HFSS for ECAD: Package Modeling, MMIC and on-die … for ECAD: Package Modeling, MMIC and on-die...

© 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary© 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary

HFSS for ECAD:

Package Modeling,

MMIC and on-die

extraction

Alain Michel

Technical Director, Europe

© 2010 ANSYS, Inc. All rights reserved. 2 ANSYS, Inc. Proprietary

• Introduction

• HFSS integrated Solver on Demand (SoD) in

Detail

– Create a project from A to Z

– Project examples

• MMIC application with UMS PH15 design kit

– Design Kit with HFSS SOD

– Package Simulation

• Conclusion

Agenda


Introduction


• MCAD (Mechanical Computer-Aided Design) vs.

ECAD (Electronic Computer-Aided Design)

– HFSS application can be mostly split into two families:

• Application originally designed with MCAD: Antennas,

Connector, Wave Guide, filters …

• Application originally designed with ECAD: PCB, RFIC,

MMIC, Planar Antenna, Package …

• HFSS original GUI perfectly address MCAD

application needs

• HFSS SoD provides a new interface for ECAD

application

Why HFSS in Ansoft Designer?


• Available with Ansoft Designer 6.0

• 2D layout design entry

– Import from APD, ODB++

– Full custom layout

• Layers stackup definition

• Easy of Use with setup automation

• Easily toggle between FEM and MOM solvers

• Support scripted footprint

• HFSS technology for reliable and accurate models

– Adaptative meshing

– 3D Objects: wirebonds, arbitrary shaped vias…

– Finite dielectric

– Support for multimoded wave ports and gap sources

HFSS SoD Overview


HFSS SoD in Detail


• Standard HFSS design entry uses 3D Object

• HFSS in Designer combine 2D drawing with stackup

definition

Stackup Definition

Port1

Port2

Port3 Port4

+=


• Define port by selecting edge

• Solver specific properties

• HFSS gap or wave port available

Easy and Automated Port Setup


• Size setup

• Deembeding available

• PEC launch allows wave port inside air box

Wave Port Setup


• Radiation Boundary for air box

• Dielectric size setup

• Air box size setup

Boundaries Setup


• Solution Frequency

• Adaptive solution

• Mixed order elements and

iterative solver available

HFSS Solution Setup


• Rectangular, smith chart … plots

• Current, far and near field display

• Meshing

Post-Processing

2.00 4.50 7.00 9.50 12.00 14.50 17.00 19.50F [GHz]

-37.50

-25.00

-12.50

0.00

Y1

Ansoft LLC spir2_20S11_12_dB ANSOFT

Curve Info

S12_3D_HFSSSetup HFSS_gap : Sw eep 1


5.002.001.000.500.200.00

5.00

-5.00

2.00

-2.00

1.00

-1.00

0.50

-0.50

0.20

-0.20

0.000

10

20

30

40

50

6070

8090100110

120

130

140

150

160

170

180

-170

-160

-150

-140

-130

-120-110

-100 -90 -80-70

-60

-50

-40

-30

-20

-10

spir2_20Smith Chart 1 ANSOFTCurve Info

S(Port1,Port1)Setup HFSS_gap : Sw eep 1


• From 2D to 3D

– Finite dielectric definition in stackup

– Use Bondwire type primitive

• Quick and easy port setup

• Display current

Package example


• Current distribution

Package example


Imported Package Example

• Import from APD/Allegro

• .mcm, .sip, .brd, .anx

• Import stackup and bondwire profile

• Setup solderball profile

• Automatically port setup for pin

• Cutout sub-design


2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 20.00F [GHz]

-45.00

-40.00

-35.00

-30.00

-25.00

-20.00

-15.00

-10.00

-5.00

0.00

Y1

Ansoft LLC spir2_20S11_12_dB ANSOFT

Curve Info

S11_3D_MoMSetup 3D MoM edge : Sw eep 1

S12_3D_MoMSetup 3D MoM edge : Sw eep 1



Spirale example

• 1 project 2 setup


MMIC application

with UMS PH15

design kit


• Provide UMS PH15 Design Kit with passive

component simulable with HFSS

• Includes parameterized footprint for

– MIM capacitor

– Spirale inductor

– Tan and TiWSi Resistors

– Vias

• Footprint are both valid for GDS export and

HFSS simulation

UMS Partnership

wint_um=50

lint_um=60.5

CapOnGrid_pF=0.998pF

Port1 Port2


• Technology file loads design kit components,

layer definition and stackup

• Stackup is defined with regards to process

technology definition given by foundry

What is a Design Kit?


