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High-Performance Flexible Organic Nano-Floating Gate Memory Devices Functionalized with Semiconducting Nanoparticles Ji Hyung Jung Department of Energy Engineering Graduate School of UNIST
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  • High-Performance Flexible Organic Nano-Floating

    Gate Memory Devices Functionalized with

    Semiconducting Nanoparticles

    Ji Hyung Jung

    Department of Energy Engineering

    Graduate School of UNIST

  • High-Performance Flexible Organic Nano-Floating

    Gate Memory Devices Functionalized with

    Semiconducting Nanoparticles

    A thesis

    Submitted to Department of Energy Engineering of UNIST

    in partial fulfillment of the requirements

    for the degree of Master of Science

    Ji Hyung Jung

    12. 19. 2014

    Approved by

    ___________________________

    Advisor

    Byeong-Su Kim

  • High-Performance Flexible Organic Nano-Floating

    Gate Memory Devices Functionalized with

    Semiconducting Nanoparticles

    Ji Hyung Jung

    This certifies that the thesis of Ji Hyung Jung is approved.

    12. 19. 2014

    Signature

    __________________________

    Byeong-Su Kim

    Signature

    __________________________

    Joon Hak Oh

    Signature

    __________________________

    Hyunhyub Ko

  • Abstract

    High-Performance Flexible Organic Nano-Floating Gate Memory Devices Functionalized with

    Semiconducting Nanoparticles, 2015, Ji Hyung Jung, Department of Energy Engineering, Ulsan

    National Institute of Science and Technology (UNIST)

    Transistor-type nano-floating gate memory (NFGM) devices have recently attracted great interest

    because of their unique and compatible characteristics as suitable platforms for integrated circuits.

    Their excellent memory properties with inexpensive fabrication processes make NFGM devices

    highly promising for the next-generation data storage devices.

    Herein, novel nonvolatile NFGM devices utilizing semiconducting cobalt ferrite (CoFe2O4)

    nanoparticles (NPs) as the charge trap sites with p-type semiconductor, pentacene as active layer on

    flexible and transparent polymer substrates as well as on conventional silicon wafers have been

    prepared. Monodisperse CoFe2O4 NPs, which were synthesized in solution from cheap and nontoxic

    metal-oleate complex precursor, provide facile and fast deposition on the target substrates via simple

    spin-casting technique. The newly developed NFGM devices exhibit superb mechanical/electrical

    stability against pure bending and repeated program/erase (P/E) operations without additional

    tunneling dielectric layer which enhances data retention capacity and helps the charge carriers to be

    trapped in the NPs. Furthermore, size effect of CoFe2O4 NPs (5, 8, and 11 nm) on electrical memory

    performance in NFGM devices was investigated.

    Keywords: Nano-floating gate memory, cobalt ferrite, nanoparticle, pentacene, organic memory

  • Blank page

  • Contents

    I. Introduction ------------------------------------------------------------------------------------------------------ 1

    1.1 Organic nano-floating gate memory (NFGM) devices --------------------------------------------- 1

    1.2 Cobalt ferrite (CoFe2O4) nanoparticles (NPs) -------------------------------------------------------- 4

    II. Experiments ----------------------------------------------------------------------------------------------------- 7

    2.1 Synthesis of CoFe2O4 NPs ------------------------------------------------------------------------------ 7

    2.2 Characterization of CoFe2O4 NPs ---------------------------------------------------------------------- 8

    2.3 Fabrication of CoFe2O4 NFGM devices ------------------------------------------------------------- 15

    III. Results & discussion ----------------------------------------------------------------------------------------- 19

    3.1 Analysis of CoFe2O4 NFGM devices ---------------------------------------------------------------- 19

    3.2 Electrical memory performance of CoFe2O4 NFGM devices ------------------------------------ 22

    3.3 Electrical memory performance and mechanical stability test of flexible CoFe2O4 NFGM

    devices -------------------------------------------------------------------------------------------------------- 33

    IV. Conclusion ---------------------------------------------------------------------------------------------------- 36

    V. Reference ------------------------------------------------------------------------------------------------------ 37

    Acknowledgement ------------------------------------------------------------------------------------------------ 40

  • List of figures

    Figure 1-1. Schematic illustrations and device operation schemes of transistor and floating gate flash

    memory devices ---------------------------------------------------------------------------------------------------- 3

    Figure 1-2. Various applications of magnetic NPs ----------------------------------------------------------- 5

    Figure 1-3. Transmission electron microscopy (TEM) images and size distribution of size- and shape-

    controllable CoFe2O4 NPs ---------------------------------------------------------------------------------------- 6

    Figure 2-1. TEM images of synthesized CoFe2O4 NPs ------------------------------------------------------ 9

    Figure 2-2. Size distribution of CoFe2O4 NPs --------------------------------------------------------------- 10

    Figure 2-3. Cyclic voltammograms of CoFe2O4 NPs ------------------------------------------------------- 11

    Figure 2-4. Plot of transformed Kubelka-Munk function versus the energy of the light absorption

    from the UV-vis absorption spectra of CoFe2O4 NPs -------------------------------------------------------- 12

    Figure 2-5. Energy band diagram of CoFe2O4 NPs --------------------------------------------------------- 13

    Figure 2-6. Contact angle measurement of D. I. water on the Si wafer ---------------------------------- 16

    Figure 2-7. Schematic configuration of the NFGM devices based on CoFe2O4 NPs ------------------- 17

    Figure 2-8. Schematic illustration and photograph of the flexible CoFe2O4 NFGM devices ---------- 18

    Figure 3-1. Atomic force microscopy (AFM) phase images of spin-coated CoFe2O4 NPs on the Si

    wafer --------------------------------------------------------------------------------------------------------------- 20

    Figure 3-2. Cross-sectional scanning transmission electron microscopy (STEM) images of 8 nm

    CoFe2O4 NP-embedded NFGM devices ---------------------------------------------------------------------- 21

    Figure 3-3. Transfer curves of the NFGM devices based on CoFe2O4 NPs ------------------------------ 25

  • Figure 3-4. Electrical memory characteristics of NFGM devices based on 8 nm CoFe2O4 NPs ------ 27

    Figure 3-5. Memory characteristics of the NFGM devices based on 8 nm CoFe2O4 NPs depending on

    the program/erase (P/E) operation bias voltage -------------------------------------------------------------- 28

