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B.C. Hein, assignor to Henkel Corp.,Plymouth Meeting, Pa.

In a process comprising operatinga continuous solvent extractioncircuit wherein an aqueous metalcontaining solution is contacted inan extraction stage with an or­ganic phase of a water-immiscibleorganic diluent having dissolvedtherein an extractant for themetal, and the aqueous phase isseparated from the organic phaseproviding an aqueous effluentcontaining entrained organicphase, the improvement whereinthe extractant in the entrainedorganic phase comprised of ex­tractant and water-immiscible or­ganic diluent is recovered fromthe aqueous effluent exiting thecontinuous solvent extraction cir­cuit, by the method comprisingthe steps of contacting the efflu­ent with the same diluent em­ployed in the extraction stage ofthe circuit for a time sufficient toallow the extractant in the en­trained organic containing extrac­tant to dissolve in the diluent; andseparating the effluent from thediluent, now containing an in­creased level of extractant; andwherein the extractant is selectedfrom the group consisting of or­thophenolic oximes; primary, sec­ondary, and tertiary amines; qua­ternary ammonium compoundssubstituted guanidines; phos­phine oxides; esters ofphosphoric,phosphonic, and phosphinic acids;aliphatic carboxylic acids and es­ters; sulfonic acids; and esters ofpyridine carboxylic esters; andthe diluent is a water-immiscibleliquid solvent capable of dissolv­ing the extractant and the associ­ated complex of extractant andextracted solute, selected fromthe group consisting of toluene,xylene, ethylene dichloride, andkerosene.

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76 Metal Flnl.hlng

u.s. Patent 5,879,564. Mar. 9, 1999R. Farinato, assignor to CytecTechnoLogy Corp., Stamford, Conn.

A method of dewatering a disper­sion of suspended solids, compris­ing adding to the dispersion aneffective amount of a cationic, wa­ter-soluble, or water-swellablepolymer to form a mixture of thedispersion and the polymer,wherein the polymer has a bulkviscosity to standard viscosity ra­tio of 300 to 500, a sedimentationvalue of 10% or less, and containsrecurring (methlacrylamide unitsand recurring diallyldimethylam­monium chloride, dialkylaminoal­ky1(alklacrylate, or dialkylamino­alkyHalklacrylamide units; anddewatering the mixture.

MULnLAYIR PRINTED CIRCUITBOARD FOR WIRE BONDINGU.S. Patent 5,879,568. Mar. 9, 1999N. Urasaki et aL., assignors toHitachi Ltd., Tokyo

A process for producing a multi­layer printed circuit board com­prising compounding electricallyinsulating ceramic whiskers in athermosetting resin varnish, dis­persing the whiskers in the var­nish uniformly by stirring, coat­ing the resulting mixture on aroughened side of a copper foil,semicuring the resin by heating toform a thermosetting resin layer,placing this layer on an interlayercircuit board in which platedthrough-holes and conductor cir­cuits have been formed, and hot

pressing them to form an integrallaminate; forming an etching re­sist on the copper foil, and etchingthe copper foil portions exposedfrom the etching resist into theshape of holes for forming inter­stitial via holes; removing theetching resist; applying laserbeams to the cured thermosettingresin layer exposed from the fineholes of the copper foil etched intothe shape of holes for forming in­terstitial via holes to remove theresin layer to an extent that thecircuit conductors of the inter­layer board are to be exposed,thereby forming via holes; rough­ening the cured thermosettingresin layer on the walls of said viaholes by using a roughening

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December 1999 77