• Components include Symbol, footprint and model

What is a Design Kit?

(Continued)


• Use parameters C, W, L …

– To set equivalent circuit model parameter values

– Automatically draw DRC safe layout

Component example

MIM capacitor

PHCAPN1

C=0.264pF

W=28um

Source UMS PH15 design guide

wint_um=28

lint_um=28.5



• Create parameterized footprint

– With respect to design rules defined

for manufacturing

– With respect to physical design

used for HFSS simulation

• Layer deposition

• Air bridges

• ….

Challenge

Source UMS PH15 design guide


• Shape of the same layer is drawn twice

– User type for manufacturing (GDSII export)

– Signal, dielectric or ground for HFSS simulation

• Stackup definition validated with UMS

• Automatically loaded with the technology file

Layer Definition


0.00 5.00 10.00 15.00 20.00 25.00 30.00 35.00 40.00F [GHz]

0.00

0.20

0.40

0.60

0.80

1.00

Y1

Cap_0_26pF_merge_nitrideCap_value ANSOFT

m4m5

m7

m6

Curve Info

cap_pf

cap_pf_UMS_Model

Name X Y

m4 7.5000 0.2929

m5 7.5000 0.2699

m6 30.0000 0.5092

m7 30.0000 0.4319

Name Delta(Y)

d(m4,m5) -0.0230

d(m6,m7) -0.0773

• Good agreement with UMS model

Simulation results:

MIM capacitor 0.26pf

wint_um=28

lint_um=28.5


Port1 Port2


Spiral Inductor 1.91nh

Ldrawn=1.902nH

Ndrawn=4

Longdrawn=1760um

Port1

Port2

1.00 6.00 11.00 16.00 20.00F [GHz]

1.00

1.50

2.00

2.50

3.00

Y1

Ansoft LLC Self_1_91nhInd_Value_zoom ANSOFT

Curve Info

ind_nh_HFSS

ind_nh_UMS_Model


0.00 10.00 20.00 30.00 40.00 50.00 60.00F [GHz]

-45.00

-40.00

-35.00

-30.00

-25.00

-20.00

-15.00

-10.00

-5.00

0.00

Y1

LPFS Parameters ANSOFT

Curve Info

dB(S(Port1,Port1))

dB(S(Port2,Port1))

• Coupling between components

• No need of internal port

Simple LPF


PA simulation

including Package

effect


Where do we start?

• Power Amplifier MMIC

– UMS HBT20 process

– CHA5012 from UMS

– Simulated in Ansoft Designer with

UMS PDK developed in

conjunction with UMS

– Device models include

Temperature modification

• Needs high volume packaging

for large-scale production 0 0 0

00

0

IZ=0ohm

PNUM=1

RZ=50ohm

IZ=0ohm

PNUM=2

RZ=50ohm

Port3

U3

CHA5014

U4

External_Biasing_Ctrl2

1uF

C8

87

100nH

L888

0.02

R889

5nH

L893 0.01

R894

10nF

C8

97

1nH

L901

0.8nH

L904

120pF

C9

07

0.01

R911

5nH

L912

1nH

L916

0.8nH

L917

120pF C9

21

10nF C9

22

V925

DC=Vcontrol

UMS HB20P V3.2

A

Name=I_Alim

V

Name=Vtot


8.80 9.00 9.20 9.40 9.60 9.80 10.00 10.20 10.40 10.60 10.80 11.00F [GHz]

10.00

12.00

14.00

16.00

18.00

20.00

22.00

24.00

26.00

dB

(GP

)

Sweeptemp ANSOFT

m1

Curve Info

temperaC='-40'

temperaC='25'

temperaC='80'

Name X Y

m1 10.0000 21.4571

8.00 8.50 9.00 9.50 10.00 10.50 11.00 11.50 12.00F [GHz]

