Date post: | 11-Jul-2015 |
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Business |
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Contents1. Summary2. Organization chart3. Marketing4. Services & Quality assurance5. Technology capability6. Raw material suppliers7. Main equipments8. Vision, Mission and Culture
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Summary
Established : 1995Total employees : 850Register capital : 100 million RMB Plant floor space: 18,000M²2014 capacity (forecast) : 360K square meter/annualWorking hours : 2 shifts
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Summary
Certified : TS16949, AS9100, ISO9001, ISO14001Our advantage
High quality controlled, quickly production lead-time and prompt response, high mixed products to support our customers with professional business service.
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Organization Chart
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Quality Assurance Chart
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Structure of Employees
Operator, 63.30%
QA, 10.00%
Others, 12.70%
Management, 9.00%
R&D, 5.00%
Management
R&D
QA
Operator
Others
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MarketingAnnual Sales turnover & production Capacity output
18.923.1
29.5 32.136.7
30 33.6
46.855
68
0
10
20
30
40
50
60
70
80
2009 2010 2011 2012 2013
Capacity Output(10K SQM) Sales Revenue(Million USD)
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<4L and 4L,15.00%
6L, 13.00%
8L, 18.00%10L, 20.00%
12L, 18.00%
14L, 8.00%
>=16L, 8.00%<4L and 4L
6L
8L
10L
12L
14L
>=16L
Products Structure
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Application Field航天航空Aerospacedefence
15%
通讯Telecommunication 35%
工业控制Industrial control 20%
医疗 10%Medical Devices
交运设备、电器、数码产品…Transportation,Electric equipment,digital… 20%
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Global Customers
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Quality Policy
Focus on customers, provide high quality products and excellent service to customers
Environment Policy
Commit to sky blue, air fresh, water clear
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High Quality Certifications
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High Quality Certifications
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Technology Capability for Rigid and Rigid-Flex PCB
Layer count : 2--40 layersMax manufacturing size: 630mm*1500mmBoard thickness: Double sided: 0.05mm—6.0mm4 layers: 0.4mm—8.0mm6 layers: 0.8mm—8.0mm10 layers: 1.2mm—8.0mm12 layers: 1.5mm—8.0mm Copper foil thickness: 0.25OZ—13OZMin line width/space: 2.5mil/2.5milMin finished holes size: 0.15mm(mechanical),0.1mm(laser)Aspect ratio: 16:1Impedance control tolerance: +/-5% Surface treatment: HASL;LF HASL; Immersion Gold(ENIG); Immersion Tin; Immersion Ag; Gold Finger; Flash Gold; Hard Gold; OSPMaterials: FR4, Tg: 130/150/170/180℃, Rogers, Bergquist, Arlon…
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Technology Capability for Flex PCBLayer count : 1--10 layersMax manufacturing size: 430mm*530mmBoard thickness: 0.1mm—6.0mmCopper foil thickness: 0.25OZ—3OZMin line width/space: 2.5mil/2.5milOutline tolerance: +/-0.05mm for laser, +/-0.15mm for punchingStiffener type: FR4(0.2-6.0mm), steel(0.2-0.4mm),PI(0.2mm)Impedance control tolerance: +/-10% Surface treatment:
Immersion gold, ENEPIG,Soft gold,hard gold,immersion silver/tin,OSP, ENIG+OSP,ENIG+G/FMaterials: Shengyi, Taiflex, Dupont, Panasonic…
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Lead-time for ProductionProduction capacity is 30 000 sqm (3500 part numbers) monthly
Layers Express lead time Standard lead-time of mass roduction
Double Sided: 2-6 Calendar days 12 Calendar days4 Layers: 3-7 Calendar days 13 Calendar days6 Layers: 3-9 Calendar days 17 Calendar days8 Layers: 4-12 Calendar days 19 Calendar days10 Layers: 5-15 Calendar days 20 Calendar days10+ Layers: 6-18+ Calendar days 21-25 Calendar days
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Raw Material Supplier
To ensure the reliability and stability of product quality, we choose the well-known suppliers in domestic or abroad to provide quality raw materials.
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PCB Sample
High mixed PCB: aluminum base PCB, mixed lamination PCB, flexible PCB…
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High density &blind via PCBName: HDI printed circuit boardPart No.: E0214040025ALayer count: 10 Material: FR4 ,1.6mm, TG 180, 1 OZ for all layerMinimum tack: 2.6milMinimum space(gap): 2.6milMinimum hole: 0.10mmSurface finished: ENIGPanel size: 390*368mm/4upCharacteristics: high density interconnect, high TG
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High Density & Blind Via PCBName: HDI printed circuit boardPart No.: E0214040025ALayer count: 16 Material: FR4 ,1.6mm, TG 180, 1 OZ for all layerMinimum tack: 2.6milMinimum space(gap): 2.6milMinimum hole: 0.10mmSurface finished: ENIGPanel size: 390*368mm/4upCharacteristics: high density interconnect PCB,via on pad(plug with resin,and plate copper flat),high TG
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Aluminum Base PCBName: aluminum base printed circuit boardPart No.: E0214040021ALayer count: 1Material: FR4 ,1.6mm,thermal conductance 2 W, 3 OZ for all layerMinimum tack: 14milMinimum space(gap): 14milMinimum hole: 0.50mmSurface finished: Lead Free HASLPanel size: 60*60mm/1upCharacteristics: aluminum base PCB,high thermal conductance
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Rigid Flexible PCB Name: rigid flex printed circuit boardPart No.: E0214040058ALayer count: 8 Material: FR4 + Polymide,1.6mm, 1 OZ for all layerMinimum tack: 4milMinimum space(gap): 4milMinimum hole: 0.30mmSurface finished: ENIG( Au 2 U")Panel size: 120*430mm/1upCharacteristics: rigid flex multilayer PCB
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Selective Hard Gold PCBName: Hard gold printed circuit boardPart No.: E0214040027ALayer count: 2 Material: FR4 ,0.2mm, TG 130, 1 OZ for all layerMinimum tack: 4milMinimum space(gap): 4milMinimum hole: 0.20mmSurface finished: Selective hard gold( Au 30 U")Panel size: 120*108mm/36upCharacteristics: selective hard gold PCB,thin finished board thickness
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Flexible PCB
Name: flexible printed circuit boardPart No.: E0214040057ALayer count: 6 Material: Polymide 0.2mm, 1 OZ for all layerMinimum tack: 4milMinimum space(gap): 4milMinimum hole: 0.30mmSurface finished: ENIG( Au 2 U")+ selective hard gold(20 U")Panel size: 46*106mm/1upCharacteristics: hard gold flex PCB, for smart mobile phone
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Main Production Equipments
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Main Measurement Equipments
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Vision and MissionVision: To be the top PCB service enterprise
Mission: Providing high quality products and prompt
satisfactory service to customers around the world
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Culture and Core Value
Focus onCustomer
Cooperation, Improving Sharing
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Contact UsTel: +86-755-23724206 E-mail: [email protected]: Shawnwang2006Add: Building7, Wanxia industry Park ,Gonghe
Village, Shajing Town,Baoan District , Shenzhen ,China
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