    Figure 3-6. Schematic energy band diagrams for the charge trap/release mechanism description --- 30

    Figure 3-7. Electrical memory performance of flexible NFGM devices based on 8 nm CoFe2O4 NPs

    ----------------------------------------------------------------------------------------------------------------------- 34

    Figure 3-8. Mechanical stability test of flexible NFGM devices based on 8 nm CoFe2O4 NPs ------- 35

  • List of tables

    Table 2-1. Electrochemical and photochemical data of CoFe2O4 NPs ------------------------------------ 14

    Table 3-1. Electrical memory characteristics of the NFGM devices with/without CoFe2O4 NPs ----- 26

    Table 3-2. Memory window and read current on/off ratio (read Ion/Ioff) of the NFGM devices based on

    8 nm CoFe2O4 NPs depending on the program/erase (P/E) operation bias voltage --------------------- 29

    Table 3-3. Comparison of electrical memory performance between with/without additional tunneling

    dielectric layer in NFGM devices ------------------------------------------------------------------------------ 31

    Table 3-4. Comparison of data retention test between with/without additional tunneling dielectric

    layer in NFGM devices ------------------------------------------------------------------------------------------ 32

  • 1

    I. Introduction

    1.1 Organic nano-floating gate memory (NFGM) devices

    As inorganic semiconductor-based electronic devices are processed on rigid and limited types of

    substrates via expensive fabrication processes requiring high temperature and vacuum condition,

    researches for organic semiconductor-based electronic devices have been intensively conducted over

    the last decades for achieving not only low-cost, facile fabrication processes but also

    commercialization for flexible and large-area electronics. To truly realize flexible electronics, all the

    components of electronic devices including transistors,1 batteries,

    2 and displays

    3 should be

    intrinsically flexible.

    Memory devices are also one of most important elements for flexible electronic devices and have

    been extensively developed so far. Among various kinds of memory devices, transistor-type flash

    memory devices have been widely studied because of their suitability as platforms for integrated

    circuits, and superb electrical performances. They can be fabricated by embedding floating gates

    and/or tunneling dielectric layer between channel and gate dielectric layer in transistor structure. In

    flash memory devices, electrically bistable behavior can be observed showing different conductivity

    at the same gate-source bias voltage (VGS = 0 V) depending on the previous memory operation.4

    Charge carriers in active layer can be induced and trapped in floating gates during program operation

    and released during erase operation resulting in threshold voltage shift, also denoted as memory

    window or hysteresis, via conductance change of the channel as shown in Figure 1-1.5

    Among many kinds of flash memory devices, nanoparticle (NP)-embedded nano-floating gate

    memory (NFGM) devices have attracted tremendous attention as promising next-generation memory

    devices because they have the merit of facile control of electrical properties of NPs such as energy

    level by modulating their sizes and shapes. To date, most of studies on organic NFGM devices have

    been investigated utilizing metallic NPs.4, 6

    Despite their high cost, Au NPs have been extensively

    exploited because of their high work function and chemical stability, and thermal evaporation has

    been widely used for the deposition of the NPs. This method, however, requires high-vacuum

    condition and not a useful method for controlling the size, shape and the density of NPs because of

    Ostwald ripening, where small Au NPs tend to dissolve and redeposit onto larger NPs during the

    evaporation.7 On the other hand, semiconducting or metal oxide NPs have been far less utilized for

    memory devices despite their lower cost compared with metallic NPs, presumably because of

    comparatively poor electrical memory performance.8

    In this study, the electrical memory characteristics of novel organic NFGM devices based on

  • 2

    semiconducting CoFe2O4 NPs were investigated showing comparable electrical memory

    characteristics to the NFGM devices based on metallic NPs. In addition, the effect of size of CoFe2O4

    on the NFGM devices has been studied thoroughly.

  • 3

    (a)

    (b)

    Figure 1-1. Schematic illustrations and device operation schemes of a) transistor and b) floating gate

    flash memory device. (Han, S.-T. et al., Adv. Mater. 2013, 25, 5425-5449)5

  • 4

    1.2 Cobalt ferrite (CoFe2O4) nanoparticles (NPs)

    Magnetic NPs have been investigated intensively in recent years because of their electrical, optical,

    and magnetic property changes depending on their sizes, shapes, agglomerations.9 CoFe2O4 NPs are

    one of the well-known hard magnetic materials having high coercivity, magnetocrystalline anisotropy,

    and moderate saturation magnetization as well as outstanding physical/chemical stability.10

    Owing to

    their unique properties of the inverse spinel ferrites of ternary composition, CoFe2O4 NPs have

    various application fields including sensors,11

    data storage,12

    and bio-applications such as drug-

    delivery systems for biological labeling or magnetic hyperthermia.13

    (Figure 1-2)

    Accordingly, various size- and shape-controllable synthesis methods of monodisperse NPs have been

    developed. CoFe2O4 NPs can be prepared via sol-gel,14

    Langmuir-Blodgett,15 coprecipitation,

    16

    hydrothermal,17

    bacterial18

    and micellar synthesis,10

    combustion,19

    aerosol vapor,20

    mechanical

    grinding,21

    or high-temperature decomposition of organic precursors.22

    In non-hydrolytic reaction

    method, size and shape of CoFe2O4 NPs can be controlled by adjusting the ratio between the quantity

    of nano-crystalline seeds and precursors in the solution and regulating NP growth rate.23

    (Figure 1-3)

    Herein, CoFe2O4 NPs were synthesized via modified thermal decomposition method as previously

    reported.24

    Using this method, the size of CoFe2O4 NPs can be controlled simply by varying Ar

    bubbling rate in the reacting solution. Furthermore, monodisperse NPs can be synthesized through

    complete separation of nucleation and growth process using Ar bubbles, which absorb the heat

    generated from exothermic multiple-bonds formation reactions in the nucleation step.25

  • 5

    Figure 1-2. Various applications of magnetic nanoparticles. (Jun, Y.-W. et al., Chem. Commun., 2007,

    1203-1214)26

  • 6

    Figure 1-3. Size and shape control of CoFe2O4 NPs. TEM images of spherical CoFe2O4 nanoparticles

    of (a) 5.2 ± 1.1, (b) 7.9 ± 0.5, and (e) 11.8 ± 1.3 nm and cubic nanoparticles of (c) 9.1 ± 0.5 and (d)

    10.9 ± 0.6 nm with scale bar as 50 nm. (f) Size distribution of cubic nanoparticles in figure (d). The

    inset of figure (f) shows the aspect ratio of cubic nanoparticles in figure (c) and (d). (Song, Q. et al., J.

