipe Heat Sink for Inverter Arc Welding Source

(1)Product Exhibition

(2)Product Parameter

Features

1. High heat dissipating efficiency, low thermal resistance, lightweight; having larger heat dissipating capability when comparedwith the normal pure aluminum heat sink in the same volume;2. Simple structure and compact design; easy installation andlow maintenance costs.

Application heat dissipating for inverter arc welding source

Operation Temperature(℃) 20~200

Heat Dissipated Power(w) According to customer requirements

Thermal Resistance((℃/w) ≤0.09

MaterialsSubstrate:AlFin: AlHP shell: Cu

Type of cooling Forced air cooling

Outline Structure

HP Heat Sink For Medium/High Voltage Inverter

(1)Product Exhibition

(2)Product Parameter

Features

1. High heat dissipating efficiency, low thermal resistance, lightweight; having larger heat dissipating capability when comparedwith the normal pure aluminum heat sink in the same volume;2. Simple structure and compact design; easy installation andlow maintenance costs.

Application Heat Sink For Medium/High Voltage Inverter

Operation Temperature(℃) 20~200

Heat Dissipated Power(w) According to customer requirements

Thermal Resistance((℃/w) ≤0.015

MaterialsSubstrate: Al/CuFin: Al/CuHP shell: Cu

Type of cooling Forced air cooling

HP heat sink for Plating Power Supply

(1)Product Exhibition

(2)Product Parameter

Features

1. High heat dissipating efficiency, low thermal resistance, lightweight; having larger heat dissipating capability when comparedwith the normal pure aluminum heat sink in the same volume;2. Simple structure and compact design; easy installation andlow maintenance costs.

Application Heatpipe heat sink for Plating Power Supply

Operation Temperature(℃) 20~200

Heat Dissipated Power(w) According to customer requirements

Thermal Resistance((℃/w) ≤0.03

MaterialsSubstrate: Al/CuFin: AlHP shell: Cu

Type of cooling Forced air cooling

Outline Structure

HP Heat Sink For Mining Explosion Proof Inverter

(1)Product Exhibition

(2)Product Parameter

Features

1. High heat dissipating efficiency, low thermal resistance, lightweight; having larger heat dissipating capability when comparedwith the normal pure aluminum heat sink in the same volume;2. Simple structure and compact design; easy installation andlow maintenance costs.

Application Heatpipe Heat Sink For Mining Explosion Proof Inverter

Operation Temperature(℃) 20~200

Heat Dissipated Power(w) 500~20000

Thermal Resistance((℃/w) ≤0.015

MaterialsSubstrate:Al/CuFin: CuHP shell: Cu

Type of cooling Natural cooling/Forced air cooling

HP Heat Sink For VVVF Inverter、SIV Auxiliary Power Unit

(1)Product Exhibition

(2)Product Parameter

Features

1. High heat dissipating efficiency, low thermal resistance, lightweight; having larger heat dissipating capability when comparedwith the normal pure aluminum heat sink in the same volume;2. Simple structure and compact design; easy installation andlow maintenance costs.

Application Heatpipe Heat Sink For VVVF Inverter、SIV Auxiliary Power Unit

Operation Temperature(℃) 20~200

Heat Dissipated Power(w) 1500~3000

Thermal Resistance((℃/w) ≤0.03

MaterialsSubstrate:AlFin: CuHP shell: Cu

Type of cooling Natural cooling

Heatpipe Heat Sink For SVC/SVG

(1)Product Exhibition

SVC SVG

(2)Product Parameter

Features

1. High heat dissipating efficiency, low thermal resistance, lightweight; having larger heat dissipating capability when comparedwith the normal pure aluminum heat sink in the same volume;2. Simple structure and compact design; easy installation andlow maintenance costs.

Application Heatpipe heat sink for SVC/SVG

Operation Temperature(℃) 20~200

Heat Dissipated Power(w) According to customer requirements

Thermal Resistance((℃/w) ≤0.045

MaterialsSubstrate: AlFin: AlHP shell: Cu

Type of cooling Natural cooling/Forced air cooling

Heatpipe Heat Sink For APF

(1)Product Exhibition

(2)Product Parameter

Features

1. High heat dissipating efficiency, low thermal resistance, lightweight; having larger heat dissipating capability when comparedwith the normal pure aluminum heat sink in the same volume;2. Simple structure and compact design; easy installation andlow maintenance costs.

Application Heatpipe heat sink for APF

Operation Temperature(℃) 20~200

Heat Dissipated Power(w) According to customer requirements

Thermal Resistance((℃/w) ≤0.045

MaterialsSubstrate: AlFin: AlHP shell: Cu

Type of cooling Forced air cooling