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

10.00

20.00

30.00

Y1

Ansoft LLC CHA5012_Ext_biasingS21_Narrow ANSOFT

MX1: 10.0000

Curve Info

S21

S11

S12

s22

-41.9647

-20.6034-18.4431

21.4192

PA Die Properties

9.00 9.20 9.40 9.60 9.80 10.00 10.20 10.40 10.60 10.80 11.00freq_in [GHz]

18.00

20.00

22.00

24.00

26.00

28.00

30.00

32.00

34.00

36.00

m1

m2

m3

Name X Y

m1 10.0000 28.5197

m2 10.0000 34.7013

m3 10.0000 21.4184

Curve Info

PAE (%) @3dBc

Pout (dBm) @3dBc

Linear gain in dB

0

RZ=50ohm

IZ=0ohm

PNUM=1

IZ=0ohm

PNUM=2

RZ=50ohm

V2

65

6

DC

=V

bia

s

AN

am

e=

Ibia

s

Port1 Port2

Port3

CHA5012_Ext_biasing2

0.3nH

L2670

0.3nH

L2673


PA Design using HFSS SOD

• This package is a dummy package created for

this presentation


Setup HFSS SOD simulation


Package results

0.00 5.00 10.00 15.00 20.00F [GHz]

-2.50

-2.00

-1.50

-1.00

-0.50

0.00

Y1

finite_moldsizeXY Plot 1 ANSOFT

Curve Info

dB(S(Port4,Port3))HFSS Setup 1 : Sweep 1


0.00 5.00 10.00 15.00 20.00F [GHz]

-62.50

-50.00

-37.50

-25.00

-12.50

0.00

Y1

finite_moldsizeXY Plot 2 ANSOFT

Curve Info






PA/Package cosimulation

• Link this HFSS model with Designer to determine

packaged S-parameters

0 0 0

00

0

IZ=0ohm

PNUM=1

RZ=50ohm

IZ=0ohm

PNUM=2

RZ=50ohm

Port3

U3

CHA5014

U4

External_Biasing_Ctrl2

1uF

C8

87

100nH

L888

0.02

R889

5nH

L893 0.01

R894

10nF

C8

97

1nH

L901

0.8nH

L904

120pF

C9

07

0.01

R911

5nH

L912

1nH

L916

0.8nH

L917

120pF C9

21

10nF C9

22

V925

DC=Vcontrol

UMS HB20P V3.2

A

Name=I_Alim

V

Name=Vtot


9.00 9.20 9.40 9.60 9.80 10.00 10.20 10.40 10.60 10.80 11.00freq_in [GHz]

17.50

20.00

22.50

25.00

27.50

30.00

32.50

35.00

Ansoft LLC PAE and Pout @P3dBc and Linear Gain ANSOFT

m1

m2

m3

Curve Info

PAE (%) @3dBc

Pout (dBm) @3dBc

Linear Gain

Name X Y

m1 10.0000 28.1190

m2 10.0000 32.4528

m3 10.0000 20.9518

8.00 8.50 9.00 9.50 10.00 10.50 11.00 11.50 12.00F [GHz]

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

10.00

20.00

30.00

Y1

Ansoft LLC PA_nominal_packageS parameters ANSOFT

MX1: 10.0000

Curve Info

S21

S11

S12

s22

-38.1480

-11.4320 -11.0842

20.9526

Packaged Die Results @ 25 °C

• Die was designed to take advantage of bondwire

inductance

• Slightly lower gain and worse matching– Ideal inductance used to model package bondwire does not

correspond to dummy package use for this presentation.


• Target ECAD application

• 2D layout design entry

– Import from APD, ODB++

– Full custom layout

• Easy and quick setup of an HFSS project

• HFSS technology for reliable and accurate models

– Adaptative meshing

– 3D Objects: wirebonds, arbitrary shaped vias…

– Finite dielectric

– Support for multimoded wave ports and gap sources

• Availability of scripted footprint

• For UMS Design Kit

– Parameterized footprints combine physical and DRC safe layout

– HFSS 3D accuracy using 2D layout and physical stackup definition

– Extend passive model range using HFSS integrated in Ansoft Designer

– Include comprehensive component coupling analysis

– Automatic port setup and de-embedding

Conclusion


Thank you

Date post:	03-Jul-2018
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HFSS for ECAD: Package Modeling, MMIC and on-die … for ECAD: Package Modeling, MMIC and on-die...

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