    Am. Chem. Soc. 2004, 126, 6164-6168)23

  • 7

    II. Experiments

    2.1 Synthesis of CoFe2O4 NPs

    In this study, CoFe2O4 NPs in three different sizes (5, 8, and 11 nm in diameter) have been

    synthesized from low-cost and non-toxic metal-oleate complex precursor modifying the experimental

    method as reported in previous study.24

    (Co2+

    Fe23+

    )-oleate was used as precursor to synthesize CoFe2O4 NPs. To synthesize precursor,

    iron(Ⅲ) chloride hexahydrate (FeCl3∙6H2O, 32 mmol), cobalt(Ⅱ) chloride hexahydrate (CoCl2∙6H2O,

    16 mmol), and sodium oleate (128 mmol) were dissolved in a mixture of 80 ml of ethanol, 80 ml of D.

    I. water, and 160 ml of n-hexane. Mixed solution was stirred until all reagents were dissolved

    thoroughly. The reacted (Co2+

    Fe23+

    )-oleate was washed with 120 ml of D. I. water for 3 times and

    residual solvent was evaporated in the rotary evaporator at 80 ˚C.

    Then, (Co2+

    Fe23+

    )-oleate complex (2.5 g), oleic acid (OLA, 0.25 g), and octadecene (10 ml) were

    mixed and evacuated at 80 ˚C for 1 h. Then, the mixture was heated to 310 ˚C at a heating rate of 1 ˚C

    min-1

    under Ar bubbling and stirred for 1 h. In this step, Ar bubbling rate into reacting solution was

    adjusted to control the size of CoFe2O4 NPs because Ar bubbles in solution can absorb the local latent

    heat generated during nucleation step, leading to continuous primary nucleation process for

    monodisperse and smaller NPs in low temperature.

    For the synthesis of 5 nm CoFe2O4 NPs, Ar was bubbled vigorously in the reacting solution. For 11

    nm ones, on the other hand, the bubbling was stopped before the reacting solution was heated. After

    growth of the NPs, the dispersion was cooled down to room temperature and rinsed with

    acetone/ethanol mixture three times. As-prepared CoFe2O4 NPs were finally dispersed in n-hexane for

    long-term storage.

  • 8

    2.2 Characterization of CoFe2O4 NPs

    Physical and electrical properties of monodisperse CoFe2O4 NPs in three different sizes (5, 8, and 11

    nm in diameter) have been chracterized using transmission electron microscopy (TEM), cyclic

    voltammetry (CV), and UV-vis absorption spectroscopy.

    TEM images of monodispersely synthesized CoFe2O4 NPs were shown in Figure 2-1. The size

    estimation of CoFe2O4 NPs showed the values of 5.59 ± 0.65 (size variation ca.10 %), 8.05 ± 0.57

    (size variation ca. 7 %), and 11.30 ± 0.76 nm (size variation ca. 5 %) for the 5, 8, and 11 nm NPs,

    respectively. (Figure 2-2) The particle size distribution of NPs was estimated from 50 random

    samples in TEM images.

    The energy level of valence band of CoFe2O4 NPs can be estimated by cyclic voltammograms as

    shown in Figure 2-3. The electrolyte was 0.1 M of tetabutylammonium hexafluorophosphate

    (Bu4NPF6) in anhydrous acetonitrile and cyclic votammograms were measured at a scan rate of 100

    mV s-1

    at room temperature under N2 gas blowing. Indium tin oxide (ITO) glass deposited by each

    CoFe2O4 NP dispersion was used as a working electrode. Platinum (Pt) wire and Ag/Ag+ electrode

    containing 0.01 M of AgNO3 and 0.1 M of tetrabutyl ammonium perchlorate (TBAP) in acetonitrile

    were served as a counter and a reference electrode, respectively. The Ag/Ag+ reference electrode was

    internally calibrated by ferrocene/ferrocenium couple (Fc/Fc+) and the valence band energy level of

    NPs can be estimated using equation,

    𝐸𝑣𝑎𝑙𝑒𝑛𝑐𝑒 𝑏𝑎𝑛𝑑 (𝑒𝑉) = −[𝐸(𝑜𝑥)𝑜𝑛𝑠𝑒𝑡 − 𝐸(𝑓𝑒𝑟𝑟𝑜𝑐𝑒𝑛𝑒)

    𝑜𝑛𝑠𝑒𝑡 + 4.8] (1)

    Energy bandgap, the energy level difference between conduction band and valence band, can be

    measured using a plot of the modified Kubelka-Munk function versus the energy of exciting light

    derived from UV-vis spectra.27

    (Figure 2-4) The spectra were measured for NP dispersion and spin-

    coated NPs on the quartz plate.

    The electromchemical/photochemical data of CoFe2O4 NPs (Figure 2-3, 2-4, and Table 2-1) showed

    that the energy level of valence band increases gradually from -6.56 to -6.52 eV as the size of NPs

    increases, and that of conduction band and energy bandgap decrease from -3.80 to -3.94 eV and 2.76

    to 2.58 eV, respectively. (Figure 2-5)

  • 9

    (a) (b)

    (c) (d)

    (e) (f)

    Figure 2-1. TEM images of (a, b) 5, (c, d) 8, and (e, f) 11 nm CoFe2O4 NPs.

  • 10

    (a) (b)

    (c)

    Figure 2-2. The size distribution of CoFe2O4 NPs in (a) 5.59 ± 0.65 (size variation ca. 10 %), (b) 8.05

    ± 0.57 (size variation ca. 7 %), and (c) 11.30 ± 0.76 nm (size variation ca. 5 %).

    4.0 4.5 5.0 5.5 6.0 6.5 7.00

    5

    10

    15

    20

    25

    30

    35

    Perc

    enta

    ge (

    %)

    Diameter (nm)

    7.0 7.5 8.0 8.5 9.0 9.50

    5

    10

    15

    20

    25

    30

    Perc

    en

    tag

    e (

    %)

    Diameter (nm)

    9 10 11 12 13 140

    10

    20

    30

    40

    50

    Perc

    enta

    ge (

    %)

    Diameter (nm)

  • 11

    (a) (b)

    (c)

    Figure 2-3. Cyclic voltammograms of (a) 5, (b) 8, and (c) 11 nm CoFe2O4 NPs.

    0 1 2 3

    Curr

    en

    t (a

    .u.)

    Potential (V vs Fc/Fc+)

    E onset

    ox = 1.82 V

    0 1 2 3

    E onset

    ox = 1.80 V

    Curr

    en

    t (a

    .u.)

    Potential (V vs Fc/Fc+)

    0 1 2 3

    E onset

    ox = 1.78 V

    Curr

    en

    t (a

    .u.)

    Potential (V vs Fc/Fc+)

  • 12

    (a) (d)

    (b) (e)

    (c) (f)

    Figure 2-4. Plots of modified Kubelka-Munk function versus the energy of the light absorption in the

    UV-vis absorption spectra of (a ~ c) NP dispersion and (d ~ f) spin-coated NPs on the quartz plate: (a,

    d) 5, (b, e) 8, and (c, f) 11 nm NPs.

    2 3 4 5

    Eg = 2.79 eV

    [F(R

    )*E

    ]1/2

    Energy / eV

    2 3 4 5

    Eg = 2.76 eV

    [F(R

    )*E

    ]1/2

    Energy / eV

    2 3 4 5

    Eg = 2.77 eV

    [F(R

    )*E

    ]1/2

    Energy / eV2 3 4 5

    Eg = 2.64 eV

    [F(R

    )*E

    ]1/2

    Energy / eV

    2 3 4 5

    Eg = 2.76 eV

    [F(R

    )*E

    ]1/2

    Energy / eV2 3 4 5

    Eg = 2.58 eV

    [F(R

    )*E

    ]1/2

    Energy / eV

  • 13

    Figure 2-5. Energy band diagrams of CoFe2O4 NPs in three different sizes.

  • 14

    Table 2-1. Electrochemical and photochemical data of CoFe2O4 NPs

    Size of NPs Eox

    onset

    (V)[a]

    Valence

    band

    (eV)[a]

    Conduction

    band

    (eV)[b]

    Eg, NPs

    (eV)[c]

    Eg, dispersion

    (eV)[c]

    5 nm 1.82 -6.56 -3.80 2.76 2.79

    8 nm 1.80 -6.54 -3.90 2.64 2.77

    11 nm 1.78 -6.52 -3.94 2.58 2.76

    [a] Deduced from the onset oxidation potentials in the cyclic voltammograms.

    [b] Calculated from Econduction (eV) = Evalence + Eg,NPs

    [c] Extracted from UV-vis spectra using Kubelka-Munk function.

  • 15

    2.3 Fabrication of NFGM devices

    n-octadecyltrimethoxysilane (OTS)-treated Si wafer was prepared for the fabrication of NFGM

    devices based on CoFe2O4 NPs.28

    The solution of 3 mM OTS dissolved in trichloroethylene (TCE)

    was spin-coated on the highly n-doped (100) Si wafer (< 0.005 Ω cm) with thermally grown SiO2 100

    nm (Ci = 32.8 nF cm-2

    ). The Si wafer was pre-cleaned in piranha solution (mixture of H2SO4 : H2O2 =

    70 : 30 by volume ratio) before washing with D. I. water and UV/ozone plasma treatment. Spin-

    coated Si wafer was exposed to ammonium hydroxide (NH4OH) vapor overnight in the desiccator for

    the smooth formation of OTS self-assembled monolayer (SAM) on the surface of Si wafer.

    Subsequently, the wafer was ultra-sonicated in toluene and rinsed with toluene, acetone, and isopropyl

    alcohol (IPA) and dried with N2 gas. The contact angle of D. I. water on the surface of Si substrate

    before and after the SAM treatment was ca. 28 and 107 ˚, respectively. (Figure 2-6)

    The schematic configuration of the NFGM device based on CoFe2O4 NPs is shown in Figure 2-7.

    The spin-casting technique was applied for the facile, fast deposition of CoFe2O4 NPs in the NFGM

    devices. After spin-casting of 2 mg ml-1

    of CoFe2O4 NP dispersion at 1000 rpm, the Si wafer was

    annealed at 60 ˚C in the vacuum oven for the thorough solvent evaporation.

    P-type semiconductor, pentacene was thermally deposited on the surface of NPs at 0.1 ~ 0.3 Å s-1

    at 60 ˚C (substrate temperature) and 40 nm-thick gold source/drain electrodes were also formed via

    thermal evaporation using shadow masks with 50 μm of channel length (L) and 1000 μm of channel

    width (W). To confirm the effect of additional tunneling dielectric layer in NFGM devices, 10 nm-

    thick Al2O3 thin-film was deposited between pentacene and NPs utilizing atomic layer deposition

    (ALD).

    For the flexible NFGM devices, transparent and flexible polyethylene terephthalate (PET) film was

    prepared as a substrate. Cr (5 nm) and Au (100 nm) was thermally deposited on PET film and used as

    adhesion layer and gate electrode, respectively. 100 nm-thick Al2O3 blocking dielectric layer (Ci = 4.0

    nF cm-2

    ) was formed by radio frequency (RF) magnetron sputtering technique. The other processes

    are the same as those in the fabrication on the Si wafer as described above. The schematic illustration

    of the structure and photograph of flexible NFGM device based on CoFe2O4 NPs is shown in Figure

    2-8.

  • 16

    (a) (b)

    Figure 2-6. Contact angle of D. I. water (a) before and (b) after OTS treatment on the Si wafer.

  • 17

    Figure 2-7. Schematic configuration of the NFGM device based on CoFe2O4 NPs.

  • 18

    (a)

    (b)

    Figure 2-8. (a) Schematic image and (b) photograph of the flexible CoFe2O4 NFGM device.

  • 19

    III. Results & Discussion

    3.1 Analysis of CoFe2O4 NFGM devices

    The surface images of CoFe2O4 NPs deposited on Si wafer were obtained from atomic force

    microscopy (AFM) phase images as shown in Figure 3-1. Uniformly coated NPs were observed in

    AFM images of 5 and 8 nm CoFe2O4 NPs, while for 11 nm NPs, closely packed aggregated NPs were

    observed. This agglomeration phenomena of 11 nm CoFe2O4 NPs may be attributed to their narrow

    particle size distribution (standard deviation ca. 5 %), uniform shape, and van der Waals interaction

    among NPs.29

    Large NPs tend to be clustered together because large NPs usually have the stronger

    attraction force among NPs than that of small NPs30

    and it was experimentally verified that van der

    Waals force increases as the size of CoFe2O4 NP increases because of their permanent dipole moment

    in spinel structure.31

    The agglomeration of 11 nm CoFe2O4 NPs was also confirmed in their TEM

    images (Figures 2-1(e) and (f)).

    Figure 3-2 shows cross-sectional bright-field (BF) and high angle annular dark field (HAADF)

    scanning transmission electron microscopy (STEM) images of 8 nm CoFe2O4 NPs-embedded NFGM

    devices showing that NPs can be deposited uniformly in monolayer on target substrates via facile and

    simple spin-casting technique.

    The sample for STEM analysis was prepared using dual-beam focused ion beam (FIB, Helios 450

    HP, FEI, USA) on the copper grid and analyzed with high resolution-transmission electron

    microscope (HR-TEM, Cs-corrected JEM-2100F, JEOL, Japan).

  • 20

    (a) (b)

    (c)

    Figure 3-1. AFM phase images of spin-coated (a) 5, (b) 8, and (c) 11 nm CoFe2O4 NPs on the OTS-

    treated Si wafer.

  • 21

    (a) (b)

    (c) (d)

    Figure 3-2. Cross-sectional (a, b) bright-field (BF) and (c, d) high angle annular dark field (HAADF)

    scanning transmission electron microscopy (STEM) images of NFGM devices based on 8 nm

    CoFe2O4 NPs.

  • 22

    3.2 Electrical memory performances of the NFGM devices based on CoFe2O4 NPs

    A Keithley 4200 semiconductor parametric analyzer was used to measure all the electrical

    performance of NFGM devices based on CoFe2O4 NPs in an N2-filled glove box.

    Figure 3-3 shows transfer curves of the NFGM devices based on 5, 8, and 11 nm CoFe2O4 NPs

    during dual gate-source voltage sweep and their electrical memory characteristics were summarized in

    Table 3-1. All the transfer curves showed typical counterclockwise hysteresis loop of p-type NFGM

    devices resulting from increased memory window of NFGM devices by charge trapping/releasing of

    NPs during dual gate-source voltage sweep as described in Chapter 1.1.

    Memory window of 73.84 ± 6.34 V for NFGM devices based on 8 nm CoFe2O4 NPs was slightly

    larger than that of 68.27 ± 2.77 V for 5 nm NP-based ones. Meanwhile, NFGM devices based on 11

    nm CoFe2O4 NPs showed smaller memory window of 62.51 ± 7.16 V.

    On the basis of energy level differences among CoFe2O4 NPs in 3 different sizes (Figure 2-5), it is

    expected that charge trap capacity of NPs would be improved as their sizes increase because of their

    lower energy level of conduction band. However, this experimental result showed that charge carrier

    trap capacity of 11 nm CoFe2O4 NPs was decreased even though their energy levels are in equivalent

    or even in better condition for the charge carrier transport than those of 5 or 8 nm CoFe2O4 NPs. This

    result could be the consequence of the irregular aggregates of 11 nm CoFe2O4 NPs as previously

    described in chapter 3.1. The agglomerated NPs may disturb the uniform deposition of pentacene

    leading to interference in charge transfer between not only source and drain electrode but also

    pentacene and NPs. This may bring about decreasing memory window as well as charge mobility.

    Consequently, 8 nm CoFe2O4 NPs showed the best electrical memory performance, and therefore the

    only 8 nm NPs will be embedded in NFGM devices for the efficient, in-depth study of memory effect

    of CoFe2O4 NPs.

    Figure 3-4 shows electrical memory performances of the NFGM devices based on 8 nm CoFe2O4

    NPs. Typical output curves of p-type transistors were obtained in Figure 3-4(a). The drain current (ID)

    response for repeating pulse bias of program/erase (P/E) operations was investigated to measure

    memory switching speed and electrical stability (Figure 3-4(b)). 60 V, 0 V, -60 V, and 0 V were

    sequentially and repeatedly applied to gate electrode for program, read on, erase, read off operation,

    respectively. This switching cycle is usually called as write-read-erase-read (WRER) cycle. As shown

    in Figure 3-4(b) and (c), electrically fast and stable switching ID response with the values of read

    on/off current ratio (read Ion/Ioff) above 103 were maintained over 1,000 WRER cycles.

    Good data storage capacity is one of the important factors in non-volatile memory devices and the

    capacity was estimated from data retention test. (Figure 3-4(d)) The ID response at both programmed

  • 23

    (high conductance) and erased (low conductance) states was measured at VGS = 0 V after program

    (VGS = 60 V) and erase (VGS = -60 V) operation, respectively. Both read Ion and Ioff values were

    decreased slightly during first 100 s, but ca. 3 × 103 of read Ion/Ioff was maintained over 1,000 s.

    To investigate the memory effect induced by P/E operation voltage level, applied bias was gradually

    increased from ±10 to ±60 V at an interval of 10 V as shown in Figure 3-5 and the results were

    summarized in Table 3-2. Both values, memory window and read Ion/Ioff remained almost constant in

    the range from ±10 V to ±30 V but started to increase above ±30 V and reached ca. 76.79 V and 2.72

    103 at ±60 V, respectively. It indicates that CoFe2O4 NPs start to function as charge trap sites from

    ±30 V.

    Schematic energy band diagrams of the elements of the NFGM devices were illustrated to propose

    the possible charge trapping/releasing mechanism of the NFGM devices based on CoFe2O4 NPs.

    (Figure 3-6)

    Under high positive gate bias (at VGS = 60 V, program operation), electrons in the lowest unoccupied

    molecular orbital (LUMO) of pentacene can be attracted and trapped in the conduction band of

    CoFe2O4 NPs through oleates by strong positive external electric field. As a result, negatively charged

    NPs induced by significant amount of electrons can cause the negative internal electric field and start

    to attract the holes in pentacene to the interface between pentacene and oleates to form p-channel

    resulting in positive threshold voltage shift and maintenance of high conductance state in read on

    operation (at VGS = 0 V) after program operation. In erase operation (at VGS= -60 V), on the other hand,

    negative threshold voltage shift can be given via released electrons from NPs or recombination with

    transferred holes by strong negative external electric field resulting in low conductance state in read

    off operation (at VGS = 0 V) after erase operation.

    Tunneling dielectric layer, which has been usually deposited in most NFGM devices for good data

    storage capacity, was not embedded in this study. It has been reported that SAM alkyl chains

    surrounding NPs can play a role as alternative tunneling dielectric layer. To verify the effect of

    additional tunneling dielectric layer, 10 nm-thick Al2O3 thin-film was deposited between CoFe2O4

    NPs and pentacene by ALD. Al2O3 has been used widely as an insulator in various electronic devices

    because of its high electrical breakdown field, high dielectric constant, and large bandgap32

    and ALD

    has been considered as a useful method for thin-film deposition due to the merits of facile and

    accurate thickness control, making dense and pinhole-free thin-films with excellent thickness

    uniformity in large area.33

    As summarized in Table 3-3 and 3-4, both memory window and data retention capacity were

    lowered by embedding Al2O3 thin-film in NFGM devices indicating that additional Al2O3 tunneling

    dielectric layer rather disturbs charge carriers to transfer and oleates capping CoFe2O4 NPs are thick

  • 24

    enough to be a tunneling layer in NFGM devices.

  • 25

    (a) (b)

    (c)

    Figure 3-3. Transfer curves of the NFGM devices based on (a) 5, (b) 8, and (c) 11 nm CoFe2O4 NPs.

    -60 -40 -20 0 20 40 6010

    -11

    10-10

    10-9

    10-8

    10-7

    10-6

    10-5

    -ID (

    A)

    VGS

    (V)

    Initial

    Erase

    Program

    -60 -40 -20 0 20 40 6010

    -11

    10-10

    10-9

    10-8

    10-7

    10-6

    10-5

    -ID (

    A)

    VGS

    (V)

    Initial

    Erase

    Program

    -60 -40 -20 0 20 40 6010

    -10

    10-9

    10-8

    10-7

    10-6

    10-5

    -ID (

    A)

    VGS

    (V)

    Initial

    Erase

    Program

  • 26

    Table 3-1. Electrical memory characteristics of the NFGM devices based on CoFe2O4 NPs in different sizes and pentacene-based organic thin-film

    transistors (OTFTs) without NPs

    Size of

    CoFe2O4

    NPs

    μavg, initial

    (cm2

    V-1

    s-1

    )

    μmax, initial

    (cm2

    V-1

    s-1

    )

    Vt, initial

    (V)

    Vt, program

    (V)

    Vt, erase

    (V)

    ΔVt

    (V)

    Ion, read[a]

    (-A)

    Ioff, read[a]

    (-A)

    Read

    Ion/Ioff

    5 nm

    2.3310-3

    (±1.95

    10-3

    )

    2.6110-3

    (±1.92

    10-3)

    4.53

    (±8.13)

    32.46

    (±1.78)

    -35.82

    (±2.09)

    68.27

    (±2.77)

    8.6010-7

    (±7.52

    10-7

    )

    1.6410-10

    (±3.06

    10-11

    )

    5.13103

    (±3.86

    103)

    8 nm

    1.9610-3

    (±6.81

    10-4

    )

    2.2410-3

    (8.44±

    10-4)

    -3.38

    (±5.39)

    31.63

    (±4.25)

    -42.21

    (±3.48)

    73.84

    (±6.34)

    5.9710-7

    (±4.08

    10-7

    )

    2.2810-10

    (±1.07

    10-10

    )

    2.98103

    (±5.29

    102)

    11 nm

    1.0410-3

    (±3.05

    10-4

    )

    1.1810-3

    (±2.56

    10-4)

    -6.18

    (±3.65)

    30.52

    (±3.16)

    -31.99

    (±4.05)

    62.51

    (±7.16)

    4.4910-7

    (±1.61

    10-7

    )

    3.2710-10

    (±8.87

    10-11

    )

    1.35103

    (±1.99

    102)

    No NPs

    5.1710-1

    (±1.12

    10-1

    )

    5.2110-1

    (±1.11

    10-1)

    -20.75

    (±4.67)

    -24.91

    (±2.05)

    -32.51

    (±2.26)

    7.60

    (±1.13)

    1.3210-10

    (±1.12

    10-11

    )

    2.2510-10

    (±7.48

    10-11

    )

    6.2110-1

    (±1.24

    10-1)

    [a]I(on/off, read) was obtained at VGS = 0 V after the program operation (VGS = 60 V), and erase operation (VGS = -60 V).

  • 27

    (a) (b)

    (c) (d)

    Figure 3-4. Electrical memory characteristics of programmable 8 nm CoFe2O4 NP-based NFGM

    devices. (a) Output curves, (b) drain current response for P/E cycles, (c) electrical endurance for 1,000

    repeating P/E cycles, and (d) data retention time test.

    -60 -50 -40 -30 -20 -10 00.0

    0.1

    0.2

    0.3

    0.4

    0.5

    0.6

    -ID (A

    )

    VDS

    (V)

    VGS

    60 V

    50 V

    40 V

    30 V

    20 V

    10 V

    0 V

    100 150 200 250 30010

    -11

    10-9

    10-7

    10-5

    10-3

    10-1

    Time (s)

    -ID (

    A)

    Program

    Erase

    Read ON

    Read OFFION

    IOFF -250

    -200

    -150

    -100

    -50

    0

    50

    100

    VG

    S (V)

    0 200 400 600 800 100010

    -11

    10-10

    10-9

    10-8

    10-7

    10-6

    -ID (

    A)

    Time (s)

    Erased state

    Programmed state

    0 200 400 600 800 100010

    -10

    10-9

    10-8

    10-7

    10-6

    Programmed state

    Erased state

    -ID (

    A)

    P/E cycles

  • 28

    (a) (b)

    Figure 3-5. Memory effect depending on P/E bias voltage for NFGM devices based on 8 nm CoFe2O4

    NPs. (a) Transfer curves and (b) summarized values of memory window and read Ion/Ioff.

    -60 -40 -20 0 20 40 6010

    -11

    10-10

    10-9

    10-8

    10-7

    10-6

    10-5

    -ID (

    A)

    P/E voltage (V)

    10 V

    20 V

    30 V

    40 V

    50 V

    60 V

    10 20 30 40 50 60

    0

    20

    40

    60

    80

    Memory window

    ON/OFF ratio

    P/E voltage (V)

    Me

    mo

    ry w

    ind

    ow

    (V

    )

    10-1

    100

    101

    102

    103

    104

    ON

    /OF

    F ra

    tio

  • 29

    Table 3-2. Memory window and read Ion/Ioff depending on the program/erase operation bias voltage

    for NFGM devices based on 8 nm CoFe2O4 NPs

    P/E voltage

    (V)

    Memory window

    (V)

    Read Ion/Ioff

    (read at 0 V)

    ±10 0.30 9.59 10-1

    ±20 1.19 9.71 10-1

    ±30 4.91 7.74 10-1

    ±40 25.93 8.15 102

    ±50 52.06 2.69 103

    ±60 76.79 2.72 103

  • 30

    (a) (b)

    (c)

    Figure 3-6. (a) Schematic energy band diagrams of program and (b) erase operation for the charge

    trap/release mechanism description and (c) energy band diagram of pentacene and CoFe2O4 NPs in

    different sizes.

  • 31

    Table 3-3. Electrical memory performances of the NFGM devices based on 8 nm CoFe2O4 NPs with/without additional Al2O3 tunneling dielectric layer

    Thickness

    of Al2O3

    μavg, initial

    (cm2

    V-1

    s-1

    )

    μmax, initial

    (cm2

    V-1

    s-1

    )

    Vt, initial

    (V)

    Vt, program

    (V)

    Vt, erase

    (V)

    ΔVt

    (V)

    Ion

    (-A)

    Ioff

    (-A)

    Read

    Ion/Ioff

    0 nm

    1.9610-3

    (±6.81

    10-4

    )

    2.2410-3

    (±8.44

    10-4)

    -3.38

    (±5.39)

    31.63

    (±4.25)

    -42.21

    (±3.48)

    73.84

    (±6.34)

    5.9710-7

    (±4.08

    10-7)

    2.2810-10

    (±1.07

    10-10

    )

    2.98103

    (±5.29

    102)

    10 nm

    5.7810-2

    (±1.30

    10-2

    )

    5.8410-2

    (±1.25

    10-2)

    -13.38

    (±2.81)

    20.98

    (±2.61)

    -38.74

    (±1.05)

    59.72

    (±2.10)

    1.7110-5

    (±4.92

    10-6)

    2.3410-10

    (±7.57

    10-11

    )

    7.47104

    (±1.42

    104)

  • 32

    Table 3-4. Data retention time test of the NFGM devices based on 8 nm CoFe2O4 NPs with/without additional Al2O3 tunneling dielectric layer

    Thickness of

    Al2O3

    Ion

    (at 0 s, -A)

    Ion

    (at 103 s, -A)

    Ion, retention[a]

    (%)

    Ioff

    (at 0 s, -A)

    Ioff

    (at 103 s, -A)

    Ioff, retention[a]

    (%)

    0 nm 8.2910-7

    1.04 10-7

    12.65 3.53 10-10

    6.42 10-11

    18.21

    10 nm 1.42 10-5 5.53 10

    -7 3.87 7.17 10

    -10 6.49 10

    -11 9.06

    [a] Ion(off), retention = [Ion(off) (at 10

    3 s)/Ion(off) (at 0 s)] 100 (%)

    .

  • 33

    3.3 Electrical memory performance and mechanical test of the flexible NFGM devices based on

    8 nm CoFe2O4 NPs

    8 nm CoFe2O4 NPs were embedded on the bendable and transparent PET film with 100 nm-thick

    Al2O3 blocking dielectric layer to investigate their charge trap capacity in the flexible NFGM devices.

    Electrical memory performance of flexible NFGM devices based on 8 nm CoFe2O4 NPs was shown

    in Figure 3-7. The memory window was enhanced to ca. 31 V by embedding 8 nm CoFe2O4 NPs in

    flexible NFGM devices (Figure 3-7(a)), compared with flexible organic thin-film transistor (OTFT)

    without CoFe2O4 NP showing less than 2 V of memory window (Figure 3-7(b)). The value below 2 V

    of the memory window of OTFTs indicates that there were few charge trap sites in the active layer,

    blocking dielectric layer, and interface between them.

    In Figure 3-7(c) and (d), electrical stability of the memory devices was examined by 700 P/E cycles

    of dual gate voltage sweep from 20 V to -20 V. The memory window remained stable ca. 30 V

    without considerable electrical degradation.

    The mechanical reliability of the NFGM devices based on CoFe2O4 NPs has been also tested by

    measuring electrical memory performance after repeating pure bending.

    The tensile strain at the surface (εtop) of the flexible memory devices in pure bending can be

    estimated from the following equation:

    𝜀𝑡𝑜𝑝 =(𝐷𝐹+𝐷𝑆)(1+2𝜂+𝜒𝜂

    2)

    2𝑅(1+𝜂)(1+𝜒𝜂) ≒

    𝐷𝑆

    2𝑅 (2)

    where η = DF/DS and χ = YF/YS. R is bending radius, D is the thickness and YF and YS are the Young’s

    modulus of the thin-film (F) and substrate (S), respectively. εtop can be simply calculated as DS/2R.5

    As shown in Figure 3-8, the memory window above 26 V was retained with little electrical

    degradation during dual gate voltage sweep from 20 V to -20 V against ca. 0.53 % of tensile strain

    over 500 bending cycles, showing their potential possibilities of application in flexible memory

    devices.

  • 34

    (a) (b)

    (c) (d)

    Figure 3-7. Transfer curves of the 1st dual gate voltage sweep (a) with and (b) without 8 nm CoFe2O4

    NPs. (c) Transfer curves for electrical stability test and (d) summarized values of threshold voltage in

    programmed/erased state for 700 P/E cycles of the flexible NFGM devices based on 8 nm CoFe2O4

    NPs.

    -20 -10 0 10 2010

    -10

    10-9

    10-8

    10-7

    -ID (

    A)

    VGS

    (V)

    Program

    Erase

    0 200 400 600-20

    -10

    0

    10

    20

    Programmed state

    Vt

    P/E Cycles

    Erased state

    -20 -10 0 10 20 30

    10-9

    10-8

    - I D

    (A

    )

    VGS

    (V)

    100

    200

    300

    400

    500

    600

    700

    -20 -15 -10 -5 0 510

    -10

    10-9

    10-8

    10-7

    10-6

    10-5

    -ID (

    A)

    VGS

    (V)

    Erase

    Program

  • 35

    (a) (b)

    Figure 3-8. (a) Transfer curves and (b) summarized values of threshold voltage in mechanical

    stability tests against pure bending.

    -20 -10 0 10 2010

    -10

    10-9

    10-8

    10-7

    - I D

    (A

    )

    VGS

    (V)

    Initial

    After 100

    After 200

    After 300

    After 400

    After 500

    0 100 200 300 400 500-20

    -10

    0

    10

    20

    Programmed state

    Vt

    Bending Cycles

    Erased state

  • 36

    IV. Conclusion

    This study is to fabricate high-performance flexible NFGM devices based on semiconducting

    CoFe2O4 NPs. Electrical memory performance depended on the size (5, 8, and 11 nm) of the NPs and

    the dependence was explained in terms of the energy level difference. Monodisperse NPs could be

    synthesized by facile thermal decomposition using (Co2+

    Fe23+

    )-oleate complex as a precursor and the

    size of NPs can be controlled by regulating Ar bubbling rate in the reacting solution through complete

    separation of nucleation and growth process.

    The NFGM devices based on 8 nm CoFe2O4 NPs showed the best electrical memory performance

    among 3 different sizes of NPs. The devices showed the excellent memory performance: large

    memory window of ca. 73.84 V, fast and reversible switching behavior, ca. 3 × 103 of high read Ion/Ioff

    at VGS = 0 V, and outstanding data retention capability with an aid of hydrocarbon chains capping NPs

    as alternative tunneling dielectric layer. Furthermore, electrical memory operations of the NFGM

    devices on the flexible PET substrates have been also investigated and they showed superb, stable

    electrical characteristics in repeating P/E cycles and mechanical stability against pure bending. These

    results are expected to open-up wide possibilities for the flexible integrated circuits in data storage

    technologies.

  • 37

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  • 40

    Acknowledgement (감사의 글)

    어느덧, 울산에서의 짧고도 긴 2년간의 석사연구를 마무리 하는 시기가 다가왔습니다.

    석사 연구를 마무리하면서, 우선 항상 촐랑대며 사고만 치고 다니는 막내 아들을 꿋꿋

    이 믿고 응원해 주신 가족들에게 감사의 말을 전하고 싶습니다. 가장으로서 항상 멋진

    모습 보여주시는 든든한 아버지, 직장 다니랴 집안일 하랴 몸이 10개라도 모자라지만 힘

    든 내색 안하며 항상 웃는 모습 보여주시는 엄마, 그리고 서울에서 열심히 꿋꿋하게 미

    래를 향해 달려가고 있는 형 모두 사랑합니다.

    2년동안 학문적으로, 그리고 인간적으로 큰 가르침을 주신 오준학 교수님께 깊은 감사

    드립니다. 불철주야 연구에 힘쓰시는 교수님의 모습을 본받아 포항공과대학교에서의 박

    사과정에서도 유니스트 입학 당시의 열정과 초심을 잃지 않고 항상 열심히 하는, number

    one이 아닌 only one이 될 수 있도록 노력 하겠습니다. 앞으로도 호된 꾸짖음과 질책, 많

    은 지도 편달 부탁 드리겠습니다.

    그리고 2년 동안 SNDL 연구실에서 동고동락을 함께하며 많은 도움을 준 호정이, 아름

    이, 은광이, 문정이와 사랑하는 동기들, 무열이, 윤호, 자연이, 은엽이, 그리고 무럭무럭

    자라고 있는 인호와 철희, 그리고 해랑이 모두 고맙습니다. 2년간의 연구실 생활을 뒤돌

    아보며 여러분들의 소중함을 다시 한번 더 느낄 수 있었습니다. 앞으로도 부끄럽지 않은

    SNDL 연구원으로서 최선을 다할 것을 약속 드립니다.

    바쁘신 와중에 흔쾌히 석사학위 논문심사를 허락해 주시고 아낌없는 조언을 해주신 김

    병수 교수님, 고현협 교수님 감사 드립니다. 또한 나노입자 합성과 논문작성에 도움을 주

    신 박종남 교수님과 김성환 학생께도 감사의 말씀을 드립니다. 위에서 언급 드린 분들뿐

    만 아니라, 제 주변 모든 분들의 응원과 격려, 도움 덕분에 제가 이 자리까지 올 수 있지

    않았나 생각해 봅니다.

  • 41

    SNDL 연구실에서 2년 동안 배운 지식, 그리고 행복한 추억 모두 영원히 잊지 않겠습

    니다. SNDL 출신 연구원으로서, 어디를 가더라도 부끄럼 없는 사람이 되도록 노력하겠습

    니다. 항상 곁에서 따뜻한 격려와 응원을 해주시는 모든 분들의 사랑과 은혜 잊지 않고

    살아가겠습니다.

    감사합니다.

    2014 년 12 월

    정 지 형

    I. Introduction 1.1 Organic nano-floating gate memory (NFGM) devices 1.2 Cobalt ferrite (CoFe2O4) nanoparticles (NPs)

    II. Experiments 2.1 Synthesis of CoFe2O4 NPs 2.2 Characterization of CoFe2O4 NPs 2.3 Fabrication of CoFe2O4 NFGM devices

    III. Results & discussion 3.1 Analysis of CoFe2O4 NFGM devices 3.2 Electrical memory performance of CoFe2O4 NFGM devices 3.3 Electrical memory performance and mechanical stability test of flexible CoFe2O4 NFGM devices

    IV. Conclusion V. Reference Acknowledgement

    10I. Introduction 1 1.1 Organic nano-floating gate memory (NFGM) devices 1 1.2 Cobalt ferrite (CoFe2O4) nanoparticles (NPs) 4II. Experiments 7 2.1 Synthesis of CoFe2O4 NPs 7 2.2 Characterization of CoFe2O4 NPs 8 2.3 Fabrication of CoFe2O4 NFGM devices 15III. Results & discussion 19 3.1 Analysis of CoFe2O4 NFGM devices 19 3.2 Electrical memory performance of CoFe2O4 NFGM devices 22 3.3 Electrical memory performance and mechanical stability test of flexible CoFe2O4 NFGM devices 33IV. Conclusion 36V. Reference 37Acknowledgement 40


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